WO2004084130A1 - Method for manufacturing a reinforced planar contactless chip card - Google Patents

Method for manufacturing a reinforced planar contactless chip card Download PDF

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Publication number
WO2004084130A1
WO2004084130A1 PCT/FR2003/002703 FR0302703W WO2004084130A1 WO 2004084130 A1 WO2004084130 A1 WO 2004084130A1 FR 0302703 W FR0302703 W FR 0302703W WO 2004084130 A1 WO2004084130 A1 WO 2004084130A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
antenna
antenna support
thermoplastic
manufacturing
Prior art date
Application number
PCT/FR2003/002703
Other languages
French (fr)
Inventor
Georges Kayanakis
Pierre Benato
Christophe Halope
Original Assignee
Ask S.A.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR0302258A external-priority patent/FR2844620B1/en
Application filed by Ask S.A. filed Critical Ask S.A.
Priority to AU2003276335A priority Critical patent/AU2003276335A1/en
Publication of WO2004084130A1 publication Critical patent/WO2004084130A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
    • B32B37/203—One or more of the layers being plastic
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/34—Inserts
    • B32B2305/342—Chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00—Labels, badges
    • B32B2519/02—RFID tags

Definitions

  • the present invention relates to methods of manufacturing contactless smart cards, and in particular a method of manufacturing a contactless smart card with enhanced flatness.
  • the contactless smart card is an increasingly used system in various sectors. In the transport sector, for example, it has been developed as a means of payment. This is also the case for the electronic purse. Many companies have also developed means of identifying their personnel by contactless smart cards.
  • the exchange of information between a contactless card and the associated reading device is carried out by remote electromagnetic coupling between an antenna housed in the contactless card and a second antenna located in the reader or directly by contact with the reader.
  • the card is equipped with a chip, which is linked to the antenna.
  • the antenna is located on a support located between two card bodies, the external faces of which are printed with graphics linked to the subsequent use of the card.
  • the antenna support is a dielectric support of plastic material or a support of fibrous material such as paper.
  • the antenna is serigraphed on the antenna support and the chip is fixed on the antenna support so that its two terminals are connected to the two communication terminals.
  • the above method unfortunately has several drawbacks, and in particular an aesthetic drawback on the final rendering of the card.
  • the external layer softens and conforms by deforming in an attenuated manner compared to the deformation undergone by the internal layer of PVC, the reliefs of the antenna support due to the thickness of the antenna, the chip and the cavity cuts.
  • these reliefs of the order of a micron are not visible to the naked eye, but they appear when the outer face of the outer layer of the card body is printed by changes in tone in the hue of the printed graphics.
  • the object of the invention is therefore to carry out a method of manufacturing a contactless card using the technique of transferring the electronic module or the chip directly to the antenna support while protecting the electronic module or the chip to avoid its destruction during the contactless card manufacturing process.
  • the invention therefore relates to a method of manufacturing a contactless smart card comprising an antenna support on which the antenna is placed by screen printing as well as an electronic module or a chip connected to the two terminals of the antenna and at least two card bodies on either side of the antenna support, the card bodies being sheets of thermoplastic applied by hot pressure lamination.
  • the thermoplastic sheet which is applied to the face of the antenna support where the electronic module or the chip is located is perforated with a through cavity and its thickness is greater than the thickness of the electronic module or of the chip.
  • the cavity being located directly above the electronic module or the chip so that the electronic module or the chip is inside the cavity when the sheet is placed on the antenna support before the lamination step and so that the electronic module or the chip is not subjected to any pressure during the lamination step.
  • Figure 1 shows the antenna support of a contactless smart card
  • Figure 2 shows a section along the axis BB of the antenna support shown in Figure 1
  • Figure 3 shows in section the plasticized antenna support of a contactless smart card
  • Figure 4 shows a section of the smart card without contact according to the invention.
  • the antenna support is made of fibrous material such as paper and has a thickness of approximately 90 ⁇ m.
  • the manufacture of the smart card according to the invention consists first of all in producing the antenna on its support 40.
  • the antenna consists of two turns 42 and 44 of screen-printed polymer conductive ink, loaded with conductive elements such as silver, copper or carbon. Each turn has one of its ends connected to one of the antenna connection pads also screen printed, the turn 42 being connected to the pad 36 and the turn 44 to the pad 38.
  • the turns are connected together by an electric bridge more commonly called cross-over (not shown in the figure).
  • An insulating strip of dielectric ink is screen printed between the cross-over and the coil 42.
  • An electronic module or a chip 50 is fixed on the antenna support 40 and is directly connected to the connection pads 36 and 38 of the antenna by means of a layer of conductive adhesive making it possible to make the ohmic contacts.
  • the contactless card manufactured according to the method of the invention can be provided with either an electronic module or a simple chip, the preferred embodiment described below relates to a contactless card having a single chip.
  • connection pads of the chip are then in contact with the connection pads of the antenna 36 and 38.
  • the ohmic connection can be made with a conductive glue or without glue by simple contact.
  • the antenna support 40 may also include two recesses 52 and 54 illustrated in FIG. 2 which are preferably produced after the screen printing of the antenna. These two recesses serve to reinforce the mechanical strength of the electronic module or of the chip 50.
  • the antenna support 40 has cutouts and / or cavities and reliefs due to the antenna and to the chip. Therefore, the two faces of the antenna support 40 are not planar and more particularly the face on which the antenna is screen printed.
