200403554 Π) 玖、發明說明 【發明所屬之技術領域】 本發明係有關半導體處理系統,尤其是有 使用者介面(GUIs )以組態(configure )及 應器之半導體處理系統。 【先前技術】 電腦一般被使用以控制、監視、及啓動製 腦極適於這些操作,因爲半導體製造工廠中來 圓流程、關鍵處理步驟、及製程可維修性的複 各種輸入輸出(I/O )裝置以控制及監視處理 狀態、及維修時程。半導體製造工廠中存在有 完成從關鍵操作(諸如蝕刻)至分批處理之複 及檢驗。大部分的工具裝設係使用一顯示幕而 示幕係一含有裝設軟體之控制電腦的圖形使 GUI )之部分。半導體處理工具之裝設係一種 〇 半導體處理設備需要經常的監視。處理條 而改變,即使於關鍵製程參數之最微小改變亦 結果。微小改變可能輕易地發生於蝕刻氣體之 、製程室、或晶圓溫度。於許多情況下,其反 之惡化的製程資料改變無法僅藉由參考所顯示 而檢測到。檢測一製程之早期異常及特性惡化 經常需要先進製程控制(APC )所提供之預測 關使用圖形 使用動態感 造程序。電 自再進入晶 雜度。使用 流程、晶圓 各種工具以 雜步驟、以 完成’此顯 用者介面( 耗時的程序 件隨著時間 產生不利的 成分或壓力 應處理特性 之製程資料 是困難的。 及型態識別 (2) (2)200403554 設備控制經常係由具有各種控制器之數個不同控制系 統來執行。某些控制系統可能具有人機介面(諸如觸控式 螢幕)’而其他系統可能僅接收並顯示一變數(諸如溫度 )。監視系統可收集製程控制系統所表列的資料。監視系 統之資料收集可涉及單變量或多變量的資料、資料之分析 及顯示,且可具有選擇欲收集之製程變數的能力。一製程 中之各種條件係由每一製程室中所提供之不同感應器所監 視,而所監視條件之資料被轉移並累計於一控制電腦中。 假如係自動地顯示及檢測製程資料,則可設定並透過統計 製程控制(SPC )圖表以控制大量生產線之最佳製程條件 。一設備之不足的監視可能導致設備停機時間,其增加了 總操作成本。 【發明內容】 依據一型態,本發明提供一種使用圖形使用者介面( GUIs )以設定一動態感應器於一之半導體處理環境中的方 法。於此方法中,執行一資料收集計畫。使用資料收集計 畫以決定一動態感應器設定計畫。執行動態感應器設定計 畫以設定動態感應器。 【實施方式】 圖1顯示一半導體製造環境中之APC系統的示範方 塊圖,依據本發明之一實施例。於所示之實施例中’半導 -5- (3) (3)200403554 體製造環境100包含至少一半導體處理工具11〇、多數製 程模組120 (PM1至PM4)、感應器介面140、及APC系 統145。APC系統145可包含介面伺服器(IS ) 150、APC 伺服器1 6 0、客戶工作站1 7 0、GUI組件1 8 0、及資料庫 1 90。於一實施例中,IS 1 50可包含一即時記憶體資料庫 ,其可被視爲一 “集線器”。 APC系統145可包含一工具狀態監視系統,用以監視 至少一處理工具 '一製程模組、及一感應器之一的性能。 於所示之實施例中,單一工具110被顯示配合四個製 程模組1 20,但此並非本發明之必要需求。工具狀態監視 系統可介面與數個處理工具,其包含具有一或更多製程模 組之叢集工具。工具狀態監視系統可被用以組態及監視數 個處理工具,其包含具有一或更多製程模組之叢集工具。 例如’工具及其相關製程模組可被使用以執行蝕刻、沈積 、擴散、淸潔、測量、拋光、生長、轉移、儲存、載入、 卸載、對齊、溫度控制、微影術、積體度量衡(IM )、 光學資料輪廓描繪(ODP )、粒子檢測、及其他半導體製 造程序。 於一實施例中,處理工具1 1 〇可包含一工具代理( agent )(未顯示),其可爲一執行於工具! 1〇上之軟體 程序’且其可提供事件資訊、上下文(context )資訊、及 開始-停止時序指令,用以使資料獲取與工具程序同步化 。同時,APC系統145可包含一代理客戶(未顯示),其 可爲一軟體程序,此軟體程序可被使用以提供與工具代理 (4) 200403554 之連接。例如,APC系統145可經由一網際網路或者 網路連接而被連接至一處理工具1 1 0。 於一實施例中,I S 1 5 0係使用插座以通訊。例如 面可使用TCP/IP插座通訊而被實施。在每次通訊之 建立一插座。接著一訊息被當作一字串而傳送。在訊 送之後,插座被刪除。 另一方面,介面可被構成爲一 TCL程序,延伸以 + +碼、或C/C + +程序,其使用一特殊類別,諸如 訊息集線器(DMH )客戶類別。於此情況下,邏輯電 其透過插座連接以收集程序/工具事件)可被修改以 件及其上下文資料插入IS 150之一表中。 工具代理可傳送訊息以提供事件及上下文資訊至 狀態監視系統。例如,工具代理可傳送批量開始/停 息、分批開始/停止訊息、晶圓開始/停止訊息、處理 (recipe )開始/停止訊息、及製程開始/停止訊息。 ,工具代理可被使用以傳送及/或接收設定點資料並 及/或接收維修計數器資料。 當一處理工具包含內部感應器時,則此資料可被 至工具狀態監視系統。資料檔案可被使用以轉移此資 例如,某些處理工具可產生追蹤檔案,其被壓縮於工 當其被產生時。壓縮及/或未壓縮資料可被轉移。當 檔案被產生於一處理工具中時,追蹤資料可以或者可 包含終點檢測(EPD )資料。追蹤資料提供有關製程 要資訊。追蹤資料可被更新及轉移,在完成一晶圓之 內部 ,介 一 刖? 息傳 C/C 分佈 路( 將事 工具 止訊 程式 此外 傳送 傳送 料。 具中 追蹤 以不 之重 處理 -7- (5) (5)200403554 之後。追蹤檔案可被轉移至各製程之較佳目錄。於一實施 例中,可從一處理工具1 1 〇獲得工具追蹤資料、維修資料 、及EPD資料。 於圖1中’顯示四個製程模組,但此並非本發明所.必 要的。半導體處理系統可包含任何數目的處理工具,其具 有任何數目之與其相關的製程模組及獨立的製程模組。包 含工具狀態監視系統之AP C系統1 4 5可被使用以組態及 監督任何數目的處理工具,其具有任何數目之與其相關的 製程模組及獨立的製程模組。工具狀態監視系統可收集、 提供、處理、儲存、及顯示來自有關處理工具、製程模組 、及感應器之製程的資料。 製程模組可使用諸如ID、模組型式、氣體參數、及 維修計數器等資料而被識別,而此資料可被儲存於一資料 庫中。當組態一新的製程模組時,此資料型式可使用GUI 組件 1 8 0中之一模組組態面板/螢幕而被提供。例如, APC系統可支援下列來自東京電子有限公司之工具型式: 單一相關的製程模組、三重相關的製程模組、Tel ins相關 的製程模組、OES相關的模組、及ODP-相關的模組。另 一方面’ APC系統可支援其他工具及其相關的製程模組。 例如’ APC系統1 45可經由一網際網路或內部網路連接而 被連接至製程模組120。200403554 Π) 发明 Description of the invention [Technical field to which the invention belongs] The present invention relates to semiconductor processing systems, and particularly to semiconductor processing systems having user interfaces (GUIs) to configure and respond. [Previous Technology] Computers are generally used to control, monitor, and activate brains, which are very suitable for these operations, because in semiconductor manufacturing plants, various input and output (I / O) processes, key processing steps, and process maintainability ) Device to control and monitor the processing status and maintenance schedule. There are semiconductor manufacturing plants that perform repetitive inspections from key operations such as etching to batch processing. Most of the tool installations use a display screen and the display screen is a part of the graphics control GUI that contains the control computer for the installation software. The installation of semiconductor processing tools is a type of semiconductor processing equipment requires frequent monitoring. The process bar changes, even with the smallest changes in key process parameters. Minor changes can easily occur in the etching gas, process chamber, or wafer temperature. In many cases, changes in deteriorating process data cannot be detected simply by referring to the display. Detecting early abnormalities and deterioration of characteristics of a process often requires predictions provided by Advanced Process Control (APC). Electricity re-enters crystal heterogeneity. The use of processes, various tools on the wafer to complete various steps to complete this user interface (the time-consuming process parts produce unfavorable components over time or stress should be processed characteristics of process data is difficult. And type identification (2 ) (2) 200403554 Device control is often performed by several different control systems with various controllers. Some control systems may have a human-machine interface (such as a touch screen) 'while other systems may only receive and display a variable (Such as temperature). The monitoring system can collect the data listed in the process control system. The data collection of the monitoring system can involve univariate or multivariate data, data analysis and display, and it can have the ability to select the process variables to be collected Various conditions in a process are monitored by different sensors provided in each process room, and the data of the monitored conditions are transferred and accumulated in a control computer. If the process data is automatically displayed and detected, then Can set and pass the statistical process control (SPC) chart to control the optimal process conditions of a large number of production lines. Monitoring may lead to equipment downtime, which increases the total operating cost. [Summary of the Invention] According to a type, the present invention provides a method for using a graphical user interface (GUIs) to set a dynamic sensor in a semiconductor processing environment. Method. In this method, a data collection plan is executed. A data collection plan is used to determine a motion sensor setting plan. A motion sensor setting plan is performed to set a motion sensor. [Embodiment] Figure 1 shows a An exemplary block diagram of an APC system in a semiconductor manufacturing environment, according to an embodiment of the present invention. In the illustrated embodiment, the 'Semiconductor-5- (3) (3) 200403554 bulk manufacturing environment 100 includes at least one semiconductor processing tool 110. Most process modules 120 (PM1 to PM4), sensor interface 140, and APC system 145. APC system 145 may include interface server (IS) 150, APC server 160, client workstation 170, The GUI component 180 and the database 1 90. In one embodiment, the IS 1 50 may include a real-time memory database, which may be regarded as a "hub". The APC system 145 may include a A status monitoring system is used to monitor the performance of at least one processing tool, a process module, and one of the sensors. In the illustrated embodiment, a single tool 110 is shown to cooperate with four process modules 120, but This is not a necessary requirement of the present invention. The tool condition monitoring system can have an interface and several processing tools, which include a cluster tool with one or more process modules. The tool condition monitoring system can be used to configure and monitor several processing tools , Which includes cluster tools with one or more process modules. For example, 'tools and their associated process modules can be used to perform etching, deposition, diffusion, cleaning, measurement, polishing, growth, transfer, storage, loading , Unloading, alignment, temperature control, lithography, integrated weights and measures (IM), optical data contouring (ODP), particle detection, and other semiconductor manufacturing processes. In an embodiment, the processing tool 110 may include a tool agent (not shown), which may be an execution tool! The software program above 10 can provide event information, context information, and start-stop timing instructions to synchronize data acquisition with the tool program. Meanwhile, the APC system 145 may include an agent client (not shown), which may be a software program, and this software program may be used to provide a connection with the tool agent (4) 200403554. For example, the APC system 145 may be connected to a processing tool 110 via an Internet or a network connection. In one embodiment, I S 1 50 uses a socket for communication. For example, it can be implemented using TCP / IP socket communication. Create a socket for each communication. A message is then sent as a string. After the message, the socket is deleted. On the other hand, the interface can be structured as a TCL program, extended by a + code, or a C / C ++ program, which uses a special category, such as the Message Hub (DMH) client category. In this case, the logic unit (connected via a socket to collect program / tool events) can be modified and inserted into a table of IS 150 with its contextual information. The tool agent can send messages to provide event and contextual information to the condition monitoring system. For example, the tool agent can send batch start / stop messages, batch start / stop messages, wafer start / stop messages, recipe start / stop messages, and process start / stop messages. The tool agent can be used to send and / or receive setpoint data and / or receive maintenance counter data. When a processing tool includes an internal sensor, this data can be passed to the tool condition monitoring system. Data files may be used to transfer this data. For example, certain processing tools may generate trace files that are compressed when they are generated. Compressed and / or uncompressed data can be transferred. When the file is generated in a processing tool, the tracking data may or may contain endpoint detection (EPD) data. The tracking data provides important information about the process. The tracking data can be updated and transferred. Within the completion of a wafer, the information transmission C / C distribution path (in addition to the tool stop program will also send the transmission material. The tracking in the tool will be processed without emphasis. 7- (5) After (5) 200403554. The tracking file can be transferred to a better directory for each process. In one embodiment, tool tracking data, maintenance data, and EPD data can be obtained from a processing tool 1 10. Figure "1" shows four process modules, but this is not necessary for the present invention. The semiconductor processing system can include any number of processing tools, which has any number of process modules associated with it and independent process modules. Contains The AP C system 1 4 5 of the tool condition monitoring system can be used to configure and supervise any number of processing tools with any number of process modules and independent process modules associated with it. The tool condition monitoring system can collect, Provides, processes, stores, and displays data from processes related to processing tools, process modules, and sensors. Process modules can be used such as ID, module type, gas Data and maintenance counters are identified, and this data can be stored in a database. When a new process module is configured, this data type can use one of the GUI component 180 modules For example, the APC system can support the following tool types from Tokyo Electronics Co., Ltd .: Single related process module, triple related process module, Tel ins related process module, OES related module Group, and ODP-related modules. On the other hand, the 'APC system can support other tools and their related process modules. For example,' APC system 1 45 can be connected to the process via an Internet or intranet connection. Module 120.
