TW200403554A - Method for dynamic sensor configuration and runtime execution - Google Patents

Abstract

Graphical User Interfaces (GUIs) are presented for configuring and setting-up dynamic sensors for monitoring tool and process performance in a semiconductor processing system. The semiconductor processing system includes a number of processing tools, a number of processing modules (chambers), and a number of sensors. The graphical display is organized so that all significant parameters are clearly and logically displayed so that the user is able to perform the desired configuration and setup tasks with as little input as possible. The GUI is web-based and is viewable by a user using a web browser.

Description

200403554 Π) 发明 Description of the invention [Technical field to which the invention belongs] The present invention relates to semiconductor processing systems, and particularly to semiconductor processing systems having user interfaces (GUIs) to configure and respond. [Previous Technology] Computers are generally used to control, monitor, and activate brains, which are very suitable for these operations, because in semiconductor manufacturing plants, various input and output (I / O) processes, key processing steps, and process maintainability ) Device to control and monitor the processing status and maintenance schedule. There are semiconductor manufacturing plants that perform repetitive inspections from key operations such as etching to batch processing. Most of the tool installations use a display screen and the display screen is a part of the graphics control GUI that contains the control computer for the installation software. The installation of semiconductor processing tools is a type of semiconductor processing equipment requires frequent monitoring. The process bar changes, even with the smallest changes in key process parameters. Minor changes can easily occur in the etching gas, process chamber, or wafer temperature. In many cases, changes in deteriorating process data cannot be detected simply by referring to the display. Detecting early abnormalities and deterioration of characteristics of a process often requires predictions provided by Advanced Process Control (APC). Electricity re-enters crystal heterogeneity. The use of processes, various tools on the wafer to complete various steps to complete this user interface (the time-consuming process parts produce unfavorable components over time or stress should be processed characteristics of process data is difficult. And type identification (2 ) (2) 200403554 Device control is often performed by several different control systems with various controllers. Some control systems may have a human-machine interface (such as a touch screen) 'while other systems may only receive and display a variable (Such as temperature). The monitoring system can collect the data listed in the process control system. The data collection of the monitoring system can involve univariate or multivariate data, data analysis and display, and it can have the ability to select the process variables to be collected Various conditions in a process are monitored by different sensors provided in each process room, and the data of the monitored conditions are transferred and accumulated in a control computer. If the process data is automatically displayed and detected, then Can set and pass the statistical process control (SPC) chart to control the optimal process conditions of a large number of production lines. Monitoring may lead to equipment downtime, which increases the total operating cost. [Summary of the Invention] According to a type, the present invention provides a method for using a graphical user interface (GUIs) to set a dynamic sensor in a semiconductor processing environment. Method. In this method, a data collection plan is executed. A data collection plan is used to determine a motion sensor setting plan. A motion sensor setting plan is performed to set a motion sensor. [Embodiment] Figure 1 shows a An exemplary block diagram of an APC system in a semiconductor manufacturing environment, according to an embodiment of the present invention. In the illustrated embodiment, the 'Semiconductor-5- (3) (3) 200403554 bulk manufacturing environment 100 includes at least one semiconductor processing tool 110. Most process modules 120 (PM1 to PM4), sensor interface 140, and APC system 145. APC system 145 may include interface server (IS) 150, APC server 160, client workstation 170, The GUI component 180 and the database 1 90. In one embodiment, the IS 1 50 may include a real-time memory database, which may be regarded as a "hub". The APC system 145 may include a A status monitoring system is used to monitor the performance of at least one processing tool, a process module, and one of the sensors. In the illustrated embodiment, a single tool 110 is shown to cooperate with four process modules 120, but This is not a necessary requirement of the present invention. The tool condition monitoring system can have an interface and several processing tools, which include a cluster tool with one or more process modules. The tool condition monitoring system can be used to configure and monitor several processing tools , Which includes cluster tools with one or more process modules. For example, 'tools and their associated process modules can be used to perform etching, deposition, diffusion, cleaning, measurement, polishing, growth, transfer, storage, loading , Unloading, alignment, temperature control, lithography, integrated weights and measures (IM), optical data contouring (ODP), particle detection, and other semiconductor manufacturing processes. In an embodiment, the processing tool 110 may include a tool agent (not shown), which may be an execution tool! The software program above 10 can provide event information, context information, and start-stop timing instructions to synchronize data acquisition with the tool program. Meanwhile, the APC system 145 may include an agent client (not shown), which may be a software program, and this software program may be used to provide a connection with the tool agent (4) 200403554. For example, the APC system 145 may be connected to a processing tool 110 via an Internet or a network connection. In one embodiment, I S 1 50 uses a socket for communication. For example, it can be implemented using TCP / IP socket communication. Create a socket for each communication. A message is then sent as a string. After the message, the socket is deleted. On the other hand, the interface can be structured as a TCL program, extended by a + code, or a C / C ++ program, which uses a special category, such as the Message Hub (DMH) client category. In this case, the logic unit (connected via a socket to collect program / tool events) can be modified and inserted into a table of IS 150 with its contextual information. The tool agent can send messages to provide event and contextual information to the condition monitoring system. For example, the tool agent can send batch start / stop messages, batch start / stop messages, wafer start / stop messages, recipe start / stop messages, and process start / stop messages. The tool agent can be used to send and / or receive setpoint data and / or receive maintenance counter data. When a processing tool includes an internal sensor, this data can be passed to the tool condition monitoring system. Data files may be used to transfer this data. For example, certain processing tools may generate trace files that are compressed when they are generated. Compressed and / or uncompressed data can be transferred. When the file is generated in a processing tool, the tracking data may or may contain endpoint detection (EPD) data. The tracking data provides important information about the process. The tracking data can be updated and transferred. Within the completion of a wafer, the information transmission C / C distribution path (in addition to the tool stop program will also send the transmission material. The tracking in the tool will be processed without emphasis. 