TW200416921A - Control method for semiconductor processing device - Google Patents
Control method for semiconductor processing device Download PDFInfo
- Publication number
- TW200416921A TW200416921A TW92103937A TW92103937A TW200416921A TW 200416921 A TW200416921 A TW 200416921A TW 92103937 A TW92103937 A TW 92103937A TW 92103937 A TW92103937 A TW 92103937A TW 200416921 A TW200416921 A TW 200416921A
- Authority
- TW
- Taiwan
- Prior art keywords
- plasma
- processing
- processing device
- vacuum processing
- semiconductor processing
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims abstract description 221
- 238000000034 method Methods 0.000 title claims abstract description 120
- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 238000004140 cleaning Methods 0.000 claims abstract description 20
- 238000004886 process control Methods 0.000 claims abstract description 6
- 238000011084 recovery Methods 0.000 claims description 53
- 230000005856 abnormality Effects 0.000 claims description 43
- 238000005406 washing Methods 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 4
- 238000000513 principal component analysis Methods 0.000 claims description 2
- 230000003595 spectral effect Effects 0.000 claims 2
- 238000003672 processing method Methods 0.000 abstract description 14
- 239000002245 particle Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 72
- 238000010586 diagram Methods 0.000 description 24
- 230000002159 abnormal effect Effects 0.000 description 11
- 239000000523 sample Substances 0.000 description 7
- 238000009825 accumulation Methods 0.000 description 6
- 238000000295 emission spectrum Methods 0.000 description 6
- 238000012544 monitoring process Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052770 Uranium Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW92103937A TW200416921A (en) | 2003-02-25 | 2003-02-25 | Control method for semiconductor processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW92103937A TW200416921A (en) | 2003-02-25 | 2003-02-25 | Control method for semiconductor processing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200416921A true TW200416921A (en) | 2004-09-01 |
| TWI308371B TWI308371B (enExample) | 2009-04-01 |
Family
ID=45071815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW92103937A TW200416921A (en) | 2003-02-25 | 2003-02-25 | Control method for semiconductor processing device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200416921A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101080200B1 (ko) * | 2009-04-14 | 2011-11-07 | 주식회사 하이닉스반도체 | 반도체 메모리 장치 및 그 리프레쉬 제어 방법 |
-
2003
- 2003-02-25 TW TW92103937A patent/TW200416921A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI308371B (enExample) | 2009-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |