玫、發明說明： 【發明所屬之技術領域】 本 本發明係關於無接觸晶片卡的製法，更明碟地說 ^月係關於增強平坦度之無接觸晶片卡的製法。 【先前技術】 。無接觸晶片卡係一種逐漸廣泛運用於各種領域的系統 ?於運輸領域中，已經將其開發成—種付費機構。 用亦可於電子錢包中發現。有許多公司還開發出 利用無接觸晶片卡來辨識其員卫的機構。 藉由位於該無接觸卡中的天線與位於讀卡機中的另一 A之間的遠距電_合’或是讓該卡直接與該讀卡機碰 2便可達到於-無接觸卡與相關的讀取裝置進行資訊交 換的目的。為產生、儲存以及處理該資訊，該卡配備—連 =至該天線的晶片。該天線係位於兩個卡片主體之間的支 牙：上，其外側表面上印製有與該卡片的曰後用法相關的 圖像。該天線支樓體係—塑膠的介電支樓體或是一由纖維 材料（例如紙張）所製成的支撐體。 於利用由纖維材料製作而成之天線支樓體的無接觸晶 卡中，該天線係網印於該天線支樓體之上，而該晶片則 係固定於該天線支擇體之上，使得其兩個終端連接至兩個 天線終端。 ,接著，於層合步驟期間，構成該等卡片主體.的PVC層 係置於該天線支撐體的任—側之上。而後便對該層合體進 仃層廢處理。接著，該層合體便於約^赃的溫度下進行 200416613 熱處理。於此同時壓合該層合體，以熔化該等不同的層。 於熱與壓力的組合作用下，該等PVC層便會軟化而且該等 内層則會流體化。因此，與該天線支撐體產生接觸之卡片 主體内層的流體化PVC便會困住天線與晶片，而兩個卡片 主體的液態P V C則會透過先前已製作於該天線支撐體中的 通孔截斷部而彼此接觸。 不幸的係上面的方法具有數項缺點，尤其是該卡片的 最終型態不夠美觀的缺點。因此，於該等卡片主體的内層 處體化期間，外層會軟化，並且以變形程度小於pVc内層 之k形程度的方式而與因該天線厚度、該晶片以及該等通 孔截斷部所導致的該天線支撐體的起伏形狀相符。本質上 ’肉眼並無法看見該些微米的起伏形狀，不過，當印製該 卡片主體之外層的外表面時，該等起伏形狀便會於印製圖 像的顏色中造成色調改變。更確切地說，就印製的卡片主 體而g，於將該等卡片主體層合於該天線支撐體上的層合 步驟期間，過大的厚度會造成該等壓印點分離，因而讓該 顏色變得比較亮；而該天線支撐體的截斷部（該等卡片主 體之内層的PVC會流入其中）則會讓該等壓印點變得更為接 近，因而讓該顏色變得比較暗。雖然不會影響到該卡片作 業的情形’不㉟’對於審美條件極度苛求的使用者而言， 仍然會發現該最終卡片外觀上的瑕疵。 士另—項缺點係當將該晶片直接放置於該天線支撐體之 。才”可此會因該層合步驟期間所遭受到的壓力而破壞 。在使用模組(也就是用以置放該晶片的電子電路)的前提 200416613 a曰 下便可解決此項問題。於此情況中’可以利用金線將該扣 片連接至此電路（「打線」）。而後便可利用環氧樹脂來塗 佈該晶片與該等線路，以便保護它們。理所當然的，此種 解決方式必須花費較長的時間而且比較困#，而且也比較 昂貴。 【發明内容】 所以，本發明的目的係利用將該晶片直接放置於該天 線支撐體之上的技術來達到無接觸卡的製》，同時保護該 晶片使其不會於該無接觸卡的製法期間遭到破壞。 所以，本發明係關於一種無接觸晶片卡的製法，該晶 片卡包括一天線支撐體（其上利用網印置放著該天線），以 及包括連接至該丨線兩終端的晶4，以及位於該天線支撐 體任一側之上的至少兩個卡片主體，該等卡片主體係於壓 力下利用熱層合方式進行配置的熱塑性塑膠薄片。該熱塑 陡塑膠薄片（其係配置於該晶片所在之該天線支撐體的表 )被打出通孔，而且其厚度比該晶片的厚度至少高 10/。。玄通孔的位置與該晶片垂直，因此當於進行層合 /驟之刖將.玄薄片放置於該天線支撐體之上的言舌，該晶片 便會位於通孔内部，並且因而讓該晶片不會於該層合步驟 期間遭受到任何的壓力。 【實施方式】 閱續下面說明時參考隨附圖式將可更明白本發明的目 的、目標以及特徵。 根據圖1所示之本發明的較佳實施例，該天線支撐體 200416613 係由纖維材料（例如紙張）製作而成，並且厚度約為9一 。根據本發明之晶片切製作㈣於其支撐體4〇上製作該 天線。該天線係由兩個網印聚合物導電油墨迴圈42與^ 製作而成，其包含導電元素，例如銀、銅或碳。每個迴圈 、八中-知連接至同樣為網印的天線的其中一個焊墊，迴 圈42會連接至焊墊36，而迴圈44則會連接至焊墊μ。該 等迴圈會透過一常稱為跨接點(該圖中並未顯示)的電橋而 互相連接。於該跨接點及迴圈42之間會網印一由介電油墨 所組成的絕緣帶。 土 電子模組或晶片50係固定於天線支撐體40之上，並 且直接連接至該天線的悍墊36貞38，由於導電黏著層的 關係口而便可達到歐姆接觸的目的。應該注意的係雖缺 根據本發明製作而成的無接觸卡可配備-電子模組或是^ _ 曰 jj — 【 曰曰 不過’下文所述的較佳實施例則係關於具有單一 片^…、接觸卡。所以，該晶片的焊墊（圖中未顯示）會接 蜀j A天線的j：干墊％與38。利用導電黏著劑或是直接接 觸而不使用任何的读t 7的黏者劑皆可達到歐姆連接的目的。天線 支撐體40還包括$相^ r 枯兩個凹口 52與54，如圖2所示，較佳係 於網印該天狳夕怂j ^、 、、 後才形成該等凹口。該等兩個凹口可用以 增強電子模組或a Η, 及日日片50的機械強度。 因為該天綠β 4 « 、Λ及6亥日a片的關係，所以天線支撐體40會 具有截斷部及/或通？丨4 X通孔以及起伏形狀。因此，天線支撐體 4 0的兩個表面皆不平括 的表面會不平坦。 更明確地說，上面有網印該天線 200416613 根據本發明之方法的後續步驟 ^ ^ ^ 灵〆鄉為於天線支撐體4〇之上 層合兩層熱塑性塑膠層或薄片。 V驟為该卡片各個組成Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for manufacturing a non-contact chip card, more specifically, a method for manufacturing a non-contact chip card for enhancing flatness. [Prior art]. The contactless chip card is a system that is gradually widely used in various fields. In the field of transportation, it has been developed into a payment mechanism. It can also be found in e-wallets. Many companies have also developed mechanisms that use contactless chip cards to identify their guards. The contactless card can be reached by a long-distance electrical connection between the antenna located in the contactless card and another A located in the card reader, or by allowing the card to directly touch the card reader 2 Purpose of information