GB0014673D0 - Substrate for mounting opto-electronic components and process for manufacture thereof - Google Patents

Substrate for mounting opto-electronic components and process for manufacture thereof

Info

Publication number
GB0014673D0
GB0014673D0 GBGB0014673.8A GB0014673A GB0014673D0 GB 0014673 D0 GB0014673 D0 GB 0014673D0 GB 0014673 A GB0014673 A GB 0014673A GB 0014673 D0 GB0014673 D0 GB 0014673D0
Authority
GB
United Kingdom
Prior art keywords
manufacture
substrate
electronic components
opto
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB0014673.8A
Other versions
GB2353405A (en
GB2353405B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of GB0014673D0 publication Critical patent/GB0014673D0/en
Publication of GB2353405A publication Critical patent/GB2353405A/en
Application granted granted Critical
Publication of GB2353405B publication Critical patent/GB2353405B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)
GB0014673A 1999-06-29 2000-06-15 Substrate for mounting opto-electronic components and process for manufacture thereof Expired - Fee Related GB2353405B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19929878A DE19929878A1 (en) 1999-06-29 1999-06-29 Support comprises a silicon body having a part with a reflecting surface and a part for receiving an optoelectronic component

Publications (3)

Publication Number Publication Date
GB0014673D0 true GB0014673D0 (en) 2000-08-09
GB2353405A GB2353405A (en) 2001-02-21
GB2353405B GB2353405B (en) 2001-09-26

Family

ID=7912995

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0014673A Expired - Fee Related GB2353405B (en) 1999-06-29 2000-06-15 Substrate for mounting opto-electronic components and process for manufacture thereof

Country Status (3)

Country Link
JP (1) JP2001021769A (en)
DE (1) DE19929878A1 (en)
GB (1) GB2353405B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10160508B4 (en) * 2001-11-30 2005-02-17 Infineon Technologies Ag Arrangement for detecting optical signals of at least one optical channel of a planar optical circuit and / or for coupling optical signals into at least one optical channel of a planar optical circuit
DE10346360B3 (en) * 2003-09-30 2005-06-23 Siemens Ag Electro-optical component for mounting on a carrier component
JP3987500B2 (en) * 2004-02-17 2007-10-10 浜松ホトニクス株式会社 Optical wiring board and method for manufacturing optical wiring board
DE102004050118A1 (en) * 2004-07-30 2006-03-23 Osram Opto Semiconductors Gmbh A semiconductor laser device, an optical device for a semiconductor laser device, and a method of manufacturing an optical device
DE102006017294A1 (en) * 2005-12-30 2007-07-05 Osram Opto Semiconductors Gmbh Optically pumpable semiconductor device for use in resonator, has surface-emitting semiconductor body which is provided with radiation penetration surface that faces away from mounting plane of semiconductor body
TWI517433B (en) * 2013-03-22 2016-01-11 財團法人工業技術研究院 Self-aligned chip carrier and package structure thereof
DE102016221464A1 (en) 2016-11-02 2018-05-03 Karlsruher Institut für Technologie Method of making an optical system and optical system
JP7060798B2 (en) 2018-05-30 2022-04-27 日亜化学工業株式会社 Light source device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4756590A (en) * 1985-09-03 1988-07-12 American Telephone And Telegraph Company, At&T Bell Laboratories Optical component package
GB8729253D0 (en) * 1987-12-15 1988-01-27 Stc Plc Ridge waveguide to photodetector coupling
US4897711A (en) * 1988-03-03 1990-01-30 American Telephone And Telegraph Company Subassembly for optoelectronic devices
DK0607524T3 (en) * 1992-11-25 1998-03-30 Bosch Gmbh Robert Device for interconnecting the ends of fiber optics and transmitting or receiving elements
DE19529978A1 (en) * 1995-08-16 1997-02-20 Bosch Gmbh Robert Arrangement for coupling an optical waveguide to a surface-emitting transmission element and arrangement for coupling an optical waveguide to a receiving element
SE506991C2 (en) * 1996-01-26 1998-03-09 Ericsson Telefon Ab L M Method and apparatus for connecting a waveguide to a component
NL1002752C2 (en) * 1996-04-01 1997-10-02 Akzo Nobel Nv A method for the hybrid integration of at least one optoelectronic component and a waveguide, and an integrated electro optical device.
KR100198460B1 (en) * 1996-10-29 1999-06-15 이계철 Optical module and its fabrication method having lens aligned on v-groove
GB2315595B (en) * 1997-02-07 1998-06-10 Bookham Technology Ltd Device for re-directing light fromoptical waveguide
DE19751650A1 (en) * 1997-11-21 1999-05-27 Bosch Gmbh Robert Optical component
JP2000241642A (en) * 1999-02-17 2000-09-08 Sumitomo Electric Ind Ltd Light transmit/receive module

Also Published As

Publication number Publication date
DE19929878A1 (en) 2001-01-04
GB2353405A (en) 2001-02-21
JP2001021769A (en) 2001-01-26
GB2353405B (en) 2001-09-26

Similar Documents

Publication Publication Date Title
GB2382542B (en) System and method for mounting electronic components onto substrates
HK1047618A1 (en) Method of manufacturing an optoelectronic substrate
GB2308243B (en) Substrate for mounting an electronic component
SG75830A1 (en) Process for mounting electronic device and semiconductor device
AU4968500A (en) Carrier for electronic components and a method for manufacturing a carrier
GB2354113B (en) Ceramic electronic component
SG102597A1 (en) Method for the packaging of electronic components
AU5461400A (en) Polestand apparatus for mounting electronic devices
HK1034805A1 (en) Chip scale surface mount package for semiconductordevice and process of fabricating the same.
TW460039U (en) Optical electronic components array
SG111010A1 (en) Substrate processing apparatus
AU5325100A (en) Mounting apparatus for electronic parts
GB2376347B (en) Mounting structure for module substrates
GB9919477D0 (en) Substrate conveyors
EP1041715B8 (en) Electronic component
GB2372006B (en) System and method for mounting electronic components onto flexible substrates
EP1041463A3 (en) Electronic watch
TW577668U (en) Component-mounting substrate
GB2353405B (en) Substrate for mounting opto-electronic components and process for manufacture thereof
AU6270599A (en) Integrated circuit attachment process and apparatus
AU5926800A (en) Semiconductor devices and process for manufacture
SG109431A1 (en) Xy stage
SG81322A1 (en) Technique for manufacturing electronic parts
GB2372228B (en) System and method for mounting electronic components onto flexible substrates
AU5647699A (en) Electronic parts mounting device

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20060615

732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
728V Application for restoration filed (sect. 28/1977)
S28 Restoration of ceased patents (sect. 28/pat. act 1977)

Effective date: 20081118

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20110615