  • the next step of the method according to the invention consists in laminating two layers or sheets of thermoplastic on the antenna support 40.
  • This step constitutes the first phase of lamination of the various constituent layers of the card and is illustrated in section in the figure. 3.
  • This first lamination step consists of welding by hot pressing on each side of the antenna support 40 two sheets of homogeneous thermoplastic 62 and 64. The temperature and the pressure reached are respectively around 180 ° C and 250 bars.
  • the thermoplastic sheet 62 which is applied to the face of the antenna support receiving the chip 50 is perforated with a through cavity 56 and its thickness is at least 5% greater than the thickness of the electronic module or the chip 50.
  • the cavity 56 is located on the thermoplastic sheet 62 so that the electronic module or the chip 50 is inside when the sheet 62 is placed on the support 40 before lamination and so that the electronic module or the chip 50 is not in contact with the sheet 62.
  • the cavity 56 is preferably circular.
  • a chip 50 is directly connected to the antenna, a chip with a thickness of 180 ⁇ m and a surface area of 1.5 mm2, the thickness of the thermoplastic layer 62 is equal to 200 ⁇ m and the diameter of the cavity 56 is equal to 3 mm.
  • the pressure is exerted on the thermoplastic sheet 62 or 64 and not on the chip 50, so that the latter is not subjected to any stress which could damage it.
  • the temperature must be sufficient for the material of the sheets 62 and 64 to soften and completely flow so as to fill the recesses 52 and 54, and any other cuts made in the support 40, to fill the cavity 56 and to trap the reliefs of the antenna support such as those due to the turns 42 and 44 of the antenna.
  • the reliefs of the antenna support 40 are trapped in the mass of the thermoplastic thus forming a plasticized antenna support 60 with a thickness equal to approximately 400 ⁇ m. Any cuts made previously on the antenna support also allow better welding of the two thermoplastic sheets 62 and 64 between them.
  • the plasticized antenna support 60 thus formed eliminates all differences in thickness from the original antenna support 40.
  • the second phase of lamination of the various constituent layers of the card consists in laminating two card bodies on each side of the support plasticized antenna 60 with reference to FIG. 4.
  • This second step carried out after a certain time corresponding to the time necessary for the sheets of thermoplastics 62 and 64 to be solidified, consists in coming to weld two layers 66 and 68 of thermoplastic, each of thickness equal to approximately 150 ⁇ m, constituting the card bodies on the plasticized and flat faces of the support 60, by hot pressing.
  • the two card bodies 66 and 68 have been previously printed, on their outer face, with the personalized graphics of the card.
  • the antenna support plasticized 60 being of constant thickness, this step is more like bonding than welding.
  • the pressure and temperature required in this phase are much lower than those used in a traditional process.
  • the temperature and the pressure necessary for this lamination step are no longer more than around 120 ° C. and 150 bars respectively.
  • thermoplastic sheets 62, 64 are previously cut to the size of the final smart card before the first lamination step. They can also be cut after the first lamination step. In this case, the plasticized antenna support 60 is cut to the dimensions of the card after the first lamination step without departing from the scope of the invention.
  • thermoplastic sheet 64 which is applied to the opposite side of the antenna support that receives the chip 50 may also be perforated • a cavity 58.
  • the cavity 58 is located on the thermoplastic sheet 64 so that it is superimposed on the location of the chip 50. In this case, during the first lamination step, the chip is completely protected from any stress due to the pressure exerted on the thermoplastic sheets 62 and 64.
  • a second variant of the method according to the invention can be applied to a contactless smart card in the case where the cavity 56 is too large to be filled with the material of the thermoplastic sheet 62 during the first lamination step.
  • the antenna support 60 obtained after the first lamination step has a recess due to the cavity 56 and therefore is not planar.
  • the support 60 can therefore receive at the location of the cavity 56, an epoxy type resin to protect the module electronic or chip 50 and make the plastic antenna support 60 perfectly flat.
  • thermoplastic material used for the constituent layers of the card bodies is preferably polyvinyl chloride (PVC), but may also be polyester (PET, PETG), polypropylene (PP), polycarbonate (PC) or acrylonitrile. -butadiene-styrene (ABS).
  • PVC polyvinyl chloride
  • PETG PETG
  • PP polypropylene
  • PC polycarbonate
  • ABS acrylonitrile.
  • ABS -butadiene-styrene
  • an antenna made up of metal turns on a plastic support such as polyester or polyamide or on a support in epoxy glass is also in relief compared to its support.
  • the invention therefore applies to any type of antenna support and to any type of antenna, and in particular to supports whose antenna appears in relief.
  • the antenna support must be made of a material whose dimensions remain stable whatever the temperature and in particular a supporting material without deformations or alterations in temperatures of the order of 180 ° C.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

A method for manufacturing a contactless chip card comprising an antenna support (40) on which an antenna (42, 44) is placed by serigraphy, in addition to an electronic chip module or chip (50) connected to two terminals of the antenna and at least tow card bodies (62, 64) on both sides of the antenna support. The bodies of the card are thermoplastic sheets which are applied by hot pressurized lamination. The thermoplastic sheet (62), which is applied to the face of the support of the antenna where the electronic module or chip is located, is perforated by a through cavity and the thickness thereof is greater than the thickness of the electronic module or chip by at least 5 % thereof. The cavity is situated perpendicular to the chip such that the chip is disposed inside the cavity when the sheet is placed on the antenna support prior to the lamination step and such that the chip is not subjected to any pressure during the lamination step.