7- (5) After (5) 200403554. The tracking file can be transferred to a better directory for each process. In one embodiment, tool tracking data, maintenance data, and EPD data can be obtained from a processing tool 1 10. Figure "1" shows four process modules, but this is not necessary for the present invention. The semiconductor processing system can include any number of processing tools, which has any number of process modules associated with it and independent process modules. Contains The AP C system 1 4 5 of the tool condition monitoring system can be used to configure and supervise any number of processing tools with any number of process modules and independent process modules associated with it. The tool condition monitoring system can collect, Provides, processes, stores, and displays data from processes related to processing tools, process modules, and sensors. Process modules can be used such as ID, module type, gas Data and maintenance counters are identified, and this data can be stored in a database. When a new process module is configured, this data type can use one of the GUI component 180 modules For example, the APC system can support the following tool types from Tokyo Electronics Co., Ltd .: Single related process module, triple related process module, Tel ins related process module, OES related module Group, and ODP-related modules. On the other hand, the 'APC system can support other tools and their related process modules. For example,' APC system 1 45 can be connected to the process via an Internet or intranet connection. Module 120.

In the illustrated embodiment, a single sensor 130 is shown connected to the same related process module, but this is not necessary for the present invention. Any number of sensors can be coupled to a process module. The sensor 130 may include an ODP (6) (6) 200403554 sensor, an OES sensor, a VIP sensor, an analog sensor, and other types of semiconductor processing sensors, including digital probes. APC data management applications can be used to collect, process, store, display, and output data from a variety of sensors. The sensor data in the APC system can be provided by external and internal sources. External sources can be defined using an external data logger type; a data logger target can be assigned to each external source; and a state variable representation can be used. Sensor configuration information combines sensor type and sensor instance parameters. The sensor type is a general term 'which corresponds to the function of the sensor. A sensor instance pairs a sensor type to a specific sensor on a specific process module and tool. At least one sensor instance is configured for each body sensor, which is attached to a tool. For example, an 0ES sensor can be one sensor type; a VI probe can be another sensor type; and an analog sensor can be a different sensor type. In addition, there may be additional general sensor types and additional specific sensor types. A sensor type contains all the variables it needs to set a particular sensor type at the time of operation. These variables can be static (all sensors of this type have the same 値), can be configured by instances (each instance of the sensor type can have a unique 値) 'or can be dynamically grouped by a data collection project State (Each time the sensor is activated during operation time, it can be provided with a different value). The "configurable by example" variable can be a sensor / probe 1 P address. This address varies from instance to instance (for each process room) but does not change with each operation

-9- (7) 200403554. The "configurable by data collection plan" variable can be one of the harmonic frequencies. These can be configured differently for each wafer according to the context information. The wafer context information can include tool ID, module ID, slot (s ID, handler ID, cassette Ϊ D, start time and end time. There are many instances of the same sensor type. A sensor instance is the corresponding specific hardware Body, and connect a sensor type to the tool and / or system (room). In other words, a sensor type is general and a sensor example is specific. As shown in FIG. 1, the sensor interface 1 40 may be used to provide an interface between the sensor 130 and the APC system 145. For example, the system 1 4 5 may be connected to the processor interface 140 via an Internet or intranet connection, and the sensor interface 140 may be Connected to the sensor 130 via the Internet or a network connection. At the same time, the sensor interface can function as a protocol converter, media converter, and data buffer. The sensor interface 1 40 can provide real-time functions , Such as data acquisition and peer-to-peer communication, and I / O scanning. On the other hand, the sensor interface 140 is removed, and the pattern memory 130 can be directly coupled to the APC system. The pattern memory 130 can be one. Static or dynamic Example. A dynamic VI sensor can have its frequency range, sampling period, specific trigger, and offset information. It is created at operating time using parameters provided by a data recording. The sensor 1 3 0 can An analog sensor can be static and / or dynamic. For example, an analog sensor can be used to provide ESC voltage data, matcher parameters, gas parameters, flow tables such as lots. Interior 140. This point can be used, for example, as an example, a counter, to rate, -10- (8) 200403554 pressure, temperature, RF parameters, and other process related data. 130 may include at least one of the following: a VIP probe, an 0ES sensor, a digital sensor, and a semiconductor processing sensor. In one embodiment, the sensor interface can write data points to a data file. For example, IS 1 50 can send a start command to the sensor to start data acquisition and can send a stop command to cause the file to close. 