GB2353405B - Substrate for mounting opto-electronic components and process for manufacture thereof - Google Patents
Substrate for mounting opto-electronic components and process for manufacture thereofInfo
- Publication number
- GB2353405B GB2353405B GB0014673A GB0014673A GB2353405B GB 2353405 B GB2353405 B GB 2353405B GB 0014673 A GB0014673 A GB 0014673A GB 0014673 A GB0014673 A GB 0014673A GB 2353405 B GB2353405 B GB 2353405B
- Authority
- GB
- United Kingdom
- Prior art keywords
- manufacture
- substrate
- electronic components
- opto
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/02234—Resin-filled housings; the housings being made of resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19929878A DE19929878A1 (en) | 1999-06-29 | 1999-06-29 | Support comprises a silicon body having a part with a reflecting surface and a part for receiving an optoelectronic component |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0014673D0 GB0014673D0 (en) | 2000-08-09 |
GB2353405A GB2353405A (en) | 2001-02-21 |
GB2353405B true GB2353405B (en) | 2001-09-26 |
Family
ID=7912995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0014673A Expired - Fee Related GB2353405B (en) | 1999-06-29 | 2000-06-15 | Substrate for mounting opto-electronic components and process for manufacture thereof |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2001021769A (en) |
DE (1) | DE19929878A1 (en) |
GB (1) | GB2353405B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10160508B4 (en) * | 2001-11-30 | 2005-02-17 | Infineon Technologies Ag | Arrangement for detecting optical signals of at least one optical channel of a planar optical circuit and / or for coupling optical signals into at least one optical channel of a planar optical circuit |
DE10346360B3 (en) * | 2003-09-30 | 2005-06-23 | Siemens Ag | Electro-optical component for mounting on a carrier component |
JP3987500B2 (en) * | 2004-02-17 | 2007-10-10 | 浜松ホトニクス株式会社 | Optical wiring board and method for manufacturing optical wiring board |
DE102004050118A1 (en) | 2004-07-30 | 2006-03-23 | Osram Opto Semiconductors Gmbh | A semiconductor laser device, an optical device for a semiconductor laser device, and a method of manufacturing an optical device |
DE102006017294A1 (en) * | 2005-12-30 | 2007-07-05 | Osram Opto Semiconductors Gmbh | Optically pumpable semiconductor device for use in resonator, has surface-emitting semiconductor body which is provided with radiation penetration surface that faces away from mounting plane of semiconductor body |
TWI517433B (en) * | 2013-03-22 | 2016-01-11 | 財團法人工業技術研究院 | Self-aligned chip carrier and package structure thereof |
DE102016221464A1 (en) * | 2016-11-02 | 2018-05-03 | Karlsruher Institut für Technologie | Method of making an optical system and optical system |
JP7060798B2 (en) * | 2018-05-30 | 2022-04-27 | 日亜化学工業株式会社 | Light source device |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4756590A (en) * | 1985-09-03 | 1988-07-12 | American Telephone And Telegraph Company, At&T Bell Laboratories | Optical component package |
GB2213957A (en) * | 1987-12-15 | 1989-08-23 | Stc Plc | Waveguide to opto-electronic transducer coupling |
EP0331331A2 (en) * | 1988-03-03 | 1989-09-06 | AT&T Corp. | Subassembly for optoelectronic devices |
EP0607524A1 (en) * | 1992-11-25 | 1994-07-27 | Robert Bosch Gmbh | Device for coupling the ends of light wave guides to emitting or receiving elements |
EP0762168A1 (en) * | 1995-08-16 | 1997-03-12 | Robert Bosch Gmbh | Device for coupling a waveguide to a surface emitting element or to a detecting element |
GB2315595A (en) * | 1997-02-07 | 1998-02-04 | Bookham Technology Ltd | Device for re-directing light from an optical waveguide |
US5854867A (en) * | 1996-10-29 | 1998-12-29 | Electronics And Telecommunications Research Institute | Optical module having lenses aligned on lens-positioning V-groove and fabrication method thereof |
EP1030201A1 (en) * | 1999-02-17 | 2000-08-23 | Sumitomo Electric Industries, Ltd. | Light transmitting/receiving module |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE506991C2 (en) * | 1996-01-26 | 1998-03-09 | Ericsson Telefon Ab L M | Method and apparatus for connecting a waveguide to a component |