exchange with related reading devices. To generate, store and process the information, the card is equipped with a chip connected to the antenna. The antenna is located on the tooth: between the two card bodies, and the outer surface of the antenna is printed with images related to the posterior usage of the card. The antenna branch system—a plastic dielectric branch or a support made of fiber material (such as paper). In a contactless crystal card using an antenna support body made of a fiber material, the antenna is screen-printed on the antenna support body, and the chip is fixed on the antenna support body, so that Its two terminals are connected to two antenna terminals. Then, during the lamination step, the PVC layer constituting the card body is placed on either side of the antenna support. The laminate is then disposed of as a waste layer. Next, the laminate is easily subjected to a 200416613 heat treatment at a temperature of about 1500 ° C. At this time, the laminate is pressed together to melt the different layers. Under the combination of heat and pressure, the PVC layers are softened and the inner layers are fluidized. Therefore, the fluidized PVC in the inner layer of the card body that comes into contact with the antenna support body will trap the antenna and the chip, and the liquid PVC of the two card bodies will pass through the through-hole cut-off portion previously made in the antenna support body. And touch each other. Unfortunately, the above method has several disadvantages, in particular the shortcomings of the final form of the card. Therefore, during the physicalization of the inner layers of the card bodies, the outer layers will soften and be deformed in a manner that is less than the k-shape of the inner layers of pVc due to the thickness of the antenna, the chip, and the through-hole cutout The undulating shape of the antenna support body matches. In essence, the undulated shapes of these micrometers cannot be seen by the naked eye, but when the outer surface of the outer layer of the card body is printed, the undulated shapes will cause a hue change in the color of the printed image. More specifically, with regard to the printed card body g, during the lamination step of laminating the card bodies on the antenna support, an excessive thickness may cause the embossed points to separate, thus allowing the color It becomes brighter; and the cut-off part of the antenna support (the inner layer of PVC of the card body will flow into it) will make the embossed points closer, thus making the color darker. Although it will not affect the situation of the card operation, 'not bad', for users with extremely demanding aesthetic conditions, they will still find flaws in the appearance of the final card. Shi another-the disadvantage is that the chip should be placed directly on the antenna support. Only "can be destroyed by the pressure experienced during the lamination step. This problem can be solved under the premise of using a module (that is, the electronic circuit used to place the chip) 200416613. In this case, 'you can use gold wire to connect the buckle to this circuit ("wiring"). The