Description

Procédé de fabrication d'une carte à puce sans contact à planéitë renforcée Method for manufacturing a contactless smart card with enhanced flatness
Domaine technique La présente invention concerne les procédés de fabrication des cartes à puce sans contact, et en particulier un procédé de fabrication d'une carte à puce sans contact à planéité renforcée.Technical Field The present invention relates to methods of manufacturing contactless smart cards, and in particular a method of manufacturing a contactless smart card with enhanced flatness.
Etat de la techniqueState of the art
La carte à puce sans contact est un système de plus en plus utilisé dans différents secteurs. Ainsi, dans le secteur des transports, elle a été développée comme moyen de paiement. C'est le cas également du porte-monnaie électronique. De nombreuses sociétés ont également développé des moyens d' identification de leur personnel par cartes à puce sans contact.The contactless smart card is an increasingly used system in various sectors. In the transport sector, for example, it has been developed as a means of payment. This is also the case for the electronic purse. Many companies have also developed means of identifying their personnel by contactless smart cards.
L'échange d'informations entre une carte sans contact et le dispositif de lecture associé s'effectue par couplage électromagnétique à distance entre une antenne logée dans la carte sans contact et une deuxième antenne située dans le lecteur ou directement par contact avec le lecteur. Pour élaborer, stocker et traiter les informations, la carte est munie d'une puce, qui est reliée à l'antenne. L'antenne se trouve sur un support situé entre deux corps de cartes dont les faces externes sont imprimées du graphisme lié à l'utilisation ultérieure de la carte. Le support d'antenne est un support diélectrique en matière plastique ou un support en matière fibreuse telle que du papier. Dans les cartes sans contact utilisant un support d'antenne en matière fibreuse, l'antenne est sérigraphiée sur le support d'antenne et la puce est fixée sur le support d'antenne de telle sorte que ses deux bornes soient connectées aux deux bornes de 1 ' antenne Ensuite, au cours d'une étape de lamination, des couches de PVC constituant les corps de carte sont placées de part et d'autre du support d'antenne. Ce sandwich est ensuite placé dans une presse à laminer. Le sandwich subit alors un traitement thermique à une température de l'ordre de 150 °C. En même temps, le sandwich subit un pressage afin de souder les différentes couches. Sous l'action combinée de la chaleur et de la pression, les couches de PVC se ramollissent et la couche interne se fluidifie. Le PVC ainsi fluidifié de la couche interne du corps de carte qui vient au contact du support d'antenne emprisonne l'antenne et la puce dans la masse et les PVC fluides des deux corps de carte rentrent en contact par des découpes de cavité réalisées préalablement dans le support d'antenne.The exchange of information between a contactless card and the associated reading device is carried out by remote electromagnetic coupling between an antenna housed in the contactless card and a second antenna located in the reader or directly by contact with the reader. To develop, store and process information, the card is equipped with a chip, which is linked to the antenna. The antenna is located on a support located between two card bodies, the external faces of which are printed with graphics linked to the subsequent use of the card. The antenna support is a dielectric support of plastic material or a support of fibrous material such as paper. In contactless cards using an antenna support made of fibrous material, the antenna is serigraphed on the antenna support and the chip is fixed on the antenna support so that its two terminals are connected to the two communication terminals. 1 antenna Next, during a lamination step, layers of PVC constituting the card bodies are placed on either side of the antenna support. This sandwich is then placed in a laminating press. The sandwich is then subjected to a heat treatment at a temperature of the order of 150 ° C. At the same time, the sandwich undergoes pressing in order to weld the different layers. Under the combined action of heat and pressure, the PVC layers soften and the inner layer becomes more fluid. The PVC thus fluidized of the internal layer of the card body which comes into contact with the antenna support traps the antenna and the chip in the mass and the fluid PVCs of the two card bodies come into contact by cavity cuts made beforehand. in the antenna holder.
