TW200407581A - Optical device receiving substrate and optical device holding carrier - Google Patents

Optical device receiving substrate and optical device holding carrier

Info

Publication number
TW200407581A
TW200407581A TW092113013A TW92113013A TW200407581A TW 200407581 A TW200407581 A TW 200407581A TW 092113013 A TW092113013 A TW 092113013A TW 92113013 A TW92113013 A TW 92113013A TW 200407581 A TW200407581 A TW 200407581A
Authority
TW
Taiwan
Prior art keywords
optical device
receiving substrate
substrate
holding carrier
carrier
Prior art date
Application number
TW092113013A
Other languages
English (en)
Inventor
Jochen Friedrich Kuhmann
Matthias Heschel
Original Assignee
Hymite As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hymite As filed Critical Hymite As
Publication of TW200407581A publication Critical patent/TW200407581A/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
TW092113013A 2002-05-15 2003-05-14 Optical device receiving substrate and optical device holding carrier TW200407581A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US38028702P 2002-05-15 2002-05-15

Publications (1)

Publication Number Publication Date
TW200407581A true TW200407581A (en) 2004-05-16

Family

ID=29549949

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092113013A TW200407581A (en) 2002-05-15 2003-05-14 Optical device receiving substrate and optical device holding carrier

Country Status (3)

Country Link
US (1) US7213978B2 (zh)
TW (1) TW200407581A (zh)
WO (1) WO2003098302A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI504954B (zh) * 2010-07-27 2015-10-21 Nitto Denko Corp 光感測器模組

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US7531445B2 (en) 2006-09-26 2009-05-12 Hymite A/S Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane
US10244181B2 (en) 2009-02-17 2019-03-26 Trilumina Corp. Compact multi-zone infrared laser illuminator
US8995493B2 (en) 2009-02-17 2015-03-31 Trilumina Corp. Microlenses for multibeam arrays of optoelectronic devices for high frequency operation
US8995485B2 (en) 2009-02-17 2015-03-31 Trilumina Corp. High brightness pulsed VCSEL sources
US20130223846A1 (en) 2009-02-17 2013-08-29 Trilumina Corporation High speed free-space optical communications
US10038304B2 (en) 2009-02-17 2018-07-31 Trilumina Corp. Laser arrays for variable optical properties
US8979338B2 (en) 2009-12-19 2015-03-17 Trilumina Corp. System for combining laser array outputs into a single beam carrying digital data
WO2011109442A2 (en) * 2010-03-02 2011-09-09 Oliver Steven D Led packaging with integrated optics and methods of manufacturing the same
US11095365B2 (en) 2011-08-26 2021-08-17 Lumentum Operations Llc Wide-angle illuminator module
WO2013086047A1 (en) * 2011-12-06 2013-06-13 Cornell University Integrated multi-chip module optical interconnect platform
US9784933B2 (en) * 2014-12-18 2017-10-10 Infinera Corporation Photonic integrated circuit (PIC) and silicon photonics (SIP) circuitry device
US20160291269A1 (en) 2015-04-01 2016-10-06 Coriant Advanced Technology, LLC Photonic integrated circuit chip packaging
US10295740B2 (en) * 2016-07-07 2019-05-21 Mellanox Technologies, Ltd. Integrating silicon photonics and laser dies using flip-chip technology
EP3534196A4 (en) * 2016-11-25 2019-11-20 Huawei Technologies Co., Ltd. PACKAGING DEVICE FOR OPTICAL COMPONENT, OPTICAL MODULE AND PACKAGING METHOD FOR OPTICAL COMPONENT
JP6944085B2 (ja) * 2019-09-30 2021-10-06 京セラ株式会社 光導波路パッケージおよび発光装置
WO2022020257A1 (en) * 2020-07-20 2022-01-27 Apple Inc. Photonic integrated circuits with controlled collapse chip connections

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JPH077149B2 (ja) * 1985-10-16 1995-01-30 ブリティシュ・テレコミュニケ−ションズ・パブリック・リミテッド・カンパニ 放射偏向器アセンブリ
US5023881A (en) * 1990-06-19 1991-06-11 At&T Bell Laboratories Photonics module and alignment method
JP3117107B2 (ja) * 1993-08-03 2000-12-11 シャープ株式会社 光集積回路素子の組立構造
DE69421767T2 (de) * 1993-08-09 2000-05-31 Nippon Telegraph & Telephone Optoelektronische Hybridintegrationsplattform, optisches Untermodul, optoelektronische hybridintegrierte Schaltung, und Herstellungsverfahren der Plattform
US5432878A (en) * 1994-03-03 1995-07-11 Cts Corporation Silicon carrier for testing and alignment of optoelectronic devices and method of assembling same
GB2307786B (en) * 1996-05-16 1997-10-15 Bookham Technology Ltd Assembly of an optical component and an optical waveguide
US5721797A (en) * 1996-05-28 1998-02-24 Lucent Technologies Inc. Apparatus and method for mounting a laser to a substrate and aligning the laser with an optical conduit
DE19632364C1 (de) * 1996-08-10 1998-03-12 Telefunken Microelectron Verfahren zur Prüfung einer Vielzahl von Produkten
DE19648424C1 (de) * 1996-11-22 1998-06-25 Siemens Ag Mikromechanischer Sensor
FR2760101B1 (fr) * 1997-02-24 1999-04-16 Alsthom Cge Alcatel Procede d'assemblage d'un dispositif opto-hybride
US6458513B1 (en) * 1999-07-13 2002-10-01 Input/Output, Inc. Temporary bridge for micro machined structures
TW523615B (en) * 2000-02-17 2003-03-11 L3 Optics Inc Guided wave optical switch based on an active semiconductor amplifier and a passive optical component
US6595700B2 (en) * 2000-04-04 2003-07-22 Shipley Company, L.L.C. Optoelectronic packages having insulation layers
US6738145B2 (en) * 2000-04-14 2004-05-18 Shipley Company, L.L.C. Micromachined, etalon-based optical fiber pressure sensor
US20030012925A1 (en) * 2001-07-16 2003-01-16 Motorola, Inc. Process for fabricating semiconductor structures and devices utilizing the formation of a compliant substrate for materials used to form the same and including an etch stop layer used for back side processing
US6747472B2 (en) * 2002-01-18 2004-06-08 International Business Machines Corporation Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same
US6786654B2 (en) * 2002-08-21 2004-09-07 Hymite A/S Encapsulated optical fiber end-coupled device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI504954B (zh) * 2010-07-27 2015-10-21 Nitto Denko Corp 光感測器模組

Also Published As

Publication number Publication date
US7213978B2 (en) 2007-05-08
US20030215194A1 (en) 2003-11-20
WO2003098302A3 (en) 2004-02-19
WO2003098302A2 (en) 2003-11-27

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