TW200416792A - Substrate treatment unit - Google Patents
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- TW200416792A TW200416792A TW092133059A TW92133059A TW200416792A TW 200416792 A TW200416792 A TW 200416792A TW 092133059 A TW092133059 A TW 092133059A TW 92133059 A TW92133059 A TW 92133059A TW 200416792 A TW200416792 A TW 200416792A
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
200416792 玖、發明說明： t發日月戶斤屬之技術領域】 發明領域 本發明係關於基板處理裝置。 發明背景 在LCD(Liquid Crystal Display :液晶顯示器）等之製造 工程方面，為了在LCD用玻璃基板上形成rr〇(Indium Tin Oxide :銦錫氧化物）之薄膜和電極圖案，而利用與半導體 10 I置之製造所使用者同一之光刻（photolithography)技術。例 如，於LCD用玻璃基板（以下稱為rLCD基板」）形成了抗蝕 膜之後，以給定之電路圖案將此抗蝕膜加以露光，進而將 之顯像處理，藉此在LCD基板形成電路圖案。在這種光刻 工程方面，將擴展抗蝕液成膜狀後進行之預烘處理，在露 15光處理後進行之後曝光烘處理、顯像處理後進行之後烘處 理等，各種加熱處理，施予LCD基板。 按照進行這種加熱處理之基板處理裝置，若將基板直 接載置於熱板上，則在基板帶電靜電，以致造成製品不良 之原因，所以在熱板上配置近接銷，熱板與擬载置之基板 20間设置一點點之間隙來加熱以進行近接烘培（日本國公開 公報特開平6-97269號公報之[〇〇19]段落，第2圖參照）。近 接銷係以給定之間隔設置以便防止玻璃基板彎曲而直接接 觸熱板。 又，就用來進行此種加熱處理之熱處理單元來說，其 5 具有與LCD基板大致同一之大小，並使用有熱板單元 熱板單元係配置在一設有加熱器於内部之熱板之框題内 在此熱板之表面，設有近接銷於給定位置，1^1)基板艮、 不直連接於熱板之狀態，被近接銷支持成大致水平姿勢2 參照曰本國公開公報特開2000-12447號公報之第7，8頁巧 第6圖，第11圖）。 、 在熱板之表面施予穿孔加工，將近接銷安裝於所形成 之孔部，藉此安裝近接銷於熱板。又，因為近接銷會隨時 間之經過而劣化，所以需要定期替換。 就將此種熱板單元中所加熱處理過iLCD基板，冷卻 到大致室溫之處理單元來說，其使用有一種具有冷卻板之 冷卻板單元。其中該冷卻板係設有用來放出冷卻水之機構 以替代加熱器，或者，使所加熱之LCD基板自然散熱，藉 此冷部LCD基板。這種冷卻板，係與熱板同樣，具有一種 在上面之給定位置配置有近接銷之構造。 【發明内容】 發明欲決之課題 然而，玻璃基板，最近變為大型化(例如其二邊之長度 變為1.5m，L2m)，隨此，也有必要使近接銷增加。由於近 接銷要载置玻璃基板許多次而會磨損，所以需要定期地加 以曰換。此替換作業，由於必需就各近接銷一面調節一個 一個之高度一面替換，所以非常費事。 為解決此問題，可考慮在熱板張貼鋼線。依鋼線之直 從而可確保熱板與基板之距離，關於替換作業即替換鋼線 200416792 就可以解決。然而’卻有鋼線與玻祝基板之接觸面積大， 因熱而造成鋼線之線狀形跡複製於玻璃基板之問題。 有鑑於上述情事，本發明之第一目的乃提供一種具有 優異之維護性，在基板不留下熱複製之形跡的基板處理裝 5 置。 再者，一如前述’為了支持LCD基板成大致水平姿勢， 而需要更多之近接銷，然而此時，卻因用來安裝近接銷於 熱板等之穿孔加工負荷變大，銷之安裝/替換費時，用於一 台熱板等之近接銷數變多等事宜，而有熱板等設備成本和 10 維護成本變高等之問題。 又，進行光刻工程之抗蝕劑塗佈·顯像處理系統，由 於具有共1〇〜20台之熱板單元及冷卻單元，所以熱板單元 及冷卻板單元之裝置成本一提高，系統整體之價格便上 漲，而且招來維護成本之大幅增大。 15 本發明鑑於此種事而進行者，其第二目的係在於提供 一種可將設備成本及維護成本壓低的基板處理裝置。 用於解決課題之手段 為了解決上述課題，本發明之基板處理裝置，包含有： 載置部，其係使基板載置以用來進行熱處理；多數個支持 構件，其係用以支持基板於前述載置部上；及第一連結構 件，其係裝知自如地設在前述载置部，以用來連結前述多 數個支持構件。 若依這種構成’則可藉多數個支持構件來支持基板， 及設置藉著裝卸第-連結構件於载置部而連結的支持構 7 件藉此不用士以往之藉鋼線來直接支持基板之手段， 也可做成不使複製之形跡留下。x，不需要一個一個地替 換近接銷，使彳«卸變成容易，取可提高維護性。 本心明之α亥开场之基板處理裂置，係用耐熱樹脂來 形成前述支持構件。 由於支持構件與載置部係直接連接，所以需要防止因 熱而造成之變形。只錢這種構成，㈣為支持構件由具 有财熱性之原料所形成’而不會受熱而變形。〖，只要是 樹脂，即因為硬纽麵等低，而縱使處理玻璃基板作2 基板，也不會受傷。在此，所謂具有耐熱性，係指即使特 別加熱也具有對外力不變形之性質而言。 前述耐熱樹脂 於本發明之該一形態之基板處理裝置 為聚醚醚酮。 聚醚醚酮為一種儘管加大約200。。之熱也不會變形之 樹脂。若依此構成，則可防止由熱所造成之變形。' 於本發明該一形態之基板處理裝置 有大致球形之形狀。 前述支持構件具 件所支持於 面積成為核 所造成之複 若依此種構成，則基板因為由球形支持構 銷點(pin poim)，而可使基板與支持構件之接觸 小之面積，藉此，不留下如習知一般之由鋼線 製痕跡。 ，前述载置部係在 凹部，前述支持構 於本發明該一形態之基板處理裝置 表面具有與前述支持構件之個數相等之 件則被載置於前述載置部之各對應凹部 200416792 若依此種構成，則把各支持構件載置於凹部，藉此可 防止在基板上移動。藉此，在支持構件不在载置部场動 下’ Γ支持構件彼此之間隔保持於—定，可抑制基板之弯 曲至最小限度。X，可防止基板受傷。 5 於本發明該—形態之基板處理裳置，前述支持構件係 被§又置成相鄰之該支持構件彼此隔開至少13G_以下。 若依此種構成，則可抑制基板之弯曲。藉此^ 會接觸於第—連結構件和載置部，也 ^ 10 …本之基板處縣置，前述支持 直徑係在0.1mm〜2mm之範圍内。 若依此種構成，則可將基板作成，從第—連 載置部確實地保持1之距離。藉此，基板不會接觸2 =結構件和錢部，衫讀叫雜留下崎之複ΐ 15 於树明該-形態之基板處理裂置，前述支持構件且 、胁别述載置部之接觸部；前述接觸部即形成平垣了 若依此種構成，則支持構件不會在载置部上移動二 =持構件彼此之間隔保持於—定，將基板之彎曲抑制二 取小限度。 巾」於 20 於本發明該一形態之基板處理裝置，前述第 件係由可撓性變形之原料所構成。 〜構 若依此構成，_前述第—連結構件安裝於載置 攸栽置部卸下時也不會損壞第—連結構件，可㈣進 。構件之替換。在此所謂可撓性變形係指對所加之力不破 9 200416792 壞’隨力而適宜變形而言。 於本發明形態之基板處理裝置，前述原料為不錄鋼。 若依此種構成，則把前述第一連結構件裝於載置部或 從載置部卸下，也不會損壞第一連結構件，並藉著使用不 銹鋼而加以輕重量化’可輕易進行連結構件之替換。藉此， 更提高維護性。 於本發明該一形態之基本處理裝置，前述第 10 15 20 件之斷面最大直徑為〇〇2mm〜〇2min之範圍内。 若依此種構成，則因為第—連結構件具有—定之对 性’而在替換第-連結構件時不會受損，可使其輕易替換 確保維護性。X，目為可將基㈣料接連於第—連結 件而不會留下如習知一般之鋼線之複製痕跡。 於本發_—形態之基核料置，前述第—連結 ^包含有：安裝部，其伽以錢前述載置部於兩端；。 Γ=，其係在前述安裝部之中，至少設在-方。前述: 衣种透過前述雜體來安裝於前述载置部。 =此種構成’則在彈性體之作用下，可使載置部 構件及支持構件之間產生—定之拉力。藉此， 使^構件不在載置部上義，將支持構件彼此之間隔 持一疋’抑制基板之彎曲到最小限度。在此，所謂彈性 係才曰對於外力顯不彈性之構件*言，例如由彈簧等金屬 形成者，及由橡料樹脂所形成者都包括在内。 於本發明之該-形態之基板處理裝置，前述 係固定於前述第一連結構件。200416792 (ii) Description of the invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a substrate processing apparatus. BACKGROUND OF THE INVENTION In the manufacturing process of LCD (Liquid Crystal Display), etc., in order to form a thin film and electrode pattern of rr0 (Indium Tin Oxide) on a glass substrate for LCD, it is used in conjunction with semiconductors. The photolithography technology is the same as the one manufactured by the user. For example, after a resist film is formed on a glass substrate for LCD (hereinafter referred to as an rLCD substrate), the resist film is exposed in a given circuit pattern, and then developed to process the circuit, thereby forming a circuit pattern on the LCD substrate. . In this photolithography process, the pre-baking treatment is performed after the extended resist solution is formed into a film, the exposure bake treatment is performed after the exposure light treatment, the bake treatment is performed after the development treatment, and the like. To the LCD substrate. According to the substrate processing device that performs such a heat treatment, if the substrate is directly placed on a hot plate, the substrate is charged with static electricity, which causes the product to be defective. Therefore, a proximity pin is arranged on the hot plate, and the hot plate is to be placed on the hot plate. A small gap is provided between the substrates 20 to be heated for proximity baking (Japanese Unexamined Patent Publication No. 6-97269, paragraph [0019], refer to FIG. 2). The proximity pins are arranged at given intervals to prevent the glass substrate from being bent and directly contact the hot plate. In addition, as for the heat treatment unit for performing such a heat treatment, 5 has a size substantially the same as that of the LCD substrate, and a hot plate unit is used. The hot plate unit is arranged on a hot plate provided with a heater inside. On the surface of the hot plate, a proximity pin is provided at a given position in the frame, 1 ^ 1) The substrate is not directly connected to the hot plate, and is supported by the proximity pin in a substantially horizontal posture. 2000-12447, pages 7, 8 (Figures 6 and 11). 1. Apply a perforation process to the surface of the hot plate, and install the proximity pin on the formed hole to install the proximity pin on the hot plate. In addition, since the proximity pin will deteriorate over time, it needs to be replaced regularly. As a processing unit that heat-processes the iLCD substrate in such a hot plate unit and cools it to approximately room temperature, a cooling plate unit having a cooling plate is used. Wherein, the cooling plate is provided with a mechanism for releasing cooling water to replace the heater, or to naturally dissipate the heated LCD substrate, thereby cooling the LCD substrate. This cooling plate has a structure in which, as with the hot plate, a proximity pin is arranged at a given position above. SUMMARY OF THE INVENTION Problems to be solved by the invention However, glass substrates have recently become larger (for example, the length of the two sides has become 1.5m and L2m). Accordingly, it is also necessary to increase the proximity pins. Since the proximity pin is worn many times on the glass substrate, it needs to be replaced periodically. This replacement operation is very laborious because it is necessary to replace the adjacent pins while adjusting the height of each one. To solve this problem, consider posting steel wire on the hot plate. Straighten the steel wire so as to ensure the distance between the hot plate and the substrate. The replacement operation is to replace the steel wire 200416792. However, there is a problem that the contact area between the steel wire and the glass substrate is large, and the linear trace of the steel wire is copied on the glass substrate due to heat. In view of the foregoing circumstances, a first object of the present invention is to provide a substrate processing apparatus having excellent maintainability without leaving a trace of thermal replication on a substrate. In addition, as mentioned above, in order to support the LCD substrate in a substantially horizontal posture, more proximity pins are required. However, at this time, the load of the punching process for mounting the proximity pins on the hot plate is increased, and the pin installation / The replacement is time-consuming, and is used to increase the number of proximity pins of a hot plate, etc., but there are problems such as the cost of equipment such as a hot plate and 10 maintenance costs. In addition, since the resist coating and developing processing system for photolithography process has a total of 10 to 20 hot plate units and cooling units, the equipment cost of the hot plate units and the cooling plate units increases, and the entire system is increased. The price rises, and the maintenance cost is greatly increased. A second object of the present invention is to provide a substrate processing apparatus capable of reducing equipment cost and maintenance cost. Means for Solving the Problem In order to solve the above-mentioned problem, the substrate processing apparatus of the present invention includes: a mounting section for mounting the substrate for heat treatment; and a plurality of supporting members for supporting the substrate on the aforementioned substrate. The mounting portion; and a first connecting member, which is provided in the mounting portion so as to be freely installed to connect the plurality of supporting members. According to this structure, the substrate can be supported by a plurality of supporting members, and the supporting structure can be provided by attaching and detaching the first-connecting member to the mounting section, thereby directly supporting the substrate without using a conventional steel wire. Means can also be made not to leave traces of reproduction. x, it is not necessary to replace the proximity pins one by one, which makes it easy to unload and improve maintenance. The substrate of the open-hearted α-Hai opens and is split, and the aforementioned support member is formed of a heat-resistant resin. Since the support member is directly connected to the mounting portion, it is necessary to prevent deformation due to heat. The structure of money is that the supporting member is formed of a material with rich thermal properties' without being deformed by heat. 〖As long as it is made of resin, that is, because the hard button surface is low, even if the glass substrate is treated as a two substrate, it will not be injured. Here, the term "having heat resistance" means that it does not deform under external force even when it is particularly heated. The substrate processing apparatus of the aforementioned heat-resistant resin in this aspect of the present invention is polyetheretherketone. Polyetheretherketone is one although added about 200. . Resin that is not deformed by heat. According to this structure, deformation by heat can be prevented. '' The substrate processing apparatus according to this aspect of the present invention has a substantially spherical shape. If the area supported by the aforementioned support member is a core, if the structure is such, the substrate has a pin poim supporting the ball, so that the contact area between the substrate and the support member can be small. Without leaving traces made of steel wire as usual. The aforementioned mounting portion is in a recessed portion, and the aforementioned supporting structure formed on the surface of the substrate processing apparatus of the present invention has a number equal to that of the aforementioned supporting member, and is placed in each corresponding recessed portion of the aforementioned mounting portion 200416792 With this configuration, each support member is placed in the recess, thereby preventing movement on the substrate. With this, when the support members are not moved by the placement portion, the distance between the support members is kept constant, and the warpage of the substrate can be suppressed to a minimum. X to prevent substrate damage. 5 In the substrate processing apparatus of this form of the present invention, the aforementioned supporting members are placed adjacent to the supporting members at least 13G_ apart from each other. According to this structure, the warpage of the substrate can be suppressed. In this way, ^ will be in contact with the first connection member and the mounting portion, and ^ 10… the base plate is located at the county, and the aforementioned support diameter is in the range of 0.1mm ~ 2mm. According to this structure, the substrate can be made, and the distance from the first serial mounting portion can be reliably maintained by one. As a result, the substrate will not contact 2 = the structural part and the money part. The shirt is called Misaki leaving the complex of Sakizaki. 15 Yu Shuming's substrate processing is cracked. If the above-mentioned contact portion is formed in this way, the supporting member will not move on the mounting portion. The distance between the holding members is kept constant, and the bending of the substrate is suppressed to a small limit. The "towel" is used in the substrate processing apparatus according to this aspect of the present invention, and the aforementioned piece is made of a flexible deformable material. ~ Structure If this structure is adopted, the first coupling member can be inserted without damaging the first coupling member when the mounting member is mounted and removed. Replacement of components. The so-called "flexible deformation" refers to the fact that the applied force does not break 9 200416792. It is suitable to deform with force. In the substrate processing apparatus according to the aspect of the present invention, the aforementioned raw material is non-recorded steel. With such a structure, the first connecting member can be mounted on or detached from the mounting portion without damaging the first connecting member, and the weight can be easily reduced by using stainless steel. Replacement of link components. Thereby, maintainability is further improved. In the basic processing device of this aspect of the present invention, the maximum cross-sectional diameter of the aforementioned 10th to 15th pieces is in the range of 0.02 mm to 0.02 min. According to this structure, since the first connection member has a certain pair of properties', it is not damaged when the first connection member is replaced, and it can be easily replaced to ensure maintainability. X, the purpose is to connect the base material to the first link without leaving traces of copying of the conventional steel wire. In the present form of the base nuclear material, the aforementioned first connection ^ includes: a mounting portion, which has the aforementioned mounting portions at both ends; Γ =, which is in the aforementioned mounting portion, and is set at least on the-side. The aforementioned: The clothing type is attached to the placing portion through the miscellaneous body. = This kind of structure 'causes a fixed tension between the mounting member and the supporting member under the action of the elastic body. Thereby, the upper member is not lifted from the mounting portion, and the support members are held at a distance of one 'to suppress the warpage of the substrate to a minimum. Here, the term "elasticity" refers to members that are inelastic to external forces, such as those made of metals such as springs and those made of rubber resins. In the substrate processing apparatus of this aspect of the present invention, the aforementioned system is fixed to the aforementioned first connection member.