於所示之實施例中,一單一感應器130被顯示連同一 相關的製程模組,但此非本發明所必要的。任何數目的感 應器可被耦合至一製程模組。感應器130可包含一 ODP (6) (6)200403554 感應器、一 0ES感應器、一 VIP感應器、一類比感應器 、及其他型式的半導體處理感應器,包含數位探針。APC 資料管理應用可被使用以收集、處理、儲存、顯示、及輸 出來自多種感應器之資料。 於A P C系統中’感應器資料可由外邰及內部來源提 供。外部來源可使用一外部資料記錄器型式而被界定;一 資料記錄器標的可被指定給各外部來源;而一狀態變數表 示可被使用。 感應器組態資訊結合感應器型式及感應器實例參數。 感應器型式是一般用語’其相應於感應器之功能。一感應 器實例將感應器型式配對至一特定製程模組及工具上之一 特定感應器。至少一感應器實例被組態給各貫體感應器, 其係裝附至一工具。 例如,一 0ES感應器可爲一種感應器型式;一 VI探 針可爲另一種感應器型式;而一類比感應器可爲一種不同 的感應器型式。此外,可能有額外的一般性感應器型式及 額外的特定感應器型式。一感應器型式包含其欲於操作時 間設定一特定感應器種類所需的所有變數。這些變數可爲 靜態的(此型式之所有感應器均具有相同的値)、可由實 例組態(感應器型式之各實例可具有一獨特的値)'或者 可由一資料收集計畫所動態地組態的(每次於操作時間啓 動感應器時,則其可被提供一不同値)。 “可由實例組態”變數可爲感應器/探針1 P位址。此位 址隨實例而變(對於各製程室)但不會隨每次運作而改變In the illustrated embodiment, a single sensor 130 is shown connected to the same related process module, but this is not necessary for the present invention. Any number of sensors can be coupled to a process module. The sensor 130 may include an ODP (6) (6) 200403554 sensor, an OES sensor, a VIP sensor, an analog sensor, and other types of semiconductor processing sensors, including digital probes. APC data management applications can be used to collect, process, store, display, and output data from a variety of sensors. The sensor data in the APC system can be provided by external and internal sources. External sources can be defined using an external data logger type; a data logger target can be assigned to each external source; and a state variable representation can be used. Sensor configuration information combines sensor type and sensor instance parameters. The sensor type is a general term 'which corresponds to the function of the sensor. A sensor instance pairs a sensor type to a specific sensor on a specific process module and tool. At least one sensor instance is configured for each body sensor, which is attached to a tool. For example, an 0ES sensor can be one sensor type; a VI probe can be another sensor type; and an analog sensor can be a different sensor type. In addition, there may be additional general sensor types and additional specific sensor types. A sensor type contains all the variables it needs to set a particular sensor type at the time of operation. These variables can be static (all sensors of this type have the same 値), can be configured by instances (each instance of the sensor type can have a unique 値) 'or can be dynamically grouped by a data collection project State (Each time the sensor is activated during operation time, it can be provided with a different value). The "configurable by example" variable can be a sensor / probe 1 P address. This address varies from instance to instance (for each process room) but does not change with each operation
-9- (7) 200403554 。“可由資料收集計畫所組態”變數可爲諧波頻率之一 。這些可根據上下文資訊而被不同地組態於各晶圓。 ,晶圓上下文資訊可包含工具ID、模組ID、槽(s ID、處理程式ID、卡帶Ϊ D、開始時間及結束時間。 有相同感應器型式之許多實例。一感應器實例係相應 特定硬體件,且將一感應器型式連接至工具及/或製 組(室)。換言之,一感應器型式是一般性的而一感 實例是特定的。 如圖1中所示,感應器介面1 40可被使用以提供 於感應器130與APC系統145之間的介面。例如, 系統1 4 5可經由一網際網路或內部網路連接而被連接 應器介面140,且感應器介面140可經由網際網路或 網路連接而被連接至感應器1 3 0。同時,感應器介面 可作用爲一協定變換器、媒體變換器、及資料緩衝器 外,感應器介面1 40可提供即時功能,諸如資料獲取 對點通訊、及I/O掃瞄。另一方面,感應器介面140 去除,且圖案記憶體1 3 0可被直接地耦合至APC系統 〇 圖案記憶體1 3 0可爲一靜態或者動態感應器。例 一動態VI感應器可具有其頻率範圍、取樣週期、比 觸發、及偏移資訊,其係於操作時間使用由一資料收 畫所提供之參數而建立。感應器1 3 0可爲一類比感應 其可爲靜態及/或動態的。例如,類比感應器可被使 提供E S C電壓之資料、匹配器參數、氣體參數、流 表列 例如 lot) 可能 於一 程模 應器 一介 APC 至感 內部 140 。此 、點 可被 145 如, 例、 集計 器, 用以 率、 -10- (8) 200403554 壓力、溫度、RF參數、及其他製程相關資料。 130可包含至少下列之一 :VIP探針、0ES感應器 感應器、數位感應器、及半導體處理感應器。 於一實施例中,感應器介面可將資料點寫入至 資料檔案。例如,I S 1 5 0可傳送一開始指令至感應 以啓動資料獲取且可傳送一停止指令以造成檔案關 1 5 0可接著讀取及分析感應器資料檔案,處理資料 料値登錄in記憶體資料表。 另一方面,感應器介面可即時地將資料串流至 。可提供一開關以容許感應器介面將檔案寫至碟片 器介面亦提供一種讀取檔案及將資料點串流至I S 方法,以供離線處理及分析。 如圖1所示,APC系統145可包含一資料庫1 具狀態監視資料可被儲存於資料庫1 9 0。此外,來 之原始資料及追蹤資料可被儲存爲資料庫1 9 0中之 資料之量係取決於使用者所組態之資料收集計畫、 程所執行和處理工具被運作之頻率。例如,資料收 可被建立以供決定如何以及何時收集工具狀態資料 理工具、處理室、感應器、及A P C系統所獲得的 儲存於表中。 於一實施例中,表可被實施於IS 150以成爲 體表及於資料庫190中以成爲恆久的儲存。is ι5〇 結構查詢語言(SQL )以供行及列產生以及將資料 中。表可被複製於資料庫1 9 0中之恆久表中(亦即 感應器 、類比 一原始 器介面 閉。IS 並將資 IS 15〇 。感應 150 ^ 9〇。:L 自工具 檔案。 以及製 集計纖 。從處 資料被 i η記憶 可使用 登錄表 丨,DB2 -11 - (9) (9)200403554 可被使用)且可使用相同S QL敘述而被塡入。 於所述之實施例中,IS 1 50可爲in記憶體即時資料 庫及訂閱伺服器。例如,客戶程序能夠使用S Q L執行資 料庫功能,以相關資料表之常見的編程模型。此外,j s 1 5 0可提供一資料訂閱服務,其中客戶軟體接收異步通知 ,每當插入、更新、或刪除符合其選擇條件之資料時。訂 閱係使用SQL選擇敘述之完整能力以指明哪些表行是相 關的以及使用哪個列選擇條件以過濾未來資料改變通知。 因爲I S 1 5 0是資料庫以及訂閱伺服器,所以客戶可 開啓“同步化”訂閱至現存的表資料,當其被初始化時。 I S 1 5 0透過一公告/訂閱機構、i n記憶體資料表、及監督 邏輯電路(供透過系統來整理事件及警示)以提供資料同 步化。IS 150提供數個傳訊TCP/IP基的技術,包含插座 、UDP、及公告/訂閱。 例如,I S 1 5 0架構可使用多重資料集線器(即,s Q L 資料庫)’其可提供即時資料管理及訂閱功能。應用模組 及使用者介面係使用S Q L訊息以存取及更新資料集線器 中之資訊。由於有關將操作時間資料登錄至相關資料庫之 性能限制’所以操作時間資料被登錄至其由IS 1 50所管 理之in記憶體資料表。這些表的內容可被登錄至相關資 料庫’於晶圓處理結束時。 於圖1所示之實施例中,顯示單一客戶工作站〗7 〇, 但此並非本發明所必要。A P C系統1 4 5可支援多數客戶工 作站1 70。於一實施例中,客戶工作站丨7〇容許一使用者-9- (7) 200403554. The "configurable by data collection plan" variable can be one of the harmonic frequencies. These can be configured differently for each wafer according to the context information. The wafer context information can include tool ID, module ID, slot (s ID, handler ID, cassette Ϊ D, start time and end time. There are many instances of the same sensor type. A sensor instance is the corresponding specific hardware Body, and connect a sensor type to the tool and / or system (room). In other words, a sensor type is general and a sensor example is specific. As shown in FIG. 1, the sensor interface 1 40 may be used to provide an interface between the sensor 130 and the APC system 145. For example, the system 1 4 5 may be connected to the processor interface 140 via an Internet or intranet connection, and the sensor interface 140 may be Connected to the sensor 130 via the Internet or a network connection. At the same time, the sensor interface can function as a protocol converter, media converter, and data buffer. The sensor interface 1 40 can provide real-time functions , Such as data acquisition and peer-to-peer communication, and I / O scanning. On the other hand, the sensor interface 140 is removed, and the pattern memory 130 can be directly coupled to the APC system. The pattern memory 130 can be one. Static or dynamic Example. A dynamic VI sensor can have its frequency range, sampling period, specific trigger, and offset information. It is created at operating time using parameters provided by a data recording. The sensor 1 3 0 can An analog sensor can be static and / or dynamic. For example, an analog sensor can be used to provide ESC voltage data, matcher parameters, gas parameters, flow tables such as lots. Interior 140. This point can be used, for example, as an example, a counter, to rate, -10- (8) 200403554 pressure, temperature, RF parameters, and other process related data. 130 may include at least one of the following: a VIP probe, an 0ES sensor, a digital sensor, and a semiconductor processing sensor. In one embodiment, the sensor interface can write data points to a data file. For example, IS 1 50 can send a start command to the sensor to start data acquisition and can send a stop command to cause the file to close. 1 50 can then read and analyze the sensor data file, process the data, log in to the memory data table. On the other hand, the sensor interface can stream data to in real time. A switch can be provided to allow the sensor interface to write files to the disc interface. The interface also provides a method for reading files and streaming data points to the IS for offline processing and analysis. As shown in FIG. 1, the APC system 145 may include a database 1 and status monitoring data may be stored in the database 190. In addition, the amount of original data and tracking data that can be stored in the database 190 depends on the frequency with which the user-configured data collection plan, process execution, and processing tools are operated. For example, data collections can be created for deciding how and when to collect tool status data. Processing tools, processing rooms, sensors, and APC systems are stored in tables. In one embodiment, the watch may be implemented in the IS 150 to become a body watch and in the database 190 to become a permanent storage. is ι5〇 Structure query language (SQL) for row and column generation and data. The table can be copied to the permanent table in the database 190 (that is, the sensor, analog-original interface is closed. IS will be IS 150. Induction 150 ^ 90 .: L self-tool file. Collecting and counting fiber. The data can be used in the registration form, and DB2 -11-(9) (9) 200403554 can be used) and can be entered using the same SQL description. In the described embodiment, IS 1 50 may be an in-memory real-time database and a subscription server. For example, client programs can use SQL to perform database functions, with a common programming model for related datasheets. In addition, j s 150 can provide a data subscription service, in which client software receives asynchronous notifications whenever a data that meets its selection conditions is inserted, updated, or deleted. Subscriptions use the full power of SQL selection narratives to indicate which table rows are relevant and which column selection criteria to use to filter future data change notifications. Because IS 150 is a database and a subscription server, customers can turn on "synchronization" to subscribe to existing table data when it is initialized. I S 1 50 provides data synchronization through an announcement / subscription organization, in-memory data tables, and supervisory logic circuits (for organizing events and alerts through the system). The IS 150 provides several messaging TCP / IP-based technologies, including sockets, UDP, and announcement / subscription. For example, the IS 150 architecture can use multiple data hubs (ie, sQL databases) 'which can provide real-time data management and subscription functions. Application modules and user interfaces use SQL messages to access and update information in the data hub. Due to the performance limitation of registering the operation time data to the related database, the operation time data is registered in the in-memory data table managed by IS 150. The contents of these tables can be registered in the relevant database 'at the end of wafer processing. In the embodiment shown in FIG. 1, a single client workstation is displayed, but this is not necessary for the present invention. A PC system 1 4 5 can support most customer workstations 1 70. In one embodiment, the client workstation 70 allows a user