wafer and the circuits can then be coated with epoxy to protect them. As a matter of course, this solution must take a long time and be more sleepy #, and it is also more expensive. [Summary of the Invention] Therefore, the object of the present invention is to use a technology of placing the chip directly on the antenna support to achieve the production of a contactless card, and at the same time protect the chip from the contactless card manufacturing method Damaged during this period. Therefore, the present invention relates to a method for manufacturing a contactless chip card. The chip card includes an antenna support (on which the antenna is placed by screen printing), and a crystal chip 4 connected to two terminals of the wire, and At least two card bodies on either side of the antenna support body, and the card main system is a thermoplastic plastic sheet configured by thermal lamination under pressure. The thermoplastic steep plastic sheet (which is arranged on the surface of the antenna support body where the chip is located) is punched out, and its thickness is at least 10% higher than the thickness of the chip. . The position of the Xuantong hole is perpendicular to the chip, so when the .xuan sheet is placed on top of the antenna support, the chip will be located inside the hole, and thus the chip will be placed. You will not experience any stress during this lamination step. [Embodiment] The purpose, object, and features of the present invention will be more clearly understood by referring to the accompanying drawings when reading the following description. According to the preferred embodiment of the present invention shown in FIG. 1, the antenna support body 200416613 is made of a fiber material (such as paper) and has a thickness of about 91 Å. The wafer is cut according to the present invention, and the antenna is fabricated on its support 40. The antenna is made of two screen-printed polymer conductive ink loops 42 and ^, which include conductive elements such as silver, copper or carbon. Each loop is connected to one of the pads of the same screen-printed antenna, the loop 42 is connected to the pad 36, and the loop 44 is connected to the pad μ. These loops are connected to each other through a bridge, often called a jumper (not shown in the figure). An insulating tape composed of a dielectric ink is screen-printed between the jumper and the loop 42. The electronic module or chip 50 is fixed on the antenna support 40 and directly connected to the antenna pad 36 and 38 of the antenna. The purpose of ohmic contact can be achieved due to the connection of the conductive adhesive layer. It should be noted that although the contactless card made according to the present invention can be equipped with an electronic module or ^ _ jj — [better said, the preferred embodiment described below is about having a single chip ^ ... Contact card. Therefore, the pads (not shown) of this wafer will be connected to the j: dry pad% and 38 of the Shu A antenna. The use of conductive adhesive or direct contact without using any t 7 read adhesive can achieve the purpose of ohmic connection. The antenna support 40 also includes two notches 52 and 54, as shown in FIG. 2, and it is preferable that the notches are formed after screen printing. The two notches can be used to enhance the mechanical strength of the electronic module or a Η, and the daily film 50. Because of the relationship between the sky green β 4 «, Λ, and the 6-h a sheet, will the antenna support 40 have a cut-off portion and / or a channel?