10 若依此構成，則可抑制支持構件在載置部上移動。又， 因為可防止支持構件對於第一連結構件移動，而可將支持 構件彼此之間隔保持於-定，抑制基板之f曲到最小限度。 、，於本發明之該-形態之基板處理裳置，前述支持構件 及前述第一連結構件，係一體地形成。 若依此種構成，則例如可用塑模來成型。藉此， 易製成。 二 於本發明該-形態之基本處理裝置，前述第一連結構 件具有多數個；及更備有第二連結機構，其係裝卸自如地 设在前述載置部，以用來連結前述多數個之第_連 若依此種構成，則因為多數個第一連結構件由第二連 結構件所連結，所以將第二連結構件安裝於载置部或 置部卸下’藉此可將各第—構件同時絲於載置部或從= •下。藉此可㈣進行連結構件之替換，使輯性提高。 再二若依本發明之其他觀點，可提供一種基板處理 衣置，包含有：板構件，其係將其面實質地配置成水平， …議咖，其係具 一、、 亚被配置在前述板構件之表面；装 中别述基板係接連於前述多數彳 熱性處理。 心數個線材料而被支持著’以便 若依本發明之另外觀點，提供—種基板處理襄置 =構件，其係在表面形成有直線狀之多數個溝部c :將/、面配置成實質地水平’以便對於 理，·及多數個桿材料，其係為了裁置基板 200416792 部，其外徑比前述溝部之深度更大；其中，前述基板 連於前述錄轉㈣而被支料，以便熱。 若依此種基板處理裝置，則因為可用少數之線材料或 桿材料來支持基板，而不需要在極板構件形成許多孔部， 5而且也不需要多數之近接鎖。藉此，可降低製造成本(裝置 價格），而且維護變為容易，從而也可減低維護成本。此種 製造成本及維護成本之減低效果，係以大成本減低之效果 之狀態，呈現於備❹數個基板處理裝置之基板處理系統。 圖式簡單說明 1〇第1圖為平面圖’顯示本發明—實施形態之塗佈顯像處 理裝置之全體構成。 第2圖係第1圖所示之塗佈顯像處理裝置之平面圖。 第3圖係第1圖所示之塗佈顯像處理裝置之背面圖。 第4圖為-斜視圖’顯示熱處理單元之外觀。 15第/圖為—斷面圖，顯示熱處理單元之内部構造。 第6园為斜視圖，顯示熱板之全體構成。 第7圖為—平面圖，顯示支持球及線材料。 第8圖係顯示將支持球連結於線材料之工程。 第9(a) 9(c)圖為側面圖，顯示熱板之整體構成。 2〇帛1〇圖係顯示基板在支持球上被加熱之狀態。 第11圖係顯示基板在支持球上被加熱之狀態。 第12圖係顯示就熱板進行維護作業之狀態。 第圖為斜視圖’顯示本發明其他實施形態之塗佈 顯像裝置之熱板之整體構成。 12 200416792 第14圖為一斜視圖，顯示安裝板之整體構成。 第15圖係顯示就熱板進行維護作業之狀態。 第16圖係顯示成型支持球部及線材料部之狀態。 第17(a)〜(b)圖為側面圖，顯示熱板之一部分。 5 第18(a)〜(b)圖為侧面圖，顯示熱板之整體構造。 第19(a)〜(b)圖為斜視圖，顯示支持圓筒構件及支持曲 面構件。 第20圖係抗蝕劑塗佈•顯像處理系統之概略平面圖。 第21(a)〜（c)圖係顯示熱板單元(HP)之概略構造之平 籲 10 面圖（a)、正面圖（b)、斷面圖（c)。 第22(a)〜（c)圖係顯示熱板單元(HP)所具備之概略構 造之平面圖（a)、正面圖（b)、斷面圖（c)。 第23圖為一說明圖，顯示將線材料之拉力保持於一定 之拉力調整機構。 15 第24圖為一斜視圖，顯示定位夾具(Jig)之構造。 第25圖為板構件之斜視圖，此板構件設有用來進行線 材料之定位的溝。 Φ 第26圖為另一板構件之斜視圖，此板構件設有用來進 行線材料之定位的溝。 20 第27圖為一說明圖，顯示將線材料之拉力保持於一定 之另外拉力調整機構。 第28圖係顯示熱板單元(HP)所具備之概略構造之平面 圖（a)及斷面圖（b)。 第29圖為一平面圖，顯示配置在板構件表面之另一配 13 200416792 置形態。 第30圖為冷卻板之概略正面圖。 第31圖為另一冷卻板之概略正面圖。 5較佳實施例之詳細說明 以下’根據圖式說明本發明之實施形態。 第一實施形熊^ (塗佈顯像處理裝置丨 第1圖為一平面圖，顯示本發明所適用之LCD基板之塗 10佈顯像處理裝置，第2圖為其正面目，第3圖為其背面圖。 此塗佈顯像處理裝置1，包含有卡匣站2,其係用以載置卡 EC(收容有多數個玻璃基板G);處理部3，其係備有多數個 處理單元以用來對基板G施予包括抗触劑塗佈及顯像在内 之-連串處理；及介面部4，其係用以同露光裝置32之間進 15行基板〇之交接。在處理部3之兩端分別配置有卡匣站2及介 面部4。 2010 With this structure, it is possible to suppress the support member from moving on the placement portion. In addition, since the support member can be prevented from moving with respect to the first connection member, the interval between the support members can be kept constant, and f warpage of the substrate can be suppressed to a minimum. In the substrate processing apparatus according to this aspect of the present invention, the support member and the first connection member are integrally formed. With such a structure, it can be molded with a mold, for example. This makes it easy to make. Secondly, in the basic processing device according to this aspect of the present invention, the first connection member has a plurality of pieces; and a second connection mechanism is further provided, which is detachably provided in the mounting portion to connect the plurality of pieces. If the _th connection is configured in this way, since most first connection members are connected by the second connection member, the second connection member is mounted on the mounting portion or the mounting portion is detached. — The component is placed on or under the mounting part at the same time. This makes it possible to replace the connecting members and improve the editing performance. According to another aspect of the present invention, a substrate processing clothes can be provided, including: a plate member, which substantially arranges its surface to be horizontal, ... a coffee, which is provided in the foregoing The surface of the plate member; the substrate in the installation is connected to most of the aforementioned thermal treatments. Supported by several wire materials, so as to provide another kind of substrate treatment according to another aspect of the present invention, a member is formed by forming a plurality of linear grooves on the surface. The ground level is for the sake of rationality, and most of the rod materials are for cutting the 200416792 portion of the base plate, the outer diameter of which is greater than the depth of the groove portion; wherein, the base plate is connected to the recording and recording unit and is supported so that heat. According to such a substrate processing apparatus, since a small number of wire materials or rod materials can be used to support the substrate, it is not necessary to form a large number of hole portions in the plate member, and a majority of proximity locks are not required. Thereby, manufacturing cost (device price) can be reduced, and maintenance becomes easy, so that maintenance cost can also be reduced. Such a reduction effect of manufacturing cost and maintenance cost is presented in a substrate processing system equipped with a plurality of substrate processing apparatuses with a large cost reduction effect. Brief Description of the Drawings 10. Fig. 1 is a plan view 'showing the entire configuration of a coating development processing apparatus according to an embodiment of the present invention. Fig. 2 is a plan view of the coating development processing apparatus shown in Fig. 1. FIG. 3 is a rear view of the coating development processing apparatus shown in FIG. 1. FIG. Fig. 4 is a perspective view showing the appearance of the heat treatment unit. 15 第 / 图 是 — cross-sectional view showing the internal structure of the heat treatment unit. The sixth garden is an oblique view, showing the entire composition of the hot plate. Figure 7 is a plan view showing the support ball and line material. Figure 8 shows the process of connecting the support ball to the wire material. Figures 9 (a) and 9 (c) are side views showing the overall configuration of the hot plate. 20 × 10 shows the state where the substrate is heated on the support ball. FIG. 11 shows a state where the substrate is heated on the support ball. Figure 12 shows the state of maintenance work on the hot plate. Figure 1 is a perspective view 'showing the overall structure of a hot plate of a coating and developing device according to another embodiment of the present invention. 12 200416792 Figure 14 is an oblique view showing the overall structure of the mounting plate. Figure 15 shows the state of maintenance work on the hot plate. FIG. 16 shows the state of the molding support ball portion and the wire material portion. Figures 17 (a) to (b) are side views showing a part of the hot plate. 5 Figures 18 (a) to (b) are side views showing the overall structure of the hot plate. Figures 19 (a) to (b) are perspective views showing the supporting cylindrical member and the supporting curved member. Figure 20 is a schematic plan view of a resist coating and developing processing system. Figures 21 (a) to (c) are plan views showing the outline structure of the hot plate unit (HP). 10 Side view (a), front view (b), and sectional view (c). Figures 22 (a) to (c) are a plan view (a), a front view (b), and a cross-sectional view (c) showing the general structure of the hot plate unit (HP). Fig. 23 is an explanatory diagram showing a tension adjusting mechanism for maintaining the tension of the wire material at a certain level. 15 Figure 24 is an oblique view showing the structure of a positioning jig. Fig. 25 is a perspective view of a plate member provided with a groove for positioning the wire material. Φ Figure 26 is an oblique view of another plate member provided with a groove for positioning the wire material. 20 FIG. 27 is an explanatory diagram showing another tension adjusting mechanism that maintains the tension of the wire material to a certain level. Fig. 28 is a plan view (a) and a sectional view (b) showing a schematic structure of a hot plate unit (HP). Fig. 29 is a plan view showing another arrangement arranged on the surface of the plate member. Figure 30 is a schematic front view of the cooling plate. Figure 31 is a schematic front view of another cooling plate. 5 Detailed Description of the Preferred Embodiment The embodiment of the present invention will be described below with reference to the drawings. The first embodiment ^ (coating development processing device 丨 Figure 1 is a plan view showing a coating 10 cloth development processing device for an LCD substrate to which the present invention is applied, Figure 2 is a front view, and Figure 3 is This coating development processing device 1 includes a cassette station 2 for loading a card EC (containing a plurality of glass substrates G), and a processing section 3 for preparing a plurality of processing units. It is used to apply a series of processes including anti-contact coating and development to the substrate G; and a mesial surface portion 4 which is used to transfer 15 rows of substrates 0 to the exposure device 32. The cassette station 2 and the interface part 4 are respectively arranged at both ends of the part 3. 20
卡匣站2，係在卡匣C與處理部3之間，備有一用來進 LCD基板之運送的運送機構1()。而且，在卡昆站〕中進行 EC之運入及運出。又，運送機構1〇備有-可在運送路12( 著卡E之制方向而設)上移動之運送fu。就是，藉由 運送臂1卜在卡EC與處理部3間進行基板運送。 在處理部3，設有：上游部3b，其係沿著乂方向並設 包含抗#劑塗佈處理單之各處理單^ ;及下游較 其係並設有包含顯像處理單元(DEV)之各處理單元。 14 200416792 於上游部3b，在卡匣站2側端部，設有：激發物 (excimer)UV處理單元(e-uv)19，其係用以從卡匣站2除去基 板G上之有機物；及洗滌器洗淨處理單元(SCR)2〇，其係用 洗滌刷子對基板施予洗淨處理。 5 在洗務器洗淨處理單元(SCR)2〇之旁邊，配置有熱處理 系統塊24及25,其係對玻璃基板G多層地堆起有用來進行熱 性處理之單元。在這些熱處理系統塊24與25之間，配置有 垂直運送單元5，並將運送臂5a作成可向2方向及水平方向 移動，且，可向Θ方向轉動，所以作成可對兩塊24及25中 1〇之各熱處理系統單元存取以進行基板G之運送。又，關於垂 直運送單元7，也具有與該垂直運送單元5同一之構成。 如第2圖所示，在熱處理系統塊24，從下依序層合有： 二層之焙烘單元(BAKE)，其係將抗蝕劑塗佈前之加熱處理 施予基板G ;黏著單元(AD)，其係藉HMDS氣體來施予疏水 15化處理。一方面，在熱處理系統塊25，從下依序層合有： 運送裝置30 ;對基板G施予冷卻處理之二層^卻單元 (COL);黏著單元(AD) 〇 與熱處理系統25相鄰之抗钱劑處理塊15係向X方向延 伸設置。此抗蝕劑處理塊15，設有：對基板G塗佈抗蝕劑之 2〇抗蝕劑塗佈處理單元(CT);藉減壓使前述所塗佈之抗钱劑 乾炼之減壓乾燥單元(VD);除去基板G周緣部G之抗蝕劑之 側邊去除器（ER)。在此抗蝕劑處理塊15，設有一從抗蝕劑 塗佈處理單元（CT)至側邊去除器（ER)移動之副臂（未圖 示）；即，用此副臂，在抗蝕劑處理塊15内運送基板 15 200416792 配設有一與抗蝕劑處理塊15相鄰之多層構成之熱處理 系塊26。在此熱處理系統塊26，層合有三層之對基板g進行 抗蝕劑塗佈後之加熱處理的預烘單元(PREBAKE)，而在下 面則設有運送裝置40。 5 在下游部3C方面，如第3圖所示，在介面部4設有熱處 理糸統塊29，在此，從下依序層合有：冷卻單元(c〇l);二 層後露光烘焙單元(PEBAKE)，其係用以進行露光後顯像處 理前之加熱處理。 向X方向延設有一與熱處理系統塊29相鄰以進行顯像 1〇處理之顯像處理單元(DEV)。在此顯像處理單元(DEV)之旁 邊，配置有熱處理系統塊28及27;在此等熱處理系統28與 27之間，具有與上述垂直運送單元5同一之構成；並設有一 "T對兩塊28及27中之各熱處理糸統單元存取之垂直運送單 元6。又，設有i線處理單元(i_UV)33，其與顯像處理單元 15 (DEV)相鄰。 在熱處理系統塊28，從下依序層合有：冷卻單元 (COL);對基板G進行顯像後之加熱處理的二層後烘焙單元 (POBAKE)。一方面，熱處理系統塊27也一樣，從下依序層 合有：冷卻單元(C0L);二層後烘焙單元(ρ〇ΒΑΚΕ)。 20 在介面部4中，其正面側設有Titler及周邊露光單元 (Titler/EE)22，而與垂直運送單元7相鄰處即設有擴展式冷 卻單元35 ;又，在背面侧配置有緩衝匣34 ;在此等Titi^及 周邊露光單元(Titler/EE)22與擴展式冷卻單元(EXTC〇L)3 5 與露光裝置32(與緩衝匣34鄰接)之間，配置有一用以進行基 16 200416792 板G之交接的垂直運送單元8。此垂直運送單元8也具有與上 述垂直運送單元5同一之構成。 (塗佈顯像處理工程） 就以上所構成之塗佈顯像處理裝置丨之處理工程說明 5之。首先，將卡匣(：：内之基板G運送至上游部3b。在上游部 3b，即於激發物(excimer)UV處理單元(e-UV)19，進行李面 性質•有機去除處理；其次，於洗滌器洗淨處理單元 (SCR)2〇, 一面大略水平地運送基板G一面進行洗淨處理及 乾燥處理。接著，於熱處理系統塊24之最下段部，藉由垂 10直運送單元中之運送臂％取出基板G;用該熱處理系統塊24 之烘焙單元(bake)來加熱處理，藉黏著單元(AD)，為了提 南玻璃基板G與抗蝕膜之黏合性，而進行將HMDS氣體喷霧 於基板G之處理。此後，使用熱處理系統塊25之冷卻單元 (COL)來進行冷卻處理。 15 其次’從運送臂5a把基板G交給運送裝置30，藉運送麥 置30將基板G運送至抗蝕劑塗佈處理單元(CT)，俟進行了抗 蝕劑之塗佈處理之後，依序用減壓乾燥處理單元(VD)來進 行減壓乾燥處理，及用邊緣去除器（ER)來進行基板周緣之 抗独劑去除處理。 20 接著，將基板G交給運送裝置40，藉該運送裝置4〇將基 板G交給垂直運送單元7之運送臂。然後，用熱處理系統塊 26中之預烘焙單元(PREBAKE)來進行加熱處理之後，使用 熱處理糸統塊29中之冷卻单元(COL)來進行冷卻處理。接 著，使用擴展式冷卻單元(EXTCOL)35將基板G加以冷卻處 17 理’同時藉露光裝置將之加以露光處理。 接著，透過垂直運送單元8及7之運送臂，將基板G運送 至熱處理系統塊29之後露光烘焙單元(PREBAKE)，俟在此 處進仃了加熱處理之後，藉冷卻單元(c〇L)來進行冷卻處 理。然後透過垂直運送單元7之運送臂，在顯像處理單元 (DEV)中一邊將基板G略水平地運送，一邊進行顯像處理、 漂洗處理及乾燥處理。 10 接著，藉由垂直運送單元6之運送臂如，從熱處理系統 塊28中之最下段父接基板G，難處理线塊或27中之後The cassette station 2 is provided between the cassette C and the processing section 3, and is provided with a transport mechanism 1 () for transporting the LCD substrate. In addition, the EC will be carried in and out at the Kakun Station]. In addition, the transport mechanism 10 is provided with a transport fu that can move on the transport path 12 (provided in the direction of the card E). That is, the substrate is transferred between the card EC and the processing unit 3 by the transfer arm 1b. In the processing section 3, an upstream section 3b is provided, each of which is disposed along the direction of 处理 including an anti-agent coating treatment sheet ^; and a downstream section is provided with a development processing unit (DEV). Of each processing unit. 14 200416792 In the upstream part 3b, at the end of the side of the cassette station 2 is provided: an excimer UV processing unit (e-uv) 19, which is used to remove organic matter on the substrate G from the cassette station 2; And a scrubber cleaning processing unit (SCR) 20, which applies a cleaning treatment to the substrate with a cleaning brush. 