-12- (10) (10)200403554 執行組態程序;觀看包含工具、室、及感應器狀態之狀態 ;觀看製程狀態;觀看歷史資料;及執行模擬與製圖功能 〇 於圖1所示之實施例中,A P C系統1 4 5可包含一 A P C 伺服器1 6 0 (其可耦合至I s 1 5 0 )、客戶工作站1 7 0、 GUI組件1 8 0、及資料庫1 9 〇,但此非本發明所必要。 AP C伺服器1 6 0可包含數個應用,包含至少一工具相關的 應用、至少一模組相關的應用、至少一感應器相關的應用 、至少一 IS相關的應用、至少一資料庫相關的應用、及 至少一 GUI相關的應用。此外,Apc伺服器可包含數個 工具狀態監視系統應用。 APC伺服器1 60包含至少一電腦及軟體,其支援多製 程工具;收集並同步化來自工具、製程模組、感應器、及 探針之資料;儲存資料於資料庫中;致能使用者觀看現有 圖表;及提供錯誤檢測。例如,APC伺服器1 60可包含操 作軟體,諸如來自東京電子(Tokyo Electron)之Ingenio 軟體。AP C伺服器容許線上系統組態、線上批量至批量錯 誤檢測、線上晶圓至晶圓錯誤檢測、線上資料庫管理,並 使用根據歷史資料之模型以執行總結資料之多變量分析。 此外,工具狀態監視系統容許處理工具之即時監視。 例如,APC伺服器160可包含數個最小3GB的可用 磁碟空間;至少 600 MHz CPU (雙處理器);最小 512 Mb RAM (實體記憶體);RAID 5組態之9 GB SCSI硬碟 ;RAM大小之兩倍的最小磁碟快取記憶體;裝設視窗 (11) (11)200403554 2000伺服器軟體;微軟網際網路Explorer; TCP/IP網路 協定;及至少兩個網路卡。 APC系統145可包含至少一儲存裝置,其儲存含有來 自感應器之原始資料的檔案及含有來自工具之追蹤資料的 檔案。假如這些檔案未妥善管理(即,一般性地被刪除) ’則儲存裝置可能有不足的磁碟空間,且可能停止收集新 的資料。APC系統145可包含一資料管理應用程式,其容 許使用者刪除較早檔案,藉此釋放磁碟空間以致其可持續 資料收集而無中斷。AP C系統1 4 5可包含多數表,其被使 用以操作系統,且這些表可被儲存於1 9 0中。此外,其他 電腦(未顯示),諸如現場或非現場電腦/工作站及/或主 機,可被網路連接以提供功能,諸如資料/圖表觀看、S P C 製圖、EPD分析、檔案存取,給一或許多工具。 如圖1所示,A P C系統1 4 5可包含一 G UI組件1 8 0。 例如,一 GUI組件可運作爲APC伺服器160、客戶工作 站1 70、及工具1 10上之一應用程式。 G U I組件1 8 0致使一 A P C系統使用者得以執行所欲 的組態、資料收集、監視、模擬、及故障排解工作,以盡 可能少的輸入。GUI設計符合半導體製造設備之SEMI人 類介面標準(SEMI Draft Doc.#2783B)以及 SEMATECH 策略胞控制器(SCC)使用者-介面型指導1.〇 ( Technology Transfer 9206 1 1 79A-ENG)。熟悉此項技術者 將瞭解其GUI面板/螢幕可包含左至右選擇移動結構及/或 右至左結構、底部至頂部結構、頂部至底部結構、或組合 -14- (12) (12)200403554 結構。 雖然供說明所顯示之螢幕爲英文版本,但此並非本發 明之必要條件,而亦可使用不同的語言。例如’日文螢幕 、中文螢幕、台文螢幕、韓文螢幕、德文螢幕、及法文螢 幕均可被使用。 同時,GUI組件1 80提供一介於工具狀態監視系統與 使用者之間的互動機構。當GUI開始時,可顯示一驗證 使用者身份及暗語之註冊螢幕,且其提供第一級安全防護 。使用者可使用一安全防護應用程式而被登入,在註冊之 前。使用者身份之資料庫檢查指示一授權等級,其將簡化 可用的GUI功能。使用者未被授權之選項可能爲不同及 不可取得。安全防護系統亦容許使用者改變現有的暗語。 例如,註冊面板/螢幕可被開啓自一瀏覽器工具,諸如 Netscape或 Internet Explorer。使用者可鍵入使用者 ID 及暗語於註冊欄位。 被授權之使用者及管理者可使用GUI面板/螢幕以修 改系統組態及感應器設定參數。GUI組件180可包含一組 態組件,以容許使用者組態處理工具、處理模組、感應器 、及APC系統。例如,GUI組態面板/螢幕可被提供至少 一處理工具、一處理模組、一感應器、一感應器實例、〜 模組暫停、及一警示之一。組態資料可被儲存於一屬性資 料庫表且可於裝設時被設定以內定値。 GUI組件1 8 0可包含一狀態組件,以供顯示處理工具 、處理模組、感應器、及APC系統之目前狀態。此外, (13) 200403554 狀態組件可包含一製圖組件,以供提呈系統相關及製程 關資料給一使用者,使用一或更多不同的圖表型式。 同時,GUI組件1 8 〇可包含一即時操作組件。例如 一 G ϋ I組件可被耦合至一上下文工作,而共用系統邏 電路可提供由上下文工作及GUI組件所使用之共同功 。共用邏輯電路可被使用以確保其送至GUI組件之回 値與送至上下文工作之回覆値相同。再者,GUI組件1 可包含一 APC檔案管理GUI組件及一安全防護組件。 可存有協助面板/螢幕。例如,協助檔案被提供以PDF 可攜式文件格式)及/或HTML格式。 如圖1所示’包含一工具狀態監視系統之AP C系 145可被耦合至一工廠系統1〇5及/或e診斷系統U5。 廠系統1 0 5及/或E診斷系統1 1 5可提供機構,以利外 地監視及外部地控制一半導體處理系統中之工具、模組 感應器、及製程。另一方面,工廠系統1〇5及/或E診 系統1 1 5可執行工具狀態監視。例如,使用者可使用一 路爲基礎的終端機以存取工具狀態監視系統,此裝置係 由工廠系統105及或E診斷系統115而被耦合至半導體 理系統。 此外,AP C系統及E診斷系統可共同工作以解決 時的問題。例如,當A P C系統1 4 5檢測到一錯誤時, 欲診斷其問題所需的資訊可由A P C伺服器彙整並傳輸 E診斷系統或者被儲存以供往後由£診斷系統存取。操 方法可使用安全防護限制及/或顧客商業規則而被決定。 -16- 相 輯 能 覆 80 亦 ( 統 工 部 Λ 斷 網 經 處 即 則 至 作 (14) (14)200403554 同日v,A P C包含機構,以利加入感應器、編輯資料收 集。十m ’其係所驅動的上下文及/或事件。例如,此可容 許E g#斷“探針”及/或軟體組件被下載以供E診斷系統排 除系統故障。E診斷系統可包含一可攜組的診斷工具,其 可fee供額外資料、其可被使用以診斷、檢測、及/或預測 一問題。例如,APC系統可使用這些診斷工具爲額外的感 應器。以一般性感應器介面(其支援多重協定,包含類比 輸入爲最低等級),則一局部可攜式診斷單元可被耦合至 工廠系統且接著由APC系統、診斷系統及/或工廠系統遠 端地使用。 APC系統可設有一新的應用程式,其係遠端地於工廠 開發並從工廠或E診斷系統下載。例如,新的應用程式可 局部地駐存於A P C伺服器中。A P C系統具有學習新程序 及動態地加入感應器、加入應用程式、及甚至加入一訂做 感應器之GUI螢幕的能力。再者,APC系統可執行極特 定的程序,諸如時序分析分配以算出一工具及/或模組何 時會故障(亦即,具有一馬達或致動器臂位置之晶圓操作 系統問題)。 此外’ A P C系統可根據工具性能以改變取樣率。例如 ’資料收集取樣率及分析量可根據工具情況而被改變。 A p C系統亦可預測一問題或者檢測到一工具及/或模組已 接近一極限情況。 此外’先進的使用者及管理者可使用GUI螢幕以修 改系統組態及感應器設定參數據機產生及編輯工具相關策 (15) (15)200403554 略及計畫;及/或修改工具及模組數目。 工具狀態監視系統係使用一可組態的系統而被實施, 此可組態系統致使顧客(末端使用者)得以加入處理工具 、製程模組、及/或感應器。工具狀態監視系統提供一開 發環境及方法,其致使顧客得以訂做監視軟體、加入分析 應用程式、及/或裝設及監視環境中之新工具、模組、及 感應器。 工具狀態監視系統軟體架構包含四個功能組件:一資 料獲取組件、一傳訊系統組件、一相關資料庫組件、及一 後處理組件。此架構亦包含in記憶體資料表,其係用以 儲存操作時間資料獲取參數。工具狀態監視系統之外爲工 具(以及工具代理),其提供上下文資訊及開始-停止時 序指令,以使資料獲取與工具製程同步化。 資料獲取組件收集資料點(其被稱爲參數)並將其寫 入至一檔案。傳訊系統使用in記憶體資料表以暫時地儲 存接收自資料獲取組件之操作時間資料。傳訊系統係由一 代理及/或工具客戶告知有關資料獲取週期之開始及結束 。於資料獲取週期之結束時,資料被登錄至相關資料庫, 而in記憶體資料表被淸除以利下一獲取週期。由傳訊系 統所供應之資料的後處理被執行於操作時間;儲存於相關 資料庫中之資料的後處理被離線地執行。 工具狀態監視系統之目標係使用即時及歷史資料以增 進半導體處理系統之性能。爲了達成此目標,可預測潛在 的問題(諸如感應器問題)並在其發生之前校正,因而減 -18- (16) (16)200403554 少設備停機時間以及所製造之非產品晶圓的數目。此目標 可錯由收集資料並接著將該資料饋送至一模擬特定工具之 行爲的軟體演算法而達成。工具狀態監視系統輸出製程參 數調適,其接著被向前或向後饋送以保持工具性能於指定 的限制內。此控制可被達成以不同等級之不同形式。 工具狀態監視系統之警示管理部分可提供錯誤檢測演 算法、錯誤分類演算法、及/或錯誤預測演算法。工具狀 態監視系統可預測一工具何時將會故障,且可辨識可能的 解決之道以校正該故障並減少於維修及處理功能期間所製 造的非產品晶Η之數目。 動態感應器應用程式提供使用者得以決定一動態感應 器是否收集資料的能力。當一資料收集計畫無須來自一動 態感應器之資料時’則感應器狀態提供使用者有關此感應 器並非預期爲開之指示。例如,當一資料收集計畫無須資 料時,則感應器狀態應爲“線上〇 f f”,而當使用者已於系 統級關斷感應器時’則狀態應爲“離線〇ff”。 動態感應器之介面能承受故障以及服務相關的中斷。 此外,介面提供設定及疑難排解的能力。例如,當發生一 中斷時,動態感應器及/或A P C系統便檢測中斷並啓動記 錄、警示及自動復原/分析以決定正確的行動並縮小功能 之損失。以此方式’可減少於動態感應器及/或A P C系統 操作以減少的功能時對於製造產品之顧客的風險。 此外,動態感應器應用程式可操作於服務^維修模式 期間。爲了疑難排解感應器通訊之目的’可於未處理晶圓 -19- (17) 200403554 時測試動態感應器。例如,動態感應器可被設定、開 停止自一網路爲基礎的GUI。此特徵可一般地被使用 應器設定及固定的感應器維修。 AP C系統係使用一可組態系統而被實施,此可組 統使顧客(末端使用者)得以加入工具、室、及感應 APC系統提供一開發環境及方法,其使顧客得以訂製 器應用程式來加入分析應用程式、及裝設新的感應器 統中。 AP C系統提供錯誤檢測演算法、錯誤分類演算法 /或錯誤預測演算法。APC系統可預測一動態感應器 將會故障,且可辨識可能的解決之道以校正該故障, 少宣告其並非製程相關而是由於感應器故障或無效感 設定之錯誤警示的機會。 例如,錯誤預測可爲錯誤檢測與錯誤模擬之結合 方法可被使用以最佳化耗損部件(諸如動態感應器) 換,且希望得以協助預防性維修工作之“機會排程” 有一停滯於生產時。錯誤預測可根據一複雜的多變量 或者一簡單的單變量關係。 圖2顯示一用以監視半導體處理系統中之處理工 流程圖之簡化圖示,依據本發明之一實施例。軟體及 的GUI螢幕提供一用以監視系統中之一或更多處理 的程序。此流程圖係說明一種示範的控制策略程序, 執行於監視程序中。程序2 0 0於2 1 0開始。 程序2 0 0可被執行於半導體處理系統中之一處理 始及 於感 態系 器。 感應 至系 、及 何時 並減 應器 。此 之更 ,當 模型 具的 相關 工具 其係 工具 -V -20- (18) 200403554 所執行的各生產步驟。一生產步驟係一蝕刻製程、 製程、一擴散製程、一淸潔製程、一測量製程、一 程、或其他半導體製程。策略係界定處理工具之一 期間會發生何事。策略可界定一單一晶圓、一單一 或工具活動之組合的一組序列。一策略可包含處理 測量活動、預調適活動、預測量活動、及後測量活 組合。一策略中之各部分(活動族群)被稱爲一計 策略係關連與一上下文。上下文資訊可被使用 既定操作關連與另一操作。特別地,上下文資訊被 將一製程步驟或處理程式匹配與一或更多控制策略 的資料收集計畫。 於220,根據一製程上下文以決定及執行一資 (控制)策略。製程上下文可取決於所執行之製造 所監視之工具。上下文決定應執行哪一策略及/或 一特定的製程處理程式。例如,欲使一控制策略關 製程型式(諸如“乾式淸潔”),則策略之上下文 上下文用語“乾式淸潔”。於此情況下,動態感應器 態以獲得“乾式淸潔”相關的資料。 一資料收集(控制)策略可爲計畫之一保留器 制策略及相關的計畫係“控制”哪些動態感應器被使 態感應器如何被組態、哪些資料被收集、及資料如 處理。 於一實施例中,一製程上下文可被比較與控制 例如,A P C伺服器1 6 0 (圖1 )取得目前的製程上 一沈積 轉移製 組序列 工具、 活動、 動之一 畫。 以將一 使用以 及相關 料收集 步驟及 計畫於 連與一 需含有 可被組 。一控 用、動 何被預 策略。 下文爲 -21 - (19)200403554 一字串,當一 “製程開始”事 較與控制策略’而接著辨識 於此製程中,搜尋順序 藉由使用一 GUI表中之優 資料查詢語言(s Q L )表達 略之後,則自動地決定一資 畫、及一判斷計畫,亦決定 集計畫ID、資料預處理計畫 “執行控制策略”模組。 可能有數個匹配一運作 特定時間執行一控制策略於 在表列上朝上或朝下移動策 略的順序。當需要選擇策略 朝下瀏覽表列直到其找到第 必要條件的策略。 一種使用上下文爲基礎 文匹配。例如,當執行上下 理之晶圓的上下文。另一*方 基底或其他半導體產品的上 可被比較與控制策略之上下 則可執行一或更多控制策略 可藉由上下文要素之組 文可爲依一預定順序之上下 爲以一字典形式之一組名稱 件發生時。製程上下文可被比 一較佳的策略。 可能是重要的。例如,搜尋可 先順序而被執行。搜尋可使用 方式而被實施。一旦辨識了策 料收集計畫、一資料預處理計 了一動態感應器計畫。資料收 ID、及判斷計畫ID被傳送至 上下文之控制策略,但僅於一 一特定處理工具。使用者藉由 略以決定一特定上下文中之策 時,軟體便從表列之頂部開始 一個匹配其由上下文所決定之 之執行的方法可能爲進行上下 文匹配時,可使用目前正被處 面,亦可使用目前正被處理之 下文。當上下文被決定時,其 文。當產生一上下文匹配時, 〇 合以界定上下文。例如,上下 文要素的陣列,或者上下文可 値對。 -22- (20) (20)200403554 用以選擇及執行一控制策略之上下文要素可包含一工 具ID、一處理程式ID、一批量ID、及一材料ID。此外 ,可使用下列要素:晶盒(c a s s e 11 e ) I D、製程模組ID、 槽ID、處理程式開始時間、處理程式停止時間、維修計 數値、及/或產品ID,其指明待處理之產品種類。 當執行一控制策略時,可辨識一資料收集計畫、可辨 識一資料預處理計畫、及可辨識一判斷計畫。圖3顯示策 略與計畫之一範例關係圖。例如,可使用一上下文匹配執 行軟體,其容許一控制策略之設定及調用(invocation ) 。於一情況中,一晶圓進入事件可觸發一系統控制器以查 詢目前的上下文資料、決定運作哪個策略、及召喚相應的 程式檔(script )以決定相關計畫。 於23 0,可執行有關控制策略之計畫。可執行至少一 資料收集計畫、一資料預處理計畫、及一判斷計畫之一。 此外,亦可執行一動態感應器計畫、一參數儲存計畫、處 理程式設定點計算計畫、及/或一修整計畫。 於其產生高品質產品之製造運作期間所收集的資料可 被使用以建立“良好感應器狀態,,資料,而於其後所收集 的資料可被比較與此基本資料以決定一動態感應器是否即 時地正確執行。 例如,可建立一資料收集(控制)策略以決定動態感 應器狀態爲品質控制(Q C )測試之部分。可執行一 Q C控 制策略及其相關計畫以確保其動態感應器適當地操作或確 保其動態感應器被設定來證實其處理工具係適當地操作。 -23- (21) (21)200403554 一 QC控制策略及其相關計畫可被執行於一指定的時間或 者當一使用者排定時。當一 QC控制策略及其相關計畫被 執行時,動態感應器可被設定以致其診斷晶圓資料可被收 集。例如,一診斷、虛擬、產品、或測試晶圓可被處理, 而上下文可爲工具、模組、或感應器診斷。 一 QC資料收集(控制)策略及其相關計畫可被建立 以用於製程模組備製程序,諸如陳化處理(s e a s ο n i n g )相 關的製程。例如,在一淸潔製程後(亦即,濕式淸潔), 數個虛擬晶圓可使用陳化處理相關策略、計晝、及處理程 式(其可包含設定一動態感應器)而被處理。使用者可使 用其爲 AP C系統之部分的策略及計畫,或者使用者可使 用,APC系統以輕易且快速地開發新的陳化處理相關控制 策略。使用者可嘗試一組不同的陳化處理資料收集計畫及 動態感應器以決定哪個陳化處理程式具有最佳檢測功率。 來自這些陳化處理運作之資料可被使用以進一步改善製程 及工具模擬。 動態感應器被設定於當一資料收集計畫被執行時。資 料收集計畫可包含一感應器設定計畫。例如,感應器之開 始及停止時間可由感應器設定計畫來決定。動態感應器所 需之動態變數可由感應器設定計畫來決定。處理程式開始 事件可被使用以告知一感應器開始記錄。一晶圓進入事件 可被使用以設定一感應器。一處理程式停止事件或晶圓離 開事件可被使用以告知一感應器停止記錄。不同的感應器 可被使用,而產品晶圓及非產品晶圓之不同資料可被收集 (22) (22)200403554 資料收集計畫亦包含一資料預處理計畫,其確定預期 的觀察參數應如何被處理相關於尖波計數、步進修整、値 臨限、及値剪截限制。 當執行資料預處理計畫時,可從原始檔案產生時間序 列資料並將其儲存於資料庫中;晶圓摘要資料可從時間序 列資料產生;而批量摘要資料可從晶圓資料產生。可於晶 圓被處理時執行資料收集。當晶圓完成此製程步驟時,則 可執行資料預處理計畫。 一資料收集計畫可爲由使用者所組態之一可再使用實 體,以供收集所欲資料。感應器計畫係由一或更多分離模 組上之一或更多感應器的組態所構成。計畫亦包含應由相 關感應器所收集之資料項的選擇、及哪些資料項應被儲存 〇 一動態感應器可爲一裝置、儀器、室型式、或其他實 體,其係收集觀察資料或要求軟體設定互動,或者由系統 軟體操縱如同其爲感應器。例如,處理工具及處理模組( 室)可被處置如同其爲資料收集計畫中之感應器。可使用 一工具狀態螢幕、一室狀態螢幕、及/或一感應器狀態螢 幕以報告感應器狀態。感應器狀態資訊可被提供給使用者 。例如,感應器狀態可包含:離線(除能);及線上(記 錄、閒置、錯誤、未選擇)。假如感應器從線上至離線, 則使用者可被告知。 相同感應器型式之數個例子可同時被裝設於一處理系 -25- (23) (23)200403554 統中。使用者可選擇特定的感應器或數個感應器以供各資 料收集計畫使用。 AP C系統從既定資料收集計畫之資料庫讀取感應器之 設定,或使用於設定期間所界定之參數。當動態感應器組 態軟體無法設定感應器時,軟體便假定其感應器係於運作 之預設關閉狀態。此係如同DC計畫要求感應器關閉之相 同動作。動態感應器組態軟體設定一警報以告知製程步驟 已完成於動態感應器爲關閉狀態。 AP C系統可包含策略及計畫,其已被設計以監視數個 不同型式的工具及相關動態感應器。例如,APC系統可介 面與其以不同方式操作的動態感應器。例如,當動態感應 器即時地傳送資料時,APC系統便即時地監視資料;而當 感應器非即時地傳送資料時,則 AP C系統在感應器傳送 資料時便立即處理資料。 APC系統可包含策略、計畫、及基本模型,其可被使 用以設定用於一般錯誤檢測之動態感應器及分類應用程式 、室指紋鑑別應用程式、乾燥完成應用程式、可損耗壽命 預測、濕式淸潔循環應用程式、及部件組裝之診斷應用程 式。 APC系統提供獨立的資料收集模式及設定模式以用於 各製程室;亦即,各室可獨立於任何其他室。而一室之設 定不會干擾其他室之資料收集。此外,APC系統提供獨立 的資料收集模式及設定模式以用於各感應器;亦即,各感 應器可獨立於任何其他室。而一感應器之設定不會干擾其 -26- (24) 200403554 他感應器之資料收集。 當一控制策略包含一判斷計畫時’則執行判斷 此執行可爲根據規則的且包含s QL敘述。一開始 斷計畫可被執行於一 “開始事件”發生之後,而一 件判斷計畫可被執行於一“結束事件”發生之後。 當一開始事件判斷計畫關連與一控制策略時,其可 於諸如晶圓進入事件、製程開始事件、或處理程式 件等開始事件之後。一開始事件判斷計畫可爲一工 監視系統之警示管理部的部分。 當一警示發生時,亦即’檢測到一錯誤時,則 計畫可傳送訊息及/或指令至一介入計畫以採行下 :顯示一·錯誤訊息於一狀態螢幕上、寫下一錯誤訊 記錄檔案中、傳送暫停下一晶圓訊息、傳送暫停下 訊息、傳送警告訊息至工具、及電子郵件至工具擁 例如,一判斷計畫可傳送訊息及/或指令至一介入 採行下列感應器相關的動作:停止使用一感應器、 態一感應器、重新調校一感應器、及取代一感應器 判斷計畫係獨立地操作。各判斷計畫不會知道 斷計衋中之動作。因此,由於整個分析計畫之結果 個判斷計畫所傳送之訊息中可能有某些冗餘或不一 入計晝解決任何問題。圖4顯示策略及計畫之一示 圖。 回到圖2,於步驟2 3 5,可執行一詢問以決定 產生一警示。當發生一警示時,程序200便分支 計畫。 事件判 結束事 例如, 被執行 開始事 具狀態 一判斷 列動作 息於一 ——記錄 有者。 計畫以 重新組 〇 其他判 ,於各 致。介 範流程 是否已 至步驟 -27- (25) (25)200403554 250。當未發生一警示時,程序200便分支至步驟24〇。 於步驟2 5 0’可執行介入計畫。介入計畫可執行下列 程序:從各判斷計畫獲取訊息(判斷):將來自不同判斷 計畫之動作分類;附加製程條件(如工具id、處理程式 i d、處理程式開始時間,等等)於電子郵件及記錄;儲存 記錄檔案資料庫;及/或傳送適當訊息至介入管理者。例 如,介入計畫可決定一動態感應器何時已失效及/或已造 成故障。 介入策略被界定爲使用者根據資料分析結果而選擇採 行的動作。例如’這些動作可包含:標示一可疑的晶圓或 批量並告知一系統擁有者及/或工具擁有者;呼叫或傳送 電子郵件給一工程師以檢閱資料並做出決定;抑制感應器 收集資料;抑制工具處理晶圓直到資料已被檢閱而釋放其 抑制;停止工具或採行工具“離線”,其可從工具淸除剩 餘的晶圓;及啓動室淸潔或維修程序。 在執行介入計畫之後,適當動作上之訊息被傳送至介 入管理者。以下爲可選擇的動作··顯示一感應器錯誤訊息 於一狀態螢幕上;傳送訊息以在下一晶圓之前暫停製程; 傳送訊息以在下一批量之前暫停製程;傳送暫停或停止訊 息至一或更多工具;及/或傳送電子郵件至工具擁有者或 製程擁有者。例如,一 “停止,,訊息可被使用以告知工具 停止取得資料;及被用以告知工具繼續處理已存在於工具 中之晶圓,而“放棄”訊息可被使用以告知工具不要處理 工具中之晶圓並將其送回至載具。 -28- 415 (26) (26)200403554 於某些情況下,工具狀態監視系統將能夠介入並回應 一問題而無須人類的介入。於其他情況下,將需要人類的 介入。例如,使用者可從工具狀態監視系統存取資料以決 定錯誤之性質。使用者可介入’且使用者可決定繼續該批 量或者終止該批量。假如使用者終止該製程,則可於修理 狀態下更換工具。使用者可從工具螢幕啓動此動作。例如 ,動態感應器可被更換。在感應器更換、檢查及製程測試 之後,製程可重新從下一晶圓開始。 於介入計畫及分析計畫之執行期間,AP C系統可提呈 “感應器相關”圖表給使用者。例如’圖表可包含壓力計資 料、質量流動資料、漏損資料、泵資料、氣體系統資料、 及轉移系統資料。圖表可顯示一或更多工具之即時資料、 歷史資料、及即時與歷史資料的組合。 分析策略亦可在控制策略執行後由 A P C系統執行。 分析型式策略,諸如錯誤檢測及分類(FCD )策略,係界 定於處理工具上之一組序列期間發生了何事。一 FD C策 略可使用一組分析計畫以在收集後“分析”資料;FCE策 略可使用依組判斷計畫以“決定”一連串動作。例如,可 使用SPC圖表及多變量分析。FCD策略可界定單一晶圓 、單一工具、單一批量、或工具動作組合之一組資料分析 計畫。策略中之各部分可被稱爲一計畫。 策略係關連與一上下文。上下文資訊可被使用以使〜 既定操作關連與另一操作。明確地,上下文資訊係使一 _ 程步驟或處理程式關連與一或更多策略及/或計畫。通常 -29- (27) (27)200403554 ,一分析策略可由一結束事件所啓動並決定一組後處理動 作。例如,一結束事件可爲一晶圓離開事件、一批量完成 事件、或者其他製程完成事件。 當執行一分析策略時,可執行一或更多下列計畫:主 成分分析(PCA )計畫、部分最小平方(PLS )計畫、統 計製程計畫(spc)、多變量分析(MVA)計畫、及使用 者界定計畫。分析計畫包含感應器問題之檢測及分類的機 構(當工具未從事生產時);於生產期間之感應器問題之 檢測的機構;於生產期間之感應器問題之檢測及分類的機 構;於生產期間之感應器問題之預測的機構;及在生產後 之感應器問題之預測的機構。 圖5顯示依據本發明之一實施例的一選擇螢幕之一示 範圖示。於所示之實施例中,顯示一具有五個次階的導引 樹狀物。此並非本發明所必要的,任何數目的次階皆可使 用。另一方面,可使用其他的選擇機構,諸如選擇欄標或 按鈕。例如,選擇欄標可包含左至右欄標、右至左欄標、 頂部至底部欄標、及底部至頂部欄標。於其他實施例中, 導引樹狀物可被顯示以不同的語言且可被不同地排序及設 置。 所示之第一階係工具階,但此並非本發明所必要的。 另一方面,可顯示一系統階或其他較高階族群。例如,一 工具階可關連與一蝕刻工具、一沈積工具、一淸潔工具、 一轉移工具、或其他半導體處理工具。 所示之下一階係一製程模組階。使用者可開啓一工具 -30- (28) (28)200403554 階檔案夾以顯示一製程模組階的狀態。例如,圖5顯示一 標示爲 “TeliusPC”之開啓的工具階檔案夾及四個標示爲 “製程模組1”至“製程模組4”之製程模組檔案夾。使用者 可開啓一製程模組檔案夾以顯示有關一特定製程模組之策 略的狀態。 所示之下一階爲策略階。使用者可開啓一製程模組階 以顯示一策略階之狀態。例如,圖5顯示標示爲“資料收 集策略”及“分析策略”之開啓的檔案夾。使用者可開啓一 策略檔案夾以顯示有關一特定策略之內容及計畫的狀態。 一資料收集(控制)策略檔案夾可被開啓以顯示資料 收集策略之一表列。於所示之實施例中,單一控制策略可 連同有關一控制策略之上下文及計畫而被顯示。上下文可 被使用以召喚一特定項目(諸如虛擬或診斷晶圓)所必要 的特定資料收集計畫。 一特定資料收集計畫檔案夾可被開啓以顯示一或更多 資料收集計畫名稱。於圖5中,顯示一稱爲“內定計畫 1”之單一資料收集計畫。 資料收集策略具有一描述感應器應如何被組態之相關 白勺資料收集計畫,且其觀察參數應被收集。一資料收集策 @亦可關連與一預處理計畫。一預處理計畫係描述預期的 _察參數如何被處理相關於尖波計數、步進修整、高剪截 及低剪截限制。 