Le procédé ci-dessus présente malheureusement plusieurs inconvénients, et en particulier un inconvénient d'ordre esthétique sur le rendu final de la carte. Ainsi, lors de la fluidification de la couche interne des corps de carte, la couche externe se ramollit et épouse en se déformant de manière atténuée par rapport à la déformation subie par la couche interne de PVC, les reliefs du support d'antenne dus à l'épaisseur de l'antenne, de la puce et des découpes de cavités. Certes, ces reliefs de l'ordre du micron ne sont pas visibles à l'œil nu mais ils apparaissent lorsque la face externe de la couche externe du corps de carte est imprimée par des changements de ton dans la teinte du graphisme imprimé. En effet, dans le cas de corps de carte imprimés, lors de l'étape de lamination des corps de carte sur le support d'antenne, la surépaisseur entraîne un écartement des points d'impression impliquant un éclaircissement de la teinte, de même que les découpes du support d'antenne dans lesquelles le PVC des couches internes des corps de carte vient fluer entraînent un resserrement des points d'impression impliquant un obscurcissement de la teinte. Sans conséquence pour le bon fonctionnement de la carte, ce défaut d'aspect de la carte finale peut être mis en avant par les utilisateurs très sensibles aux critères esthétiques. Un autre inconvénient provient du fait que, lorsque la puce est reportée directement sur le support d'antenne, elle peut être détériorée par la pression subie lors de l'étape de lamination. Ce problème a pu être résolu à condition d'utiliser un module c'est à dire un circuit électronique sur lequel est positionnée la puce. Dans ce cas, la puce est câblée à ce circuit avec des fils d'or ("wire bonding"). La puce et le câblage sont ensuite enrobés dans une résine époxy pour les protéger. Cette solution est bien sûr plus longue et plus difficile à mettre en œuvre et également plus coûteuse .The above method unfortunately has several drawbacks, and in particular an aesthetic drawback on the final rendering of the card. Thus, during the fluidization of the internal layer of the card bodies, the external layer softens and conforms by deforming in an attenuated manner compared to the deformation undergone by the internal layer of PVC, the reliefs of the antenna support due to the thickness of the antenna, the chip and the cavity cuts. Admittedly, these reliefs of the order of a micron are not visible to the naked eye, but they appear when the outer face of the outer layer of the card body is printed by changes in tone in the hue of the printed graphics. In fact, in the case of printed card bodies, during the step of laminating the card bodies on the antenna support, the extra thickness causes the printing dots to spread apart, so that the color becomes lighter, as is the cutouts of the antenna support in which the PVC of the internal layers of the card bodies comes to cause a tightening of the printing dots implying a darkening of the color. Without consequence for the proper functioning of the card, this defect in the appearance of the final card can be highlighted by users who are very sensitive to aesthetic criteria. Another drawback stems from the fact that, when the chip is transferred directly to the antenna support, it can be deteriorated by the pressure undergone during the lamination step. This problem could be solved on condition of using a module, ie an electronic circuit on which the chip is positioned. In this case, the chip is wired to this circuit with gold wires ("wire bonding"). The chip and wiring are then coated in an epoxy resin to protect them. This solution is of course longer and more difficult to implement and also more expensive.
Exposé de l'inventionStatement of the invention
Le but de l'invention est donc de réaliser un procédé de fabrication d'une carte sans contact utilisant la technique du report du module électronique ou de la puce directement sur le support d'antenne tout en protégeant le module électronique ou la puce pour éviter sa destruction durant le procédé de fabrication de la carte sans contact.The object of the invention is therefore to carry out a method of manufacturing a contactless card using the technique of transferring the electronic module or the chip directly to the antenna support while protecting the electronic module or the chip to avoid its destruction during the contactless card manufacturing process.
L'invention concerne donc un procédé de fabrication d'une carte à puce sans contact comportant un support d'antenne sur lequel est placée l'antenne par sérigraphie ainsi qu'un module électronique ou une puce connecté aux deux bornes de 1 ' antenne et au moins deux corps de carte de part et d'autre du support d'antenne, les corps de carte étant des feuilles de thermoplastique appliquées par lamination sous pression à chaud. La feuille de thermoplastique qui est appliquée sur la face du support d'antenne où se trouve le module électronique ou la puce est perforée d'une cavité traversante et son épaisseur est supérieure à l'épaisseur du module électronique ou de la puce d'au moins 5% de celle-ci, la cavité étant située à l'aplomb du module électronique ou de la puce pour que le module électronique ou la puce soit à l'intérieur de la cavité lorsque la feuille est placée sur le support d'antenne avant l'étape de lamination et de façon à ce que le module électronique ou la puce ne subisse aucune pression lors de l'étape de lamination. Description brève des figuresThe invention therefore relates to a method of manufacturing a contactless smart card comprising an antenna support on which the antenna is placed by screen printing as well as an electronic module or a chip connected to the two terminals of the antenna and at least two card bodies on either side of the antenna support, the card bodies being sheets of thermoplastic applied by hot pressure lamination. The thermoplastic sheet which is applied to the face of the antenna support where the electronic module or the chip is located is perforated with a through cavity and its thickness is greater than the thickness of the electronic module or of the chip. minus 5% of this, the cavity being located directly above the electronic module or the chip so that the electronic module or the chip is inside the cavity when the sheet is placed on the antenna support before the lamination step and so that the electronic module or the chip is not subjected to any pressure during the lamination step. Brief description of the figures
Les buts, objets et caractéristiques ressortiront mieux à la lecture de la description qui suit faite en référence aux dessins joints dans lesquels : la figure 1 représente le support d'antenne d'une carte à puce sans contact, la figure 2 représente une coupe selon l'axe B-B du support d'antenne représentée sur la figure 1, , la figure 3 représente en coupe le support d'antenne plastifié d'une carte à puce sans contact, et la figure 4 représente une coupe de la carte à puce sans contact selon l'invention.The purposes, objects and characteristics will become clearer on reading the following description made with reference to the accompanying drawings in which: Figure 1 shows the antenna support of a contactless smart card, Figure 2 shows a section along the axis BB of the antenna support shown in Figure 1,, Figure 3 shows in section the plasticized antenna support of a contactless smart card, and Figure 4 shows a section of the smart card without contact according to the invention.
