TW200409805A - Latent hardener, manufacturing method for latent hardener, and adhesive - Google Patents

Abstract

This invention is to obtain an adhesive having a high storage stability and hardening in a short time under a low temperature. The latent hardener comprises a hardener particle principally comprising a metal chelate, and a capsule covering the surface of the hardener particle, in which the substituent of resin component composing the capsule is bonded to the metal chelate. Since the capsule has a high mechanical strength, the capsule is not broken in the process for kneading the latent hardener and epoxy resin.

Description

200409805

File: TW1008F-IPO.doc SUNDIAL CONFIDENTIAL 玖, description of the invention (the description of the invention should state: the technical field to which the invention belongs, the prior art, the content, the embodiments, and the drawings) [the technical field to which the invention belongs] The present invention relates to Adhesive, especially a latent hardener used when the semiconductor wafer and TCP are connected on the substrate by thermal compression. [Previous technology] In the past, when a semiconductor wafer was bonded to a substrate, or when TCP (Tape Carrier Package) and LCD (Liquid Crystal Display) were used to manufacture electrical equipment, they were bonded with a thermosetting resin epoxy resin. Agent. As shown by the symbol 111 in FIG. 7 (a), the LCD 111 includes a glass substrate 112, and an ITO electrode (Indium tinoxide) 113 ° LCD 111 disposed on the glass substrate 112. When following the TCP described below, the LCD 111 The surface on which the ITO electrode 113 is to be arranged is coated with an adhesive. Reference numeral 125 in FIG. 7 (b) indicates a state where the adhesive is applied to the LCD 111. Reference numeral 115 in FIG. 7 (C) indicates TCP. The TCP 115 includes a base film 116 and a metal wiring 117 disposed on the surface of the base film 116. The metal wiring 117 of the TCP115 is arranged on the arranged surface toward the adhesive 125 on the LCD111. After the alignment position, 5 200409805

File: TW 1008F-IPO.doc

SUNDIAL CONFIDENTIAL The layout surface of the metal wiring ln of TCP115 is pressed toward the adhesive i25. When heating is pressed in this state, the adhesive 125 is softened, and the metal wiring 117 pushes the softened adhesive ι25 backward and contacts the surface of the ITO electrode 113. Generally, a hardening agent such as imidazol is added to the above-mentioned adhesive after heating, which will overlap with epoxy resin. When metal wiring 1 丨 7 and IT〇 electrode 113 continue to be heated in the bonding state, the hardening agent The catalyst action will cause the epoxy resin to overlap and allow the adhesive 125 to harden. Reference numeral 101 in FIG. 7 (C) shows electrical equipment in a state where the adhesive 125 is cured. In this electric device 101, the TCP 115 and the LCD 111 are fixed by the hardened adhesive ι25 in a state where the metal wiring 117 is in contact with the ITO electrode 113. Therefore, TCP115 and LCD111 are connected electrically and mechanically. However, when the above-mentioned adhesive is hardened, the adhesive must be heated at a high temperature of 1 ⑽ or more. When the circuit of the metal wiring 117 is very fine, the heating may cause deformation of the TCP 115 such as elongation or shortening. This problem can be solved by lowering the heating temperature, but it will increase the time required for heat treatment and reduce productivity. Adhesives that are also excellent in hardening properties at low temperatures have been developed in recent years. 6

File: TWl 008F-IPO.doc SUNDIAL CONFIDENTIAL

A logically coincident resin such as Acrylate and an adhesive containing a logically coincident starter. However, compared with the use of epoxy resins, this type of adhesive has poor electrical properties and thermal resistance in the hardened state. [Summary of the Invention] The present invention was created to solve the above-mentioned problems of the prior art, and its purpose is to provide an adhesive which can be hardened under low temperature and short time conditions and has excellent preservation properties. The inventors of the present invention, instead of using a commonly used hardener, have focused on a method of superposing epoxy resin into cations. After repeated research, the following methods were found: at least one alkoxy group in the structure, the structure containing a stone yaki compound (> 5 Silane Coupling agent), and a metal complex (or metal Alcolart) ) Is added to the adhesive, and the epoxy resin is made to overlap (cation overlap) by using a cation generated when the metal adduct reacts with the Silane Coupling agent. The hardening process in which a metal adduct and a Silane Coupling agent are added to harden an epoxy resin is described by the following reaction formulas (1) to (4). 200409805