從一資料收集計畫階,使用者可存取一感應器組態階 °於感應器組態階,使用者可裝設、改變、及解除裝設一-12- (10) (10) 200403554 Execute the configuration program; view the status including the status of tools, rooms, and sensors; view the status of the process; view historical data; and perform simulation and drawing functions. Implementation shown in Figure 1 For example, the APC system 145 can include an APC server 160 (which can be coupled to Is 15), a client workstation 170, a GUI component 180, and a database 190, but this Not necessary for the present invention. The AP C server 160 may include several applications, including at least one tool-related application, at least one module-related application, at least one sensor-related application, at least one IS-related application, and at least one database-related application. Application and at least one GUI related application. In addition, the Apc server can contain several tool condition monitoring system applications. APC server 1 60 contains at least one computer and software that supports multiple process tools; collects and synchronizes data from tools, process modules, sensors, and probes; stores data in a database; enables users to watch Existing diagrams; and provide error detection. For example, the APC server 160 may include operating software, such as Ingenio software from Tokyo Electron. The AP C server allows online system configuration, online batch-to-batch error detection, online wafer-to-wafer error detection, online database management, and the use of models based on historical data to perform multivariate analysis of summary data. In addition, the tool status monitoring system allows real-time monitoring of processing tools. For example, the APC server 160 can contain several minimum 3GB of free disk space; at least 600 MHz CPU (dual processor); minimum 512 Mb RAM (physical memory); 9 GB SCSI hard disk in RAID 5 configuration; RAM Minimal disk cache with twice the size; Install Windows (11) (11) 200403554 2000 server software; Microsoft Internet Explorer; TCP / IP network protocol; and at least two network cards. The APC system 145 may include at least one storage device that stores files containing raw data from the sensors and files containing tracking data from the tools. If these files are not properly managed (ie, deleted generally), the storage device may have insufficient disk space and may stop collecting new data. The APC system 145 may include a data management application that allows users to delete older files, thereby freeing up disk space so that their data can be collected continuously without interruption. The AP C system 1 4 5 may contain most tables, which are used for the operating system, and these tables may be stored in 190. In addition, other computers (not shown), such as on-site or off-site computers / workstations and / or hosts, can be networked to provide functions such as data / graphic viewing, SPC mapping, EPD analysis, file access, Many tools. As shown in FIG. 1, the AP PC system 145 may include a G UI component 1800. For example, a GUI component may operate as an application on the APC server 160, the client workstation 170, and the tool 110. The G U I component 180 enables an A PC system user to perform desired configuration, data collection, monitoring, simulation, and troubleshooting tasks with as few inputs as possible. GUI design complies with SEMI Human Interface Standard for Semiconductor Manufacturing Equipment (SEMI Draft Doc. # 2783B) and SEMATECH Strategy Cell Controller (SCC) User-Interface Guide 1. (Technology Transfer 9206 1 1 79A-ENG). Those familiar with this technology will understand that its GUI panel / screen can include left-to-right selection of moving structures and / or right-to-left structures, bottom-to-top structures, top-to-bottom structures, or combinations. 14- (12) (12) 200403554 structure. Although the screens shown for explanation are in English, this is not a requirement of this invention, and different languages can be used. For example, 'Japanese screen, Chinese screen, Taiwanese screen, Korean screen, German screen, and French screen can be used. At the same time, the GUI component 180 provides an interactive mechanism between the tool condition monitoring system and the user. When the GUI starts, a registration screen that verifies the user's identity and password can be displayed, and it provides the first level of security protection. Users can be logged in using a security application before registration. A database check of user identity indicates an authorization level that will simplify the available GUI functions. Unauthorized options for users may be different and unavailable. The safety protection system also allows users to change existing passwords. For example, the registration panel / screen can be opened from a browser tool such as Netscape or Internet Explorer. The user can enter the user ID and password in the registration field. Authorized users and administrators can use the GUI panel / screen to modify system configuration and sensor setting parameters. The GUI component 180 may include a set of state components to allow users to configure processing tools, processing modules, sensors, and APC systems. For example, the GUI configuration panel / screen can be provided with at least one of a processing tool, a processing module, a sensor, a sensor instance, a module suspension, and an alert. The configuration data can be stored in an attribute database table and can be set to default settings during installation. The GUI component 180 may include a status component for displaying the current status of the processing tool, processing module, sensor, and APC system. In addition, (13) 200403554 The status component may include a drawing component for presenting system-related and process-related data to a user, using one or more different chart types. Meanwhile, the GUI component 180 may include an instant operation component. For example, a GϋI component may be coupled to a context task, and a common system logic may provide common functions used by the context task and the GUI component. The common logic circuit can be used to ensure that its response to the GUI component is the same as the response to the context task. Furthermore, the GUI component 1 may include an APC file management GUI component and a security protection component. Assistance panel / screen can be stored. For example, assistance files are provided in PDF (Portable Portable Document Format) and / or HTML format. As shown in FIG. 1 ', the AP C series 145 including a tool condition monitoring system may be coupled to a factory system 105 and / or an e-diagnosis system U5. The factory system 105 and / or the E-diagnosis system 115 can provide a mechanism to facilitate external monitoring and external control of tools, module sensors, and processes in a semiconductor processing system. On the other hand, the factory system 105 and / or the E-diagnosis system 115 can perform tool condition monitoring. For example, a user can use a all-in-one terminal to access a tool condition monitoring system, which is coupled to a semiconductor processing system by the factory system 105 and / or the E-diagnostic system 115. In addition, AP C system and E diagnostic system can work together to solve the current problem. For example, when the APC system 1 45 detects an error, the information needed to diagnose the problem can be aggregated and transmitted by the APC server to the E-diagnostic system or stored for later access by the diagnostic system. The method of operation may be determined using security restrictions and / or customer business rules. -16- Photo album can cover 80. (The Ministry of Industry and Commerce Λ network disconnection office will go to (14) (14) 200403554 on the same day v. APC includes institutions to facilitate joining sensors and editing data collection. Ten m 'its The context and / or events driven by the system. For example, this may allow Eg # broken "probes" and / or software components to be downloaded for the E diagnostic system to troubleshoot the system. The E diagnostic system may include a portable set of diagnostic tools It can feed for additional data, it can be used to diagnose, detect, and / or predict a problem. For example, APC systems can use these diagnostic tools as additional sensors. With a general sensor interface (which supports multiple protocols , Including analog input as the lowest level), a local portable diagnostic unit can be coupled to the factory system and then used remotely by the APC system, diagnostic system and / or factory system. The APC system can be provided with a new application program , Which is developed remotely at the factory and downloaded from the factory or E-diagnostic system. For example, new applications can be locally stored in the APC server. The APC system has the ability to learn new procedures and dynamically The ability to enter sensors, add applications, and even add a custom-designed GUI screen. Furthermore, the APC system can perform very specific procedures such as timing analysis assignments to figure out when a tool and / or module will fail (That is, a problem with a wafer operating system with a motor or actuator arm position). In addition, the 'APC system can change the sampling rate based on tool performance. For example,' data collection sampling rate and analysis volume can be changed according to the tool situation The ApC system can also predict a problem or detect that a tool and / or module is approaching a limit. In addition, 'advanced users and managers can use the GUI screen to modify system configuration and sensor setting parameters. (15) (15) 200403554 strategy and plan; and / or modify the number of tools and modules. The tool status monitoring system is implemented using a configurable system. This configurable system Enables customers (end users) to add processing tools, process modules, and / or sensors. The tool condition monitoring system provides a development environment and method that Customers can customize monitoring software, add analysis applications, and / or install and monitor new tools, modules, and sensors in the environment. The tool condition monitoring system software architecture includes four functional components: a data acquisition component, a Messaging system components, a related database component, and a post-processing component. This architecture also includes in-memory data tables, which are used to store operating time data acquisition parameters. The tools (and tool agents) are outside the tool status monitoring system. , Which provides contextual information and start-stop timing instructions to synchronize data acquisition with the tool process. The data acquisition component collects data points (called parameters) and writes them to a file. The messaging system uses in memory The data table temporarily stores the operation time data received from the data acquisition module. The messaging system is informed by an agent and / or tool client about the beginning and end of the data acquisition cycle. At the end of the data acquisition cycle, the data is registered in the relevant database, and the in-memory data table is deleted to facilitate the next acquisition cycle. The post-processing of the data supplied by the messaging system is performed at the operation time; the post-processing of the data stored in the relevant database is performed offline. The goal of a tool condition monitoring system is to use real-time and historical data to increase the performance of a semiconductor processing system. To achieve this, potential problems (such as sensor problems) can be predicted and corrected before they occur, thereby reducing equipment downtime and the number of non-productive wafers manufactured. This goal can be achieved by mistake by collecting data and then feeding that data to a software algorithm that simulates the behavior of a particular tool. Tool condition monitoring system output process parameters are adapted, which are then fed forward or backward to keep tool performance within specified limits. This control can be achieved in different forms at different levels. The alert management part of the tool status monitoring system can provide error detection algorithms, error classification algorithms, and / or error prediction algorithms. The tool condition monitoring system predicts when a tool will fail, and identifies possible solutions to correct the failure and reduce the number of non-product wafers made during maintenance and processing functions. The motion sensor application provides the user with the ability to determine whether a motion sensor is collecting data. When a data collection plan does not require data from a dynamic sensor, the sensor status provides the user with an indication that the sensor is not expected to be on. For example, when a data collection plan does not require data, the sensor status should be “online 0 f f”, and when the user has turned off the sensor at the system level, the status should be “offline 0ff”. The interface of the motion sensor can withstand failures and service-related interruptions. In addition, the interface provides the ability to set up and troubleshoot. For example, when an interruption occurs, the motion sensor and / or the APC system detects the interruption and initiates recording, alerting, and automatic recovery / analysis to determine the correct action and reduce the loss of