1 50 can then read and analyze the sensor data file, process the data, log in to the memory data table. On the other hand, the sensor interface can stream data to in real time. A switch can be provided to allow the sensor interface to write files to the disc interface. The interface also provides a method for reading files and streaming data points to the IS for offline processing and analysis. As shown in FIG. 1, the APC system 145 may include a database 1 and status monitoring data may be stored in the database 190. In addition, the amount of original data and tracking data that can be stored in the database 190 depends on the frequency with which the user-configured data collection plan, process execution, and processing tools are operated. For example, data collections can be created for deciding how and when to collect tool status data. Processing tools, processing rooms, sensors, and APC systems are stored in tables. In one embodiment, the watch may be implemented in the IS 150 to become a body watch and in the database 190 to become a permanent storage. is ι5〇 Structure query language (SQL) for row and column generation and data. The table can be copied to the permanent table in the database 190 (that is, the sensor, analog-original interface is closed. IS will be IS 150. Induction 150 ^ 90 .: L self-tool file. Collecting and counting fiber. The data can be used in the registration form, and DB2 -11-(9) (9) 200403554 can be used) and can be entered using the same SQL description. In the described embodiment, IS 1 50 may be an in-memory real-time database and a subscription server. For example, client programs can use SQL to perform database functions, with a common programming model for related datasheets. In addition, j s 150 can provide a data subscription service, in which client software receives asynchronous notifications whenever a data that meets its selection conditions is inserted, updated, or deleted. Subscriptions use the full power of SQL selection narratives to indicate which table rows are relevant and which column selection criteria to use to filter future data change notifications. Because IS 150 is a database and a subscription server, customers can turn on "synchronization" to subscribe to existing table data when it is initialized. I S 1 50 provides data synchronization through an announcement / subscription organization, in-memory data tables, and supervisory logic circuits (for organizing events and alerts through the system). The IS 150 provides several messaging TCP / IP-based technologies, including sockets, UDP, and announcement / subscription. For example, the IS 150 architecture can use multiple data hubs (ie, sQL databases) 'which can provide real-time data management and subscription functions. Application modules and user interfaces use SQL messages to access and update information in the data hub. Due to the performance limitation of registering the operation time data to the related database, the operation time data is registered in the in-memory data table managed by IS 150. The contents of these tables can be registered in the relevant database 'at the end of wafer processing. In the embodiment shown in FIG. 1, a single client workstation is displayed, but this is not necessary for the present invention. A PC system 1 4 5 can support most customer workstations 1 70. In one embodiment, the client workstation 70 allows a user

-12- (10) (10) 200403554 Execute the configuration program; view the status including the status of tools, rooms, and sensors; view the status of the process; view historical data; and perform simulation and drawing functions. Implementation shown in Figure 1 For example, the APC system 145 can include an APC server 160 (which can be coupled to Is 15), a client workstation 170, a GUI component 180, and a database 190, but this Not necessary for the present invention. The AP C server 160 may include several applications, including at least one tool-related application, at least one module-related application, at least one sensor-related application, at least one IS-related application, and at least one database-related application. Application and at least one GUI related application. In addition, the Apc server can contain several tool condition monitoring system applications. APC server 1 60 contains at least one computer and software that supports multiple process tools; collects and synchronizes data from tools, process modules, sensors, and probes; stores data in a database; enables users to watch Existing diagrams; and provide error detection. For example, the APC server 160 may include operating software, such as Ingenio software from Tokyo Electron. The AP C server allows online system configuration, online batch-to-batch error detection, online wafer-to-wafer error detection, online database management, and the use of models based on historical data to perform multivariate analysis of summary data. In addition, the tool status monitoring system allows real-time monitoring of processing tools. For example, the APC server 160 can contain several minimum 3GB of free disk space; at least 600 MHz CPU (dual processor); minimum 512 Mb RAM (physical memory); 9 GB SCSI hard disk in RAID 5 configuration; RAM Minimal disk cache with twice the size; Install Windows (11) (11) 200403554 2000 server software; Microsoft Internet Explorer; TCP / IP network protocol; and at least two network cards. The APC system 145 may include at least one storage device that stores files containing raw data from the sensors and files containing tracking data from the tools. If these files are not properly managed (ie, deleted generally), the storage device may have insufficient disk space and may stop collecting new data. The APC system 145 may include a data management application that allows users to delete older files, thereby freeing up disk space so that their data can be collected continuously without interruption. The AP C system 1 4 5 may contain most tables, which are used for the operating system, and these tables may be stored in 190. In addition, other computers (not shown), such as on-site or off-site computers / workstations and / or hosts, can be networked to provide functions such as data / graphic viewing, SPC mapping, EPD analysis, file access, Many tools. As shown in FIG. 1, the AP PC system 145 may include a G UI component 1800. For example, a GUI component may operate as an application on the APC server 160, the client workstation 170, and the tool 110. The G U I component 180 enables an A PC system user to perform desired configuration, data collection, monitoring, simulation, and troubleshooting tasks with as few inputs as possible. GUI design complies with SEMI Human Interface Standard for Semiconductor Manufacturing Equipment (SEMI Draft Doc. # 2783B) and SEMATECH Strategy Cell Controller (SCC) User-Interface Guide 1. (Technology Transfer 9206 1 1 79A-ENG). Those familiar with this technology will understand that its GUI panel / screen can include left-to-right selection of moving structures and / or right-to-left structures, bottom-to-top structures, top-to-bottom structures, or combinations. 