5 Next to the scrubber cleaning processing unit (SCR) 20, heat treatment system blocks 24 and 25 are arranged, which are stacked on the glass substrate G in multiple layers for thermal processing. Between these heat treatment system blocks 24 and 25, a vertical conveying unit 5 is arranged, and the conveying arm 5a is made to be movable in two directions and horizontally, and is rotatable in the direction of Θ. Each of the heat treatment system units in the middle 10 is accessed to carry the substrate G. The vertical transport unit 7 also has the same configuration as the vertical transport unit 5. As shown in FIG. 2, the heat treatment system block 24 is sequentially laminated from below: a two-layer baking unit (BAKE), which is a substrate G that is subjected to a heat treatment before a resist is applied; an adhesion unit (AD), which is subjected to a hydrophobic treatment with HMDS gas. On the one hand, in the heat treatment system block 25, the following layers are sequentially stacked: a transport device 30; a two-layer cooling unit (COL) for applying a cooling treatment to the substrate G; an adhesion unit (AD); and adjacent to the heat treatment system 25 The anti-money agent treatment block 15 is extended in the X direction. This resist processing block 15 is provided with: a 20 resist coating processing unit (CT) for applying a resist to the substrate G; Drying unit (VD); a side remover (ER) that removes the resist on the peripheral portion G of the substrate G. Here, the resist processing block 15 is provided with a sub-arm (not shown) moving from the resist coating processing unit (CT) to the side remover (ER); that is, using this sub-arm, The substrate 15 is transported in the agent processing block 15 200416792. A heat treatment block 26 having a plurality of layers adjacent to the resist processing block 15 is provided. In this heat treatment system block 26, three layers of pre-baking units (PREBAKE) for heat-treating the substrate g with resist coating are laminated, and a conveying device 40 is provided below. 5 In the downstream part 3C, as shown in FIG. 3, a heat treatment system block 29 is provided on the mesial surface part 4, and here, the layers are sequentially stacked from the bottom: the cooling unit (c0l); the second layer is exposed and baked Unit (PEBAKE), which is used to perform heat treatment before exposure processing before exposure. A development processing unit (DEV) adjacent to the heat treatment system block 29 for development 10 processing is extended in the X direction. Next to this development processing unit (DEV), heat treatment system blocks 28 and 27 are arranged; between these heat treatment systems 28 and 27, the structure is the same as that of the vertical transport unit 5 described above; and a " T pair The vertical transport unit 6 accessed by each of the two heat treatment system units in 28 and 27. An i-line processing unit (i_UV) 33 is provided, which is adjacent to the development processing unit 15 (DEV). In the heat treatment system block 28, a cooling unit (COL) and a two-layer post-baking unit (POBAKE) that heat-processes the substrate G after development are laminated in this order. On the one hand, the heat treatment system block 27 is also the same, and is laminated in this order from the bottom: a cooling unit (C0L); a two-layer post-baking unit (ρ〇ΒΑΚΕ). 20 In the interface portion 4, a Titler and a peripheral exposure unit (Titler / EE) 22 are provided on the front side, and an extended cooling unit 35 is provided adjacent to the vertical transport unit 7; and a buffer is disposed on the back side Box 34; Between these Titi ^ and peripheral exposure unit (Titler / EE) 22 and extended cooling unit (EXTCOL) 3 5 and exposure unit 32 (adjacent to buffer box 34), a base 16 200416792 Vertical transfer unit 8 for board G transfer. This vertical transfer unit 8 also has the same configuration as the vertical transfer unit 5 described above. (Coating development processing process) The processing process of the coating development processing apparatus 丨 constructed as described above will be described. First, the cassette (:: substrate G inside is transported to the upstream portion 3b. In the upstream portion 3b, the excimer UV processing unit (e-UV) 19 is used to perform the processing of the noodle properties and organic removal; secondly, In the scrubber cleaning processing unit (SCR) 20, the substrate G is transported approximately horizontally while being cleaned and dried. Then, in the lowermost part of the heat treatment system block 24, the vertical transport unit is placed in the vertical direction. Take out the substrate G from the conveying arm%; use the bake unit (block) of the heat treatment system block 24 to heat process, and use the adhesion unit (AD) to improve the adhesion between the glass substrate G and the resist film, and perform HMDS gas The process of spraying on the substrate G. Thereafter, the cooling unit (COL) of the heat treatment system block 25 is used for cooling processing. 15 Next, the substrate G is transferred from the transfer arm 5a to the transfer device 30, and the substrate G is transferred by the transfer device 30. Transported to the resist coating processing unit (CT), and after the resist coating process was performed, the vacuum drying processing unit (VD) was used to perform the vacuum drying process in order, and the edge remover (ER) ) To remove the anti-soldering agent on the periphery of the substrate 20 Next, the substrate G is transferred to the transfer device 40, and the substrate G is transferred to the transfer arm of the vertical transfer unit 7 by the transfer device 40. Then, the pre-baking unit (PREBAKE) in the heat treatment system block 26 is used for heat treatment After that, the cooling unit (COL) in the heat treatment system block 29 is used for cooling treatment. Then, the substrate G is cooled and processed by the extended cooling unit (EXTCOL) 35, and exposed by the exposure device. Next, the substrate G is conveyed to the heat treatment system block 29 through the conveying arms of the vertical conveying units 8 and 7 and exposed to a baking unit (PREBAKE). After the heat treatment is performed here, the cooling unit (c0L) is used to The cooling process is performed. Then, the development process, the rinsing process, and the drying process are performed while the substrate G is conveyed in the development processing unit (DEV) horizontally through the conveying arm of the vertical conveying unit 7. 10 Next, the vertical For example, the transport arm of the transport unit 6 is connected to the substrate G from the bottom of the heat treatment system block 28, and it is difficult to process the wire block or 27.
火、：):口單々POBAKE)來進行加熱處理，並藉冷卻單元(⑺L) 來進行冷卻處理。然後， 容於卡匣C中。 將基板G交接於運送機構1〇後，收 (熱處理單元） 其次’根據弟4圖〜箸Q固 弟9圖，來說明本發明之基板處Ϊ 15 裝置之熱處理單元之構成。 第4圖係本發明之埶虛Fire, :): 口 单 々 POBAKE) for heating treatment, and cooling unit (⑺L) for cooling treatment. Then, it is stored in the cassette C. After the substrate G is delivered to the transport mechanism 10, it is received (heat treatment unit). Next, the structure of the heat treatment unit of the substrate processing unit 15 of the present invention will be described with reference to Fig. 4 to Fig. 9 and Fig. 9. Figure 4 shows the falsity of the present invention
…、處理I置即熱處理系統單元之一 外觀圖。熱處理系統塊24 … 刀別具有熱處理單兀。其1 之一的熱處理單元41，复古. “有：形成外殼之外箱42 ;要進ί 熱處理單元41内部之維佟 20 ^乍業日寸卸下之外蓋43 ;及用以| 入基板G之搬入口 44。a办# 熱處理單元41之内部，設有用來;5 熱基板之熱板45，熱板4 、，> _ ，係由例如鋁等之金屬所形成 並在内部設有例如電熱綠 ^ …、、、寺之未圖示之發熱機構。…, Appearance of one of the heat treatment system units. Heat treatment system block 24 ... The knife has a heat treatment unit. One of the first heat treatment units 41, retro. "Yes: to form the outer box 42; to enter the inside of the heat treatment unit 41 to maintain 20 ^ Zhaye day inch to remove the outer cover 43; and to use | into the substrate G 的 移 入口 44。a 办 # The inside of the heat treatment unit 41 is provided with a hot plate 45 for hot substrates, hot plates 4, and _, which are formed of a metal such as aluminum and are provided inside For example, electric heating green ^ ... ,, the heating mechanism not shown in the temple.
第5圖為第4圖之A 甸断面圖，係顯示熱處理單元二 内部構造者。在熱處理蕈一 几41之内部，設有處理室46及! 18 200416792 動機構51。 在處理室46内，設有熱板45，而在熱板45上則設有貫 穿孔47，此等貫穿45分別插穿有用來支持基板〇之升降鎖 48。貫穿孔數為多數，例如9個。又，在此熱板45上載置有 5用來載置基板0之支持球50。關於支持球50，即留待後述 之。升降銷48分別由保持構件49所保持著。又，在處理室 46中設有··用來搬入基板G之基板搬入口（未圖示）；取出口 57，其係在祕作業日棘出熱板45於跟基㈣切對向之 面；及取出蓋58(請參照第12圖）。在基板搬入口，設有用來 H)搬入•搬出基板G之開閉器（未圖示）。在搬入基板〇時，啟 開此開閉為，而搬人基板G後進行熱處理時關閉該開閉器。 料驅動機構51肖者，例如制氣缸。將保持構件49 一如弟5圖所示安I於氣缸52之活塞52a，藉此可使升降銷 48向，直方向升降。氣缸52即藉支持台％來安裝於外箱. 15 為熱板45之整體®，其中安裝有連結了支持球50 20Figure 5 is a sectional view of Adian in Figure 4, which shows the internal structure of the second heat treatment unit. Inside the heat treatment chamber 41, there are a processing chamber 46 and! 18 200416792 moving mechanism 51. In the processing chamber 46, a hot plate 45 is provided, and a through hole 47 is provided on the hot plate 45. These through holes 45 are respectively inserted with lift locks 48 for supporting the substrate 0. The number of through holes is many, for example, nine. A support ball 50 for mounting the substrate 0 is placed on the hot plate 45. The support ball 50 will be described later. The lift pins 48 are held by the holding members 49, respectively. In the processing chamber 46, a substrate carrying inlet (not shown) for carrying in the substrate G is provided; and an outlet 57 is provided on the side facing away from the base plate when the hot plate 45 is opened on the secret operation day. ; And remove the cover 58 (refer to Figure 12). A shutter (not shown) is provided at the substrate loading port for H) loading and unloading the substrate G. This opening / closing action is opened when the substrate 0 is carried in, and the shutter is closed when the substrate G is carried in and heat-treated. The material driving mechanism 51 is, for example, a cylinder. The holding member 49 is mounted on the piston 52a of the air cylinder 52 as shown in FIG. 5 to thereby raise and lower the lifting pin 48 in a straight direction. The air cylinder 52 is installed in the outer box by the support table%. 15 is the whole of the hot plate 45, which is connected with the support ball 50 20
…、板45之表面，載置有藉線材料來連結之支持球 浦=熱板Μ之側面祝及价，設有絲安裝線材料54之 二―*軸55係料於，例如人在操作Φ輯行手段之 對之側面（第1圖所示之箭頭符號A)、及與此側面 來安裝於由例如不銹鋼等所形成’在兩端形成有用 55 ,藉此二壯5之掛部54a。將掛部5如掛在熱板45之掛銷 911文骏於熱板45。由SUS等所形成之線材料54，由 19 200416792 5 10 於進行對於熱板45之安裝或卸下時也不會折斷而變形成可 撓性，所以可輕易進行替換作業。 支持球50 ’係由例如pEEK(聚醚醚酮）所形成。進行加 …、處理# ’熱板45之溫度大約成為6(Γ(：〜15(Γ〇。反觀， K為L &加熱到·。c也不會變形之樹月旨。此樹脂不但 可防止由熱所造叙變形，且因硬度較例如玻璃等還低， 所乂:使載置基板G也不會受損傷。又，由於此材質之熱傳 導比至屬更所以支持球5G本身之溫度不會上升到那個 程度。因此’可抑制基板G留下複製痕跡。 寺农50係對於j條之線材料54連結例如個，而這種 線材料54則在熱㈣安裝例如職。各支持⑽之間隔係 、 下為且，作成UOmm〜130mm的話更加適宜。 右作成n丨可抑制基板㈣曲，基板不會接觸於線材料 54和熱板45，也不會留下複製之痕跡。…, The surface of the plate 45 is provided with a support ball connected by a borrow line material. The side of the hot plate M is provided with a wire, and a wire installation line material 54 bis is provided. The shaft 55 is for example, for example, a person is operating. Φ The opposite side of the rowing means (arrow symbol A shown in Fig. 1) and the side that is attached to the side formed by, for example, stainless steel, etc. to form a useful 55 at both ends, whereby the second and fifth hanging portions 54a . Hang the hanging part 5 on the hot plate 45, such as 911 Wenjun on the hot plate 45. The wire material 54 formed of SUS and the like is not deformed when it is installed or removed from 19 200416792 5 10 and is flexible, so it can be easily replaced. The support ball 50 'is formed of, for example, pEEK (polyetheretherketone). Adding, processing # 'The temperature of the hot plate 45 becomes approximately 6 (Γ (: ~ 15 (Γ〇. In contrast, K is L & heating to... C will not deform the tree moon purpose. This resin is not only available Prevents deformation caused by heat, and because the hardness is lower than that of glass, for example, so that the mounting substrate G will not be damaged. Also, because the thermal conductivity of this material is more than the heat, the temperature of the ball 5G itself is supported. It will not rise to that level. Therefore, the substrate G can be suppressed from leaving traces of reproduction. The Sinon 50 series is connected to, for example, a wire material 54 of j, and this wire material 54 is installed in a hot line. The distance between the bottom and the bottom is more suitable for UOmm ~ 130mm. Making n 丨 on the right can suppress the warpage of the substrate, the substrate will not contact the wire material 54 and the hot plate 45, and there will be no traces of copying.