functionality. In this way ' the risk to the customer who manufactures the product when the motion sensor and / or the APC system is operating with reduced functionality can be reduced. In addition, the motion sensor application can operate during service ^ repair mode. For the purpose of troubleshooting sensor communication ’, the motion sensor can be tested on unprocessed wafers -19- (17) 200403554. For example, the motion sensor can be set to start and stop from a web-based GUI. This feature can generally be serviced by the sensor settings and fixed sensors. The AP C system is implemented using a configurable system. This system enables customers (end users) to add tools, rooms, and sensors. The APC system provides a development environment and method that enables customers to customize applications. Program to add analysis applications and install new sensor systems. The AP C system provides error detection algorithms, error classification algorithms, or error prediction algorithms. The APC system can predict that a dynamic sensor will fail, and can identify possible solutions to correct the failure, and less likely to declare it is not a process related, but an opportunity for false alarms due to sensor failure or invalid setting. For example, misprediction can be a combination of error detection and error simulation. Methods can be used to optimize the replacement of consumable parts (such as motion sensors) and hope to assist in the "opportunity scheduling" of preventive maintenance work. . Misprediction can be based on a complex multivariate or a simple univariate relationship. FIG. 2 shows a simplified diagram of a flow chart for monitoring a science and technology in a semiconductor processing system according to an embodiment of the present invention. The software and the GUI screen provide a program to monitor one or more processes in the system. This flowchart illustrates an exemplary control strategy program that is executed in the monitoring program. The program 2 0 0 starts at 2 1 0. The program 2 0 0 can be executed in one of the semiconductor processing systems, starting with the sensor. Sense to the system, and when and reducer. In addition, when the related tools of the model are the production steps performed by the tool -V -20- (18) 200403554. A production step is an etching process, a process, a diffusion process, a cleaning process, a measurement process, a process, or other semiconductor processes. Strategy defines what happens during one of the processing tools. A strategy can define a sequence of a single wafer, a single, or a combination of tool activities. A strategy can include a combination of processing measurement activities, pre-adaptation activities, predictive activity, and post-measurement activities. Each part of a strategy (active group) is called a strategy system that is related to a context. Contextual information can be used to associate a given operation with another operation. In particular, contextual information is a data collection plan that matches a process step or process with one or more control strategies. At 220, a capital (control) strategy is determined and implemented based on a process context. The process context can depend on the manufacturing being performed and the tools being monitored. The context determines which strategy and / or a particular process handler should be implemented. For example, to make a control strategy related to a process type (such as "dry cleaning"), the context of the policy is "dry cleaning". In this case, the state of the dynamic sensor is used to obtain relevant information about “dry cleaning”. A data collection (control) strategy can be a retention strategy for the plan and the related plan is to "control" which dynamic sensors are enabled, how the sensors are configured, what data is collected, and how the data is processed. In one embodiment, a process context can be compared and controlled. For example, the AP server 160 (Fig. 1) obtains the current process, a deposition transfer group, a sequence of tools, activities, and animations. In order to combine a use and related materials collection steps and plans, one needs to contain and can be grouped. A strategy of controlling and using is controlled. The following is a string of -21-(19) 200403554. When a "process starts" is compared with the control strategy 'and then identified in this process, the search order is performed by using a superior data query language (s QL After the expression is omitted, an asset plan and a judgment plan are automatically determined, and a set of project ID and data pre-processing plan "execute control strategy" module is also determined. There may be several sequences that match an operation, execute a control strategy at a particular time, and move the strategy up or down the list. When you need to select a strategy, browse down the list until it finds the strategy with the first requirement. A context-based text matching. For example, when performing a wafer context. The top of another square or other semiconductor product can be compared and the control strategy can be executed. One or more control strategies can be executed. The context of the elements can be in a predetermined order and the top and bottom are in a dictionary form. When a set of name pieces occurs. The process context can be compared to a better strategy. May be important. For example, searches may be performed sequentially. Searching can be performed using the method. Once the strategy collection plan is identified, a data pre-processing plan is a motion sensor plan. The data receiving ID and the judgment plan ID are transmitted to the control strategy of the context, but only for a specific processing tool. When the user decides a strategy in a specific context, the software starts from the top of the list to match the execution of the context-determined method. When the context is matched, it can use the current situation. You can also use what is currently being processed. When the context is decided, the text. When a context match is generated, 0 is combined to define the context. For example, an array of contextual elements, or contexts can be paired. -22- (20) (20) 200403554 The context elements used to select and execute a control strategy may include a tool ID, a handler ID, a batch ID, and a material ID. In addition, the following elements can be used: casse 11 e) ID, process module ID, slot ID, processing program start time, processing program stop time, maintenance count, and / or product ID, which indicates the product to be processed kind. When a control strategy is implemented, a data collection plan can be identified, a data pre-processing plan can be identified, and a judgment plan can be identified. Figure 3 shows an example relationship between strategy and plan. For example, a context matching execution software may be used, which allows the setting and invocation of a control strategy. In one case, a wafer entry event can trigger a system controller to query current contextual data, decide which strategy to run, and call a corresponding script to determine related plans. At 230, plans for control strategies can be implemented. One of at least one data collection plan, one data pre-processing plan, and one judgment plan may be executed. In addition, a motion sensor plan, a parameter storage plan, a processing program set point calculation plan, and / or a trimming plan may be executed. The data collected during its manufacturing operations that produce high-quality products can be used to create "good sensor status," data, and data collected thereafter can be compared with this basic data to determine whether a dynamic sensor is Real-time and correct execution. For example, a data collection (control) strategy can be established to determine the dynamic sensor status as part of a quality control (QC) test. A QC control strategy and related plans can be implemented to ensure that its dynamic sensor is appropriate Or to ensure that its motion sensor is set to verify that its processing tools are operating properly. -23- (21) (21) 200403554 A QC control strategy and its related plans can be executed at a specified time or as a User scheduling. When a QC control strategy and related plans are implemented, the motion sensor can be set so that its diagnostic wafer data can be collected. For example, a diagnostic, virtual, product, or test wafer can be Are processed, and the context can be tool, module, or sensor diagnostics. A QC data collection (control) strategy and its related plans can be created for Process module preparation procedures, such as aging related processes. For example, after a cleaning process (ie, wet cleaning), several virtual wafers can use aging related strategies. , Program, and processing program (which may include setting a motion sensor) and are processed. Users can use the strategies and plans that are part of the AP C system, or users can use the APC system to easily and quickly To develop new aging treatment-related control strategies. Users can try a different set of aging treatment data collection plans and dynamic sensors to determine which aging treatment program has the best detection power. Data can be used to further improve process and tool simulation. Dynamic sensors are set when a data collection plan is executed. The data collection plan can include a sensor setting plan. For example, the start and stop times of the sensors It can be determined by the sensor setting plan. The dynamic variables required by the motion sensor can be determined by the sensor setting plan. The handler start event can be determined by Use to tell a sensor to start recording. A wafer entry event can be used to set a sensor. A handler stop event or wafer exit event can be used to tell a sensor to stop recording. Different sensors can be used Use, and different data for product wafers and non-product wafers can be collected. (22) (22) 200403554 The data collection plan also includes a data preprocessing plan that determines how the expected observation parameters should be processed. Wave count, step trimming, threshold, and clipping limit. When performing a data preprocessing plan, time series data can be generated from the original file and stored in the database; wafer summary data can be obtained from time Sequence data generation; and batch summary data can be generated from wafer data. Data collection can be performed while the wafer is being processed. When the wafer completes this process step, a data preprocessing plan can be performed. A data collection plan may be a reusable entity configured by the user for collecting desired data. The sensor plan consists of the configuration of one or more sensors on one or more discrete modules. The plan also includes a selection of data items that should be collected by the relevant sensors, and which data items should be stored. A motion sensor can be a device, instrument, room type, or other entity that collects observational data or requirements The software is set to interact or be manipulated by the system software as if it were a sensor. For example, processing tools and processing modules (rooms) can be treated as if they were sensors in a data collection project. Sensor status can be reported using a tool status screen, a room status screen, and / or a sensor status screen. Sensor status information can be provided to the user. For example, sensor status can include: offline (disabled); and online (logged, idle, error, unselected). If the sensor goes from online to offline, the user can be informed. Several examples of the same sensor type can be installed in a processing system -25- (23) (23) 200403554 at the same time. The user can select a specific sensor or several sensors for each data collection