14- (12) (12) 200403554 structure. Although the screens shown for explanation are in English, this is not a requirement of this invention, and different languages can be used. For example, 'Japanese screen, Chinese screen, Taiwanese screen, Korean screen, German screen, and French screen can be used. At the same time, the GUI component 180 provides an interactive mechanism between the tool condition monitoring system and the user. When the GUI starts, a registration screen that verifies the user's identity and password can be displayed, and it provides the first level of security protection. Users can be logged in using a security application before registration. A database check of user identity indicates an authorization level that will simplify the available GUI functions. Unauthorized options for users may be different and unavailable. The safety protection system also allows users to change existing passwords. For example, the registration panel / screen can be opened from a browser tool such as Netscape or Internet Explorer. The user can enter the user ID and password in the registration field. Authorized users and administrators can use the GUI panel / screen to modify system configuration and sensor setting parameters. The GUI component 180 may include a set of state components to allow users to configure processing tools, processing modules, sensors, and APC systems. For example, the GUI configuration panel / screen can be provided with at least one of a processing tool, a processing module, a sensor, a sensor instance, a module suspension, and an alert. The configuration data can be stored in an attribute database table and can be set to default settings during installation. The GUI component 180 may include a status component for displaying the current status of the processing tool, processing module, sensor, and APC system. In addition, (13) 200403554 The status component may include a drawing component for presenting system-related and process-related data to a user, using one or more different chart types. Meanwhile, the GUI component 180 may include an instant operation component. For example, a GϋI component may be coupled to a context task, and a common system logic may provide common functions used by the context task and the GUI component. The common logic circuit can be used to ensure that its response to the GUI component is the same as the response to the context task. Furthermore, the GUI component 1 may include an APC file management GUI component and a security protection component. Assistance panel / screen can be stored. For example, assistance files are provided in PDF (Portable Portable Document Format) and / or HTML format. As shown in FIG. 1 ', the AP C series 145 including a tool condition monitoring system may be coupled to a factory system 105 and / or an e-diagnosis system U5. The factory system 105 and / or the E-diagnosis system 115 can provide a mechanism to facilitate external monitoring and external control of tools, module sensors, and processes in a semiconductor processing system. On the other hand, the factory system 105 and / or the E-diagnosis system 115 can perform tool condition monitoring. For example, a user can use a all-in-one terminal to access a tool condition monitoring system, which is coupled to a semiconductor processing system by the factory system 105 and / or the E-diagnostic system 115. In addition, AP C system and E diagnostic system can work together to solve the current problem. For example, when the APC system 1 45 detects an error, the information needed to diagnose the problem can be aggregated and transmitted by the APC server to the E-diagnostic system or stored for later access by the diagnostic system. The method of operation may be determined using security restrictions and / or customer business rules. -16- Photo album can cover 80. (The Ministry of Industry and Commerce Λ network disconnection office will go to (14) (14) 200403554 on the same day v. APC includes institutions to facilitate joining sensors and editing data collection. Ten m 'its The context and / or events driven by the system. For example, this may allow Eg # broken "probes" and / or software components to be downloaded for the E diagnostic system to troubleshoot the system. The E diagnostic system may include a portable set of diagnostic tools It can feed for additional data, it can be used to diagnose, detect, and / or predict a problem. For example, APC systems can use these diagnostic tools as additional sensors. With a general sensor interface (which supports multiple protocols , Including analog input as the lowest level), a local portable diagnostic unit can be coupled to the factory system and then used remotely by the APC system, diagnostic system and / or factory system. The APC system can be provided with a new application program , Which is developed remotely at the factory and downloaded from the factory or E-diagnostic system. For example, new applications can be locally stored in the APC server. The APC system has the ability to learn new procedures and dynamically The ability to enter sensors, add applications, and even add a custom-designed GUI screen. Furthermore, the APC system can perform very specific procedures such as timing analysis assignments to figure out when a tool and / or module will fail (That is, a problem with a wafer operating system with a motor or actuator arm position). In addition, the 'APC system can change the sampling rate based on tool performance. For example,' data collection sampling rate and analysis volume can be changed according to the tool situation The ApC system can also predict a problem or detect that a tool and / or module is approaching a limit. In addition, 'advanced users and managers can use the GUI screen to modify system configuration and sensor setting parameters. (15) (15) 200403554 strategy and plan; and / or modify the number of tools and modules. The tool status monitoring system is implemented using a configurable system. This configurable system Enables customers (end users) to add processing tools, process modules, and / or sensors. The tool condition monitoring system provides a development environment and method that Customers can customize monitoring software, add analysis applications, and / or install and monitor new tools, modules, and sensors in the environment. The tool condition monitoring system software architecture includes four functional components: a data acquisition component, a Messaging system components, a related database component, and a post-processing component. This architecture also includes in-memory data tables, which are used to store operating time data acquisition parameters. The tools (and tool agents) are outside the tool status monitoring system. , Which provides contextual information and start-stop timing instructions to synchronize data acquisition with the tool process. The data acquisition component collects data points (called parameters) and writes them to a file. The messaging system uses in memory The data table temporarily stores the operation time data received from the data acquisition module. The messaging system is informed by an agent and / or tool client about the beginning and end of the data acquisition cycle. At the end of the data acquisition cycle, the data is registered in the relevant database, and the in-memory data table is deleted to facilitate the next acquisition cycle. The post-processing of the data supplied by the messaging system is performed at the operation time; the post-processing of the data stored in the relevant database is performed offline. The goal of