丨 4 X through hole and undulating shape. Therefore, the surfaces where both surfaces of the antenna support 40 are not flattened will be uneven. More specifically, the antenna is screen-printed on it. 200416613 The subsequent steps of the method according to the present invention ^ ^ ^ In the Lingxiang Township, two thermoplastic plastic layers or sheets are laminated on the antenna support 40. Step V is the composition of the card
層的第一層合階段，其剖面圖姓I 口、口果如圖3所示。此第一層 合步驟係於該天線支撐體40的每— 曰 ^ 側上精由熱壓合兩片均 質的熱塑性塑膠薄片62與64央、t ;違行熔化。該溫度與壓力 分別約為180°C及250Pa。 邴®+人 配置於該天線支撐體表面上用 以接收晶片50的熱塑性塑膠薄片62被打出一通孔Μ，而In the first layering stage of the layer, the cross-sectional view of the surname I mouth and mouth fruit is shown in Figure 3. This first lamination step is performed on each side of the antenna support 40 by hot-pressing two homogeneous thermoplastic plastic sheets 62 and 64, t; melting in violation. The temperature and pressure are about 180 ° C and 250Pa, respectively.邴 ® + person A thermoplastic sheet 62 disposed on the surface of the antenna support to receive the chip 50 is punched with a through hole M, and
且其厚度比電子模組或晶片5〇的厚度至少高出5%。通孔 5 6係位於熱塑性塑膠薄片6 2夕L _ -，哥之上，因此當於進行層合之 W將薄片62放置於支撐體4〇夕u a 牙篮4U之上的話，該電子模組或晶 片5 0便會位於其内部，使得雷 丨仗侍冤子拉組或晶片5〇不會與薄 片6 2產生接觸。通孔56較佳的w u 、扎ϋΌ罕乂佳的形狀為圓形。如果將厚度 為180^且面積為的晶μ 5〇i接連接至該天線的 話，那麼熱塑性塑膠層62的厚度便會等於20—，而通 孔56的直徑便會等於3_。 因此於第層合步驟期間，該壓力係施加於熱塑性 ，片62 & 64之上’而非施加於晶片5。之上，因此該 晶片50並不會受到任何會造成其損壞的應力作用。該溫度 必須足以讓薄片62與64的材料軟化而且可以完全流動， 、真補凹口 52與54以及支撐體4〇之中其它可能的截斷部 ’並且填補通1 56’以及困住該天線支撐體產生之起伏形 狀（例如因該天線的迴圈42與44所造成的起伏形狀）。 因此’便可於整片熱塑性塑膠中困住天線支撐體4〇的 (伏t狀；k而形成—厚度約等於彻“⑺的塑化天線支揮 10 200416613 體6〇。先前製造於該天線支樓體上的可能的截斷部進一牛 可讓兩片熱塑性塑膠薄片62與64以更佳的狀態炫化在二 ^所=的塑化天線支撐體6Q便可消除原來的天線支標 體4 0中任何的厚度差異。 …參考® 4 ’該卡片的各個組成層的第二層合階段係在 該塑化天線支擇體6G的每—側上層合兩個卡片主體。此第 二步驟係在熱塑性塑膠薄片62與64凝固所需要的時間長 度之後的-段衫時間長度以後來實&，其係藉由熱壓二 7層熱塑性塑膠層66與68(其厚度約等於26〇#m)來進行 熔化，用以於支撐體60的塑化平坦表面上製作該等卡片2 體。卡片主體66與68兩者皆已經於其外部表面上事先印 製这卡片的自有圖像。因為塑化天線支撐體6〇具有均勻的 厚度，所以此步驟比較類似於黏著結合，而非熔化。因此 ，此階段中所需要的壓力與溫度會遠低於傳統方法中所使 用的壓力與溫度。此層合步驟所需要的溫度與壓力僅分別 約為120°C及150Pa。再者，加壓與加熱循環的持續時間同 樣也會縮短。 於進行弟一層合步驟之前可先將熱塑性塑膠薄片62、 64裁切成最終晶片卡的尺寸。亦可於進行第一層合步驟之 後再將其裁切成最終晶片卡的尺寸。於後者情況中，係在 進行第一層合步驟之後才將塑化天線支撐體6〇裁切成該卡 片的尺寸，不過，並未脫離本發明的範噃。 根據本發明的變化例，配置於該天線支擇體中與用 以接收電子模組或晶片相反表面上的熱塑性塑膠薄片 200416613 64也可打出一通孔58。通孔58係位於熱塑性塑膠薄片64 之上’因此其係疊置於電子模組或晶片50的位置之上。於 此情況中，在第一層合步驟期間，該晶片可受到完全的保 護，避免受到因施加於該等熱塑性塑膠薄片與64之上 的壓力所引起的任何應力的破壞。 根據應用於無接觸晶片卡之本發明的方法的第二變化 例為通孔56的面積太大，而無法於第一層合步驟期間被熱 塑性塑膠薄片6 2的材料補滿。於此情況中，於第一層合步 驟之後所獲得的天線支撐體60將會因通孔56的關係而包 含一空洞，所以便不平坦。所以，支撐體6〇可於通孔Μ 的位置處接收環氧樹脂型的樹脂，用以保護電子模組或晶 片50 ’並且讓塑化天線支撐體6〇變得更為平坦。 该等卡片主體之組成層所使用的熱塑性塑膠最佳的係 聚氯乙烯（PVC)，不過亦可使用下面的熱塑性塑膠：聚酯 (PET、PETG)、聚丙烯（pp)、聚碳酸酯（？(：）或丙烯睹—丁二 烯-苯乙烯（ABS)。 必須提出的係：由塑膠支撐體（例如聚酯或聚醯胺）或 環氧樹脂玻璃支撐體上的金屬迴圈製作而成的天線，相較 於其支撐體同樣也會呈現出起伏形狀。所以，本發明可應 用於任何類型的天線支撐體以及任何類型的天線，尤其是 其上的天線呈現出起伏形狀的支撐體。