NL1002752C2 (en) * | 1996-04-01 | 1997-10-02 | Akzo Nobel Nv | A method for the hybrid integration of at least one optoelectronic component and a waveguide, and an integrated electro optical device. |
DE19751650A1 (en) * | 1997-11-21 | 1999-05-27 | Bosch Gmbh Robert | Optical component |
-
1999
- 1999-06-29 DE DE19929878A patent/DE19929878A1/en not_active Withdrawn
-
2000
- 2000-06-15 GB GB0014673A patent/GB2353405B/en not_active Expired - Fee Related
- 2000-06-26 JP JP2000191510A patent/JP2001021769A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4756590A (en) * | 1985-09-03 | 1988-07-12 | American Telephone And Telegraph Company, At&T Bell Laboratories | Optical component package |
GB2213957A (en) * | 1987-12-15 | 1989-08-23 | Stc Plc | Waveguide to opto-electronic transducer coupling |
EP0331331A2 (en) * | 1988-03-03 | 1989-09-06 | AT&T Corp. | Subassembly for optoelectronic devices |
EP0607524A1 (en) * | 1992-11-25 | 1994-07-27 | Robert Bosch Gmbh | Device for coupling the ends of light wave guides to emitting or receiving elements |
EP0762168A1 (en) * | 1995-08-16 | 1997-03-12 | Robert Bosch Gmbh | Device for coupling a waveguide to a surface emitting element or to a detecting element |
US5854867A (en) * | 1996-10-29 | 1998-12-29 | Electronics And Telecommunications Research Institute | Optical module having lenses aligned on lens-positioning V-groove and fabrication method thereof |
GB2315595A (en) * | 1997-02-07 | 1998-02-04 | Bookham Technology Ltd | Device for re-directing light from an optical waveguide |
EP1030201A1 (en) * | 1999-02-17 | 2000-08-23 | Sumitomo Electric Industries, Ltd. | Light transmitting/receiving module |
Also Published As
Publication number | Publication date |
---|---|
GB0014673D0 (en) | 2000-08-09 |
DE19929878A1 (en) | 2001-01-04 |
GB2353405A (en) | 2001-02-21 |
JP2001021769A (en) | 2001-01-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2382542B (en) | System and method for mounting electronic components onto substrates | |
HK1047618A1 (en) | Method of manufacturing an optoelectronic substrate | |
GB2308243B (en) | Substrate for mounting an electronic component | |
SG75830A1 (en) | Process for mounting electronic device and semiconductor device | |
SG87915A1 (en) | Substrate assembling apparatus | |
AU4968500A (en) | Carrier for electronic components and a method for manufacturing a carrier | |
GB2354113B (en) | Ceramic electronic component | |
SG102597A1 (en) | Method for the packaging of electronic components | |
AU5461400A (en) | Polestand apparatus for mounting electronic devices | |
HK1034805A1 (en) | Chip scale surface mount package for semiconductordevice and process of fabricating the same. | |
TW460039U (en) | Optical electronic components array | |
SG102704A1 (en) | Substrate processing apparatus | |
AU5325100A (en) | Mounting apparatus for electronic parts | |
GB2376347B (en) | Mounting structure for module substrates | |
GB9919477D0 (en) | Substrate conveyors | |
EP1041715B8 (en) | Electronic component | |
GB2372006B (en) | System and method for mounting electronic components onto flexible substrates | |
EP1041463A3 (en) | Electronic watch | |
TW577668U (en) | Component-mounting substrate | |
GB2353405B (en) | Substrate for mounting opto-electronic components and process for manufacture thereof | |
AU6270599A (en) | Integrated circuit attachment process and apparatus | |
SG109431A1 (en) | Xy stage | |
AU5926800A (en) | Semiconductor devices and process for manufacture | |
SG81322A1 (en) | Technique for manufacturing electronic parts | |
GB2372228B (en) | System and method for mounting electronic components onto flexible substrates |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20060615 |
|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
728V | Application for restoration filed (sect. 28/1977) | ||
S28 | Restoration of ceased patents (sect. 28/pat. act 1977) |
Effective date: 20081118 |
|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20110615 |