File: TW 1008F-IPO.doc

SUNDIAL CONFIDENTIAL [Chemical formula 1] X-Si-OR + H2〇- > X-Si-OH + R-OH Reaction formula (1) I \ A1 + OH-Si-X 厶 XAl-0-Si-X + RH Reaction Formula (2)

R

, Al-0-Si-X + X-Si-OH- >X-Si-〇-HH; Al-〇-Si-X Reaction formula (3)

R-CH-CH / I — 0 1 r-ch-ch2 OPT R-CH-CH2— R-CH-CH2 + >

\ / IO H + OH- R-CH-CH2 \ 〇 / Reaction formula (4) a silane compound having at least one alkoxy group, as shown in reaction formula (1), reacts with water in the adhesive, and the oxyhydrogen group will It decomposes with water and becomes a Silanol group. When the adhesive is heated, the silanol group reacts with a metal adduct such as a Ming adduct, and the silane compound combines with an aluminum adduct. (Reaction formula (2)) Then, as shown in reaction formula (3), the silanol group is bonded to the bonded aluminum 200409805

File: TW 1008F-IPO.doc

SUNDIAL CONFIDENTIAL Because of the equilibrium reaction, other silanol groups remaining in the adhesive will coordinate to generate the Branstade acid point, as shown in reaction formula (4). Because of the activated shellfish, the ring at the end of the epoxy resin The oxygen ring will open the ring and coincide with the epoxy ring of other epoxy resins (cation coincidence). Therefore, when a silane coupling agent (Silane Coupling) and a metal coupler are added to the adhesive, a thermosetting resin such as an epoxy resin is cationically overlapped. The reactions shown in the reaction formulae (2) to (4) are performed at a temperature lower than the pulsation (180 C or higher) of the hardening of the conventional adhesive. Therefore, the aforementioned adhesive is higher than the conventional adhesive. , Can be hardened at a lower temperature and in a short time. However, if the metal and metal Alcolart are directly dispersed in the adhesive together with the Silane Coupling agent, the superposition reaction of the epoxy resin can be performed even at the reed temperature, which deteriorates the preservation property. . Encapsulating a metal admixture in a capsule to make a so-called latent hardener can improve the shelf life of the adhesive. However, when the mechanical strength of the capsule is poor, the process of dispersing the latent resin into the epoxy resin is sometimes It will also destroy the capsule. The inventors have conducted in-depth research on improving the mechanical strength of the capsules. As a result, it has been found that if a capsule containing a water-based acid group or a carboxyl group specifically substituted for a resin component is used, the surface of the hardener particles will have gold. 200409805

File: TW10〇8F-iP〇.d〇c

SUNDIAL CONFIDENTIAL The metal compound will be combined with the substitution group, which can improve the mechanical strength of the capsule, and thus a potential hardening agent resistant to physical impact can be obtained.

The present invention is based on the above-mentioned Transcendence. The invention covered by the patent application No. 1 δ has contained a invention, which is a latent hardener. It has a hardener particle and a capsule covering the surface of the hardener particle. The hardener particle It is one of metal adduct or metal Akolart, or both, as the main component. The aforementioned capsule contains a resin component, and the resin component contains one or both of a water acid group or a carboxyl group. For the substitution group, on the surface portion of the hardener particle, the substitution group 'in the resin component may react with the metal admixture to form a potential hardening agent.

The invention described in item 2 of the scope of patent application is a potential hardener as described in item 1 of the scope of patent application, and the aforementioned metal philosophical compound is a potential hardener containing aluminum adduct as a main component. The invention described in the patent application_item 3 is a potential hardener as described in item 1 of the patent scope. The aforementioned metal Alcolart is a latent hardener which is mainly composed of aluminum. The invention described in item 4 of the scope of patent application is potentially hard as described in item 1 of the scope of patent application, and the composition of the resin is 10 200409805.

File.TWl008F-IPO.doc

SUNDIAL CONFIDENTIAL Potential sclerosing agent based on polyethenol (PVA). The invention described in claim 5 of the scope of the patent application is a method for manufacturing a latent hardener, which has hardener particles and a capsule covering the surface of the hardener particles. A manufacturing process of a capsule material is: The capsule is made of a resin component having a substitution group of one or both of a water acid group and a carboxyl group. The average particle diameter of the powdery capsule material is smaller than the average particle diameter of the hardener particles. Another method for manufacturing a latent hardener, the encapsulation process in the manufacturing method: the aforementioned capsule material is adhered to the surface of the hardener particles described above, and the state of the material on the surface of the hardener H is solved The capsule material forms the aforementioned capsule. The invention described in item 6 of the two patent applications is a method for manufacturing a latent hardener as described in item 5 of the patent application, and has the aforementioned processes. This is the aforementioned encapsulation process, which is a mixing process of mixing the hardener particles with the capsule material and allowing the hardener particles to represent the capsule material. — 疋 In the state that the hardener particles are attached to the aforementioned capsule material, _, let the aforementioned glue _ melt_ engineering. The invention described in item 7 of the scope of patent application is the patent application 200409805