不論溫度為何，用 以製作本發明之天線支撐體的材料的尺寸都必須維持穩定 ，特別是能夠耐受約18(TC的溫度而不會產生變形或變化 的材料。 12 200416613 【圖式簡單說明】 圖1所示的係一無接觸晶片卡的天線支撐體的示意圖， 圖2所示的係沿著圖1所示之天線支撐體的軸線B-B 所獲得的剖面圖， 圖3所示的係一無接觸晶片卡的塑化天線支撐體的剖 面圖， 圖4所示的係根據本發明之無接觸晶片卡的剖面圖。And its thickness is at least 5% higher than the thickness of the electronic module or chip 50. The through-hole 5 6 is located on the thermoplastic sheet 6 2 L L-, brother. Therefore, when the sheet 62 is placed on the support 4 30 Ua dental basket 4U in the laminated W, the electronic module Or the wafer 50 will be located inside, so that the warrior or the wafer 50 will not make contact with the wafer 62. The through hole 56 preferably has a round shape. If a crystal with a thickness of 180 ^ and an area of 50 μi is connected to the antenna, the thickness of the thermoplastic layer 62 will be equal to 20 mm, and the diameter of the through hole 56 will be equal to 3 mm. Therefore during the first lamination step, this pressure is applied to the thermoplastic, sheet 62 & 64 ' rather than to the wafer 5. As a result, the wafer 50 is not subject to any stress that would damage it. The temperature must be sufficient to soften the material of the lamellas 62 and 64 and be able to fully flow. The true fill notches 52 and 54 and the other possible cut-offs in the support body 40 and fill the opening 156 'and trap the antenna support. The undulating shape of the body (such as the undulating shape caused by the loops 42 and 44 of the antenna). Therefore, 'the antenna support body 40 (volt t-shaped; k can be trapped in the whole piece of thermoplastic plastic]-the thickness of the plastic antenna approximately equal to the thickness of the entire body 10 200416613 body 60. Previously manufactured on the antenna A possible cut-out on the support body will allow the two thermoplastic plastic sheets 62 and 64 to dazzle in a better state. The plastic antenna support 6Q = can eliminate the original antenna support 4 Any thickness difference in 0.… Reference ® 4 'The second lamination stage of the various constituent layers of the card is to laminate two card bodies on each side of the plasticized antenna support 6G. This second step is After the length of time required for the solidification of the thermoplastic plastic sheets 62 and 64-the length of the shirt after the length of time, it is obtained by hot pressing two or seven thermoplastic plastic layers 66 and 68 (the thickness of which is approximately equal to 26〇 # m ) To melt to make the cards 2 on the plasticized flat surface of the support 60. Both the card bodies 66 and 68 have printed their own images of the card in advance on their outer surfaces. Because The plasticized antenna support 60 has a uniform thickness, so this step This step comparison is similar to adhesive bonding, not melting. Therefore, the pressure and temperature required at this stage will be much lower than those used in traditional methods. The temperature and pressure required for this lamination step are only about 120 ° C and 150Pa. In addition, the duration of the pressure and heating cycles will also be shortened. Before performing the lamination step, the thermoplastic plastic sheets 62, 64 can