Description détaillée de l'invention Selon un mode de réalisation préféré de l'invention illustré sur la figure 1, le support d'antenne est en matière fibreuse telle que du papier et a une épaisseur d'environ 90 μm. La fabrication de la carte à puce selon l'invention consiste tout d'abord à réaliser l'antenne sur son support 40. L'antenne est constituée de deux spires 42 et 44 d'encre conductrice polymère sérigraphiée, chargée en éléments conducteurs tels que l'argent, le cuivre ou le carbone. Chaque spire a une de ses extrémités reliée à un des plots de connexion de l'antenne également sérigraphiés, la spire 42 étant reliée au plot 36 et la spire 44 au plot 38. Les spires sont reliées entre elles par un pont électrique appelé plus communément cross-over (non représenté sur la figure). Une bande isolante d'encre diélectrique est sérigraphiée entre le cross-over et la spire 42.Detailed description of the invention According to a preferred embodiment of the invention illustrated in FIG. 1, the antenna support is made of fibrous material such as paper and has a thickness of approximately 90 μm. The manufacture of the smart card according to the invention consists first of all in producing the antenna on its support 40. The antenna consists of two turns 42 and 44 of screen-printed polymer conductive ink, loaded with conductive elements such as silver, copper or carbon. Each turn has one of its ends connected to one of the antenna connection pads also screen printed, the turn 42 being connected to the pad 36 and the turn 44 to the pad 38. The turns are connected together by an electric bridge more commonly called cross-over (not shown in the figure). An insulating strip of dielectric ink is screen printed between the cross-over and the coil 42.
Un module électronique ou une puce 50 est fixé sur le support d'antenne 40 et est directement connecté aux plots de connexion 36 et 38 de l'antenne grâce à une couche de colle conductrice permettant de réaliser les contacts ohmiques. A noter que, bien que la carte sans contact fabriquée selon le procédé de l'invention puisse être pourvue soit d'un module électronique soit d'une simple puce, le mode de réalisation préférentiel décrit par la suite concerne une carte sans contact disposant d'une simple puce.An electronic module or a chip 50 is fixed on the antenna support 40 and is directly connected to the connection pads 36 and 38 of the antenna by means of a layer of conductive adhesive making it possible to make the ohmic contacts. Note that, although the contactless card manufactured according to the method of the invention can be provided with either an electronic module or a simple chip, the preferred embodiment described below relates to a contactless card having a single chip.
Les plots de connexion de la puce (non montrés) sont alors en contact avec les plots de connexion de l'antenne 36 et 38. La connexion ohmique peut se faire avec une colle conductrice ou sans colle par le simple contact. Le support d'antenne 40 peut comporter également deux évidements 52 et 54 illustrés sur la figure 2 qui sont élaborés de préférence après la sérigraphie de l'antenne. Ces deux évidements servent à renforcer la tenue mécanique du module électronique ou de la puce 50.The connection pads of the chip (not shown) are then in contact with the connection pads of the antenna 36 and 38. The ohmic connection can be made with a conductive glue or without glue by simple contact. The antenna support 40 may also include two recesses 52 and 54 illustrated in FIG. 2 which are preferably produced after the screen printing of the antenna. These two recesses serve to reinforce the mechanical strength of the electronic module or of the chip 50.
Ainsi le support d'antenne 40 possède des découpes ou/et des cavités et des reliefs dus à l'antenne et à la puce. De ce fait, les deux faces du support d'antenne 40 ne sont pas planes et plus particulièrement la face sur laquelle est sérigraphiée l'antenne.Thus, the antenna support 40 has cutouts and / or cavities and reliefs due to the antenna and to the chip. Therefore, the two faces of the antenna support 40 are not planar and more particularly the face on which the antenna is screen printed.
L'étape suivante du procédé selon l'invention consiste à laminer deux couches ou feuilles de thermoplastique sur le support d'antenne 40. Cette étape constitue la première phase de lamination des différentes couches constitutives de la carte et est illustrée en coupe sur la figure 3. Cette première étape de lamination consiste à souder par pressage à chaud de chaque côté du support d'antenne 40 deux feuilles de thermoplastique homogènes 62 et 64. La température et la pression atteintes sont respectivement de l'ordre de 180°C et 250 bars. La feuille de thermoplastique 62 qui est appliquée sur la face du support d'antenne recevant la puce 50 est perforée d'une cavité traversante 56 et son épaisseur est supérieure d'au moins 5% à l'épaisseur du module électronique ou de la puce 50. La cavité 56 est située sur la feuille de thermoplastique 62 de façon à ce que le module électronique ou la puce 50 soit à l'intérieur lorsque la feuille 62 est placée sur le support 40 avant la lamination et de façon à ce que le module électronique ou la puce 50 ne soit pas en contact avec la feuille 62. La cavité 56 est de préférence circulaire. Lorsqu'il s'agit d'une puce 50 directement connectée à l'antenne, une puce d'épaisseur 180 μm et de surface 1,5 mm2, l'épaisseur de la couche de thermoplastique 62 est égale à 200 μm et le diamètre de la cavité 56 est égal à 3 mm.The next step of the method according to the invention consists in laminating two layers or sheets of thermoplastic on the antenna support 40. This step constitutes the first phase of lamination of the various constituent layers of the card and is illustrated in section in the figure. 3. This first lamination step consists of welding by hot pressing on each side of the antenna support 40 two sheets of homogeneous thermoplastic 62 and 64. The temperature and the pressure reached are respectively around 180 ° C and 250 bars. The thermoplastic sheet 62 which is applied to the face of the antenna support receiving the chip 50 is perforated with a through cavity 56 and its thickness is at least 5% greater than the thickness of the electronic module or the chip 50. The cavity 56 is located on the thermoplastic sheet 62 so that the electronic module or the chip 50 is inside when the sheet 62 is placed on the support 40 before lamination and so that the electronic module or the chip 50 is not in contact with the sheet 62. The cavity 56 is preferably circular. When a chip 50 is directly connected to the antenna, a chip with a thickness of 180 μm and a surface area of 1.5 mm2, the thickness of the thermoplastic layer 62 is equal to 200 μm and the diameter of the cavity 56 is equal to 3 mm.