Fiie: TW 1008F-IPO.doc sundial confidential method of manufacturing the latent hardener described in item 5 of the patent scope and any of the item 6 of the patent scope of the towel. The ratio of the average particle diameters is 100: 80. The invention described in item 8 of the scope of patent application is as described in item 5 of the scope of patent application and item 6 of the scope of patent application

The manufacturing method of latent hardener φ A method is the average particle diameter of hardener particles

The ratio to the average particle diameter of the aforementioned capsule material is $ ⑽:%. The invention described in item 9 of the scope of patent application is a method for producing a latent hardener as described in item 5 of the scope of patent application. After the capsule is formed, the capsule is heated with the hardener particles. The invention described in the scope of patent application item H) contains a thermosetting resin, silicon (Silane), and a latent hardener as described in any one of the scope of application patent scope i to the scope of patent scope patent application. Of

Then agent. The structure of the present invention is as described above. After the powdered capsule material is mixed with the hardener particles, the capsule material adheres to the surface of the hardener particles due to the electrostatic effect. In this state, if the hardener particles are agitated at a high speed, the capsule material will be melted in a state where the hardener particles are electrostatically attached to the surface of the hardener particles, and the capsule material will be integrated into a capsule (encapsulation). 12 200409805

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SUNDIAL CONFIDENTIAL When the substitution group of the resin component is extremely reactive to hardenable particles, during the encapsulation process, the substitution group of the resin component will react with the metal admixture or metal Alcolar on the surface of the hardener particle, and the substitution group will react with The main metal bond of a metal admixture or metal Alcolar.

In addition, when the reaction of the substitution group of the resin component to the hardenable particles is very low, after the encapsulation process, it will be heated together with the hardener particles, and the substitution group and the metal admixture or metal on the surface of the hardener particles can also be made. Alcholat reacted. When the aluminum adduct is used as the metal adduct, the reaction situation in which the substituent of the resin component is combined with the aluminum adduct is shown in the following reaction formula (5). Chemical 2] A1 + OH-X-

A1-0-X

+ RH reaction formula (5)

R

The above reaction formula (5) shows the case where the aluminum adduct is bonded to a hydroacid group, and the Proton (hydrogen atom) on the hydroacid group is detached and bonded to | g. In addition, when the substitution group is a carboxylated group, the hydroacid group in the carboxylated group will have the same reaction as the above reaction formula (5), and will be combined with Ming. As such, in the latent hardener of the present invention, the substitution group of the resin component constituting the capsule will be combined with the metal adduct on the surface of the hardened particle, since 13 200409805

File: TWl 008F-IPO.doc

SUNDIAL CONFIDENTIAL This capsule has high mechanical strength. Therefore, in the manufacturing process of the latent hardener of the present invention, which is dispersed in an adhesive such as an epoxy resin, the capsule is not damaged by physical impact. When the above-mentioned latent hardener is mixed with a Silane Coupling agent and an epoxy resin to form an adhesive, all powder-like hardenable particle surfaces are covered by capsules at normal temperature, and will not occur. The superposition reaction of epoxy resin, but when the adhesive is heated, the metal admixture constituting the hardenable particles will thermally expand and the capsule will rupture. As soon as the capsule breaks, the hardenable particles are mixed with the epoxy resin in the adhesive and the Silane Coupling agent, and the metal admixture constituting the hardener particles will react with the Silane Coupling agent. Release cations into the adhesive, because the melting point is above 30 ° C and below 350 ° C, the thermal decomposition temperature is above 50 ° C and below 500t, the softening temperature is above 0 ° C and below 300 ° C, and the glass transition temperature is -40 The relationship between various conditions such as ° C above 300 ° C, the epoxy resin will violently overlap (melting point 30 ° C to 350 ° C, thermal decomposition temperature 50 ° C to 500 ° C, softening temperature Above 0 ° C and below 300 ° C, the glass transition temperature is above -40 ° C and below 300 ° C, etc.), let the adhesive harden. 0 14