15 20 一 又符琛50連結於線材料54之狀態。， 圖所不’支持球50之直徑宜為〇1職〜2麵。藉此，' 基板G從熱板45和線材料辦實地保持—定之距離，從r 板不會接觸於熱板45和線材料54，也不會留下複製^ 跡二又，線材料54之最大直徑宜㈣2咖〜〇·2_ι 此耗圍’則可-面保持線材料54成可撓性之狀態，—茂 持一定之強度。15 20 A Fuchen 50 is connected to the wire material 54. The diameter of the support ball 50 shown in the figure should be 0 to 2 sides. As a result, the substrate G is kept in a fixed distance from the hot plate 45 and the wire material. The r plate will not contact the hot plate 45 and the wire material 54, and there will be no copy left. The maximum diameter should be 2 coffee ~ 0 · 2_ι This consumption 'can be-the surface to maintain the line material 54 into a flexible state,-to maintain a certain strength.
在線材料Μ之一端設有彈性體例如彈簧。此彈簧54b， 係作用為··將線材料54安裝於熱板45時使其產生—定拉 力在t拉力下，連結於線材料Μ之支持球测在熱板衫 20 200416792 上抑制其向X方向或Y方向移動，將支持球5G彼此之間隔保 持於一定，抑制基板之彎曲至最小限度。彈簧54b可用與線 材枓54同-之SUS來形成，也可用另外之金屬或塑膠等來 形成。雖未有圖示但安裝-用來収此種拉力之感測器於 線材料54也可。此時’最好設定某閾值，測定值—從此閑 值偏移即發出警告聲音。 10An elastic body such as a spring is provided at one end of the wire material M. This spring 54b is used to generate the wire material 54 when it is installed on the hot plate 45-a fixed tensile force is under t, the support ball connected to the wire material M is measured on the hot shirt 20 200416792 to suppress its direction X Move in the Y direction or Y direction to keep the distance between the support balls 5G to a certain level, and to suppress the bending of the substrate to a minimum. The spring 54b may be formed of SUS, which is the same as the wire member 54, or may be formed of another metal or plastic. Although not shown, a sensor-wire material 54 for receiving such a tensile force may be installed. At this time, it is better to set a certain threshold value, and the measured value-a warning sound will be issued when the idle value deviates. 10
第8圖，係顯示第6圖所示之熱板衫之側面圖。在側面 45a之掛鎖55，雖安裝了沒有彈簧⑽之—方的掛部％，而 在側面45b之-邊的掛銷55則安裝了有彈簧娜之—方的掛 部54a ’但相反也可。在熱板45之末齡職置緩衝器，俾 使線材料54不會在熱板45之末端被切斷也可。 15 弟V圚你用踝材料54來連結支持球5〇之工程。若要戶 材料54來連結支持球5辦，例如，在支持⑽中預^ 可讓線材料54穿過之大小的孔他。將線材料54穿$ .以用來固定支持球5〇。此時，例如可藉黏合劑來固 也可在支持球5〇之兩端形成鉚接部(變形部cau丨Fig. 8 is a side view showing the hot shirt shown in Fig. 6; Although the padlock 55 on the side 45a is installed with a spring-shaped square hanging portion%, and the side pin 45-side of the hanging pin 55 is installed with a spring-shaped square hanging portion 54a ', but the opposite is also possible . At the end of the hot plate 45, a post buffer may be provided so that the wire material 54 is not cut at the end of the hot plate 45. 15 Brother V: You use the ankle material 54 to connect the support ball 50. If the material 54 is to be connected to the support ball 5, for example, in the support frame, a hole of a size that allows the line material 54 to pass through is predicted. Thread material 54 is used to secure the support ball 50. At this time, for example, it can be fixed by an adhesive, or riveting portions (deformed portions cau 丨) can be formed at both ends of the support ball 50.
，藉此加以固定也可。藉此，可抑制支持球叫 板45上移動。-將支持球麵定，即把線材料^之 彎以形成掛部54a。 " ^ 闯，木況明丰發明基板處理裝置 處理單元之動作。 & 基板G係藉由運送f5a〜7a從搬人叫搬入於 46。基板G一搬入於處理室扑，降銷48即上升 化〜城收基板G，交給基板G之運送仏〜如隨:退 21 10 15 2〇 運适臂5&〜％一退回，升 安=r—。在此狀態下進=於— 置部。如二:放大：基板城載置在支持球50上時之鸯 物之間因自Γ而產支持球5G上之基糾，係在支持 之間隔而不同。亦=二此彎曲之程度係依支軸 板〇之自重愈大，-曲二間隔愈廣，在其間之基 隔變為狹窄，在y純：。又，反之，料持球50之間 产甘 在支持球間之自重即變小，彎曲也變小。若 =:地=球5。彼此之間隔變廣，則在其他地點間隔 乍 就疋，支持球50彼此之間隔非一定的話美板G =曲也變為依場所而不同。結果，依其場所而基板之彎 /分料過大’討能與線材料54或熱板&接觸。接觸 =之線材料54和熱板45，分別以⑽，料之金屬作為 ，’。此等金屬之熱容量比PEEK等之樹脂還大，而線材料 54和熱板45，财加熱時其溫度㈣比支持轴還高。因 此’雖只接觸於支持球5()時不會留下複製之痕跡，但接觸 於、騎料54或熱板時變為會在基板G留下複製之痕跡。若依 本只’則由於支持球5()彼此之間隔被保持為一定， 而即使是基板G巾彎曲最大之部位，衫會接觸於線材料m 或熱板45，複製之痕跡也不會留下。To fix it. Thereby, it is possible to suppress the support ball 45 from moving. -Fix the support sphere, that is, bend the wire material ^ to form the hanging portion 54a. " ^ Break, Mu Kuang Mingfeng invented the substrate processing device processing unit operation. & The substrate G is carried in from 46 to 46 by transferring f5a to 7a. As soon as the substrate G is moved into the processing chamber, it will rise when the pin 48 is lowered. ~ The substrate G will be collected and delivered to the substrate G for transportation. ~ If it follows: Retreat 21 10 15 2〇 The transport arm 5 & = r—. In this state, advance = at — place. Such as two: Zoom in: When the substrate city is placed on the support ball 50, the base correction on the support ball 5G is generated from Γ, which is different in the support interval. Also = the degree of this bending is according to the greater the weight of the fulcrum plate 0, the wider the interval of -2, the interval between them becomes narrow, and in y :. On the other hand, the weight between the ball holding 50 and the weight between the supporting ball becomes smaller and the bending becomes smaller. If =: Ground = Ball 5. If the distance between each other is widened, the interval between other locations may be different. If the interval between the support balls 50 is not constant, the US plate G = song will also be different depending on the location. As a result, the bending / distribution of the substrate is too large depending on the location, so that it can come into contact with the wire material 54 or the hot plate & The contact wire material 54 and the hot plate 45 are made of ⑽ and metal, respectively, ′. The heat capacity of these metals is greater than that of resins such as PEEK, and the temperature of the wire material 54 and the hot plate 45 is higher than that of the support shaft when the material is heated. Therefore, although it does not leave a trace of copying when it is only in contact with the support ball 5 (), it does not leave a trace of copying on the substrate G when it is in contact with the material 54 or the hot plate. If it is according to this, because the distance between the support balls 5 () is kept constant, even if the part of the substrate G towel is most bent, the shirt will contact the thread material m or the hot plate 45, and the traces of copying will not remain. under.
第12圖，係顯示交換支持球時之狀態。啟開一安裝在 外箱42之外蓋43及一安裴在處理室46之取出口 57之取出蓋 58，取出熱板45於熱處理單元41之外。卸下該掛在所取出 來之熱板45側面45a及45b的掛銷55之掛部54a，藉此從熱板 22 45卸下支持球50及線材料54。將要重新安裝之支持球刈及 線材料54之掛部54a，掛在熱板45之各側面45a及45b之掛銷 55。若就10條之線材料54進行此作業，則結束支持球刈及 線材料54之交換。支持球5〇及線材料54之交換一終了，即 5再將熱板45收容於處理室46内，關閉取出蓋58及外蓋43。 像^樣，在掛部54a之安裝•卸下，可輕易交換支持球5〇， 提南維護性。 (弟一貫施形態） 根據第13圖〜第15圖，說明本發明基板處理裝置之熱 馨 1〇處理單元之第二實施形態。 … 首先，說明構成。第13圖為熱板之概略圖。在熱板幻 之側面45a及45b，將安裝有例如10個掛銷55之安裝板外保 持於安裝板保持部60。 第Μ圖為關於安裝板59之斜視圖。在安裝板％之表 15 2 ’以等間隔開穿有用來安裝掛銷55之孔61。於此孔㈣ 衣掛銷55，使用例如黏合劑來固定之。 女衣板保持部60，係藉由例如未圖示之螺絲等來固定 _ 於熱糾5之側面45a及45b。當然，與熱板一體地形成也無 ★第13圖所7^ ’ *裝板保持部6錄用以保持安裝板分 之上面59a除外之五面，藉此使絲板％確實地^產生位移。 其次，根據第15圖來說明作用。 第15圖係從處理室及外箱取出熱板時之側面圖。卸下 由熱板45之側面45a及45b所保持著之安襄板％，藉此從执 板邱下支持球50及線材_。將要重新安裝之支持球％ 23 200416792 及線材料54之掛部％安裝在安襞板59之掛鎖％，把安裝板 59分別安裝於安裝板保持部6()。在此作業下，結束支持球 50及線材料54之交換。將各掛部％預先掛在安裝板％之掛 鎖55，藉此可將支持球5〇及線材料Μ一次同時從熱板衫脫 5 離’從而有助於維護之提高。 本發明並不限定於以上說明的實施形態，可做各種之 變形。 例如如第16圖所示，上述第一及第二實施形態所述 之支持球50及線材料54，係將溶解樹脂你堯注於例如塑模 10 62來賴’藉此—體地製作以作為支持球部咖及線材料部 63b。洗注之樹脂宜為咖轉之耐熱性樹脂。藉此，製作 變為容易。 又，如第17圖所示，設置凹部64以便支持球％之一部 ^不留間隙地載置於熱板45上也可。若將熱板衫，例如進 15行成型加工，並將對應於凹部64之部分預先形成於塑模， 則可輕易地作出凹部64。如此，則在載置支持球_，、可 防止支持球50在熱板45上移動。藉此，可將支持球％彼此 之間隔保持於—定，抑制基板G之彎曲至最小限度。又，可 防止基板G受傷。 20 又，如第18圖所示，將掛銷55安裝在表面上也可。第 18⑷圖，係顯示把第_實施形態變形之情形。即，將掛: 安裝在熱板45之表面的情形。第18(b)圖，係顯示把第二實 施形態變形之情形，即，將掛銷55安裝於安裂板59之二 的情形。藉此可節省線材料54之長度。 24 又’如第19⑷圖所示，使關筒形之支持構件65a，作 為在熱板45上支持基板G之構件也可。支持構件-之跟熱 狄接觸之面.，係平坦之圓形。藉此，可防止在熱板45 :移動。第剛圖，係、顯示使用其上部為曲面形之支持構 的，作為支持基板G之構件的情形。支持構件批跟基板 ^接觸部’係形成曲面。此時’與熱㈣接觸之祕地 。樣形成平坦。觀，可防止在触Μ场動。支持構件 10 ，係與支持球50同樣由例如職所形成。又，藉由成 i加工，與線材料一體地形成也可。 上述實施形態，雖就用熱處理塊24〜29來加熱基板G 4進仃了口兄明’但冷卻基板G之實施也可適用本發明。 〇、’於黏著處理和塗佈抗_等處理中進行加熱等時，也 可適用。 (第三實施形態） 15 此 其 其 ^圖為抗钱劑塗佈·顯像處理系統1〇〇之平面圖 劑塗佈•顯像處理系統⑽，包含有：卡£站101 系用以載置收容有多數個基板G之卡gc ;處理㈣2，其 20Figure 12 shows the state when the support ball is exchanged. Open a cover 43 mounted on the outer box 42 and a take-out cover 58 of an outlet 57 of the processing chamber 46, and take out the hot plate 45 outside the heat treatment unit 41. The hanging portion 54a of the hanging pin 55 hanging on the side surfaces 45a and 45b of the taken-out hot plate 45 is removed, thereby removing the support ball 50 and the wire material 54 from the hot plate 22-45. The hanging portions 54a of the ball and wire material 54 to be reinstalled are hanging on the hanging pins 55 on the sides 45a and 45b of the hot plate 45. If this operation is performed with respect to the ten line materials 54, the support of the ball and line materials 54 is ended. At the end of the exchange of the support ball 50 and the wire material 54, that is, the hot plate 45 is housed in the processing chamber 46, and the removal cover 58 and the outer cover 43 are closed. As such, the installation and removal of the hanging portion 54a can easily exchange the support ball 50, which improves maintenance. (Consistent application mode) The second embodiment of the thermal processing unit 10 of the substrate processing apparatus of the present invention will be described with reference to Figs. 13 to 15. … First, the structure will be explained. Fig. 13 is a schematic view of a hot plate. On the side surfaces 45a and 45b of the hot plate, the mounting plate holding portion 60 is held outside the mounting plate to which ten hanging pins 55 are mounted, for example. Figure M is a perspective view of the mounting plate 59. In the table 15 2 'of the mounting plate, holes 61 for mounting the hanging pins 55 are formed at regular intervals. The clothes hanging pin 55 is fixed in this hole using, for example, an adhesive. The clothing board holding portion 60 is fixed to the side surfaces 45a and 45b of the thermal correction 5 by, for example, screws (not shown). Of course, it does not need to be formed integrally with the hot plate. ★ The mounting plate holding portion 6 shown in Fig. 13 is used to hold the five sides except the upper surface 59a of the mounting plate, thereby causing the wire plate% to be reliably displaced. Next, the function will be described with reference to FIG. 15. Fig. 15 is a side view when the hot plate is taken out from the processing chamber and the outer box. The Anxiang board% held by the sides 45a and 45b of the hot plate 45 is removed, thereby supporting the ball 50 and the wire from the bottom of the board. The supporting ball% 23 200416792 and wire material 54 to be reinstalled are mounted on the padlock% of the mounting plate 59, and the mounting plates 59 are respectively mounted on the mounting plate holding portions 6 (). With this operation, the exchange of the support ball 50 and the line material 54 is ended. Each of the hanging portions% is hung in advance on the padlock 55 of the mounting plate%, whereby the support ball 50 and the thread material M can be detached from the hot shirt at the same time at once, thereby contributing to the improvement of maintenance. The present invention is not limited to the embodiments described above, and various modifications can be made. For example, as shown in FIG. 16, the support ball 50 and the thread material 54 described in the above first and second embodiments are based on dissolving resin in, for example, a mold 10 to 62. As the supporting ball portion coffee and thread material portion 63b. The injection resin should preferably be a heat-resistant resin. Thereby, production becomes easy. In addition, as shown in FIG. 17, a recessed portion 64 may be provided so as to support one portion of the ball%, and it may be placed on the hot plate 45 without leaving a gap. If the hot shirt is subjected to, for example, 15 molding processes, and a portion corresponding to the recessed portion 64 is formed in advance in a mold, the recessed portion 64 can be easily made. In this way, when the support ball _ is placed, the support ball 50 can be prevented from moving on the hot plate 45. Thereby, the interval between the support balls% can be kept constant, and the warpage of the substrate G can be suppressed to a minimum. In addition, the substrate G can be prevented from being injured. 20 As shown in FIG. 18, the hanging pin 55 may be mounted on the surface. Fig. 18 (a) shows a situation in which the _th embodiment is deformed. That is, it is to be hung: when it is mounted on the surface of the hot plate 45. Fig. 18 (b) shows a case where the second embodiment is deformed, that is, a case where the hanging pin 55 is mounted on the safety plate 59bis. This can save the length of the wire material 54. 24 'As shown in FIG. 19 (a), the support member 65a having a closed cylindrical shape may be used as a member for supporting the substrate G on the hot plate 45. The supporting member-the contact surface with the heat, is a flat circle. Thereby, movement on the hot plate 45: can be prevented. The first figure shows a case where a supporting structure having a curved shape at the upper portion is used as a member supporting the substrate G. The support member and the substrate ^ contact portion 'form a curved surface. At this time ’the secret place of contact with the heat. The sample is flat. Observation can prevent movement in the M field. The support member 10 is formed by, for example, a job similarly to the support ball 50. In addition, it may be formed integrally with the wire material by forming processing. In the above-mentioned embodiment, although the substrate G 4 is heated by using the heat treatment blocks 24 to 29, the present invention can be applied to cooling the substrate G. 〇, 'can also be applied when heating or the like in an adhesion treatment, an anti-coating treatment, or the like. (Third Embodiment) 15 This figure is a plan-coating agent coating and developing processing system of an anti-molding agent coating and developing processing system 100, which includes: card station 101 is used for placing Card gc containing a plurality of substrates G; processing ㈣2, which 20