Lors de la première étape de lamination, la pression s'exerce sur la feuille de thermoplastique 62 ou 64 et non sur la puce 50, de telle sorte que celle-ci ne subit aucune contrainte qui pourrait l'endommager. La température doit être suffisante pour que la matière composant les feuilles 62 et 64 se ramollisse et flue totalement de manière à remplir les évidements 52 et 54, et les éventuelles autres découpes effectuées dans le support 40, à remplir la cavité 56 et à emprisonner les reliefs du support d'antenne tels que ceux dus aux spires 42 et 44 de l'antenne.During the first lamination step, the pressure is exerted on the thermoplastic sheet 62 or 64 and not on the chip 50, so that the latter is not subjected to any stress which could damage it. The temperature must be sufficient for the material of the sheets 62 and 64 to soften and completely flow so as to fill the recesses 52 and 54, and any other cuts made in the support 40, to fill the cavity 56 and to trap the reliefs of the antenna support such as those due to the turns 42 and 44 of the antenna.
Ainsi, les reliefs du support d'antenne 40 sont emprisonnés dans la masse du thermoplastique formant ainsi un support d'antenne plastifié 60 d'épaisseur égale à environ 400 μm. Les éventuelles découpes effectuées préalablement sur le support d'antenne permettent en outre une meilleure soudure des deux feuilles de thermoplastique 62 et 64 entre elles. Le support d'antenne plastifié 60 ainsi formé fait disparaître toutes différences d'épaisseur du support d'antenne d'origine 40. La deuxième phase de lamination des différentes couches constitutives de la carte consiste à laminer deux corps de carte de chaque côté du support d'antenne plastifié 60 en référence à la figure 4. Cette seconde étape, réalisée après un certain temps correspondant au temps nécessaire pour que les feuilles de thermoplastiques 62 et 64 soient solidifiées, consiste à venir souder deux couches 66 et 68 de thermoplastique, chacune d'épaisseur égale à environ 150 μm, constituant les corps de carte sur les faces plastifiées et planes du support 60, par pressage à chaud. Les deux corps de carte 66 et 68 ont été préalablement imprimés, sur leur face extérieure, du graphisme personnalisé de la carte. Le support d'antenne plastifié 60 étant d'épaisseur constante, cette étape s'apparente davantage à un collage qu'à un soudage. De ce fait, la pression et la température nécessaires dans cette phase sont bien inférieures à celles utilisées dans un procédé traditionnel. La température et la pression nécessaires pour cette étape de lamination ne sont plus que d'environ 120°C et 150 bars respectivement. De plus, la durée des cycles de mise en pression et en température est également diminuée . Les feuilles de thermoplastique 62, 64 sont préalablement découpées à la dimension de la carte à puce finale avant la première étape de lamination. Elles peuvent également être découpées après la première étape de lamination. Dans ce cas, le support d'antenne plastifié 60 est découpé aux dimensions de la carte après la première étape de lamination sans pour autant sortir du cadre de 1' invention.Thus, the reliefs of the antenna support 40 are trapped in the mass of the thermoplastic thus forming a plasticized antenna support 60 with a thickness equal to approximately 400 μm. Any cuts made previously on the antenna support also allow better welding of the two thermoplastic sheets 62 and 64 between them. The plasticized antenna support 60 thus formed eliminates all differences in thickness from the original antenna support 40. The second phase of lamination of the various constituent layers of the card consists in laminating two card bodies on each side of the support plasticized antenna 60 with reference to FIG. 4. This second step, carried out after a certain time corresponding to the time necessary for the sheets of thermoplastics 62 and 64 to be solidified, consists in coming to weld two layers 66 and 68 of thermoplastic, each of thickness equal to approximately 150 μm, constituting the card bodies on the plasticized and flat faces of the support 60, by hot pressing. The two card bodies 66 and 68 have been previously printed, on their outer face, with the personalized graphics of the card. The antenna support plasticized 60 being of constant thickness, this step is more like bonding than welding. As a result, the pressure and temperature required in this phase are much lower than those used in a traditional process. The temperature and the pressure necessary for this lamination step are no longer more than around 120 ° C. and 150 bars respectively. In addition, the duration of the pressurization and temperature cycles is also reduced. The thermoplastic sheets 62, 64 are previously cut to the size of the final smart card before the first lamination step. They can also be cut after the first lamination step. In this case, the plasticized antenna support 60 is cut to the dimensions of the card after the first lamination step without departing from the scope of the invention.
Selon une variante du procédé de l'invention, la feuille de thermoplastique 64 qui est appliquée sur la face du support d'antenne opposée à celle recevant la puce 50 peut également être perforée • d'une cavité 58. La cavité 58 est située sur la feuille de thermoplastique 64 de façon à ce qu'elle se superpose à l'emplacement de la puce 50. Dans ce cas, lors de la première étape de lamination, la puce est totalement préservée de toute contrainte due à la pression exercée sur les feuilles de thermoplastique 62 et 64.According to a variant of the inventive method, the thermoplastic sheet 64 which is applied to the opposite side of the antenna support that receives the chip 50 may also be perforated • a cavity 58. The cavity 58 is located on the thermoplastic sheet 64 so that it is superimposed on the location of the chip 50. In this case, during the first lamination step, the chip is completely protected from any stress due to the pressure exerted on the thermoplastic sheets 62 and 64.