plan. The AP C system reads the sensor settings from the database of the established data collection plan, or uses parameters defined during the setting period. When the motion sensor configuration software cannot set the sensor, the software assumes that its sensor is in the default off state of operation. This is the same action as the DC program requires the sensor to be turned off. The motion sensor configuration software sets an alarm to inform that the process steps have been completed when the motion sensor is turned off. The AP C system can include strategies and plans that have been designed to monitor several different types of tools and related motion sensors. For example, APC systems can interface with motion sensors that operate differently. For example, when a dynamic sensor transmits data in real time, the APC system monitors the data in real time; and when the sensor transmits data non-real time, the AP C system immediately processes the data when the sensor transmits data. APC systems can include strategies, plans, and basic models that can be used to set up motion sensors and classification applications for general error detection, room fingerprinting applications, drying completion applications, wearable life prediction, wet Cleaning applications, and diagnostic applications for component assembly. The APC system provides independent data collection mode and setting mode for each process room; that is, each room can be independent of any other room. The setting of one room will not interfere with the data collection of other rooms. In addition, the APC system provides independent data collection mode and setting mode for each sensor; that is, each sensor can be independent of any other room. The setting of one sensor will not interfere with the data collection of other sensors. When a control strategy includes a judgment plan, then the judgment is performed. This execution may be rule-based and include an SQL statement. An initial interruption plan can be executed after an "start event" occurs, and a judgment plan can be executed after an "end event" occurs. When a start event judgment plan is related to a control strategy, it may be after a start event such as a wafer entry event, a process start event, or a processing program. Initially, the event judgment plan can be part of the alarm management department of a work monitoring system. When an alert occurs, that is, when an error is detected, the plan can send a message and / or instructions to an intervention plan for implementation: display an error message on a status screen, write an error In the message log file, send the next wafer pause message, send the pause pause message, send a warning message to the tool, and email to the tool. For example, a judgment plan can send a message and / or instruction to an intervention using the following sensing Sensor-related actions: Stop using a sensor, state a sensor, recalibrate a sensor, and replace a sensor to determine the plan independently. Each judgment plan will not know the action in the interruption plan. Therefore, due to the results of the entire analysis plan, there may be some redundancy or inconsistencies in the messages transmitted by the judgment plan to resolve any issues. Figure 4 shows one of the strategies and plans. Returning to Fig. 2, in step 2 35, a query can be performed to decide to generate an alert. When an alert occurs, the program 200 branches the plan. Event Judgment and End of Event For example, being executed to start the event status, a judgment, a series of actions, and one in one-record the owner. The plan is to reorganize. 〇 Other judgments are consistent. Refer to the procedure to step -27- (25) (25) 200403554 250. When an alert does not occur, the program 200 branches to step 24. An intervention plan can be performed at step 2 5 0 '. The intervention plan can perform the following procedures: obtain information from each judgment plan (judgment): classify actions from different judgment plans; add process conditions (such as tool id, handler id, handler start time, etc.) in Email and records; store log file database; and / or send appropriate messages to intervention managers. For example, an intervention plan can determine when a motion sensor has failed and / or has caused a failure. Intervention strategies are defined as actions that users choose to take based on data analysis results. For example, 'these actions may include: marking a suspicious wafer or lot and informing a system owner and / or tool owner; calling or sending an email to an engineer to review the data and make a decision; inhibit the sensor from collecting data; The suppression tool processes the wafer until the data has been reviewed and releases its suppression; stopping the tool or adopting the tool "offline" removes the remaining wafers from the tool; and initiates a room cleaning or repair process. After the intervention plan is executed, messages on appropriate actions are transmitted to the intervention manager. The following are optional actions: · Display a sensor error message on a status screen; send a message to pause the process before the next wafer; send a message to pause the process before the next batch; send a pause or stop message to one or more Multiple tools; and / or email the tool owner or process owner. For example, a "Stop," message can be used to tell the tool to stop acquiring data; and a "Stop," message can be used to tell the tool to continue processing wafers already in the tool, and a "Abandon" message can be used to tell the tool not to process the tool Wafer and return it to the carrier. -28- 415 (26) (26) 200403554 In some cases, the tool condition monitoring system will be able to intervene and respond to a problem without human intervention. In other cases Human intervention is required. For example, the user can access data from the tool status monitoring system to determine the nature of the error. The user can intervene 'and the user can decide to continue the batch or terminate the batch. If the user terminates the process , The tool can be changed in the repair state. The user can initiate this action from the tool screen. For example, the motion sensor can be replaced. After the sensor is replaced, checked, and the process is tested, the process can be restarted from the next wafer. During the execution of the intervention plan and analysis plan, the AP C system may present a "sensor-related" chart to the user. For example, the 'chart may include pressure Force gauge data, mass flow data, leak data, pump data, gas system data, and transfer system data. The chart can show real-time data, historical data, and a combination of real-time and historical data from one or more tools. The analysis strategy also It can be executed by the APC system after the execution of the control strategy. Analysis-type strategies, such as error detection and classification (FCD) strategies, define what happens during a set of sequences on the processing tool. An FD C strategy can use a set of analytical tools Draw to "analyze" data after collection; FCE strategies can use group-by-group judgment plans to "determine" a series of actions. For example, SPC charts and multivariate analysis can be used. FCD strategies can define a single wafer, a single tool, a single batch , Or a set of data analysis plans for tool action combinations. Each part of a strategy can be referred to as a plan. A strategy is related to a context. Contextual information can be used to link ~ a given operation to another operation. Clear Locally, contextual information relates a process step or process to one or more strategies and / or plans. Usually -29- (27) (27) 200403554, An analysis strategy can be initiated by an end event and determines a set of post-processing actions. For example, an end event can be a wafer leave event, a batch completion event, or other process completion event. When an analysis is performed In strategy, one or more of the following programs can be executed: a principal component analysis (PCA) program, a partial least squares (PLS) program, a statistical process program (spc), a multivariate analysis (MVA) program, and use The definition plan. The analysis plan includes the mechanism for the detection and classification of sensor problems (when the tool is not engaged in production); the mechanism for the detection of sensor problems during production; the detection and classification of sensor problems during production The mechanism for predicting sensor problems during production; and the mechanism for predicting sensor problems after production. FIG. 5 shows an exemplary diagram of a selection screen according to an embodiment of the present invention. In the embodiment shown, a guide tree with five sub-orders is shown. This is not necessary for the present invention, and any number of secondary orders can be used. On the other hand, other selection mechanisms may be used, such as selection columns or buttons. For example, selection tabs may include left to right tabs, right to left tabs, top to bottom tabs, and bottom to top tabs. In other embodiments, the guide tree can be displayed in different languages and can be sorted and set differently. The first stage shown is a tool stage, but this is not necessary for the present invention. On the other hand, a systematic or other higher-order population may be displayed. For example, a tool stage may be associated with an etching tool, a deposition tool, a cleaning tool, a transfer tool, or other semiconductor processing tools. The next stage shown is a process module stage. The user can open a tool -30- (28) (28) 200403554 level folder to display the status of a process module level. For example, Figure 5 shows an open tool-level folder labeled "TeliusPC" and four process module folders labeled "Process Module 1" to "Process Module 4." The user can open a process module folder to display the status of policies related to a particular process module. The next level shown is the strategy level. The user can open a process module stage to display the status of a strategy stage. For example, Figure 5 shows the open folders labeled "Data Collection Strategy" and "Analysis Strategy". The user can open a strategy folder to display the contents of a particular strategy and the status of the plan. A data collection (control) strategy folder can be opened to display a list of data collection strategies. In the embodiment shown, a single control strategy may be displayed along with the context and plan for a control strategy. Context can be used to summon a specific data collection plan necessary for a specific project, such as a virtual or diagnostic wafer. A specific data collection plan folder can be opened to display one or more data collection plan names. In Figure 5, a single data collection plan called "Intended Plan 1" is shown. The data collection strategy has a relevant data collection plan that describes how the sensor should be configured, and its observation parameters should be collected. A data collection strategy @also linked to a pre-processing plan. A preprocessing project describes how the expected observation parameters are processed in relation to spike counting, step trimming, high clipping, and low clipping limits. From a data collection plan stage, the user can access a sensor configuration stage ° At the sensor configuration stage, the user can install, change, and uninstall a