Si:，個處理單元以用來對基板G施行包括抗钱劑塗 _'、内之—連串處理；及介面部1〇3’其係在與未圖 不t露裝置之間進行基板G之交接。其中，在處理部呢之 兩立而刀別配置切站101及介面部103。 夕问卡&站⑻，備有運送機構110以用來在卡£(：與處理部 搬二進:，G之運送。而且，於卡進行卡欧 又，運送機構110備有可在運送路110a上移動 25 200416792 之運送臂ill，該運送路11Ga係'沿著卡E之排列方向而設置者。 處理部102 ’係區分為前段部1〇2、中段部i〇2b及後段 部l〇2c，分別在中央具有運送路112、113、ιΐ4，而在此等 運送路之兩側則配設有各處理單元。而且’在此等之中間 5 設有中繼部115、116。 前段部102a，備有可沿著運送路112移動之主運送裝置 11°其中運运路112之-方侧配置有兩個洗淨處理單元(scr) 121a、121b ’而在運送路ι12之另—方侧則配置有：把紫外 線照射單元(UV)及冷卻板單元(C0L)堆起成二層之處理塊 # 125 ;把熱板單元(HP)堆起成二層之處理塊126 :及把冷卻 板單元(COL)堆起成二層之處理塊127。又，關於冷卻板單 元(COL)及熱板單元(HP)之構造，待在後文詳述之。 又，中I又部102b，備有可沿著運送路113移動之主搬運 送裝置118。其中，在運送路113之一方側成一體地構成有 抗姓I塗佈處理單元(CT) 122、減壓乾燥處理單元㈤） 14 0及用來除去基板G周緣部之抗钱劑的周緣抗餘劑除去 單凡(邊緣去除; ER) 123，以構成塗佈處理系統單元群。 φ 按妝此塗佈系統處理群，待用抗蝕劑塗佈處理單元(CT) I〕] 來塗佈抗钱劑於基板G之後，運送基板G至減壓乾燥處理單 2〇元(VD)140，加以乾燥處理，然後，藉邊緣去除器㈣123 來進行周緣部抗蝕劑除去處理。 在運送路II3之另-方侧，配置有：堆起二層熱板單元 (HP)而成之處理塊128、上下堆起熱板單元(Hp)及冷卻板單 元(COL)而成之處理塊129、及上下堆起黏著處理單元⑽） 26 及冷卻板單元(COL)而成之處理塊130。 而且，後段部102c備有可沿著運送路移動主運送裝置 119。其中·在運送路114之一方側，備有三個顯像處理單 元(DEV) 124a、124b、124c ;而在運送路114之另一方側則 備有堆起一層熱板單元(HP)而成之處理塊丨31、及上下堆起 熱板單元(HP)及冷部板單元(c〇L)而成之處理塊132、133。 又，處理部102，係夾著運送路而在一方側只配置有洗 淨處理單元(SCR) 121a、抗蝕劑塗佈處理單元(CT) 122、減 壓乾燥處理單元(VD) 140、邊緣去除器（ER) 123、如顯像處 理單兀(DEV) 124a—般之旋轉器單元，而另一方側則只配 置有熱板單元(HP)及冷卻板單元(c〇L)等之熱系統處理單 元。又，在中繼部115、116之旋轉器系單元配置側之部分， 配置有藥液供給單元134，更且，設有用來進行主運送裝置 之維護的空間135。 主運送裝置117、118、119,分別備有水平面内二方向 之x軸驅動機構、Y軸驅動機構、及垂直方向之Z軸驅動機 構，更且，備有以z轴為中心旋轉之旋轉驅動機構，同時分 別具有用來支持基板G之臂。 主運送裝置117具有運送臂117a，其機能為：在與運送 機構110之運送臂111間進行基板G之交接；同時對於前段部 102a之各處理單元進行基板G之搬入·搬出；及在與中繼部 115之間進行基板G之交接。又，主運送裝置118具有運送臂 118a，其機能為：在與中繼部115之間進行基板G之交接· 同呀對於中段部l〇2b之各處理單元進行基板G之搬入·搬 200416792 出，及在與中繼部116之間進行基板g之交接。更且，主運 送裝置U9具有運送臂119a，其機能為：在與中繼部ιι6之 間進行基板G之交接；同時對於後段部1〇2(^之各處理單元進 行基板G之搬入·搬出；及在與介面部1〇3之間進行基板G 5之交接。又，中繼部115、116也可作為冷卻板作用。 介面部103，備有··分機136，其係在與處理部1〇2之間 交接基板時暫時保持基板；兩個緩衝板構件137，其係用來 配置設在其兩側之緩衝匣；及運送機構138，其係在它們與 I光衣置（未圖示）之間進行基板G之搬入·搬出。運送機構 1〇 U8備有運送臂139,其係可在沿著分機136及緩衝板構件之 排列方向而設置的運送路138&上移動；藉由此運送臂ι39， 在處理單元102與露光裝置之間進行基板〇之運送。 像這樣，將處理單元彙集成一體化，藉此可謀求省空 間化及處理之效率化。 在如此構成之抗蝕劑塗佈·顯像處理系統1〇〇方面，將 卡昆C内之基板G運送至處理部1〇2，於處理部ίο]，首先用 則段部102a之處理塊125之紫外線照射單元(uv)來進行表 面改質·洗淨處理，待用冷卻板單元(c〇L)來冷卻之後，藉 先’爭處理單元(scR)121a、121b來施行清潔洗淨，待用處理 塊126之任一熱板單元(HP)來加熱乾燥之後，藉處理塊127 之任一冷卻板單元(COL)來冷卻。 其後，將基板G運送至中段部l〇2b，為了提高抗餘劑之 固疋性，而用處理塊13〇上段之黏著處理單元(AD)來疏水化 處理（HMDS處理）之後，用下段之冷卻板單s(c〇L)來冷 28 200416792 將抗14劑塗佈 卻。接著，於抗蝕劑塗佈處理單元(CT)122 於基板G。 按照此抗蝕劑塗佈工程，例Si: a processing unit for performing a series of processing including anti-money coating on the substrate G; and an internal surface 103 ′, which performs the substrate G between the device and the exposed device Handover. Among them, the cutting station 101 and the interface surface 103 are arranged in the processing section. Evening card & station, there is a transport mechanism 110 for transporting the card at the card (: and moving into the processing department :, G. Also, the card is transported on the card, and the transport mechanism 110 is available for transport A transport arm ill of 25 200416792 is moved on the road 110a, and the transport path 11Ga is provided along the arrangement direction of the card E. The processing unit 102 'is divided into a front section 102, a middle section 102, and a rear section 1. 〇2c, there are conveying paths 112, 113, ιΐ4 in the center, and processing units are arranged on both sides of these conveying paths. And 'relays 115 and 116 are provided in the middle 5 of these. The section 102a is provided with a main conveying device 11 ° which can be moved along the conveying path 112. Two cleaning processing units (scr) 121a and 121b are arranged on the-side of the conveying path 112, and the other on the conveying path 12- On the side, there are: a processing block of 125 stacked with ultraviolet irradiation unit (UV) and cooling plate unit (C0L); a processing block of 126 stacked with hot plate unit (HP); and The cooling plate unit (COL) is stacked into two layers of processing blocks 127. Also, regarding the structure of the cooling plate unit (COL) and the hot plate unit (HP), The main part 102b is provided with a main conveying device 118 that can move along the conveying path 113. Among them, an anti-surname I coating process is integrally formed on one side of the conveying path 113. Unit (CT) 122, reduced-pressure drying processing unit ㈤) 14 0 and peripheral anti-reagent remover Danfan (edge removal; ER) 123 for removing the anti-money agent on the peripheral edge portion of the substrate G to constitute a coating processing system unit group. φ According to the processing system of the coating system, wait for the resist coating processing unit (CT) I]] to apply the anti-money agent to the substrate G, and then transport the substrate G to a reduced-pressure drying treatment unit for 20 yuan (VD ) 140, drying treatment is performed, and then the peripheral edge resist removal processing is performed by the edge remover ㈣123. On the other side of the transport path II3, a processing block 128 formed by stacking a two-layer hot plate unit (HP), and a processing formed by stacking a hot plate unit (Hp) and a cooling plate unit (COL) up and down are arranged. Block 129, and a processing block 130 formed by stacking the adhesive processing unit (i) 26 and the cooling plate unit (COL). Further, the rear section 102c is provided with a main transport device 119 that can move along the transport path. Among them, three developing processing units (DEVs) 124a, 124b, and 124c are provided on one side of the transport path 114, and a hot plate unit (HP) is stacked on the other side of the transport path 114. The processing block 31, and the processing blocks 132 and 133 formed by stacking the hot plate unit (HP) and the cold plate unit (c0L) up and down. In addition, the processing unit 102 has only a cleaning processing unit (SCR) 121a, a resist coating processing unit (CT) 122, a reduced pressure drying processing unit (VD) 140, and an edge disposed on one side across the transport path. Remover (ER) 123, a spinner unit like a development processing unit (DEV) 124a, while the other side is only equipped with heat from a hot plate unit (HP) and a cooling plate unit (c〇L) System processing unit. A medicinal solution supply unit 134 is disposed on a portion on the side where the rotator system unit of the relay units 115 and 116 is disposed, and a space 135 is provided for performing maintenance on the main transport device. The main conveying devices 117, 118, and 119 are respectively provided with an x-axis drive mechanism, a Y-axis drive mechanism, and a vertical Z-axis drive mechanism in two directions in a horizontal plane, and a rotary drive that rotates around the z-axis as a center. The mechanisms each have arms for supporting the substrate G. The main conveying device 117 has a conveying arm 117a, and its function is to transfer the substrate G to and from the conveying arm 111 of the conveying mechanism 110; at the same time, carry in and out the substrate G to each processing unit of the front section 102a; The relays 115 transfer the substrate G. In addition, the main conveying device 118 has a conveying arm 118a, and its function is to transfer and transfer the substrate G to and from the relay unit 115. Also, to transfer and transfer the substrate G to and from each processing unit of the middle section 102b, 200416792 And handing over the substrate g to and from the relay section 116. In addition, the main conveying device U9 has a conveying arm 119a, and its function is to transfer and transfer the substrate G between the relay unit ιι6 and the substrate G in and out of each processing unit in the rear section 102 (^). And transfer of the substrate G 5 to the mesas section 103. The relay sections 115 and 116 can also serve as cooling plates. The mesas section 103 is equipped with an extension 136, which is connected to the processing section. The substrate is temporarily held when the substrate is handed over between 102; two buffer plate members 137, which are used to configure buffer boxes disposed on both sides thereof; and a transport mechanism 138, which is connected between them and the I-coat (not shown) (Shown) to carry in and out of the substrate G. The transport mechanism 10U8 is equipped with a transport arm 139, which can move on the transport path 138 & provided along the arrangement direction of the extension 136 and the buffer plate member; This conveying arm ι39 conveys the substrate 0 between the processing unit 102 and the exposure apparatus. By integrating the processing units in this way, it is possible to save space and improve the efficiency of processing. The resist structured in this way The agent coating and development processing system 100 will The substrate G in Carcun C is transported to the processing section 102. In the processing section, the first step is to use the ultraviolet irradiation unit (uv) of the processing block 125 of the section section 102a to perform surface modification and cleaning treatment. After cooling the cooling plate unit (c0L), use the scramble processing unit (scR) 121a, 121b to perform cleaning and washing, and then use any hot plate unit (HP) of the processing block 126 to heat and dry. The cooling plate unit (COL) of the processing block 127 is used for cooling. After that, the substrate G is transported to the middle section 102b. In order to improve the solidity of the residual agent, the adhesion processing unit of the upper section of the processing block 13 is used. (AD) after the hydrophobization treatment (HMDS treatment), the cold plate sheet s (c0L) in the lower stage is used to cool 28 200416792 to apply the anti-14 agent. Then, in the resist coating treatment unit (CT) 122 on the substrate G. According to this resist coating process, for example
一 ^例如將抗蝕劑液供給基板G 前，先對基板G供給稀_，使基板此料表面錢劑液 5之潤濕性提高，其後，從用來吐出抗钱劑液之喷嘴，供應 給定量之抗#劑液至基板G之表面中心，以給定之速度使基 板G旋轉，藉此把抗軸液向外周擴展。藉此形成抗钱膜。For example, before supplying the resist solution to the substrate G, first supply the substrate G with a thin film to improve the wettability of the agent liquid 5 on the surface of the substrate, and thereafter, from the nozzle for ejecting the agent liquid, A given amount of the anti- # agent solution is supplied to the center of the surface of the substrate G, and the substrate G is rotated at a given speed, thereby expanding the anti-axis fluid to the outer periphery. This forms an anti-money film.
將塗佈有抗蝕膜之基板(3，運送至減壓乾燥處理單元 (VD)140，在那裡施行減壓處理，其後將之運送至邊緣去除 10器（ER)123，進行基板G周緣部之抗蝕劑之去除。其後，用 中段部102中之熱板單元(HP)之一個來預烘處理，藉處理塊 129或130之下段冷部板單元(cql)來冷卻。The resist-coated substrate (3) is transported to a reduced-pressure drying processing unit (VD) 140, where the reduced-pressure treatment is performed, and then it is transported to an edge removal device (ER) 123 to perform the periphery of the substrate G Removal of the resist in the section. Thereafter, one of the hot plate units (HP) in the middle section 102 is used for pre-baking treatment, and the cooling block plate (cql) in the lower section of the processing block 129 or 130 is used for cooling.
其次，藉主運送裝置119從中繼部116透過介面部丨〇3運 送基板G至露光裝置，在那裡露光成給定之圖案。然後，再 15透過介面部103搬入基板G，依其需要而用後段部i〇2c之處 理塊131、132、133之任一熱板單元(HP)來施行後露光烘焙 處理之後，藉顯像處理單元(DEV)124a、124b、124c任一來 施行顯像處理，形成給定之電路圖案。 藉由後段部102c之任一熱板單元(HP)，將已顯像處理 2〇 過之基板G施予後烘處理之後，用任一個冷卻板單元(c〇L) 來冷卻，藉主運送裝置丨19、118、117及運送機構110來收 容於卡匣站101上之給定匣C。 其次，就熱板單元(HP)之構造詳述之。第21圖係顯示 熱板單元(HP)之概略構造的平面圖（a)、正面圖（b)、斷面圖 29 200416792 (c)(平面圖⑷中所示之A-A斷面圖）。熱板單元(Hp)備有：外 殼211 ;設在外殼211内部之熱板151 ;貫穿外殼211及熱板 151而設置之升降銷156;使升降銷156上下移動之銷驅動裝 置157 ;及設在外殼211上之排氣蓋221。 5 10 在外殼221之正面，設有窗部212，其係作為讓運送臂 1173〜119&存取之用，以便可在運送臂11%〜11如與升降銷 156間進行基板G之交接。此窗部丨2係在開閉器2丨3之作用下 成為開閉自如，而開閉器213之開閉驅動則藉開閉器驅動裝 置214來進行。在外殼211之背面（後部侧面），設有窗部]^， 其係藉門扉構件216來自由開閉，以便進行外殼211内部之 維護專時’作業員可對外殼211之内部存取。Next, the main conveyance device 119 conveys the substrate G from the relay section 116 through the mesial surface to the light exposure device, where the light is exposed to a given pattern. Then, 15 is carried into the substrate G through the mesial surface portion 103, and any one of the hot-plate units (HP) of the processing blocks 131, 132, and 133 of the rear section IO2C is used to perform post-exposure baking processing as required, and the image is then developed Any one of the processing units (DEV) 124a, 124b, 124c performs development processing to form a given circuit pattern. The substrate G that has undergone the imaging process 20 is subjected to a post-baking process by any one of the hot plate units (HP) of the rear section 102c, and then cooled by any one of the cooling plate units (c0L). 19, 118, 117 and the transport mechanism 110 to accommodate a given cassette C on the cassette station 101. Next, the structure of the hot plate unit (HP) will be described in detail. Fig. 21 is a plan view (a), a front view (b), and a sectional view showing the schematic structure of the hot plate unit (HP). 29 200416792 (c) (A-A sectional view in plan view). The hot plate unit (Hp) is provided with: a housing 211; a heat plate 151 provided inside the housing 211; a lifting pin 156 provided through the housing 211 and the hot plate 151; a pin driving device 157 for moving the lifting pin 156 up and down; and Exhaust cover 221 on the casing 211. 5 10 On the front surface of the housing 221, a window portion 212 is provided, which is used for accessing the conveying arms 1173 ~ 119 & so that the substrate G can be transferred between the conveying arms 11% ~ 11 and the lifting pins 156. This window section 2 is opened and closed freely by the shutters 2 and 3, and the opening and closing driving of the shutter 213 is performed by the shutter driving device 214. A window portion is provided on the back (side of the rear portion) of the casing 211, which is opened and closed freely by the door sill member 216, so that the operator can access the interior of the casing 211 during the maintenance period.