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SUNDIAL CONFIDENTIAL

File: TW 1008F-IPO.doc When the difference between the hardener particles is small, the average particle size of the hard-to-form particles is too small, and the particle size of the capsule material is preferably 0.5 // capsules, so the average of the hardener particles Granules 111 to 50 // m or less In addition, in the mixing process and the mixing process, a mixed dial can be used (such as NHS-0 | manufactured by Nara Machinery Manufacturing Co., Ltd., this strong class ^ n

The cheek garment has a mouth device capable of mixing hardenable particles and a capsule material, and a stirring device capable of holding a hardener when the capsule material is attached. The addition ratio of the hardener particles to the capsule material is calculated by the following formula (1). Equation ⑴ ... M / m = D X F / (4xdxf)

In the above formula (1), M is the added amount (g) of the hardener particles, m is the added amount (g) of the capsule material, and D is the average particle diameter of the powdered hardener particles (d is the The average particle diameter (#m), F is the specific gravity of the hardener particles, and f is the specific gravity of the capsule material. In addition, the specific gravity refers to the density ratio of each substance to the density of water at 4 C. However, the above formula ( 1) As a theoretical formula, the optimal addition ratio of hardener particles and capsule materials depends on the situation. In addition, if a thermoplastic resin is added to the adhesive, the properties of the thermoplastic resin will increase the cohesion, and the adhesion of the adhesive The performance will be higher. If a highly polar thermoplastic resin is used, the thermoplastic resin will not only increase 15 200409805

File: TW10〇F-IP〇.d〇c

SUNDIAL CONFIDENTIAL Into the hardening reaction of epoxy resin, it can also be combined with inorganic materials through silane coupling agent (Silane Coupling). Therefore, not only the hardening property of the adhesive is made higher, but also the affinity of the coated body of the inorganic material is improved. In order to make the above-mentioned objects, features, and advantages of the present invention more obvious and easy to hide, a preferred embodiment is given below, and in conjunction with the accompanying drawings, the detailed description is as follows: [Embodiment] The following describes the potential of manufacturing the present invention Engineering of hardeners. First, prepare a resin component having either one of the hydroacid group or the carboxyl group or both of the substitution groups, disperse the resin component in a solvent, and prepare a resin solution, and then spray-dry the resin solution with a spray drying device to prepare Powdery resin component (capsule material) (spray-drying Spr dryer method). Then, an aluminum admixture powder containing a metal adduct was prepared as hardener particles. The reference numeral 31 in the figure shows the hardened particle. The ratio of the average particle diameter of the hardener particles to the average particle diameter of the capsule material is not less than 80.

Next, 'the hardenable particles 31 and the capsule material are mixed according to the specified addition ratio, and after being placed in the mixing device and stirred, the capsule material with a small particle size of 31 will be coated with the electrostatic average particle size than the hardener. Hardener 16 200409805

File: TW 1008F-IPO.doc

SUNDIAL CONFIDENTIAL Particles 1 on the surface (mixed engineering). Symbol 32 in FIG. 1 (b) shows the capsule material in this state. The surface of one hardener particle 31 is covered with a plurality of capsule materials 32. The surface of the capsule material 32 is electrostatically hardened. The agent particles 3 i are put into the stirring device, and the capsule material 32 on the surface of the hardener particles 31 will be caused by collision with the capsule material 32 on the surface of other hardening particles 31, or by the rotation of the stirring device «, ㈣, etc., or frictional heat generation. When the capsule materials 32 are melted, the melted capsule materials 32 become one body (stirring process). At this time, the 'dissolved capsule material 32 comes into contact with the surface of the hardenable particle 31, and the substitution group in the resin component constituting the capsule material 32 is bonded to the metal adduct on the surface portion of the hardenable particle 31. The symbol 33 in FIG. IiC) is a capsule formed by the capsule material 32 as a whole. The capsule 33 covers the entire surface of the hardener particles 31. The hardener particles 31 and the capsule 33 constitute a latent hardener 30 ° The reaction between the substitution group of the resin component of the capsule material 32 and the metal admixture will occur after contact Keep going, but will form a latent 17 in the state of capsule 33