a tool condition monitoring system is to use real-time and historical data to increase the performance of a semiconductor processing system. To achieve this, potential problems (such as sensor problems) can be predicted and corrected before they occur, thereby reducing equipment downtime and the number of non-productive wafers manufactured. This goal can be achieved by mistake by collecting data and then feeding that data to a software algorithm that simulates the behavior of a particular tool. Tool condition monitoring system output process parameters are adapted, which are then fed forward or backward to keep tool performance within specified limits. This control can be achieved in different forms at different levels. The alert management part of the tool status monitoring system can provide error detection algorithms, error classification algorithms, and / or error prediction algorithms. The tool condition monitoring system predicts when a tool will fail, and identifies possible solutions to correct the failure and reduce the number of non-product wafers made during maintenance and processing functions. The motion sensor application provides the user with the ability to determine whether a motion sensor is collecting data. When a data collection plan does not require data from a dynamic sensor, the sensor status provides the user with an indication that the sensor is not expected to be on. For example, when a data collection plan does not require data, the sensor status should be “online 0 f f”, and when the user has turned off the sensor at the system level, the status should be “offline 0ff”. The interface of the motion sensor can withstand failures and service-related interruptions. In addition, the interface provides the ability to set up and troubleshoot. For example, when an interruption occurs, the motion sensor and / or the APC system detects the interruption and initiates recording, alerting, and automatic recovery / analysis to determine the correct action and reduce the loss of functionality. In this way ' the risk to the customer who manufactures the product when the motion sensor and / or the APC system is operating with reduced functionality can be reduced. In addition, the motion sensor application can operate during service ^ repair mode. For the purpose of troubleshooting sensor communication ’, the motion sensor can be tested on unprocessed wafers -19- (17) 200403554. For example, the motion sensor can be set to start and stop from a web-based GUI. This feature can generally be serviced by the sensor settings and fixed sensors. The AP C system is implemented using a configurable system. This system enables customers (end users) to add tools, rooms, and sensors. The APC system provides a development environment and method that enables customers to customize applications. Program to add analysis applications and install new sensor systems. The AP C system provides error detection algorithms, error classification algorithms, or error prediction algorithms. The APC system can predict that a dynamic sensor will fail, and can identify possible solutions to correct the failure, and less likely to declare it is not a process related, but an opportunity for false alarms due to sensor failure or invalid setting. For example, misprediction can be a combination of error detection and error simulation. Methods can be used to optimize the replacement of consumable parts (such as motion sensors) and hope to assist in the "opportunity scheduling" of preventive maintenance work. . Misprediction can be based on a complex multivariate or a simple univariate relationship. FIG. 2 shows a simplified diagram of a flow chart for monitoring a science and technology in a semiconductor processing system according to an embodiment of the present invention. The software and the GUI screen provide a program to monitor one or more processes in the system. This flowchart illustrates an exemplary control strategy program that is executed in the monitoring program. The program 2 0 0 starts at 2 1 0. The program 2 0 0 can be executed in one of the semiconductor processing systems, starting with the sensor. Sense to the system, and when and reducer. In addition, when the related tools of the model are the production steps performed by the tool -V -20- (18) 200403554. A production step is an etching process, a process, a diffusion process, a cleaning process, a measurement process, a process, or other semiconductor processes. Strategy defines what happens during one of the processing tools. A strategy can define a sequence of a single wafer, a single, or a combination of tool activities. A strategy can include a combination of processing measurement activities, pre-adaptation activities, predictive activity, and post-measurement activities. Each part of a strategy (active group) is called a strategy system that is related to a context. Contextual information can be used to associate a given operation with another operation. In particular, contextual information is a data collection plan that matches a process step or process with one or more control strategies. At 220, a capital (control) strategy is determined and implemented based on a process context. The process context can depend on the manufacturing being performed and the tools being monitored. The context determines which strategy and / or a particular process handler should be implemented. For example, to make a control strategy related to a process type (such as "dry cleaning"), the context of the policy is "dry cleaning". In this case, the state of the dynamic sensor is used to obtain relevant information about “dry cleaning”. A data collection (control) strategy can be a retention strategy for the plan and the related plan is to "control" which dynamic sensors are enabled, how the sensors are configured, what data is collected, and how the data is processed. In one embodiment, a process context can be compared and controlled. For example, the AP server 160 (Fig. 1) obtains the current process, a deposition transfer group, a sequence of tools, activities, and animations. In order to combine a use and related materials collection steps and plans, one needs to contain and can be grouped. A strategy of controlling and using is controlled. The following is a string of -21-(19) 200403554. When a "process starts" is compared with the control strategy 'and then identified in this process, the search order is performed by using a superior data query language (s QL After the expression is omitted, an asset plan and a judgment plan are automatically determined, and a set of project ID and data pre-processing plan "execute control strategy" module is also determined. There may be several sequences that match an operation, execute a control strategy at a particular time, and move the strategy up or down the list. When you need to select a strategy, browse down the list until it finds the strategy with the first requirement. A context-based text matching. For example, when performing a wafer context. The top of another square or other semiconductor product can be compared and the control strategy can be executed. One or more control strategies can