15 在外殼221之上面設有排氣口 217，其係從已在外殼22 内部處理過之基板G向排氣蓋221流入要蒸發·昇華之彩 質。排氣蓋22卜係與外殼211離定自如。拆氣蓋221具有努 氣路222a及排氣路222b，而在排氣蓋221之側面（第21⑷圈 中之左右側面），設有供氣D223，其係用以供給去 泰 至吸氣路222a者。供給排氣蓋221内部之空氣，__面與排泰 自外殼211之排氣口 217之蒸氣混合，—面從排氣_⑽出去。15 An exhaust port 217 is provided on the upper surface of the casing 221, which flows into the exhaust cover 221 from the substrate G which has been processed inside the casing 22, to the color to be evaporated and sublimated. The exhaust cover 22 is free from the housing 211. The gas removal cover 221 has a gas passage 222a and an exhaust passage 222b. On the side of the exhaust cover 221 (the left and right sides in the 21st circle), there is an air supply D223, which is used to supply the air to the air intake passage 222a. The air supplied into the exhaust cover 221 is mixed with the steam from the exhaust port 217 of the casing 211, and the surface is exhausted from the exhaust.
2〇 纟次，就配置在熱板單元㈣内部之熱板之構成說明 之。第22圖，係顯示熱板151之概略構造的平面圖⑷、正面 圖⑼、斷面圖⑷。此熱板⑸，備有：由未圖示之框架等 保持成略水平之板構件152;以―定_略平行地配置在板 構件⑸表φ之錄條_料153 ;制μ熱板構件⑸之 30 加熱器154。 線材料153之一端係連接於一設在板構件丨52之側面的 線材料固定夾具161。在線材料固定夾具161之上部，設有 孔（未圖示），此孔部係由蓋161a所閉塞。將線材料153之一 立而插入於此孔部後用盍l61a來閉塞此孔部，藉此固定線材 料153之一端。宜調整線材料固定夾具161之安裝位置，俾 於線材料153接觸於板構件152之部分線材料153之折斷變 小〇 於板構件152，在與設有線材料固定夾具161之侧面對 向之側面，以一定間隔安裝有彈簧保持台163a而在各彈簀 保持台163a則分別安裝有彈簧163。彈簧163之另一端係連 接於桿形之中繼構件162，線材料153之另一端也固定於此 中繼構件162。又，多數條線材料之長度為同長，以便彈筈 163大致均勻地伸長及中繼構件162可保持成大致水平，藉 此對多數條15 3施加一定之拉力。 若藉由加熱器154把板構件152加熱到給定之溫度，板 構件152則熱膨脹，若使已加熱過之板構件152冷卻，板構 件152則恢復原來之大小。儘管產生了此種板彳冓之形 狀變化’線材153之拉力也因彈簣163之伸縮量變化而保持 為-定。又，這種拉力調整機構也可作為線材153之定 位機構作用。又，不用彈簀163，而代之使用具有伸縮性= 材料(例如，橡膠等）也可。 在板構件⑸，設有在多數處(例如，第22圖為⑷向上 下貫穿之貫穿IU55，而在此貫穿孔155則嵌插有升降銷 200416792 156。此升降銷156係在銷驅動裝置157(第22圖並未圖示）之 驅動下升降自如。例如，使保持著基板(3之運送臂U7a進入 於熱板單元(HP)後，使升降銷156上升，藉此基板G從運^ 臂117a離開，由升降銷156來支持。若使運送臂117&從熱板 5單元(HP)退出後使升降銷丨56下降，基板G則接觸於張掛在 板構件152表面之線材料153而保持略水平之姿勢。 就熱板151來說，基板〇之一邊之長度即使為丨瓜，例 如，若以10cm間隔配置9條之線材料153的話，也可保持其 板G成略水平之姿勢。由線材料所支持之基板G即由來自^ 10 構件丨52之輻射熱所加熱處理。 作為線材料153用者，可適用鋼琴線等之金屬線材料和 玻璃纖維等之玻璃線材料。又，隨板構件152之最高加熱溫 度’而也可使用耐熱性石夕聚合物和？弧等之耐熱性樹脂Z 材料。線材料153之粗細宜為大約〇lmm〜lmm之範圍，以 15便從板構件152向基板G之熱輕射均一地產生。從透過線材 料153來抑制從板構件向基板G之熱傳導觀之，線材料⑸ 更加宜使用熱傳導率小者。又，線材料153，也可為自金屬 材料、玻璃材料、樹脂材料選出的二以上之材料之複合材 料所成者。 2〇 &熱板151，並不需要像習知《為了配置近接銷而在 板構件152表面進行多數孔之穿孔加工。又，不需要使用多 之近接銷數之線材料153及簡單之夾具就可支持基 板若此，即可降下熱板151之製造成本。又，線材料⑸ 之父換作業等之維護也容易，可削減維護成本。 32 5 弟23圖為-說明圖，顯示將線材料153(配置在板構件 ⑸之表面）之拉力保持—定的另―拉力調整機構⑼。 所示’線材料153之—端係連接於線材料固定夹具 161板構件152之相對向之—對側面係以—定之間隔安農 有用來定位線材料153之定位夾具164。 、 弟24圖為一斜視圖，顯示定位夾具164之構造。定位夾 、4 /、林成有溝祕之構造，其巾溝腿制以掛上 1020 times, the structure of the hot plate arranged inside the hot plate unit 说明 will be explained. Fig. 22 is a plan view ⑷, a front view ⑼, and a sectional view ⑷ showing a schematic structure of the hot plate 151. This hot plate is provided with: a plate member 152 which is maintained at a slightly horizontal level by a frame or the like not shown in the figure; a strip _ material 153 which is arranged on the plate member ⑸ table φ in a parallel manner; ⑸ 之 30 heater 154. One end of the wire material 153 is connected to a wire material fixing jig 161 provided on the side of the plate member 52. A hole (not shown) is provided on the upper portion of the wire material fixing jig 161, and the hole portion is closed by the cover 161a. One of the wire materials 153 is inserted upright into the hole portion, and the hole portion is closed with 盍 161a, thereby fixing one end of the wire material 153. It is advisable to adjust the installation position of the wire material fixing jig 161. The part of the wire material 153 that is in contact with the plate member 152 and the breakage of the wire material 153 becomes smaller. On the plate member 152, the side opposite to the side where the wire material fixing jig 161 is provided. The spring holding bases 163a are installed at regular intervals, and the spring holding bases 163a are respectively equipped with springs 163. The other end of the spring 163 is connected to the rod-shaped relay member 162, and the other end of the wire material 153 is also fixed to the relay member 162. In addition, the lengths of the plurality of lines of material are the same length so that the spring 163 is extended substantially uniformly and the relay member 162 can be maintained at a substantially horizontal level, thereby applying a certain tensile force to the plurality of lines 15 3. If the plate member 152 is heated to a given temperature by the heater 154, the plate member 152 thermally expands, and if the plate member 152 that has been heated is cooled, the plate member 152 returns to its original size. Although such a change in the shape of the plate reel is generated, the pulling force of the wire 153 is kept constant due to the change in the amount of expansion and contraction of the reel 163. This tension adjusting mechanism can also function as a positioning mechanism for the wire 153. In addition, it is not necessary to use impeachment 163, but to use elastic = material (for example, rubber, etc.) instead. The plate member ⑸ is provided at a plurality of places (for example, FIG. 22 shows the through IU 55 penetrating up and down, and a lift pin 200416792 156 is inserted in the through hole 155. This lift pin 156 is attached to the pin driving device 157 (Fig. 22 is not shown) can be lifted and lowered freely. For example, after the transport arm U7a holding the substrate (3 enters the hot plate unit (HP), the lift pin 156 is raised, whereby the substrate G is removed from the transport ^ The arm 117a leaves and is supported by the lifting pin 156. If the conveying arm 117 & is withdrawn from the hot plate 5 unit (HP) and the lifting pin 56 is lowered, the substrate G contacts the wire material 153 suspended on the surface of the plate member 152 and Maintain a slightly horizontal posture. For the hot plate 151, even if the length of one side of the substrate 0 is 丨, for example, if 9 wire materials 153 are arranged at 10 cm intervals, the plate G can be maintained in a slightly horizontal posture. The substrate G supported by the wire material is heated by the radiant heat from the ^ 10 member 丨 52. As the wire material 153, metal wire materials such as piano wires and glass wire materials such as glass fiber can be applied. Also, Depending on the maximum heating temperature of the plate member 152 A heat-resistant resin Z material such as heat-resistant stone polymer and? Arc is used. The thickness of the wire material 153 should be in the range of about 0.01 mm to 1 mm, and the heat from the plate member 152 to the substrate G is uniformly generated at 15 From the viewpoint of suppressing the heat conduction from the plate member to the substrate G through the wire material 153, it is more suitable to use a wire material with a smaller thermal conductivity. Also, the wire material 153 may be selected from metal materials, glass materials, and resin materials. A composite of two or more materials. The 20 & hot plate 151 does not need to be perforated on the surface of the plate member 152 in order to configure the proximity pin. Also, it is not necessary to use more. The wire material 153 and the simple jig can support the substrate if the number of pins is close. If this is the case, the manufacturing cost of the hot plate 151 can be reduced. In addition, the maintenance of the wire material and the father can be easily replaced, which can reduce the maintenance cost. Brother 23 is an explanatory diagram showing that the tension of the wire material 153 (arranged on the surface of the plate member ⑸) is fixed and the tension adjustment mechanism 定 is shown. The end of the 'wire material 153 shown is connected to the wire material and fixed Fixture 16 1 The plate member 152 is opposite to the opposite side at a fixed interval. Anong has positioning fixtures 164 for positioning the line material 153. Figure 24 is an oblique view showing the structure of the positioning fixture 164. Positioning clip, 4 / , Lin Cheng has a ditch secret structure, and its towel ditch legs are made to hang 10
15 線材料153於板材料16如。^位夾具164，係由易使線材料 53滑溜之_例如，含議旨等)所構成。础64b呈有 給定之㈣錢可防止、騎料⑸之折斷。在配置成跨過板 _152及定位夾具164之線材料153之另—端，安裝有給定 重量=重錘165。定位夾具164即為了以不接觸於板構件⑸ 狀心吊下垂錘165而也盡到了支持線材料⑸之角色。結 果不官板構件152之熱膨脹變化如何，可在作用於重鐘⑹ 重力下，對線材料15 3施加一定之拉力。15 The wire material 153 is such as the board material 16. The position clamp 164 is constituted by a material that makes the thread material 53 slippery (for example, including the purpose). The foundation 64b shows that the given amount of money can prevent and break the material. At the other end of the wire material 153 configured to straddle the plate _152 and the positioning jig 164, a given weight = weight 165 is installed. The positioning jig 164 fulfills the role of supporting wire material 为了 in order to suspend the drooping hammer 165 without touching the plate member ⑸. As a result, how the thermal expansion of the non-official plate member 152 changes, a certain tensile force can be applied to the wire material 153 under the gravity acting on the heavy bell.