Une seconde variante du procédé selon l'invention peut être appliquée à une carte à puce sans contact dans le cas où la cavité 56 est trop importante pour être remplie par la matière de la feuille de thermoplastique 62 lors de la première étape de lamination. Dans ce cas, le support d'antenne 60 obtenu après la première étape de lamination comporte un creux dû à la cavité 56 et donc n'est pas plan. Le support 60 peut donc recevoir à l'emplacement de la cavité 56, une résine du type époxy pour protéger le module électronique ou puce 50 et rendre le support d'antenne plastifié 60 parfaitement plan.A second variant of the method according to the invention can be applied to a contactless smart card in the case where the cavity 56 is too large to be filled with the material of the thermoplastic sheet 62 during the first lamination step. In this case, the antenna support 60 obtained after the first lamination step has a recess due to the cavity 56 and therefore is not planar. The support 60 can therefore receive at the location of the cavity 56, an epoxy type resin to protect the module electronic or chip 50 and make the plastic antenna support 60 perfectly flat.
Le matériau thermoplastique utilisé pour les couches constitutives des corps de carte est préférentiellement du polychlorure de vinyle (PVC) , mais peut être aussi du polyester (PET, PETG) , du polypropylène (PP) , du polycarbonate (PC) ou de l' acrylonitrile-butadiène-styrène (ABS) .The thermoplastic material used for the constituent layers of the card bodies is preferably polyvinyl chloride (PVC), but may also be polyester (PET, PETG), polypropylene (PP), polycarbonate (PC) or acrylonitrile. -butadiene-styrene (ABS).
Il est important de préciser qu'une antenne constituée de spires métalliques sur un support en plastique tel que du polyester ou du polyamide ou sur un support en verre époxy est également en relief par rapport à son support. L'invention s'applique donc à tout type de support d'antenne et à tout type d'antenne, et en particulier aux supports dont l'antenne apparaît en relief. Le support d'antenne doit être constitué d'un matériau dont les dimensions restent stables quelle que soit la température et notamment un matériau supportant sans déformations ni altérations des températures de l'ordre de 180°C. It is important to specify that an antenna made up of metal turns on a plastic support such as polyester or polyamide or on a support in epoxy glass is also in relief compared to its support. The invention therefore applies to any type of antenna support and to any type of antenna, and in particular to supports whose antenna appears in relief. The antenna support must be made of a material whose dimensions remain stable whatever the temperature and in particular a supporting material without deformations or alterations in temperatures of the order of 180 ° C.

Claims

REVENDICATIONS
1. Procédé de fabrication d'une carte à puce sans contact comportant un support d'antenne sur lequel est placée l'antenne par sérigraphie ainsi qu'un module électronique ou une puce connecté aux deux bornes de 1 ' antenne et au moins deux corps de carte de part et d'autre dudit support d'antenne, les corps de carte étant des feuilles de thermoplastique appliquées par lamination sous pression à chaud ledit procédé étant caractérisé en que la feuille de thermoplastique (62) qui est appliquée sur la face dudit support d'antenne (40) où se trouve le module électronique ou la puce (50) est perforée d'une cavité traversante (56) et son épaisseur est supérieure à l'épaisseur du module électronique ou de la puce d'au moins 5% de celle-ci, ladite cavité (56) étant située à l'aplomb du module électronique ou de la puce de façon à ce que le module électronique ou la puce soit à l'intérieur de la cavité lorsque ladite feuille est placée sur ledit support d'antenne avant l'étape de lamination et de façon à ce que le module électronique ou la puce ne subisse aucune pression lors de ladite étape de lamination.1. Method for manufacturing a contactless smart card comprising an antenna support on which the antenna is placed by screen printing as well as an electronic module or a chip connected to the two terminals of the antenna and at least two bodies card on either side of said antenna support, the card bodies being sheets of thermoplastic applied by hot pressure lamination said method being characterized in that the sheet of thermoplastic (62) which is applied to the face of said antenna support (40) where the electronic module or the chip (50) is located is perforated with a through cavity (56) and its thickness is greater than the thickness of the electronic module or the chip by at least 5 % thereof, said cavity (56) being located directly above the electronic module or the chip so that the electronic module or the chip is inside the cavity when said sheet is placed on said ante support nne before the lamination step and so that the electronic module or the chip does not undergo any pressure during said lamination step.
2. Procédé de fabrication d'une carte à puce selon la revendication 1, dans lequel chacun desdits corps de carte est constitué de deux feuilles de thermoplastique appliquées sur ledit support d'antenne selon les étapes suivantes : une première étape de lamination consistant à souder de chaque côté dudit support d'antenne (40) une première feuille de thermoplastique homogène (62, 64) par pressage à une température suffisante pour que la matière composant les feuilles se ramollisse et flue totalement de manière à faire disparaître toutes différences d'épaisseur du support d'antenne et à former un support d'antenne plastifié (60) à faces planes, et une seconde étape de lamination réalisée après un temps correspondant au temps nécessaire pour que lesdites feuilles de thermoplastique (62, 64) soient solidifiées, ladite deuxième étape consistant à souder sur chaque face plastifiée et plane dudit support d'antenne (60) d' épaisseur constante une autre feuille de thermoplastique (66, 68) , par pressage à chaud.2. A method of manufacturing a smart card according to claim 1, in which each of said card bodies consists of two sheets of thermoplastic applied to said antenna support according to the following steps: a first lamination step consisting of welding on each side of said antenna support (40) a first sheet of homogeneous thermoplastic (62, 64) by pressing at a temperature sufficient for the material making up the sheets to soften and completely flow so as to remove any differences in thickness of the antenna support and forming a plasticized antenna support (60) with flat faces, and a second lamination step carried out after a time corresponding to the time necessary for said thermoplastic sheets (62, 64) to be solidified, said second step consisting in welding on each plasticized and flat face of said antenna support (60) of thickness constant another sheet of thermoplastic (66, 68), by hot pressing.