-31 - (29) (29)200403554 感應器。此外,使用者可產生、編輯、及檢閱一動態感應 器之設定資訊。 如圖5中所示,一選擇螢幕可包含標題面板、資訊面 板及控制面板。例如,標題面板可包含一螢幕之頂部兩列 。標題面板可包含:公司商標欄,以顯示版本資訊;使用 者ID欄,以顯示目前使用者之ID ;警示訊息欄,以當有 •—作用中之警示時顯示一訊息;目前日期及時間欄’以顯 示伺服器之目前日期與時間;目前螢幕名稱攔’以顯示目 則營幕之名稱(例如’工具狀態),通日只狀心欄’以顯不 介於伺服器與工具間之通訊連結的目前狀態;工具ID欄 ,以顯示正被監視之工具的ID ;登出欄,其容許使用者 登出;螢幕選擇欄,其可被選擇以觀看所有可得螢幕之一 表列。於其他實施例中,標題面板可被顯示以不同語言且 可被不同地縮放及放置。 圖6顯示依據本發明之一實施例的計畫資訊螢幕之範 例圖示,其可從圖5之資料收集計畫階來存取。於所示之 實施例中,顯示一具有選擇欄標(tab )之資訊面板。選 擇欄標可被使用以選擇其他的GUI螢幕。另一方面,可 使用一導引樹狀物以顯示及選擇其他GUI螢幕。 感應器實例之表列可包含其吻合tool_id、module_id 及§十畫名稱之條件的感應器貫例之表列。一'表列可被提供 ,因爲一感應器型式可具有許多感應器實例。舉例而言, 一稱爲“內定計畫1 ”之計畫被顯示有數個欄位中之資訊 ,但此並非本發明所必要的。另一方面,可顯示其他的計 (30) 200403554 畫及其他的感應器。例如,可使用Langmuir探針、 探針、及半導體處理探針之其他型式。 計畫名稱欄位包含一資料收集計畫之名稱,而敘 位可包含此資料收集計畫之詳細敘述。工具i d欄位 含供選擇之現存工具(工具i d )的表列,而模組i d 可包含供選擇之現存製程模組(模組i d )的表列。資 後使用日期欄位可被使用以指示使用此資料收集計畫 後曰期。 儲存按鈕可被使用以將來自此螢幕之資料儲存至 庫。取消按鈕可被使用以塡入所有欄位之原始(內定 料。加入按鈕可被使用以加入一選定的動態感應器實 從右^側列至左側表。移除按鈕可被使用以移除一選定 應器型式,從左側表至右側。一躍上型訊息視窗將顯 確認訊息,而一條目(entry )將被加回至右側表。 編輯按鈕可被使用以編輯選定的感應器參數,藉 能如圖7中所示之一感應器設定螢幕。參數儲存按鈕 使用以致能如圖1 〇中所示之參數儲存螢幕。 儲存按鈕可被使用以更新/插入資料至兩個表中 dc__plans 表及一sensor — dcplan 表。 圖7顯示依據本發明之一實施例的一感應器設定 之範例圖示。於所示之實施例中,顯示一具有選擇欄 資訊面板。選擇欄標可被使用以選擇其他的GUI螢 另一方面,可使用一導引樹狀物以顯示及選擇其他 螢幕。一使用者可使用感應器組態螢幕,諸如感應器 0ES 述欄 可包 欄位 料最 的最 資料 )資 例, 的感 示一 由致 可被 螢幕 標之 幕。 GUI 設定 -33- (31) (31)200403554 螢幕,以檢閱及編輯--有關感應器之參數。舉例而言’顯 示兩個參數,但此並非本發明所必要。動態感應器可具有 與其相關之任何數目的參數。 選定感應器之設定項目表列可被顯示於螢幕上。編輯 按鈕可被使用以顯示如圖8中所示之感應器設定項目螢幕 。此螢幕容許使用者根據一選定的valuejype以修改選定 的參數。 感應器設定螢幕包含一項目名稱欄位、一項目値欄位 、一敘述欄位、及一 I s _ 0 p t i ο n a 1欄位,其可被使用以控 制對資料之存取。例如,使用者可選擇此資料收集之參數 ,假如IS_Optional變數之値爲真時。 圖8顯示依據本發明之一實施例的一資料收集計畫螢 幕之感應器設定項目的範例圖示。於所示之實施例中’顯 示一具有選擇欄標之資訊面板。選擇欄標可被使用以選擇 其他的GUI螢幕。另一方面,可使用一導引樹狀物以顯 示及選擇其他GUI螢幕。一使用者可使用感應器組態螢 幕,諸如感應器設定項目螢幕,以組態一動態感應器之參 數。舉例而言,顯示一 “操作頻率”參數之資訊,但此並 非本發明所必要。動態感應器可具有與其相關之任何數目 的參數。 螢幕可包含一名稱欄位,其可被顯示爲一標題、及一 敘述/指示/求助欄位,以提供指示及/或求助訊息給使用者 。感應器設定項目螢幕亦可包含項目欄位及選定項目欄位 之表列。此兩者均被顯示爲表列。 -34- (32) (32)200403554 儲存按鈕可被使用以儲存來自此螢幕之資料至資料庫 。取消按鈕可被使用以塡入所有欄位之原始(內定)資料 。加入按鈕可被使用以加入一選定的感應器實例,從右側 列至左側表。移除按鈕可被使用以移除選定的感應器型式 ,從左側列至右側列。一躍上型訊息視窗將顯示一確認, 而一條目可被加回至右側表。 感應器設定項目螢幕提供一簡易使用機構,以組態一 動態感應器及/或改變有關一動態感應器之參數。所示之 範例係顯示其一使用者可被提供對於一特定動態感應器之 操作模式的指示訊息。指示訊息提供安全性之觀念給使用 者,並避免錯誤。可提供項目表列給使用者,且可提供其 容許使用者移動項目至及自選定項目表列的按鈕。選定參 數之此感應器設定項目(編輯)螢幕係取決於選定參數之 value_type,而對於範例螢幕其value_type可爲選擇。 當裝設一新的感應器或改變模組上之一現存感應器時 ,APC系統及感應器裝設應用程式可使得一模組離線。例 如,關連與任一感應器之感應器電纜(RS23 2、乙太網路 、光纖、等等)可被中斷及重新連接;一感應器之網路位 址可被改變;感應器設定可被組態;及一感應器可被測試 ,包含手動地設定感應器(亦即,手動地啓動感應器、即 時地監視感應器資料、停止感應器、儲存其被收集爲一檔 案之感應器資料、及儲存感應器設定爲一檔案),而不中 斷其他模組之運作。 圖9顯示依據本發明之一實施例的另一感應器設定項 -35- (33) (33)200403554 目螢幕之範例圖示。於所示之實施例中’威不一具有選擇 欄標之資訊面板。選擇欄標可被使用以選擇其他的GUI 螢幕。另一方面,可使用一導引樹狀物以顯示及選擇其他 GUI螢幕。一使用者可使用感應器組態螢幕’諸如感應器 設定項目螢幕,以組態一動態感應器之參數。 螢幕可包含一名稱欄位,其可被顯不爲一標題、及一 敘述/指示/求助欄位,以提供指示及/或求助訊息給使用者 。感應器設定項目螢幕亦可包含數個用以提供一値之欄位 。此圖顯示一內定値欄位、一插入値欄位、一最小限制欄 位、一最大限制欄位及一選定項目欄位。其均被顯示爲表 列。儲存按鈕可被使用以將來自此螢幕之資料儲存至資料 庫。取消按鈕.可被使用以塡入所有欄位之原始(內定)資 料。 感應器設定項目螢幕提供機構,以供組態一動態感應 器及/或改變有關一動態感應器之參數。所示之範例顯示 其一使用者可被指示以插入 “MF樣本時間”之一値,而 其他欄位提供其使得選擇較不易出錯的資訊。額外的欄位 提供安全性之觀念給使用者,並避免錯誤。選定參數之此 感應器設定項目(編輯)螢幕可取決於選定參數之 value_type,而對於螢幕,其value_type可爲整數。 圖1 0顯不依據本發明之一實施例的參數儲存螢幕之 範例圖示。於所示之實施例中,顯示一具有選擇欄標之資 訊面板。選擇欄標可被使用以選擇其他的GUI螢幕。另 一方面,可使用一導引樹狀物以顯示及選擇其他GUI螢-31-(29) (29) 200403554 Sensor. In addition, users can generate, edit, and review configuration information for a motion sensor. As shown in FIG. 5, a selection screen may include a title panel, an information panel, and a control panel. For example, the title panel can include the top two columns of a screen. The title panel can include: the company's trademark column to display the version information; the user ID column to display the ID of the current user; the warning message column to display a message when there is an active alert—the current date and time column 'To display the current date and time of the server; the current screen name block' to display the name of the target screen (such as' tool status', only the heart bar throughout the day ') to show the communication between the server and the tool Current status of the link; Tool ID column to display the ID of the tool being monitored; Logout column, which allows the user to log out; Screen selection column, which can be selected to view a list of all available screens. In other embodiments, the title panel can be displayed in different languages and can be scaled and placed differently. FIG. 6 shows an exemplary diagram of a plan information screen according to an embodiment of the present invention, which can be accessed from the data collection plan stage of FIG. 5. In the embodiment shown, an information panel with a selection tab is displayed. The selection tab can be used to select other GUI screens. Alternatively, a navigation tree can be used to display and select other GUI screens. The list of sensor instances can include the list of sensor instances that match the conditions of tool_id, module_id, and §10 names. A 'list can be provided because a sensor type can have many sensor instances. For example, a project called "Intended Project 1" is displayed with information in several fields, but this is not necessary for the present invention. On the other hand, other programs (30) 200403554 and other sensors can be displayed. For example, Langmuir probes, probes, and other types of semiconductor processing probes can be used. The plan name field contains the name of a data collection plan, and the description can include a detailed description of the data collection plan. The tool i d field contains a list of existing tools (tool i d) for selection, and the module i d may include a list of existing process modules (module i d) for selection. The post-use date field can be used to indicate the date of use of this data collection plan. The Save button can be used to save data from this screen to the library. The cancel button can be used to enter the original (internal order) of all fields. The add button can be used to add a selected motion sensor from the right side to the left table. The remove button can be used to remove a Select the type of reactor, from the left table to the right. A confirmation message will be displayed in the upper message window, and an entry will be added back to the right table. The edit button can be used to edit the selected sensor parameters. One of the sensor setting screens is shown in Figure 7. The parameter save button is used to enable the parameter save screen as shown in Figure 10. The save button can be used to update / insert data into the two tables dc__plans and one sensor — dcplan table. Figure 7 shows an example diagram of a sensor setting according to an embodiment of the present invention. In the embodiment shown, an information panel with a selection bar is displayed. The selection bar can be used to select other GUI screen on the other hand, a navigation tree can be used to display and select other screens. A user can configure the screen using sensors, such as the sensor 0ES. Most sense data) owned embodiment, illustrated by the actuator may be a standard screen of the screen. GUI Settings -33- (31) (31) 200403554 screen to review and edit --- related sensor parameters. For example, 'shows two parameters, but this is not necessary for the present invention. The motion sensor can have any number of parameters associated with it. A list of setting items for the selected sensor can be displayed on the screen. The edit button can be used to display the sensor setting item screen as shown in Figure 8. This screen allows the user to modify selected parameters based on a selected valuejype. The sensor setting screen includes an item name field, an item 値 field, a narrative field, and an I s _ 0 p t i ο n a 1 field, which can be used to control access to data. For example, the user can select the parameters for this data collection, if the IS_Optional variable is true. FIG. 8 shows an exemplary diagram of sensor setting items of a data collection plan screen according to an embodiment of the present invention. In the embodiment shown, an information panel with selection columns is displayed. Selection tabs can be used to select other GUI screens. Alternatively, a navigation tree can be used to display and select other GUI screens. A user can use a sensor configuration screen, such as a sensor setting item screen, to configure the parameters of a motion sensor. For example, the information of an "operating frequency" parameter is displayed, but this is not necessary for the present invention. The motion sensor can have any number of parameters associated with it. The screen may include a name field, which may be displayed as a title, and a narrative / instruction / help field to provide instructions and / or help information to the user. The sensor setting item screen can also include a list of item fields and selected item fields. Both are shown as table columns. -34- (32) (32) 200403554 The Save button can be used to save data from this screen to the database. Cancel button can be used to enter the original (default) data of all fields. The Join button can be used to add a selected sensor instance, from the right to the left table. The remove button can be used to remove the selected sensor type from the left column to the right column. A pop-up message window will display a confirmation, and an entry can be added back to the table on the right. The sensor setting item screen provides an easy-to-use mechanism to configure a motion sensor and / or change parameters related to a motion sensor. The example shown shows an indication that a user can be provided with the mode of operation of a particular motion sensor. Instruction messages provide the user with a sense of security and avoid mistakes. Item lists can be provided to users, and buttons can be provided that allow users to move items to and from selected item lists. The sensor setting item (edit) screen of the selected parameter depends on the value_type of the selected parameter. For the example screen, the value_type can be selected. When installing a new sensor or changing an existing sensor on the module, the APC system and sensor installation application can take a module offline. For example, the sensor cable (RS23 2, Ethernet, fiber, etc.) connected to any sensor can be disconnected and reconnected; the network address of a sensor can be changed; the sensor settings can be changed Configuration; and a sensor that can be tested, including manually setting the sensor (that is, manually activating the sensor, monitoring the sensor data in real time, stopping the sensor, storing the sensor data collected as a file, And storing the sensor as a file) without interrupting the operation of other modules. FIG. 9 shows another example of a sensor setting item according to an embodiment of the present invention. (35) (33) (33) 200403554 screen. In the illustrated embodiment, the ' Way is an information panel with a selection bar. The selection bar can be used to select other GUI screens. Alternatively, a navigation tree can be used to display and select other GUI screens. A user can use a sensor configuration screen, such as a sensor setting item screen, to configure the parameters of a dynamic sensor. The screen may include a name field, which may be displayed as a title, and a narrative / instruction / help field to provide instructions and / or help information to the user. The sensor setting screen can also include several fields to provide a frame. This figure shows a default setting field, an insertion setting field, a minimum limit field, a maximum limit field, and a selected item field. They are all displayed as tables. The Save button can be used to save data from this screen to the database. Cancel button. Can be used to enter the original (default) data of all fields. The sensor setting screen provides a mechanism for configuring a motion sensor and / or changing parameters related to a motion sensor. The example shown shows that one user can be instructed to insert one of the "MF sample times", while the other fields provide information that makes the selection less error-prone. Extra fields provide security concepts to users and avoid mistakes. The sensor setting item (edit) screen of the selected parameter may depend on the value_type of the selected parameter, and for the screen, its value_type may be an integer. FIG. 10 shows an exemplary diagram of a parameter storage screen according to an embodiment of the present invention. In the illustrated embodiment, an information panel with a selection bar is displayed. Selection tabs can be used to select other GUI screens. On the other hand, a navigation tree can be used to display and select other GUI screens.