20 在線材料I53之定位方面，如第Μ圖之斜視圖所示，在 板構件152之對向側面上側之邊緣部分，以—定之間隔形成 u刀槽，以替代定位夾具164之設置，藉此定位線材料Μ)也 可。在此切槽158也宜設曲率以便防止線材料153之折斷。 再者，如第26圖之斜視圖所示，在板構件152之表面以 一定間隔來設置直線狀之溝159，將線材料153定位，俾使 材料153(第26圖中未圖示）欲入於溝159中也可。將溝159 ^深度作成比線材料153之外徑還淺，藉此可使線材料153 坆板構件152之表面突出。例如若將溝159作成深度為 33 5 使用外徑1.2mm者作為線材料153 從板構件152之夺 、⑴線材料153 構件152^W出Μ0" ’而可使基板G不接觸於板 ^表面’_材料153來切成大略平行。溝159 不限疋於如第26圖所示之平底之形狀，曲面也無妨。 且說，若在板構件肋《這㈣159時，例如將直徑 件= 線材細嵌入於2贿深度之溝159，藉此從板構 干U2之表面離lmm之距離來支持基板g也可。然而，若比 較用外徑細之線材料來支持基板G之情形，與用外徑粗:之 線材料來支持基板G之情形，縣為後者時由於線材料愈基 板G之接觸面積變廣，而於基板G，在接觸於線材料之部分 與不接觸於線材料之部分之間易產生溫度差。因此，即使 在板構件丨52設置了溝159,就線材153來說宜使用直 mm以下者。 15 又，例如，將溝159之寬度擴至比線材料153之直徑更 廣，只把線材料I53配置於溝丨％内也可。 2020 As for the positioning of the in-line material I53, as shown in the oblique view of FIG. M, u sipes are formed at regular intervals on the edge portions on the upper side of the opposite side of the plate member 152 to replace the positioning fixture 164, thereby Positioning line material M) is also possible. The cutting groove 158 should also be provided with a curvature so as to prevent the wire material 153 from being broken. Furthermore, as shown in the oblique view in FIG. 26, linear grooves 159 are provided at a certain interval on the surface of the plate member 152, and the wire material 153 is positioned so that the material 153 (not shown in FIG. 26) is desired. It is also possible to enter the groove 159. The depth of the groove 159 is smaller than the outer diameter of the wire material 153, so that the surface of the wire material 153 and the plate member 152 can protrude. For example, if the groove 159 is made to a depth of 33 5 and an outer diameter of 1.2 mm is used as the wire material 153, the board member 152 is taken away from the plate member 152, and the wire member 153 member 152 ^ W is out of M0 and "', so that the substrate G does not contact the board surface '_Material 153 to cut into approximately parallel. The groove 159 is not limited to the flat bottom shape as shown in FIG. 26, and the curved surface is not necessary. In addition, if the plate member rib ㈣ ㈣ 159, for example, the diameter piece = wire is finely embedded in the groove 159 with a depth of 2 mm, so that the substrate g can be supported by a distance of 1 mm from the surface of the plate structure U2. However, if the case where the wire material with a small outer diameter is used to support the substrate G is compared with the case where the wire material with a large outer diameter is used to support the substrate G, when the county is the latter, the contact area of the wire material becomes wider as the substrate G becomes wider. On the substrate G, a temperature difference is likely to occur between a portion that is in contact with the wire material and a portion that is not in contact with the wire material. Therefore, even if the grooves 159 are provided in the plate member 52, it is preferable to use a wire with a diameter of less than mm. 15 For example, if the width of the groove 159 is wider than the diameter of the wire material 153, the wire material I53 may be arranged only within the groove. 20
第27圖為-說明圖，顯示將配置在板構件15表面之線 材料153之拉力保持成一定的另一拉力調整機構192。拉力 調整機構192，備有：線材料供給捲筒171，其係捲取有給 定長度之未使用之線材料153 ;線材料回收捲筒丨72，其係 用以捲取線材料153，此線材料153係拉出自線材料供給捲 筒171且跨過板構件152來配置者；線材料固定裝置173，其 係用二張之板材料等，來夾入線材料153，藉此固定保線材 料153 ;及滾輪175，其係用以防止線材料153在板構件152 之邊緣部分折彎，又，定位線材料153。線材料供給捲筒171 34 平時成為旋轉自如之狀態，而線材料回收捲筒172及線材料 固定裝置173之驅動控制，則藉控制裝置174來進行。 若依這種拉力調整機構192，則例如於線材料153，跨 過板構件152之部分劣化時，控制裝置174便解除該藉助於 5線材料固定裝置173之線材料153之固定，使之成為可從線 材料供給捲筒171送出未使用之線材料153之狀態。其次， 控制I置174驅動線材料回收捲筒172，使線材料回收捲筒 172捲取一定長度之線材料153。接著，控制裝置174，待驅 動了線材料固定裝置173以固定線材料153之供給側之後， 1〇调整線材料回收捲筒172之捲取轉矩，以調整線材料153之 拉力成給定值，使線材料153保持於一定之拉力。控制裝置 174接著控制線材料回收捲筒172之捲取轉矩，以使即使板 構件152處於熱膨脹/收縮時，線材料153之拉力也成一定， 此時有必要的話，於線材料153處於熱膨脹/收縮時，線材 15料153之拉力也成為一定，此時有必要的話，於線材料153， 將被捲取之部分釋放給定之長度。 拉力調變機構192，可構成為：當操作者以目視等判斷 為已劣化時，可由操作者操作控制裝置174。一方面，拉力 凋整機構192也可構成：藉由預先輸入於控制裝置174之控 20制資料，貼附未使用之線材料153後經過了一定時間之後， 自動地把線材料153換貼為未使用者。又，不設置線材料固 定裝置173，而代之，在線材料供給捲筒171設置旋轉停止 裝置，藉此使未使用之線材料153之供給停止也可。 其次，就配置在熱板單元(Hp)内部之熱板之另一形態 35 呪明之。第28圖係顯示熱板151a之概略構造之平面圖及斷 面圖。熱板151a，係在保持成水平之板構件152表面形成有 直線狀之溝185,並具有在此溝185嵌入有外徑比溝185之深 度更長之桿材186之構造。 藉助於熱板151a之基板G之熱處理大致如下所示。首 先，使保持有基板G之運送臂ina進入熱板單元(Hp)内，其 次使升降銷156上升，藉此使基板G離開，受升降銷156之支 持。若使運送臂U7a從熱板單元(HP)退出了之後，使升降 銷156降下’基板⑽接觸於一酉己置在板構件152表面之桿材 料186，而被保持成略水平姿勢。基板G，於是，被來自板 構件152之輻射熱加熱處理。 熱板151a，雖有必要在板構件施行溝加工，但與熱板 15ι比較的話，由於不使用線材料1S3而不需要將線材料153 之拉力保持成一定，可減輕對於熱板單板(HP)之管理負 擔。又，桿材料186之交換也容易，可壓低維護成本。 作為桿材186用者，可使用金屬桿材料，耐熱性樹脂桿 材料、玻璃桿材料、陶竞桿材料等之各制熱性材料。作 為#材料186肖者，宜選擇其熱膨脹錄近於板構件156之 =脹係數的材料，以便防止在板構件152之熱膨脹/收縮 時造成桿材料186之移動。桿材料186從板構件152突出之高 lmm之範圍。又，桿材料186之外徑，從減少 土糾射干材料186之接觸面積之觀點視之，宜設定為Mm 以下。 右要在板構件152之表面配置桿材料186時，桿材料180 亚非如第28圖所示必須配置成略平行。例如，第29圖為-平面圖’顯示桿材料186之另—配置形態；就是，可將桿材 料186配置成形成長方形。丨條之桿材料186之長度並沒有限 =。例如，使用5支⑺⑽之桿材料，以替代使用之 干材料也T 1_ ’且作成不讓桿材料數過多，以免增加維 護時之桿材料186之交換作業之負擔。 又，在熱板15la方面，將溝185之寬度作成比桿材料186 之直徑廣寬’只把桿材料186配置於溝185之溝内也可。 以上，雖說明了本發明之有關實施形態，但本發明不 受這種形態之限制。如上所示，本發明之基本處理裂置， 雖可適用於熱板單元(Hp)所具備之熱板⑸、⑸a，但本發 明之基板處理裝置，也可適用於冷卻單元(⑴l)所具備之冷 卻板。 7 第0圖係4部板148之概略正圖。冷卻板，係在板 152之内部設有冷媒流路149，俾使用來冷卻板構件⑸之冷 W水等*動’而在構件152之表面則與第22圖所示之熱板 151同樣’具有線材153被—定之拉力緊張之構造。冷媒流 路149 ’係例如把板構件152上下二分割，於此等接觸施予 溝加工，藉此形成者。對於冷媒流路149之冷卻水等之供 給，及來自冷媒流路Μ9之冷卻水等之回收，可使用冷卻器 等來進行。將由熱板單元(ΗΡ)所加熱之基板⑽置於冷卻板 148之概略正關。冷卻板148，，频第·所示之熱板⑸ 同樣，具有在板構件152之表面，線材料153被—定之拉力 拉緊之構造。若已加熱之基板G，被载置於冷卻板148,，則 200416792 基板G便藉著自_熱而被冷卻。此時藉著自基板g向板構 造152傳熱而對板構件152加溫，但板構件152卻藉著自铁气 —冷卻。此種冷卻板148,，仙可料暫時魅基板G1 用途，而例如也可配置於中繼部115、116。 5 上述冷卻板148、148，，係將熱板⑸改造成冷卻板用 但不用說也可將熱板151破造成冷卻板用。用於冷卻板之 線材料⑸和桿材料186，只要具有耐於要載置之基板 度之耐熱性即可。 1Fig. 27 is an explanatory diagram showing another tension adjusting mechanism 192 that maintains the tension of the wire material 153 arranged on the surface of the plate member 15 to be constant. The tension adjusting mechanism 192 is provided with a thread material supply reel 171, which is used to take up unused thread material 153 of a given length, and a thread material recovery roll 72, which is used to take up the thread material 153. The material 153 is pulled out from the wire material supply reel 171 and configured across the plate member 152; the wire material fixing device 173, which uses two sheets of board material, etc., to clamp the wire material 153, thereby fixing the wire holding material 153; The roller 175 is used to prevent the wire material 153 from being bent at the edge portion of the plate member 152 and to position the wire material 153. The thread material supply reel 171 34 usually rotates freely, and the drive control of the thread material recovery reel 172 and the thread material fixing device 173 is performed by the control device 174. According to such a tension adjustment mechanism 192, for example, when the wire material 153 and the part across the plate member 152 deteriorate, the control device 174 releases the fixation of the wire material 153 by the 5-wire material fixing device 173, so that it becomes The unused thread material 153 can be fed out from the thread material supply reel 171. Next, the control unit 174 drives the wire material recovery roll 172 to cause the wire material recovery roll 172 to take up a certain length of wire material 153. Next, the control device 174, after driving the wire material fixing device 173 to fix the supply side of the wire material 153, 10 adjusts the winding torque of the wire material recovery roll 172 to adjust the pulling force of the wire material 153 to a given value To keep the wire material 153 at a certain tensile force. The control device 174 then controls the winding torque of the wire material recovery reel 172 so that even when the plate member 152 is under thermal expansion / contraction, the pulling force of the wire material 153 is constant. At this time, if necessary, the wire material 153 is under thermal expansion. When shrinking, the tension of the wire material 153 becomes constant. At this time, if necessary, the wire material 153 will release the coiled portion to a given length. The tension adjusting mechanism 192 may be configured such that the operator can operate the control device 174 when the operator determines that the deterioration has occurred visually or the like. On the one hand, the pull-out adjustment mechanism 192 can also be constituted by automatically inputting the thread material 153 into Not used. The thread material fixing device 173 is not provided. Instead, the thread material supply reel 171 is provided with a rotation stop device to stop the supply of unused thread material 153. Secondly, another form of the hot plate arranged inside the hot plate unit (Hp) is as follows. Fig. 28 is a plan view and a sectional view showing a schematic structure of the hot plate 151a. The hot plate 151a has a structure in which a linear groove 185 is formed on the surface of the plate member 152 held horizontally, and a rod material 186 having an outer diameter longer than the depth of the groove 185 is embedded in the groove 185. The heat treatment of the substrate G by the hot plate 151a is as follows. First, the transport arm ina holding the substrate G is brought into the hot plate unit (Hp), and secondly, the lifting pin 156 is raised, whereby the substrate G is separated and supported by the lifting pin 156. After the conveying arm U7a is withdrawn from the hot plate unit (HP), the lift pin 156 is lowered and the substrate ⑽ contacts a bar material 186 which has been placed on the surface of the plate member 152, and is maintained in a slightly horizontal posture. The substrate G is then heat-treated by radiant heat from the plate member 152. Although it is necessary to perform groove processing on the plate member of the hot plate 151a, compared with the hot plate 15m, since the wire material 1S3 is not used, the tension of the wire material 153 does not need to be kept constant. ) Management burden. In addition, the rod material 186 can be easily exchanged, which can reduce maintenance costs. As the rod material 186, various heating materials such as a metal rod material, a heat-resistant resin rod material, a glass rod material, and a ceramic rod material can be used. As the #material 186, it is preferable to select a material whose thermal expansion is close to the expansion coefficient of the plate member 156, so as to prevent the rod material 186 from moving when the plate member 152 is thermally expanded / contracted. The rod material 186 protrudes from the plate member 152 by a height of 1 mm. In addition, the outer diameter of the rod material 186 is preferably set to Mm or less from the viewpoint of reducing the contact area of the soil correction dry material 186. When the rod material 186 is to be arranged on the surface of the plate member 152, the rod material 180 must be arranged slightly parallel as shown in FIG. 28. For example, Fig. 29 is a -plan view 'showing another configuration of the rod material 186; that is, the rod material 186 can be arranged to form a rectangle. There is no limit to the length of the rod material 186. For example, using 5 rods of rod material instead of the dry material T 1_ ′ and making it not to make the rod material too much, so as not to increase the burden of the rod material 186 exchange operation during maintenance. In the hot plate 15la, the width of the groove 185 is made wider than the diameter of the rod material 186 ', and the rod material 186 may be arranged in the groove of the groove 185. As mentioned above, although the embodiment concerning this invention was described, this invention is not limited to this aspect. As shown above, although the basic processing split of the present invention is applicable to the hot plates ⑸ and ⑸a provided in the hot plate unit (Hp), the substrate processing apparatus of the present invention can also be applied to the cooling unit (⑴l) provided. The cooling plate. 7 Figure 0 is a schematic front view of four plates 148. The cooling plate is provided with a refrigerant flow path 149 inside the plate 152, which is used to cool the plate member, such as cold water, water, etc., and the surface of the member 152 is the same as the hot plate 151 shown in FIG. It has a structure in which the wire 153 is fixed in tension. The refrigerant flow path 149 'is formed by, for example, dividing the plate member 152 up and down and contacting and applying a groove process to the plate member 152. The supply of cooling water and the like from the refrigerant flow path 149 and the recovery of cooling water and the like from the refrigerant flow path M9 can be performed using a cooler or the like. The general outline of placing the substrate heated by the hot plate unit (HP) on the cooling plate 148. The cooling plate 148, the hot plate 频 shown in Fig. 1 also has a structure in which the wire material 153 is tightened by a predetermined tension on the surface of the plate member 152. If the heated substrate G is placed on the cooling plate 148, then the 200416792 substrate G is cooled by self-heating. At this time, the plate member 152 is heated by transferring heat from the substrate g to the plate structure 152, but the plate member 152 is cooled by the iron gas. Such a cooling plate 148 may be used for the purpose of temporarily enchanting the substrate G1, and may be disposed in the relay sections 115 and 116, for example. 5 The above cooling plates 148 and 148 are used to transform the hot plate ⑸ into a cooling plate, but needless to say, the hot plate 151 may be broken into a cooling plate. The wire material ⑸ and the rod material 186 used for the cooling plate need only have heat resistance to the degree of the substrate to be placed. 1
若在設置加熱器154於板構件152之狀態下，更加形成 1〇 一用來流動冷卻水於板構件152之冷媒流路149，則這種板 構件152，也可作為熱板及冷卻板使用。If the heater 154 is installed on the plate member 152, the refrigerant flow path 149 for cooling water to flow through the plate member 152 is further formed, and the plate member 152 can also be used as a hot plate and a cooling plate. .