3. Procédé de fabrication d'une carte à puce selon la revendication 2, dans lequel ladite feuille de thermoplastique (64) qui est appliquée sur la face du support d'antenne opposée à celle recevant le module électronique ou la puce est perforée d'une cavité (58) , la cavité (58) étant située sur ladite feuille de thermoplastique (64) de façon à ce qu'elle se superpose à l'emplacement du module électronique ou de la puce (50) .3. A method of manufacturing a smart card according to claim 2, wherein said thermoplastic sheet (64) which is applied to the face of the antenna support opposite to that receiving the electronic module or the chip is perforated with a cavity (58), the cavity (58) being located on said thermoplastic sheet (64) so that it is superimposed on the location of the electronic module or the chip (50).
4. Procédé de fabrication d'une carte à puce selon la revendication 1, 2 ou 3 , dans lequel , une résine du type époxy est placée dans la cavité (56) de ladite feuille de thermoplastique (62) pour protéger le module électronique ou la puce (50) et rendre le support d'antenne plastifié (60) parfaitement plan.4. A method of manufacturing a smart card according to claim 1, 2 or 3, wherein, an epoxy type resin is placed in the cavity (56) of said thermoplastic sheet (62) to protect the electronic module or the chip (50) and make the plasticized antenna support (60) perfectly flat.
5. Procédé de fabrication d'une carte à puce selon la revendication 4, dans lequel ledit support d'antenne (40) est en matière fibreuse telle que du papier.5. A method of manufacturing a smart card according to claim 4, wherein said antenna support (40) is made of fibrous material such as paper.
6. Procédé de fabrication d'une carte à puce selon la revendication 5, dans lequel l'étape de fabrication de l'antenne consiste à sérigraphier des spires d'encre polymère conductrice sur ledit support en matière fibreuse et à faire subir un traitement thermique audit support afin de cuire ladite encre.6. A method of manufacturing a smart card according to claim 5, in which the step of manufacturing the antenna consists in screen printing turns of conductive polymer ink on said support made of fibrous material and in subjecting to a heat treatment. to said support in order to bake said ink.
7. Procédé de fabrication d'une carte à puce selon la revendication 6, dans lequel , des découpes de cavités (52, 54) réalisées dans le support d'antenne (40) permettent la soudure des deux couches de thermoplastique (62, 64) entre elles lors de la première étape de lamination.7. A method of manufacturing a smart card according to claim 6, in which cavity cutouts (52, 54) produced in the antenna support (40) allow the two layers of thermoplastic (62, 64) to be welded together during the first lamination step.
8. Procédé de fabrication d'une carte à puce selon l'une des revendications 1 à 7, dans lequel lesdits corps de carte (66, 68) laminés de chaque côté dudit support d'antenne plastifié (60) sont pré-imprimés du graphisme personnalisé de la carte.8. A method of manufacturing a smart card according to one of claims 1 to 7, wherein said card bodies (66, 68) laminated on each side of said plasticized antenna support (60) are pre-printed with custom map graphics.
9. Procédé de fabrication d'une carte à puce selon l'une des revendication 1 à 8, dans lequel durant l'étape de lamination des corps de carte sur ledit support d'antenne plastifié (60), une troisième feuille (66 ou 68) de thermoplastique ou une couche de vernis est ajoutée sur chaque corps de carte, jouant le rôle de couverture.9. A method of manufacturing a smart card according to one of claims 1 to 8, wherein during the step of laminating the card bodies on said plasticized antenna support (60), a third sheet (66 or 68) of thermoplastic or a layer of varnish is added on each card body, playing the role of cover.
10. Procédé de fabrication d'une carte à puce selon l'une des revendications 1 à 9, caractérisé en ce que le matériau thermoplastique constituant les corps de carte est du polychlorure de vinyle (PVC) , du polyester (PET, PETG) , du polyprolpylène (PP) , du polycarbonate (PC) ou de 1' acrylonitrile-butadiène-styrène (ABS) . 10. Method of manufacturing a smart card according to one of claims 1 to 9, characterized in that the thermoplastic material constituting the card bodies is polyvinyl chloride (PVC), polyester (PET, PETG), polyprolpylene (PP), polycarbonate (PC) or acrylonitrile-butadiene-styrene (ABS).
PCT/FR2003/002703 2003-02-25 2003-09-12 Method for manufacturing a reinforced planar contactless chip card WO2004084130A1 (en)

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FR0302258A FR2844620B1 (en) 2002-09-13 2003-02-25 METHOD FOR MANUFACTURING CONTACTLESS CONTACTLESS CONTACT OR CONTACT HYBRID CARD WITH REINFORCED PLANE
FR0302258 2003-02-25
FR0307906 2003-06-30
FR0307906A FR2851674B1 (en) 2003-02-25 2003-06-30 METHOD FOR MANUFACTURING CONTACTLESS CHIP CARD WITH REINFORCED PLANE

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TW200416613A (en) 2004-09-01
FR2851674A1 (en) 2004-08-27

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