-36- (34) (34)200403554 幕。一使用者可使用感應器組態螢幕,諸如參數儲存螢幕 ,以決定應被儲存至資料庫之動態感應器參數。 參數儲存螢幕顯示一選定資料收集計畫中之一選定感 應器實例的參數表列。資料庫儲存計畫被提供一連結至參 數儲存螢幕中之各參數。 參數儲存螢幕可包含選定感應器之項目表列,其包含 選定感應器設定項目之名稱。參數儲存螢幕亦可包含一編 輯按鈕,其致能面板;一加入按鈕,其可被使用以利用特 定公式來加入新的參數名稱;及一摘要資訊按鈕。摘要資 訊按鈕可被使用以選擇一供儲存之參數並致能圖1 1中所 示之螢幕。取消按鈕可被使用以將原始値塡入所有欄位, 而儲存按鈕可被使用以儲存m_valiie表中之檢查格的選 擇。所列出之項目包含參數名稱、新的參數名稱、公式、 及儲存選擇檢查格。 圖1 1顯示依據本發明之一實施例的公式資訊螢幕之 範例圖示。於所示之實施例中,顯示一具有選擇欄標之資 訊面板。公式資訊螢幕可提供關連與一動態感應器之選定 參數的公式編輯器。 例如,使用者可指定一新的參數名稱給新參數名稱欄 位中之現存參數。參數名稱欄位顯示參數之原始名稱。一 儲存計畫參數欄位可包含選定資料收集計畫中之參數表列 。一加入按鈕可被使用以從下拉格加入選定的儲存計畫參 數至公式敘述欄位中。儲存按鈕可被使用以儲存資訊至一 r u η __ v a 1 U e表。軟體執行公式檢查並決定所指定的參數名 -37- (35) (35)200403554 稱是否是唯一的。取消按鈕可被使用以取消其改變。儲存 檢查格可被使用以選擇資料收集計畫之參數且亦致能如圖 1 2中所示之螢幕。 圖1 2顯示依據本發明之一實施例的參數收集資訊螢 幕之範例圖示。於所示之實施例中,顯示一具有選擇欄標 之資訊面板。參數收集資訊螢幕提供一機構以利編輯有關 一動態感應器之選定參數的摘要資料收集資訊。 例如,參數收集資訊螢幕可包含一名稱欄位,其顯示 選定的參數名稱。新按鈕致能供輸入之右側欄位;編輯按 鈕可被使用以塡入値於右側欄位中。設定點、百分比、及 絕對檢查格被使用以選擇資料收集計畫中之參數的這些資 料收集型式之一。臨限値、低尖波、高尖波、及剪截檢查 格被使用以選擇這些資料預處理項目之一或更多並致能相 應的文字欄位。儲存按鈕可被使用以儲存來自 param_limits表中之右側欄位的資訊。取消按鈕可被使用 以取消其改變。 感應器型式可爲一相應於感應器之功能的一般用詞。 一感應器實例配對感應器型式至一特定感應器於一製程模 組(室)及工具上。至少一感應器實例被組態給其被裝設 至一工具之各實際感應器。 感應器型式可包含其設定操作時間之一特定感應器型 式所需的所有變數。這些變數均可爲靜態的(亦即,此型 式之所有感應器均具有相同値)、可由實例所組態的(亦 即,感應器型式之各實例可具有唯一的値)、或者可由資 -38- (36) (36)200403554 料收集計畫所組態的(亦即,每次感應器於操作時間被啓 動時,其可被提供一不同的値)。例如,“可由實例組態 ”變數可爲探針IP位址。此位址隨實例而變(對於各製程 室)但並不隨運作而變。“可由資料收集計畫組態,,變數 可爲探針之諧波頻率的表列。此感應器可爲動態的,且根 據上下文資訊之一製程可組態其變數。例如,製程上下文 資訊可包含工具ID、模組ID、槽ID、處理程式id、卡 帶ID、開始時間及結束時間。 關連與動態感應器之應用程式係撓性且可組態的。例 如,諸如IP位址、工具id等取決於消費者的資訊可爲隨 系統而變的,而在消費者或欄位工程師組態其設定之後, 則資訊可使用於下次啓動時。動態感應器應用程式可操作 於數種不同的操作系統,諸如視窗NT及視窗2000。 功能按鈕可被設置沿著GUI螢幕之底部及/或頂部。 因爲相同的功能按鈕被顯示於許多螢幕上,所以使用者可 從任何螢幕導引至任何功能而無須通過一連串選單。一登 出按鈕可被顯示於標題面板中,且其被用以登出系統。提 示訊息可被提供當資料已被修改或未被儲存時。此外’一 求助按鈕可被顯示’且其可被使用以內容特定或一般性文 件,以協助使用者瞭解其被提呈給使用者之資料及/或使 用者所請求之資料。 根據上述教導而得以產生本發明之多種修改及變化。 因而應瞭解’於後附申請專利範圍之範圍內’本發明可被 實施以此處所特定描述者以外的方式。 -39- (37) (37)200403554 【圖式簡單說明】 後附圖形(其被倂入且構成說明書之一部分)說明莽: 發明之實施例,且配合以上之一般性敘述及以下之詳細余戈 述以供解釋本發明之原理。參考以下之詳細敘述則將獲得 對本發明之更完整的理解,特別當配合後附圖形以考量日寺 ,其中: 圖1顯示一種先進製程控制(APC )半導體製造系統 之一簡化方塊圖,依據本發明之一實施例; 圖2顯示一用以監視半導體處理系統中之處理工具的 流程圖之簡化圖示,依據本發明之一實施例; 圖3顯示策略與計畫之間的示範關係圖,依據本發明 之一實施例; 圖4咸不策略與計畫之間的不範流程圖,依據本發明 之一實施例; 圖5顯示依據本發明之一實施例的選擇螢幕之一示範 圖示; 圖6顯示依據本發明之一實施例的資料收集計畫資訊 螢冪之一示範圖示; 圖7顯示依據本發明之一實施例的感應器設定螢幕之 一示範圖示; 圖8顯示依據本發明之一實施例的資料收集計畫之次 螢幕的示範圖示’此資料收集計畫係界定一 諧波爲基 礎之感應器的感應器設定; 圖9顯示依據本發明之一實施例的一感應器設定項目 -40- (38) (38)200403554 營幕之另一暴露時間次螢幕的一示範圖示; 圖1 〇顯示依據本發明之一實施例的參數儲存螢冪之 一示範圖示; 圖n顯示依據本發明之一實施例的公式資訊螢幕之 一示範圖示;及 圖1 2顯示依據本發明之一實施例的參數收集資訊螢 幕之一示範圖示,此參數收集資訊螢幕係用於使用處理程 式設定點之動態過濾。 主要元件對照表 100 半導體製造環境 10 5 工廠系統 110 半導體處理工具 115 E診斷系統 120 製程模組 130 感應器 140 感應器介面 145 APC系統 15 0 介面伺服器 160 APC伺服器 170 客戶工作站 180 GUI組件 19 0 資料庫-36- (34) (34) 200403554 Act. A user can use a sensor configuration screen, such as a parameter storage screen, to determine the dynamic sensor parameters that should be stored in the database. The parameter storage screen displays a parameter list of a selected sensor instance in a selected data collection plan. The database storage plan is provided with a link to each parameter in the parameter storage screen. The parameter storage screen can include a list of items for the selected sensor, which contains the name of the selected sensor setting item. The parameter storage screen can also include an edit button that enables the panel; a join button that can be used to add a new parameter name using a specific formula; and a summary information button. The summary information button can be used to select a parameter for storage and enable the screen shown in Figure 11. The Cancel button can be used to load the original into all fields, and the Save button can be used to save the selection of check boxes in the m_valiie table. The listed items include parameter names, new parameter names, formulas, and save selection check boxes. FIG. 11 shows an exemplary diagram of a formula information screen according to an embodiment of the present invention. In the illustrated embodiment, an information panel with a selection bar is displayed. The formula information screen provides a formula editor related to selected parameters of a motion sensor. For example, the user can assign a new parameter name to an existing parameter in the new parameter name field. The parameter name field displays the original name of the parameter. A stored plan parameter field may contain a list of parameters in the selected data collection plan. An Add button can be used to add selected saved plan parameters from the drop-down box to the formula description field. The save button can be used to save information to a r u η __ v a 1 U e table. The software performs a formula check and decides whether the specified parameter name -37- (35) (35) 200403554 is said to be unique. The Cancel button can be used to cancel its changes. The save checkbox can be used to select the parameters of the data collection plan and also enables the screen shown in Figure 12. FIG. 12 shows an exemplary diagram of a parameter collection information screen according to an embodiment of the present invention. In the illustrated embodiment, an information panel with selection columns is displayed. The parameter collection information screen provides a mechanism for editing summary data collection information about selected parameters of a motion sensor. For example, the parameter collection information screen may include a name field that displays the selected parameter name. The new button enables the right field for input; the edit button can be used to enter in the right field. Set points, percentages, and absolute check boxes are used to select one of these data collection types for the parameters in the data collection plan. Threshold threshold, low spike, high spike, and clipping check boxes are used to select one or more of these data preprocessing items and enable corresponding text fields. The save button can be used to store information from the right field in the param_limits table. The Cancel button can be used to cancel its changes. The sensor type may be a general term corresponding to the function of the sensor. A sensor instance pairs the sensor type to a specific sensor on a process module (room) and tool. At least one sensor instance is configured for each actual sensor which is mounted to a tool. The sensor type can include all the variables required for a particular sensor type for which it sets the operating time. These variables can all be static (that is, all sensors of this type have the same 値), configurable by the instance (ie, each instance of the sensor type can have a unique 値), or can be provided by- 38- (36) (36) 200403554 The material collection program is configured (ie, each time the sensor is activated at the operating time, it can be provided with a different pump). For example, the "configurable by example" variable can be the probe IP address. This address varies from instance to instance (for each process room) but does not vary from operation to operation. "It can be configured by the data collection plan, and the variable can be a list of the harmonic frequencies of the probe. This sensor can be dynamic, and its variable can be configured according to one of the context's processes. For example, the process context information can be Contains tool ID, module ID, slot ID, handler ID, cassette ID, start time and end time. Applications that are connected to motion sensors are flexible and configurable. For example, such as IP address, tool ID The information that depends on the consumer can be system-dependent, and after the consumer or field engineer configures its settings, the information can be used at the next startup. The motion sensor application can operate on several different Operating systems, such as Windows NT and Windows 2000. Function buttons can be set along the bottom and / or top of the GUI screen. Because the same function buttons are displayed on many screens, users can navigate from any screen to any Functions without going through a series of menus. A logout button can be displayed in the title panel and it is used to log out of the system. A reminder message can be provided when the information has been modified or When stored. In addition, a 'help button can be displayed' and it can be used with content specific or general documents to help users understand the information they are presented to users and / or the information requested by users. Based on the above teachings, various modifications and changes of the present invention can be produced. Therefore, it should be understood that the present invention can be implemented in a manner other than those specifically described herein within the scope of the appended patent application. -39- (37) ( 37) 200403554 [Brief description of the drawings] The following drawings (which are incorporated into and constitute a part of the description) illustrate the embodiment of the invention, and cooperate with the general description above and the detailed description below to explain the present invention. A more complete understanding of the present invention will be obtained by referring to the following detailed description, especially when the accompanying drawings are taken into consideration to consider the temple, where: Figure 1 shows a simplified block diagram of an advanced process control (APC) semiconductor manufacturing system According to an embodiment of the present invention; FIG. 2 shows a simplified diagram of a flowchart for monitoring a processing tool in a semiconductor processing system. An embodiment of the invention; FIG. 3 shows an exemplary relationship diagram between a strategy and a plan, according to an embodiment of the present invention; FIG. 4 An irregular flowchart between a strategy and a plan, according to an embodiment of the present invention Figure 5 shows an exemplary diagram of a selection screen according to an embodiment of the invention; Figure 6 shows an exemplary diagram of the data collection plan information screen according to an embodiment of the invention; Figure 7 shows according to the invention An exemplary diagram of a sensor setting screen according to an embodiment; FIG. 8 shows an exemplary diagram of a secondary screen of a data collection plan according to an embodiment of the present invention. 'This data collection plan defines a harmonic based Sensor setting of a sensor; FIG. 9 shows an exemplary setting diagram of a sensor setting item -40- (38) (38) 200403554 according to an embodiment of the present invention, and another exemplary display screen of the secondary screen of the exposure time; 10 shows an exemplary diagram of a parameter storage screen according to an embodiment of the present invention; FIG. N shows an exemplary diagram of a formula information screen according to an embodiment of the present invention; and FIG. 12 shows an exemplary diagram of a formula information screen according to an embodiment of the present invention; One implementation One exemplary illustration of parameters used to collect information firefly screen, this screen parameter information collection system for using a dynamic set point drive type of filtration process. Main component comparison table 100 Semiconductor manufacturing environment 10 5 Factory system 110 Semiconductor processing tools 115 E-diagnosis system 120 Process module 130 Sensor 140 Sensor interface 145 APC system 15 0 Interface server 160 APC server 170 Client workstation 180 GUI component 19 0 Database