be executed. The context of the elements can be in a predetermined order and the top and bottom are in a dictionary form. When a set of name pieces occurs. The process context can be compared to a better strategy. May be important. For example, searches may be performed sequentially. Searching can be performed using the method. Once the strategy collection plan is identified, a data pre-processing plan is a motion sensor plan. The data receiving ID and the judgment plan ID are transmitted to the control strategy of the context, but only for a specific processing tool. When the user decides a strategy in a specific context, the software starts from the top of the list to match the execution of the context-determined method. When the context is matched, it can use the current situation. You can also use what is currently being processed. When the context is decided, the text. When a context match is generated, 0 is combined to define the context. For example, an array of contextual elements, or contexts can be paired. -22- (20) (20) 200403554 The context elements used to select and execute a control strategy may include a tool ID, a handler ID, a batch ID, and a material ID. In addition, the following elements can be used: casse 11 e) ID, process module ID, slot ID, processing program start time, processing program stop time, maintenance count, and / or product ID, which indicates the product to be processed kind. When a control strategy is implemented, a data collection plan can be identified, a data pre-processing plan can be identified, and a judgment plan can be identified. Figure 3 shows an example relationship between strategy and plan. For example, a context matching execution software may be used, which allows the setting and invocation of a control strategy. In one case, a wafer entry event can trigger a system controller to query current contextual data, decide which strategy to run, and call a corresponding script to determine related plans. At 230, plans for control strategies can be implemented. One of at least one data collection plan, one data pre-processing plan, and one judgment plan may be executed. In addition, a motion sensor plan, a parameter storage plan, a processing program set point calculation plan, and / or a trimming plan may be executed. The data collected during its manufacturing operations that produce high-quality products can be used to create "good sensor status," data, and data collected thereafter can be compared with this basic data to determine whether a dynamic sensor is Real-time and correct execution. For example, a data collection (control) strategy can be established to determine the dynamic sensor status as part of a quality control (QC) test. A QC control strategy and related plans can be implemented to ensure that its dynamic sensor is appropriate Or to ensure that its motion sensor is set to verify that its processing tools are operating properly. -23- (21) (21) 200403554 A QC control strategy and its related plans can be executed at a specified time or as a User scheduling. When a QC control strategy and related plans are implemented, the motion sensor can be set so that its diagnostic wafer data can be collected. For example, a diagnostic, virtual, product, or test wafer can be Are processed, and the context can be tool, module, or sensor diagnostics. A QC data collection (control) strategy and its related plans can be created for Process module preparation procedures, such as aging related processes. For example, after a cleaning process (ie, wet cleaning), several virtual wafers can use aging related strategies. , Program, and processing program (which may include setting a motion sensor) and are processed. Users can use the strategies and plans that are part of the AP C system, or users can use the APC system to easily and quickly To develop new aging treatment-related control strategies. Users can try a different set of aging treatment data collection plans and dynamic sensors to determine which aging treatment program has the best detection power. Data can be used to further improve process and tool simulation. Dynamic sensors are set when a data collection plan is executed. The data collection plan can include a sensor setting plan. For example, the start and stop times of the sensors It can be determined by the sensor setting plan. The dynamic variables required by the motion sensor can be determined by the sensor setting plan. The handler start event can be determined by Use to tell a sensor to start recording. A wafer entry event can be used to set a sensor. A handler stop event or wafer exit event can be used to tell a sensor to stop recording. Different sensors can be used Use, and different data for product wafers and non-product wafers can be collected. (22) (22) 200403554 The data collection plan also includes a data preprocessing plan that determines how the expected observation parameters should be processed. Wave count, step trimming, threshold, and clipping limit. When performing a data preprocessing plan, time series data can be generated from the original file and stored in the database; wafer summary data can be obtained from time Sequence data generation; and batch summary data can be generated from wafer data. Data collection can be performed while the wafer is being processed. When the wafer completes this process step, a data preprocessing plan can be performed. A data collection plan may be a reusable entity configured by the user for collecting desired data. The sensor plan consists of the configuration of one or more sensors on one or more discrete modules. The plan also includes a selection of data items that should be collected by the relevant sensors, and which data items should be stored. A motion sensor can be a device, instrument, room type, or other entity that collects observational data or requirements The software is set to interact or be manipulated by the system software as if it were a sensor. For example, processing tools and processing modules (rooms) can be treated as if they were sensors in a data collection project. Sensor status can be reported using a tool status screen, a room status screen, and / or a sensor status screen. Sensor status information can be provided to the user. For example, sensor status can include: offline (disabled); and online (logged, idle, error, unselected). If the sensor goes from online to offline, the user can be informed. Several examples of the same sensor type can be installed in a processing system -25- (23) (23) 200403554 at the same time. The user can select a specific sensor or several sensors for each data collection plan. The AP C system reads the sensor settings from the database of the established data collection plan, or uses parameters defined during the setting period. When the motion sensor configuration software cannot set the sensor, the software assumes that its sensor is in the default off state of operation. This is the same action as the DC program requires the sensor to be turned off. The motion sensor configuration software sets an alarm to inform that the process steps have been completed when the motion sensor is turned off. The AP