在上述說明方面，雖舉出LDC用基板之例作為基板， 但基板並不受此之限制，以半導體晶圓作為基板也無妨。 又，作為板構件152用者雖提示平面略長方形者，但即使是 15平面略圓形之板構件，也可將線材料以一定間隔拉緊成略 平行，又，將桿材料以任意之形狀配置於板構件之表面， 猎此支持基板G也可。 若採用了第22圖所示之線材料153之拉力調整機構 時，也可在板構件152設置第25圖及第26圖所示之切槽158 20及溝159。又’若將第25圖及第26圖所示之切槽158和溝129 設在板構件152，則只要將板構件152採取其下一半小於上 一半之階段差構造，即不用定位夾具也可定位線材料153， 且，可在不接觸於板構件152之狀態下吊下重錘165。在第 23圖所示之拉力調整機構191方面，可使用第27圖所示之滾 38 200416792 輪175，以替代第23圖及㈣圖所示之定位夾具164。 在拉力„周力π周整機構19〇方面，例如，在線材料⑸ 之兩w置扣釣，在線材料固定失具⑹及中繼構件⑹設】 用炎掛下此扣鈎之孔部，將線材料i53配置於給練置也 可同‘在拉力调整機構191方面，在線材料⑸之兩端 設置扣釣’且’在線材料固定失具i6i及垂細設置用來 掛上扣鈞之孔部或圓圈，將線材料153配置於給定位置也 可。在這射法下，可更加㈣地安裝線㈣153及敎板 15卜 …、 ίο 再者將線材料⑸和桿材料⑽之斷面形狀作成，例 如’三角形和五角形，藉此可更加減低跟基板G接觸之面 積。更且’例如’將線材料固定爽具ΐ6ι配置於窗部扣側、 或窗細側，把拉力調整機構1%、191配置於基對面州窗 部215或窗部212之任一側），藉此可透過窗部212及窗部 15 215 ’ fe易設置·交換線材料153。 線材料153和桿材料186之配置形態並不受上述形態所 限制。例如，若將多數個製品區域設置於基板叫，可在避 開這種製品區域的區域配置線材料153和桿材料186。 發明之效果 20 如上所說明’若依本發明，則可實現一種具有優異之 維護性，在基板不留下熱複製之痕跡的基板處理裒置。 又，若依本發明之基板處理裝置，則可用少數之線材 料或桿材料來支持基板。因此，不需要像習知那樣為了用 夕數之近接銷來支持基板而在板構件形成多數個孔部而 39 制t不而要多數個之近接鎖。藉此可降低基板處理裝置之 3成本(裝置價格）。又，被使用之零件之件數少，所以維 =變為容易，藉此也可減低維護成本。這種製造成本及維 k、本之減低效果’可在具有多數個基板處理裝置之基板 處理系統作為更大之成本減低效果來取得。 【圖式簡單明】 第1圖為平面圖’顯不本發明_實施形態之塗佈顯像處 理裝置之全體構成。 10 15 20 第2圖係第1圖所不之塗佈顯像處理裝置之平面圖。 幻圖係第1圖所示之塗佈顯像處理裝置之背面圖。第4圖為-斜視圖，顯示熱處理單元之外觀。 =5圖為-斷面圖，顯示熱處理單元之内部構造。 第6圖為一斜視圖，顯示熱板之全體構成。 第7圖為-平面圖，顯示支持球及線材料。 第8圖係顯示將支持球連結於線㈣之工程。 第9⑷〜9⑷圖為侧面圖，顯示熱板之整體構成。 第10圖係顯示基板在支持球上被加熱之狀態。 第11圖係顯示基板在支持球上被加熱之狀態。 第I2圖係顯示就熱板進行維護作業之狀能。 第13圖為一斜視圖，顯示本發明其他實郷態之塗佈 顯像裝置之熱板之整體構成。In the above description, although the substrate for LDC is exemplified as the substrate, the substrate is not limited thereto, and a semiconductor wafer may be used as the substrate. In addition, although the user of the plate member 152 is suggested to have a slightly rectangular plane, even a plate member with a 15 plane and a round shape can be used to tighten the wire material at a certain interval to be slightly parallel, and the rod material can be in any shape. It can be arranged on the surface of the plate member. When the tension adjusting mechanism of the wire material 153 shown in FIG. 22 is used, the plate member 152 may be provided with the notches 158 20 and the grooves 159 shown in FIGS. 25 and 26. Also, if the grooves 158 and grooves 129 shown in FIGS. 25 and 26 are provided in the plate member 152, as long as the plate member 152 adopts a stepped structure whose lower half is smaller than the upper half, it is not necessary to use a positioning jig. The positioning line material 153 can suspend the weight 165 without contacting the plate member 152. In the aspect of the tension adjusting mechanism 191 shown in FIG. 23, a roller 38 200416792 wheel 175 shown in FIG. 27 can be used instead of the positioning jig 164 shown in FIG. 23 and FIG. Regarding the pull force, the week force, and the sizing mechanism, for example, the two-line buckle fishing of the wire material, the wire material fixing gear and the relay member are set.] Hang the hole of the buckle with the flame, and The line material i53 can be placed in the training position. It can also be used in the same way as 'in the tension adjustment mechanism 191, the two sides of the line material 设置 are equipped with catches', and the line material is fixed with the i6i and the slender is set to hang the hole of the buckle. Or circle, the wire material 153 can be arranged at a given position. Under this shooting method, the wire material 153 and the cymbal plate 15 can be installed more easily, and the cross-sectional shape of the wire material ⑸ and the rod material ⑽ can be installed more. It can be made, for example, 'triangular and pentagonal, thereby reducing the area in contact with the substrate G. Furthermore,' for example ', the wire material is fixed and placed on the window buckle side or the window thin side, and the tension adjustment mechanism is 1% And 191 are arranged on either side of the state window portion 215 or the window portion 212 opposite to the base), so that the wire material 153 can be easily installed and exchanged through the window portion 212 and the window portion 15 215. The configuration form is not limited by the above form. For example, if Each product area is set on the substrate, and the line material 153 and the rod material 186 can be arranged in an area that avoids such a product area. Effect of the Invention 20 As explained above, if the present invention is used, an excellent maintainability can be achieved. The substrate processing device does not leave traces of thermal replication on the substrate. In addition, if the substrate processing device according to the present invention can support the substrate with a small amount of wire material or rod material, it is not necessary to use the substrate as is conventionally known. The number of proximity pins supports the substrate and a large number of hole portions are formed in the plate member. The 39-t system requires a number of proximity locks. This can reduce the cost of the substrate processing device (device price). Also, the used parts The number of pieces is small, so dimension = becomes easy, which can also reduce maintenance costs. This manufacturing cost and the reduction effect of dimension k and cost can be used as a larger cost in a substrate processing system with a large number of substrate processing devices. The effect is reduced. [The diagram is simple and clear.] Figure 1 is a plan view showing the overall configuration of the coating and developing processing device of the present invention _ embodiment. 10 15 20 Figure 2 is the first figure Plan view of the coating development processing device. Magic image is the back view of the coating development processing device shown in Figure 1. Figure 4 is a-oblique view showing the appearance of the heat treatment unit. = 5 Figure is-broken The top view shows the internal structure of the heat treatment unit. Figure 6 is an oblique view showing the overall structure of the hot plate. Figure 7 is a plan view showing the support ball and line material. Figure 8 shows the support ball connected to the line Project ㈣. Figures 9⑷ ~ 9⑷ are side views showing the overall structure of the hot plate. Figure 10 shows the state where the substrate is heated on the support ball. Figure 11 shows the state where the substrate is heated on the support ball. Figure I2 shows the performance of performing maintenance work on the hot plate. Figure 13 is an oblique view showing the overall structure of the hot plate of the coating and developing device in another actual state of the present invention.
第14圖為-斜視圖’顯示安裝板之整體構成。 第15圖係顯示就熱板進行 第16圖係齡成型支持球部及線㈣部之狀態 40 200416792 第17(a)〜(b)圖為側面圖，顯示熱板之一部分。 第18(a)〜(b)圖為側面圖，顯示熱板之整體構造。 第19(a)〜(b)圖為斜視圖，顯示支持圓筒構件及支持曲 面構件。 5 第20圖係抗蝕劑塗佈•顯像處理系統之概略平面圖。 第21(a)〜（c)圖係顯示熱板單元(HP)之概略構造之平 面圖（a)、正面圖（b)、斷面圖（c)。 第22(a)〜（c)圖係顯示熱板單元(HP)所具備之概略構 造之平面圖（a)、正面圖（b)、斷面圖（c)。 參 10 第23圖為一說明圖，顯示將線材料之拉力保持於一定 之拉力調整機構。 第24圖為一斜視圖，顯示定位夾具(Jig)之構造。 第25圖為板構件之斜視圖，此板構件設有用來進行線 材料之定位的溝。 15 第26圖為另一板構件之斜視圖，此板構件設有用來進 行線材料之定位的溝。 第27圖為一說明圖，顯示將線材料之拉力保持於一定 · 之另外拉力調整機構。 第28圖係顯示熱板單元(HP)所具備之概略構造之平面 20 圖（a)及斷面圖（b)。 第29圖為一平面圖，顯示配置在板構件表面之另一配 置形態。 第30圖為冷卻板之概略正面圖。 第31圖為另一冷卻板之概略正面圖。 41 200416792 【圖式之主要元件代表符號表】 G…基板 42…外箱 1…塗佈顯像處理裝置 43…外蓋 2—^匣站 44···搬入口 3…處理部 45…熱板 3b…上游部 45a，45b···側面 3c···下游部 46···處理室 4···介面部 47…貫穿孔 5,6,7,8···垂直運送單元 48…升降銷 6a…運送臂 49···保持構件 10…運送機構 50…支持球 ll···運送臂 50a···孔 15…抗I虫劑處理塊 51…驅動機構 19…UV處理單元 52···氣缸 20…洗滌器洗淨處理單元 52a···活塞 22…周邊露光單元 53…支持台 24〜29…熱處理系方塊 54…線材料 30…運送裝置 54a…掛部 32…露光裝置 54b…彈簧 33···ί線處理單元 54c…鉚接(變形部，caulked part) 34…緩衝匣 55…掛銷 35…擴展式冷卻單元 57…取出口 40…運送裝置 58…取出蓋 41…熱處理單元 59…安裝板 42 200416792 60…保持部 61···孔 63a…支持球部 63b…線材料部 64…凹部 65···支持圓筒構件 65a，66a···面 66…支持曲面構件 100···抗餘劑塗佈·顯像處理系統 101 —^匡站 102…處理部 102a…前段部 l〇2c···後段部 103·· ·介面部 110···運送機構 110a···運送路 111···運送臂 112，113，114···運送路 115，116···中繼部 117，117a，l 18，119…主搬運送裝置 121a，121b…洗淨處理單元 12 2…抗餘劑塗佈處理單元 123…周緣抗#劑除去單元 124a，124b，124c…顯像處理單元 125，126，127，128，129，130，131，132, 133···處理塊 134···藥液供給單元 135…空間 136…分機 137…緩衝板構件 138···運送機構 138a…運送路 139···運送臂 140…減壓乾燥處堙單元 148,148’…冷卻板 149…冷媒流路 151，151a…熱板 152…板構件 153···線材料 154…加熱器 155···貫穿孔 156···升降銷 158…切槽，溝 159···溝 161···固定夾具 161a…蓋 162···中繼構件 163…彈簧Fig. 14 is a perspective view showing the overall configuration of the mounting plate. Fig. 15 shows the state of the hot plate. Fig. 16 shows the state of the ball-forming and ball-forming parts at the age of 40. 40 200416792 Figs. 17 (a) to (b) are side views showing a part of the hot plate. Figures 18 (a) to (b) are side views showing the overall structure of the hot plate. Figures 19 (a) to (b) are perspective views showing the supporting cylindrical member and the supporting curved member. 5 Figure 20 is a schematic plan view of a resist coating and development processing system. Figures 21 (a) to (c) are a plan view (a), a front view (b), and a sectional view (c) showing a schematic structure of the hot plate unit (HP). Figures 22 (a) to (c) are a plan view (a), a front view (b), and a cross-sectional view (c) showing the general structure of the hot plate unit (HP). Refer to FIG. 23 and FIG. 23 is an explanatory diagram showing a tension adjusting mechanism that maintains the tension of the wire material to a certain level. Fig. 24 is an oblique view showing the structure of a positioning jig. Fig. 25 is a perspective view of a plate member provided with a groove for positioning the wire material. 15 Figure 26 is an oblique view of another plate member provided with a groove for positioning the wire material. Fig. 27 is an explanatory diagram showing another tension adjusting mechanism for keeping the tension of the wire material constant. Fig. 28 is a plan view (a) and a sectional view (b) showing a schematic structure of a hot plate unit (HP). Fig. 29 is a plan view showing another arrangement form arranged on the surface of the plate member. Figure 30 is a schematic front view of the cooling plate. Figure 31 is a schematic front view of another cooling plate. 41 200416792 [Representative symbols for main components of the drawings] G ... Substrate 42 ... Outer box 1 ... Coating development processing device 43 ... Outer cover 2-^ Station 44 ... Loading port 3 ... Processing section 45 ... Hot plate 3b ... upstream 45a, 45b ... side 3c ... downstream 46 ... processing chamber 4 ... mesas 47 ... through holes 5, 6, 7, 8 ... vertical transport unit 48 ... lift pin 6a ... transport arm 49 ... holding member 10 ... transport mechanism 50 ... support ball 11 ... transport arm 50a ... hole 15 ... anti-I insecticide treatment block 51 ... drive mechanism 19 ... UV treatment unit 52 ... Cylinder 20 ... Scrubber cleaning processing unit 52a ... Piston 22 ... Peripheral exposure unit 53 ... Support stand 24-29 ... Heat treatment block 54 ... Wire material 30 ... Transport device 54a ... Hanging portion 32 ... Exposure device 54b ... Spring 33 ·· ίWire processing unit 54c ... riveting (caulked part) 34 ... buffer box 55 ... hanging pin 35 ... expanded cooling unit 57 ... outlet 40 ... conveyor 58 ... removal cover 41 ... heat treatment unit 59 ... installation Plate 42 200416792 60 ... holding part 61 ... hole 63a ... support ball part 63b ... wire Portion 64 ... Recessed portion 65 ... Supports cylindrical members 65a, 66a ... Surface 66 ... Supports curved surface members 100 ... Anti-residue coating · Development processing system 101-Kuang station 102 ... Processing section 102a ... Department 102c ... Back section 103 ... Intermediate section 110 ... Transport mechanism 110a ... Transport road 111 ... Transport arm 112, 113, 114 ... Transport road 115, 116 ... Subsequent sections 117, 117a, 118, 119 ... Main conveying and conveying devices 121a, 121b ... Washing processing unit 12 2 ... Anti-residue coating processing unit 123 ... Peripheral anti- # agent removing unit 124a, 124b, 124c ... Development Units 125, 126, 127, 128, 129, 130, 131, 132, 133 ... Processing block 134 ... Medical solution supply unit 135 ... Space 136 ... Extension 137 ... Buffer plate member 138 ... Transport mechanism 138a ... Conveying path 139 ... Conveying arm 140 ... Decompression drying unit 148, 148 '... Cooling plate 149 ... Refrigerant flow path 151, 151a ... Hot plate 152 ... Plate member 153 ... Wire material 154 ... Heater 155 ... Through hole 156 ... Lifting pin 158 ... Groove, groove 159 ... Groove 161 ... Fixing fixture 161a ... Cover 162 ... Relay member 163 ... Reed
43 200416792 163a…保持台 211…外殼 164…定位夾具 213…關閉器 165···重鍾 214…開閉器驅動裝置 171···線材料供給捲筒 215…窗部 172···線材料回收捲筒 216…門扉構件 173…線材料固定裝置 217…排氣口 174…控制裝置 221…排氣蓋子 185…溝 222a···吸氣路 186···桿材料 222b···排氣路 190，191，192…拉力調整機構 223…供氣口 200···抗名虫劑塗佈顯像處理系統 4443 200416792 163a ... Holder 211 ... Housing 164 ... Positioning jig 213 ... Closure 165 ... Heavy clock 214 ... Switch drive 171 ... Wire reel 215 ... Window 172 ... Wire reel Cylinder 216 ... Lane member 173 ... Wire material fixing device 217 ... Exhaust port 174 ... Control device 221 ... Exhaust cover 185 ... Gutter 222a ... Intake path 186 ... Lever material 222b ... Exhaust path 190, 191, 192 ... Tension adjustment mechanism 223 ... Air supply port 200 ..... Anti-ming insecticide coating development processing system 44
Claims (1)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002343703A JP3942533B2 (en) | 2002-11-27 | 2002-11-27 | Substrate processing equipment |
| JP2003076097A JP4014210B2 (en) | 2003-03-19 | 2003-03-19 | Substrate processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200416792A true TW200416792A (en) | 2004-09-01 |
| TWI239034B TWI239034B (en) | 2005-09-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092133059A TWI239034B (en) | 2002-11-27 | 2003-11-25 | Substrate treatment unit |
Country Status (2)
| Country | Link |
|---|---|
| KR (2) | KR101026323B1 (en) |
| TW (1) | TWI239034B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104950485A (en) * | 2014-03-27 | 2015-09-30 | 斯克林集团公司 | Substrate processing device |
| TWI649721B (en) * | 2017-12-06 | 2019-02-01 | 凌通科技股份有限公司 | Panoramic photographing method of unmanned aerial vehicle and unmanned aerial vehicle using same |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090038641A1 (en) * | 2006-01-10 | 2009-02-12 | Kazuhisa Matsumoto | Substrate Cleaning Apparatus, Substrate Cleaning Method, Substrate Processing System, and Storage Medium |
| KR20140028579A (en) * | 2012-08-29 | 2014-03-10 | 세메스 주식회사 | Apparatus for treating substrate |
| KR101960879B1 (en) * | 2015-12-17 | 2019-03-20 | 주식회사 와이아이테크닉스 | Wire and a manufacturing method for a flat panel loading |
| KR20170127202A (en) * | 2016-05-11 | 2017-11-21 | 주성엔지니어링(주) | Substrate supporting holder and substrate processing apparatus using the same |
| CN114195377B (en) * | 2021-12-28 | 2023-08-29 | 安徽燕龙基新能源科技有限公司 | Multistage transmission production line used for photovoltaic glass production |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04360552A (en) * | 1991-06-07 | 1992-12-14 | Mitsubishi Electric Corp | Wire transfer system |
| JP3153372B2 (en) * | 1992-02-26 | 2001-04-09 | 東京エレクトロン株式会社 | Substrate processing equipment |
| JP3457900B2 (en) * | 1998-11-18 | 2003-10-20 | 東京エレクトロン株式会社 | Substrate heat treatment apparatus and substrate heat treatment method |
| JP3874960B2 (en) | 1999-04-02 | 2007-01-31 | 東京エレクトロン株式会社 | Substrate processing equipment |
| JP4575570B2 (en) * | 2000-10-16 | 2010-11-04 | 新日本製鐵株式会社 | Wafer holder, wafer holding apparatus and heat treatment furnace |
-
2003
- 2003-11-24 KR KR1020030083533A patent/KR101026323B1/en not_active IP Right Cessation
- 2003-11-25 TW TW092133059A patent/TWI239034B/en not_active IP Right Cessation
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2010
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104950485A (en) * | 2014-03-27 | 2015-09-30 | 斯克林集团公司 | Substrate processing device |
| TWI649721B (en) * | 2017-12-06 | 2019-02-01 | 凌通科技股份有限公司 | Panoramic photographing method of unmanned aerial vehicle and unmanned aerial vehicle using same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101000602B1 (en) | 2010-12-10 |
| KR20100113472A (en) | 2010-10-21 |
| KR101026323B1 (en) | 2011-03-31 |
| TWI239034B (en) | 2005-09-01 |
| KR20040047616A (en) | 2004-06-05 |
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