FilerTW 1008F-IPO.doc

SUNDIAL CONFIDENTIAL When the hardening agent 3G is heated, the reaction between the substituent and the metal admixture will proceed more quickly. Next, the present invention made using the above-mentioned latent hardener 30 will be described, and then the manufacturing process of the electrical equipment made using the adhesive of the present invention will be described. The epoxy resin, the thermoplastic resin, the Silane Coupling agent, the above-mentioned latent hardener 30, the conductive particles, and the solvent, which are thermosetting resins, are mixed and stirred according to a predetermined addition ratio, and then the mixture is made. Agent. In this state, the adhesive is paste-like. The mechanical strength of the capsule 33 of the latent hardener 30 is very high. Therefore, the capsule 33 is not damaged during the stirring process. Reference numeral 21 in Fig. 2 (e) shows a release film. A certain amount of the above-mentioned adhesive is applied to the surface of the release adhesive film 21, and the solvent in the adhesive will evaporate after drying to form a coating layer of the adhesive (Fig. 2 (b)). Reference numeral 20 in Fig. 2 (b) shows an adhesive film in a state where the coating layer 25 is formed. Here, reference numeral 27 in the figure shows conductive particles dispersed with the latent curing agent 30 in the adhesive. In this state, the hardening particles 31 of the latent hardener 30 are enclosed in the capsule 33, and the hardening particles 30 are not coupled with the silane in the adhesive constituting the coating layer 25 of the figure 200409805

FileiTW1008F-IPO.doc

SUNDIAL CONFIDENTIAL (Silane Coupling) agent does not harden with the coating layer 25 at normal temperature. Symbol 11 in FIG. 3 (a) shows an LCD. The LCD 11 forms a narrow, multi-branch IT0 electrode 13 (Indium tin oxide) on one surface of the glass substrate 12 and the glass substrate 12. This figure shows five ITO electrodes 13. On the surface of the LCD 11 where the ITO electrode 13 is formed, a portion connected to the cp mentioned later is aligned with the coating layer 25 of the support film 20 shown in FIG. 2 (b) (FIG. 3 (b)). Since the adhesive force between the release film 21 and the coating layer 25 is smaller than that between the coating layer 25 and the ITO electrode 13, the coating layer 25 remains on the LCD 11 after the release film 21 is peeled off (No. 3 (c ) Figure). Reference numeral 15 in FIG. 5 indicates TCP. The TCP 15 has a long base film 16 ′ On one side of the base film 16, several narrow metal wirings 17 are arranged along the length direction of the base film 16 (five metal wirings are shown here). The ends of the metal wiring 17 in the longitudinal direction are located at the ends of the base film 16 in the longitudinal direction, respectively. Fig. 3 (d) is a cross-sectional view taken along the line AA in Fig. 5. On the side on which the TCP15 metal wiring π is disposed, the LCDlnT〇 electrode 13 is disposed. The cloth layer 25 faces each other, and the ITO electrode 13 of the LCD 11 and the metal line 17 of τROP 15 face each other. 19 200409805

File: TW 1008F-IPO.doc

SUNDIAL CONFIDENTIAL In this state, the surface where the metal wiring 17 of TCP15 is arranged is pressed against the coating layer 25 '. The overlapping part of TCP15 and LCD11 is pressed together, and then the whole is heated. It will soften because pressing the metal wiring 17 will push the softened coating layer 25 back, and the conductive particles 27 in the remaining coating layer 25 will be sandwiched between the metal wiring 17 and the ITO electrode 13 (No. 4 ( e) Figure). If heating and pressing are continued in this state, the hardener particles 9 丨 will thermally expand and the capsule 33 will rupture. When the capsule 33 is ruptured, the hardener particles 31 will be mixed with the epoxy dendrite and the Silane Coupling agent in the coating layer 25, and the aluminum complex constituting the hardener particles 31 will be coupled with the phytane (Silane Coupling) ), The cations in the coating layer 25 are released. This cation causes the epoxy to proceed (cation overlap), and the conductive particles 27 are sandwiched between the metal wiring 17 and the Ito electrode 13, and the coating layer 25 is hardened in this state. (Fig. 4 (f)) Subscript 10 of Fig. 4 (f) shows the electrical equipment in which the coating layer 25 is hardened. In this electrical device 10, not only the metal wiring 17 and the Ito electrode 13 can continue to be connected through the conductive particles 27, but also the LCD1 and the TCP15 hardened coating layer 25 to be mechanically connected. What's more, the adhesive of the present invention not only has excellent preservation 20 200409805