be cut to the size of the final chip card. After the first lamination step, it is cut to the size of the final chip card. In the latter case, the plasticized antenna support 60 is cut to the size of the card after the first lamination step. However, it does not depart from the scope of the present invention. According to a variation of the present invention, a thermoplastic sheet 200416613 64 disposed on the opposite surface of the antenna support body and used to receive an electronic module or chip can also be punched with a through hole 58 The through-hole 58 is located on the thermoplastic sheet 64 'so it is superimposed on the position of the electronic module or wafer 50. In this case, during the first lamination step, the wafer Fully protected from damage caused by any stress caused by the pressure exerted on these thermoplastic sheets and 64. According to a second variant of the method of the invention applied to a contactless chip card is a through hole 56 The area is too large to be filled with the material of the thermoplastic sheet 62 during the first lamination step. In this case, the antenna support 60 obtained after the first lamination step will be due to the through hole 56 It contains a cavity so that it is not flat. Therefore, the support 60 can receive an epoxy resin at the position of the through-hole M to protect the electronic module or chip 50 'and to support the plastic antenna The body 60 becomes flatter. The thermoplastic used in the composition layer of the card body is preferably polyvinyl chloride (PVC), but the following thermoplastics can also be used: polyester (PET, PETG), poly Acrylic (pp), polycarbonate (? (:) or Propylene-butadiene-styrene (ABS). The system that must be proposed: an antenna made of a plastic support (such as polyester or polyamide) or a metal loop on an epoxy glass support will also exhibit an undulating shape compared to its support. Therefore, the present invention can be applied to any type of antenna support and any type of antenna, especially the support on which the antenna exhibits an undulating shape. Regardless of the temperature, the size of the material used to make the antenna support of the present invention must be kept stable, especially a material that can withstand a temperature of about 18 ° C without deformation or change. 12 200416613 [Schematic description 1 is a schematic view of an antenna support body of a contactless chip card shown in FIG. 1, a cross-sectional view taken along the axis BB of the antenna support body shown in FIG. 2 is shown in FIG. 2, and the system shown in FIG. 3 is shown in FIG. A cross-sectional view of a plasticized antenna support for a contactless chip card. FIG. 4 is a cross-sectional view of a contactless chip card according to the present invention.
【元件符號說明】[Description of component symbols]
36, 38 焊墊 40 天線支撐體 42, 44 迴圈 50 電子模組或晶片 52, 54 凹口 56, 58 通孔 60 塑化天線支撐體 62, 64 熱塑性塑膠薄片 66, 68 熱塑性塑膠層（卡片主體） 1336, 38 Pads 40 Antenna support 42, 44 loops 50 Electronic module or chip 52, 54 Notch 56, 58 through hole 60 Plastic antenna support 62, 64 Thermoplastic sheet 66, 68 Thermoplastic layer (card Main body) 13