C system can include strategies and plans that have been designed to monitor several different types of tools and related motion sensors. For example, APC systems can interface with motion sensors that operate differently. For example, when a dynamic sensor transmits data in real time, the APC system monitors the data in real time; and when the sensor transmits data non-real time, the AP C system immediately processes the data when the sensor transmits data. APC systems can include strategies, plans, and basic models that can be used to set up motion sensors and classification applications for general error detection, room fingerprinting applications, drying completion applications, wearable life prediction, wet Cleaning applications, and diagnostic applications for component assembly. The APC system provides independent data collection mode and setting mode for each process room; that is, each room can be independent of any other room. The setting of one room will not interfere with the data collection of other rooms. In addition, the APC system provides independent data collection mode and setting mode for each sensor; that is, each sensor can be independent of any other room. The setting of one sensor will not interfere with the data collection of other sensors. When a control strategy includes a judgment plan, then the judgment is performed. This execution may be rule-based and include an SQL statement. An initial interruption plan can be executed after an "start event" occurs, and a judgment plan can be executed after an "end event" occurs. When a start event judgment plan is related to a control strategy, it may be after a start event such as a wafer entry event, a process start event, or a processing program. Initially, the event judgment plan can be part of the alarm management department of a work monitoring system. When an alert occurs, that is, when an error is detected, the plan can send a message and / or instructions to an intervention plan for implementation: display an error message on a status screen, write an error In the message log file, send the next wafer pause message, send the pause pause message, send a warning message to the tool, and email to the tool. For example, a judgment plan can send a message and / or instruction to an intervention using the following sensing Sensor-related actions: Stop using a sensor, state a sensor, recalibrate a sensor, and replace a sensor to determine the plan independently. Each judgment plan will not know the action in the interruption plan. Therefore, due to the results of the entire analysis plan, there may be some redundancy or inconsistencies in the messages transmitted by the judgment plan to resolve any issues. Figure 4 shows one of the strategies and plans. Returning to Fig. 2, in step 2 35, a query can be performed to decide to generate an alert. When an alert occurs, the program 200 branches the plan. Event Judgment and End of Event For example, being executed to start the event status, a judgment, a series of actions, and one in one-record the owner. The plan is to reorganize. 〇 Other judgments are consistent. Refer to the procedure to step -27- (25) (25) 200403554 250. When an alert does not occur, the program 200 branches to step 24. An intervention plan can be performed at step 2 5 0 '. The intervention plan can perform the following procedures: obtain information from each judgment plan (judgment): classify actions from different judgment plans; add process conditions (such as tool id, handler id, handler start time, etc.) in Email and records; store log file database; and / or send appropriate messages to intervention managers. For example, an intervention plan can determine when a motion sensor has failed and / or has caused a failure. Intervention strategies are defined as actions that users choose to take based on data analysis results. For example, 'these actions may include: marking a suspicious wafer or lot and informing a system owner and / or tool owner; calling or sending an email to an engineer to review the data and make a decision; inhibit the sensor from collecting data; The suppression tool processes the wafer until the data has been reviewed and releases its suppression; stopping the tool or adopting the tool "offline" removes the remaining wafers from the tool; and initiates a room cleaning or repair process. After the intervention plan is executed, messages on appropriate actions are transmitted to the intervention manager. The following are optional actions: · Display a sensor error message on a status screen; send a message to pause the process before the next wafer; send a message to pause the process before the next batch; send a pause or stop message to one or more Multiple tools; and / or email the tool owner or process owner. For example, a "Stop," message can be used to tell the tool to stop acquiring data; and a "Stop," message can be used to tell the tool to continue processing wafers already in the tool, and a "Abandon" message can be used to tell the tool not to process the tool Wafer and return it to the carrier. -28- 415 (26) (26) 200403554 In some cases, the tool condition monitoring system will be able to intervene and respond to a problem without human intervention. In other cases Human intervention is required. For example, the user can access data from the tool status monitoring system to determine the nature of the error. The user can intervene 'and the user can decide to continue the batch or terminate the batch. If the user terminates the process , The tool can be changed in the repair state. The user can initiate this action from the tool screen. For example, the motion sensor can be replaced. After the sensor is replaced, checked, and the process is tested, the process can be restarted from the next wafer. During the execution of the intervention plan and analysis plan, the AP C system may present a "sensor-related" chart to the user. For example, the 'chart may include pressure Force gauge data, mass flow data, leak data, pump data, gas system data, and transfer system data. The chart can show real-time data, historical data, and a combination of real-time and historical data from one or more tools. The analysis strategy also It can be executed by the APC system after the execution of the control strategy. Analysis-type strategies, such as error detection and classification (FCD) strategies, define what happens during a set of sequences on the processing tool. An FD C strategy can use a set of analytical tools Draw to "analyze" data after collection; FCE strategies can use group-by-group judgment plans to "determine" a series of actions. For example, SPC charts and multivariate analysis can be used. FCD strategies can define a single wafer, a single tool, a single batch , Or a set of data analysis plans for tool action combinations. Each part of a strategy can be referred to as a plan. A strategy is related to a context. Contextual information can be used to link ~ a given operation to another operation. Clear Locally, contextual information relates a process step or process to one or more strategies and / or plans. Usually -29- (27) (27) 200403554, An analysis