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SUNDIAL CONFIDENTIAL property, because epoxy resin hardens due to the cation superposition, it can harden the adhesive at a lower temperature and in a shorter time than conventional hardeners. [Examples] A resin component 10 weight part made of polyvinyl alcohol (PVA) (trade name PVA205 manufactured by Kurale Co., Ltd.) and 90 weight part of water were dissolved, and a resin component 10 weight part was prepared. % Aqueous solution. Then, 10% by weight of water in the resin component is easily sprayed from a nozzle into nitrogen (temperature of 160 ° C) and dried to form a powdered capsule material 32 (average particle diameter 0.8 // m) (spray Drying method). As the hardener particles 31, a fine powder of metal adduct-aluminum adduct (Alumiun Tris acetactate manufactured by Kawaken Shoken Chemical Co., Ltd.) and a fine powder of metal Aichoiate (Kawaken Shoken Chemical Co., Ltd.) Alumium Isopropylate). The average particle size of these two hardener particles 31 was 5 a m. Therefore, the ratio of the average particle diameter of the hardener particles 31 to the average particle diameter of the capsule material 32 is $ ·· 〇8. Next, the capsule material 32 was electrostatically adhered to the hardener particles 3 i by using the product of the Nara Machinery Manufacturing Co., Ltd. under the trade name "Hybddaizer-NHS-o", as described in the i. After the surface, the rotation speed is MZOOrpm (circumferential speed: 100m $, and the processing time is 5 21 200409805).

File: TW1008F-IPO.doc

SUNDIAL CONFIDENTIAL After agitating for one minute, the capsules 33 were formed. After obtaining two types of potential hardeners 30, these potential hardeners 30 were heated at 40 ° C for 48 hours. These two types of latent hardener 30, thermoplastic resin Phenoxy resin (manufactured by Phenoxy Associates Co., Ltd., trade name "PKHH"), and thermosetting resin Bisphenol A-type epoxy resin (Oilified Shell Epoxy Corporation ) Manufactured by the company, with the product name "EP828"), Silane Coupling (manufactured by Unika Co., Ltd., product name "A-187"), and conductive particles are added in the proportion shown in Table 1 below 2 kinds of paste-like adhesives were prepared, and these adhesives were used to prepare the adhesive film 20 of Example 2 in the process shown in Figures 2 (a) and 2 (b) above. [Table 1] Table 1: Ingredients of the adhesive Adhesive composition Example 1 Example 2 Comparative example 1 Comparative example 2 Phenoxy resin 50 50 50 50 Bisphenol A type epoxy resin 50 50 50 50 Potential hardener A 1 22 200409805

File: TW1008F-IPO.doc SUNDIAL CONFIDENTIAL Potential Hardener B 1 Alumium Tris Acetactate 1 Alumium Isopropylate 1 Silane Coupling Agent 1 1 1 1 Conductive Particles 5 5 5 5 * Potential Hardener A: Alumium Tris Acetacetate + Capsule * Potential Hardener B Alumiun Isopropylate + Capsules 的 Each value in the above table is expressed by weight.

In addition, Table Comparative Examples 1 and 2 of Table 1 above are cases where two types of hardener particles of Examples 1 and 2 were used and an adhesive was added without forming a capsule. Using the adhesive films 20 of Examples 1 and 2 and Comparative Examples 1 and 2, the following "room temperature storage test" and "40 ° C storage test" were performed. [Room temperature storage test] Using the adhesive films 20 of Examples 1 and 2 and Comparative Examples 1 and 2, the above-mentioned Figures 3 (a) to 3 (d), 4 (e), and 4 (f) Project, after TCP15 is connected to LCD11, measure the peeling strength when TCP15 is peeled off on LCD11 23 200409805

SUNDIAL CONFIDENTIAL

File: TW1008F-IP.doc degree (initial peel strength). In addition, 'using these adhesive films 20 of Examples 1, 2 and Comparative Examples 1, 2' was stored at room temperature (25. (:) for 1 day, 3 days, and 7 days respectively, and each of the adhesive films 20 after storage was used to After the same process as above, after connecting TCP15 and LCD11, the peeling strength (peeling strength after storage) of TCP15 on LCD11 was measured. [40 ° C storage test] This test except for adjusting the storage temperature of the adhesive film 20 from room temperature to After 40 ° C, store the adhesive film 20 under the same conditions as in the "room temperature storage test" described above. After TCP15 and LCD11 are connected, measure the peel strength after storage. 0 In the above "room temperature storage test" and r4 (rc storage) In the "test", if the peel strength after storage reaches 90% or more of the initial peel strength, the book "◎", 80% or more and 90% or less, "0", 70% or more and 80% or less "△", 7G% The following "X" is used for evaluation, and the evaluation results are shown in Table 2. 24 200409805

SUNDIAL CONFIDENTIAL

File: T W1008F-lPO.doc [Table 2] Table 2 · Results of the evaluation test Stored at room temperature at 40 ° C Stored at 1 ° 3 ° 7 ° 1 ° 3 ° 7 ° Example 1 ◎ ◎ ◎ ◎ ◎ ◎ Example 2 ◎ ◎ ◎ ◎ ○ Comparative Example 1 〇 Δ XXX Comparative Example 2 — One — One — * —: The adhesive is hardened during the manufacturing process of the adhesive film.

