GB2353405B - Substrate for mounting opto-electronic components and process for manufacture thereof - Google Patents

Substrate for mounting opto-electronic components and process for manufacture thereof

Info

Publication number
GB2353405B
GB2353405B GB0014673A GB0014673A GB2353405B GB 2353405 B GB2353405 B GB 2353405B GB 0014673 A GB0014673 A GB 0014673A GB 0014673 A GB0014673 A GB 0014673A GB 2353405 B GB2353405 B GB 2353405B
Authority
GB
United Kingdom
Prior art keywords
manufacture
substrate
electronic components
opto
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0014673A
Other versions
GB0014673D0 (en
GB2353405A (en
Inventor
Nikolaus Schunk
Engelbert Strake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of GB0014673D0 publication Critical patent/GB0014673D0/en
Publication of GB2353405A publication Critical patent/GB2353405A/en
Application granted granted Critical
Publication of GB2353405B publication Critical patent/GB2353405B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0225Out-coupling of light
    • H01S5/02255Out-coupling of light using beam deflecting elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4249Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/02218Material of the housings; Filling of the housings
    • H01S5/02234Resin-filled housings; the housings being made of resin
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0225Out-coupling of light
    • H01S5/02253Out-coupling of light using lenses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/023Mount members, e.g. sub-mount members
    • H01S5/02325Mechanically integrated components on mount members or optical micro-benches

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)
GB0014673A 1999-06-29 2000-06-15 Substrate for mounting opto-electronic components and process for manufacture thereof Expired - Fee Related GB2353405B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19929878A DE19929878A1 (en) 1999-06-29 1999-06-29 Support comprises a silicon body having a part with a reflecting surface and a part for receiving an optoelectronic component

Publications (3)

Publication Number Publication Date
GB0014673D0 GB0014673D0 (en) 2000-08-09
GB2353405A GB2353405A (en) 2001-02-21
GB2353405B true GB2353405B (en) 2001-09-26

Family

ID=7912995

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0014673A Expired - Fee Related GB2353405B (en) 1999-06-29 2000-06-15 Substrate for mounting opto-electronic components and process for manufacture thereof

Country Status (3)

Country Link
JP (1) JP2001021769A (en)
DE (1) DE19929878A1 (en)
GB (1) GB2353405B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10160508B4 (en) * 2001-11-30 2005-02-17 Infineon Technologies Ag Arrangement for detecting optical signals of at least one optical channel of a planar optical circuit and / or for coupling optical signals into at least one optical channel of a planar optical circuit
DE10346360B3 (en) * 2003-09-30 2005-06-23 Siemens Ag Electro-optical component for mounting on a carrier component
JP3987500B2 (en) * 2004-02-17 2007-10-10 浜松ホトニクス株式会社 Optical wiring board and method for manufacturing optical wiring board
DE102004050118A1 (en) 2004-07-30 2006-03-23 Osram Opto Semiconductors Gmbh A semiconductor laser device, an optical device for a semiconductor laser device, and a method of manufacturing an optical device
DE102006017294A1 (en) * 2005-12-30 2007-07-05 Osram Opto Semiconductors Gmbh Optically pumpable semiconductor device for use in resonator, has surface-emitting semiconductor body which is provided with radiation penetration surface that faces away from mounting plane of semiconductor body
TWI517433B (en) * 2013-03-22 2016-01-11 財團法人工業技術研究院 Self-aligned chip carrier and package structure thereof
DE102016221464A1 (en) * 2016-11-02 2018-05-03 Karlsruher Institut für Technologie Method of making an optical system and optical system
JP7060798B2 (en) * 2018-05-30 2022-04-27 日亜化学工業株式会社 Light source device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4756590A (en) * 1985-09-03 1988-07-12 American Telephone And Telegraph Company, At&T Bell Laboratories Optical component package
GB2213957A (en) * 1987-12-15 1989-08-23 Stc Plc Waveguide to opto-electronic transducer coupling
EP0331331A2 (en) * 1988-03-03 1989-09-06 AT&T Corp. Subassembly for optoelectronic devices
EP0607524A1 (en) * 1992-11-25 1994-07-27 Robert Bosch Gmbh Device for coupling the ends of light wave guides to emitting or receiving elements
EP0762168A1 (en) * 1995-08-16 1997-03-12 Robert Bosch Gmbh Device for coupling a waveguide to a surface emitting element or to a detecting element
GB2315595A (en) * 1997-02-07 1998-02-04 Bookham Technology Ltd Device for re-directing light from an optical waveguide
US5854867A (en) * 1996-10-29 1998-12-29 Electronics And Telecommunications Research Institute Optical module having lenses aligned on lens-positioning V-groove and fabrication method thereof
EP1030201A1 (en) * 1999-02-17 2000-08-23 Sumitomo Electric Industries, Ltd. Light transmitting/receiving module

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE506991C2 (en) * 1996-01-26 1998-03-09 Ericsson Telefon Ab L M Method and apparatus for connecting a waveguide to a component
NL1002752C2 (en) * 1996-04-01 1997-10-02 Akzo Nobel Nv A method for the hybrid integration of at least one optoelectronic component and a waveguide, and an integrated electro optical device.
DE19751650A1 (en) * 1997-11-21 1999-05-27 Bosch Gmbh Robert Optical component

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4756590A (en) * 1985-09-03 1988-07-12 American Telephone And Telegraph Company, At&T Bell Laboratories Optical component package
GB2213957A (en) * 1987-12-15 1989-08-23 Stc Plc Waveguide to opto-electronic transducer coupling
EP0331331A2 (en) * 1988-03-03 1989-09-06 AT&T Corp. Subassembly for optoelectronic devices
EP0607524A1 (en) * 1992-11-25 1994-07-27 Robert Bosch Gmbh Device for coupling the ends of light wave guides to emitting or receiving elements
EP0762168A1 (en) * 1995-08-16 1997-03-12 Robert Bosch Gmbh Device for coupling a waveguide to a surface emitting element or to a detecting element
US5854867A (en) * 1996-10-29 1998-12-29 Electronics And Telecommunications Research Institute Optical module having lenses aligned on lens-positioning V-groove and fabrication method thereof
GB2315595A (en) * 1997-02-07 1998-02-04 Bookham Technology Ltd Device for re-directing light from an optical waveguide
EP1030201A1 (en) * 1999-02-17 2000-08-23 Sumitomo Electric Industries, Ltd. Light transmitting/receiving module

Also Published As

Publication number Publication date
GB0014673D0 (en) 2000-08-09
DE19929878A1 (en) 2001-01-04
GB2353405A (en) 2001-02-21
JP2001021769A (en) 2001-01-26

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20060615

732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
728V Application for restoration filed (sect. 28/1977)
S28 Restoration of ceased patents (sect. 28/pat. act 1977)

Effective date: 20081118

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20110615