In addition, TCP 15 is configured by 25 // m metal wiring at 25 " m intervals. LCD11 has a surface area of 1 Ωm2. The resistance is formed by IT 10 electrode 13 of 10 Ω. In the portion where TCP 15 and LCD 11 overlap Add a load of 3Mpa, heat for 10 seconds, and increase the temperature of the coating layer 25 to 130 ° C. As can be seen from the above Tables 1 and 2, in Examples 丄 and 2 in which the hardener particles 31 were sealed in the capsule 33, the evaluation results of the "room temperature storage test" and "40 C storage test" were very good. It was confirmed that the adhesive using the latent hardener of the present invention has excellent storage stability. On the other hand, in Comparative Examples 1 and 2 in which the hardener particles were not sealed in the capsule, compared with Examples 1 and 2, the entire 25 200409805

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The evaluation of the SUNDIAL CONFIDENTIAL trial was poor. In particular, in Comparative Example 2 of aluminum, Alcholate (Alumiumlsopropylate), which has high reactivity, the epoxy resin overlapped during the manufacturing process of the adhesive and the adhesive film, and the adhesive became too high to form the adhesive film itself. . The case where the adhesive film is produced using the adhesive agent has been described above, but the application of the present invention is not limited to this. For example, the adhesive agent may be directly used in the form of a paste. _ The symbol 11 shown in Figure 6 (a) is the same as that shown in Figure 3 (a). It is an LCD. When the LCD11 is connected to TCP15, it must first be on the surface of the ITO electrode 13 of LCD11 and on the surface of TCP15. An adhesive is applied to the connected portions to form a coating layer 45 of the adhesive (Fig. 6 (b)). After performing the alignment of TCP15 in the process of Figure 3 (d) above, in the process of Figures 4 (e) and 4 (f) above, connecting TCP15 to LCD11 ^ can obtain electrical equipment 40 (Figure 6 (c)). The case where TCP15 and LCD11 are connected using an adhesive has been described above, but the application of the present invention is not limited to this. It can be used for the connection of substrates and semiconductor wafers and in the manufacture of various electrical equipment. As the conductive particles 27 to which the adhesive of the present invention can be used, various conductive particles can be used. In addition, the above means that the conductive particles are dispersed to the next 26 200409805.

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The situation in the SUNDIAL CONFIDENTIAL agent will be described, but the application of the present invention is not limited to this. For example, an adhesive containing no conductive particles is also included in the scope of the present invention. As the metal adduct, various metal adducts such as a complex compound, a titanium adduct, and a Ming adduct can be used. Among them, an aluminum adduct having the highest reactivity is preferably used. The case where polyvinyl alcohol is used as the resin component has been described above. The scope of application of the present invention is not limited to this, and any hydroacid group, carboxylated group, etc. may be used as long as they have a substituent capable of reacting with a metal adduct or a metal Alcholate. For example, resins such as Phenoxy resin, urinary resin, and polystyrene resin can be used. After the formation of the capsule 33, if the latent hardener 30 is to be heated, the heating temperature is not limited to 40 ° C. When the heating temperature is too high, the capsule 33 will be damaged, so the heating temperature should preferably be transferred to the glass of the resin component. Turn the temperature below 0 °. In addition to epoxy resins, thermosetting resins include urea resins, melamin resins, acid test resins, vinyl ether resins, and Oxetane resins. For adhesive strength and the like, it is better to use epoxy resin. In addition, the Silane Coupling 27 200409805 used in the present invention

File: TW 1008F-IPO.doc

As the SUNDIAL CONFIDENTIAL agent, it is preferable to use a substance represented by the following formula (6). [Chemical formula 3] X2 1 \ 3 X1——Si-X3 …… General formula (6) (In the general formula (6) above, at least one of the substituents X1 to X4 is an alkoxy group. ). The alkoxy group is preferably a methoxy group (Methoxy) or an ethoxy group (Ethoxy). In addition, at least one of the substituents X1 to X4 other than the alkoxy group is preferably epoxy or The vinyl group is particularly preferably a Glycidil group having an epoxy substitution group. Examples of the ethylene group include a Metacryloxipropil group. In addition, the substitution groups X1 to X4 are all composed of Alchoxy groups, so-called silicates. Also possible.) In addition to Phenoxy resins, thermoplastic resins, such as polyethylene resin, urinary resin, Polyvinyl acetale, Ethylene vinyle Acetate, Lu

Polybutatien rubber can also be used. In the adhesive of the present invention, not only the adhesive has high storability, but also in the resin component constituting the capsule on the surface portion of the hardener particle, the substitution group is combined with the metal adduct of the main component of the hardener particle. Therefore, the capsule has high mechanical strength and high physical impact resistance of the latent hardener. In summary, although the present invention has been disclosed in a preferred embodiment, such as 28 200409805

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SUNDIAL CONFIDENTIAL, however, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and retouches without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be attached as the following. The ones defined in the scope of patent application shall prevail.

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SUNDIAL CONFIDENTIAL [Brief description of the drawings] Figures 1 (a) to 1 (c) are explanatory drawings for an example of the manufacturing process of the latent hardener of the present invention. Figures 2 (a) and 2 (b) are drawings for explaining an example of the process of manufacturing an adhesive film using the adhesive of the present invention. Figures 3 (a) to 3 (d) are drawings for the first half of the engineering description for bonding the LCD and TCP using the adhesive of the present invention. Figures 4 (e) and 4 (f) are diagrams for explaining the semi-process after TCP and LCD are bonded. Fig. 5 is a plan view illustrating the state where the TCP and the LCD are aligned. Figures 6 (a) to 6 (c) are explanatory diagrams of other examples of the bonding process using the adhesive of the present invention. Figures 7 (a) to 7 (c) are explanatory diagrams of the first half of the process of bonding LCD and TCP using an adhesive using traditional technology. DESCRIPTION OF Schematic Symbols 20, 45: Adhesive (coating layer) 3 0 • Potential hardener 31: Hardener particles 30 200409805

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Claims (1)

200409805 Fiie: TW 1008F-IPO.doc SUNDIAL CONFIDENTIAL Patent application scope 1. A potential hardener, which has hardener particles and a capsule covering the surface of the hardener particles. The hardener particles are metal admixtures or metals. One of Alcolart's or both is the main component, the capsule contains a resin component, the resin component contains one or both of a water acid group or a carboxyl group as a substitution group, and the surface portion of the hardener particle The substitution group 'in the resin component will react with the metal admixture as described above to form a potential hardener. 2. The latent hardener as described in item 1 of the scope of the patent application, wherein the main component of the metal admixture is an aluminum adduct. 3. The latent hardener as described in item 1 of the scope of patent application, the main component of the metal AlCOlart is aluminum Alcolart. 4. The latent hardener as described in item 1 of the scope of patent application, the main component of the resin component is polyvinyl alcohol (pVA). 5 · A method for manufacturing a latent hardener, the latent hardener has hardener particles and a capsule covering the surface of the hardener particle, a manufacturing process of a capsule material, the capsule is made of a hydroacid group The average particle diameter of the powdery capsule material is smaller than that of the hardener particles. 32 200409805 File.TW J008F-IPO.doc SUNDIAL CONFIDENTIAL small. A method for manufacturing a latent hardener. The encapsulation process in the manufacturing method is to attach the aforementioned capsule material to the surface of the aforementioned hardener particles, and transfer the aforementioned capsule material to form the aforementioned material while the material is attached to the hardened surface. capsule. 6. The manufacturer of the latent hardener as described in item 5 of the scope of patent application "There are two types of work. This is the encapsulation process, which involves mixing the hardener particles with the capsule material and letting the surface of the edge hardener particles adhere to the aforementioned 'capsule material. The second is Riding in the state that the hardener particles are attached to the capsule material, and letting the capsule material rotate. The manufacturer of the potential hardener as described in item 5 of the scope of patent application In the method, the ratio of the average particle diameter of the hardener particles to the average particle diameter of the capsule material is 100: 80. = In the method for manufacturing a latent hardener as described in item 5 of the patent application scope and item 6 of the patent application scope, the ratio of the average particle diameter of the hardener particles to the average particle diameter of the capsule material is 1 〇〇: 50. 9. In the manufacturing method of latent sister hardening according to item 5 of the application, after the capsule is formed, the capsule is heated with the hardener particles. 33 200409805 File: TW1008F-IPO.doc SUNDIAL CONFIDENTIAL Heat. 10. An adhesive comprising a thermosetting resin, a silane (Silane), and a latent hardener as described in any one of the scope of claims 1 to 4 of the scope of patent application. 34