strategy can be initiated by an end event and determines a set of post-processing actions. For example, an end event can be a wafer leave event, a batch completion event, or other process completion event. When an analysis is performed In strategy, one or more of the following programs can be executed: a principal component analysis (PCA) program, a partial least squares (PLS) program, a statistical process program (spc), a multivariate analysis (MVA) program, and use The definition plan. The analysis plan includes the mechanism for the detection and classification of sensor problems (when the tool is not engaged in production); the mechanism for the detection of sensor problems during production; the detection and classification of sensor problems during production The mechanism for predicting sensor problems during production; and the mechanism for predicting sensor problems after production. FIG. 5 shows an exemplary diagram of a selection screen according to an embodiment of the present invention. In the embodiment shown, a guide tree with five sub-orders is shown. This is not necessary for the present invention, and any number of secondary orders can be used. On the other hand, other selection mechanisms may be used, such as selection columns or buttons. For example, selection tabs may include left to right tabs, right to left tabs, top to bottom tabs, and bottom to top tabs. In other embodiments, the guide tree can be displayed in different languages and can be sorted and set differently. The first stage shown is a tool stage, but this is not necessary for the present invention. On the other hand, a systematic or other higher-order population may be displayed. For example, a tool stage may be associated with an etching tool, a deposition tool, a cleaning tool, a transfer tool, or other semiconductor processing tools. The next stage shown is a process module stage. The user can open a tool -30- (28) (28) 200403554 level folder to display the status of a process module level. For example, Figure 5 shows an open tool-level folder labeled "TeliusPC" and four process module folders labeled "Process Module 1" to "Process Module 4." The user can open a process module folder to display the status of policies related to a particular process module. The next level shown is the strategy level. The user can open a process module stage to display the status of a strategy stage. For example, Figure 5 shows the open folders labeled "Data Collection Strategy" and "Analysis Strategy". The user can open a strategy folder to display the contents of a particular strategy and the status of the plan. A data collection (control) strategy folder can be opened to display a list of data collection strategies. In the embodiment shown, a single control strategy may be displayed along with the context and plan for a control strategy. Context can be used to summon a specific data collection plan necessary for a specific project, such as a virtual or diagnostic wafer. A specific data collection plan folder can be opened to display one or more data collection plan names. In Figure 5, a single data collection plan called "Intended Plan 1" is shown. The data collection strategy has a relevant data collection plan that describes how the sensor should be configured, and its observation parameters should be collected. A data collection strategy @also linked to a pre-processing plan. A preprocessing project describes how the expected observation parameters are processed in relation to spike counting, step trimming, high clipping, and low clipping limits. From a data collection plan stage, the user can access a sensor configuration stage ° At the sensor configuration stage, the user can install, change, and uninstall a

-31-(29) (29) 200403554 Sensor. In addition, users can generate, edit, and review configuration information for a motion sensor. As shown in FIG. 5, a selection screen may include a title panel, an information panel, and a control panel. For example, the title panel can include the top two columns of a screen. The title panel can include: the company's trademark column to display the version information; the user ID column to display the ID of the current user; the warning message column to display a message when there is an active alert—the current date and time column 'To display the current date and time of the server; the current screen name block' to display the name of the target screen (such as' tool status', only the heart bar throughout the day ') to show the communication between the server and the tool Current status of the link; Tool ID column to display the ID of the tool being monitored; Logout column, which allows the user to log out; Screen selection column, which can be selected to view a list of all available screens. In other embodiments, the title panel can be displayed in different languages and can be scaled and placed differently. FIG. 6 shows an exemplary diagram of a plan information screen according to an embodiment of the present invention, which can be accessed from the data collection plan stage of FIG. 5. In the embodiment shown, an information panel with a selection tab is displayed. The selection tab can be used to select other GUI screens. Alternatively, a navigation tree can be used to display and select other GUI screens. The list of sensor instances can include the list of sensor instances that match the conditions of tool_id, module_id, and §10 names. A 'list can be provided because a sensor type can have many sensor instances. For example, a project called "Intended Project 1" is displayed with information in several fields, but this is not necessary for the present invention. On the other hand, other programs (30) 200403554 and other sensors can be displayed. For example, Langmuir probes, probes, and other types of semiconductor processing probes can be used. The plan name field contains the name of a data collection plan, and the description can include a detailed description of the data collection plan. The tool i d field contains a list of existing tools (tool i d) for selection, and the module i d may include a list of existing process modules (module i d) for selection. The post-use date field can be used to indicate the date of use of this data collection plan. The Save button can be used to save data from this screen to the library. The cancel button can be used to enter the original (internal order) of all fields. The add button can be used to add a selected motion sensor from the right side to the left table. The remove button can be used to remove a Select the type of reactor, from the left table to the right. A confirmation message will be displayed in the upper message window, and an entry will be added back to the right table. The edit button can be used to edit the selected sensor parameters. One of the sensor setting screens is shown in Figure 7. The parameter save button is used to enable the parameter save screen as shown in Figure 10. The save button can be used to update / insert data into the two tables dc__plans and one sensor — dcplan table. Figure 7 shows an example diagram of a sensor setting according to an embodiment of the present invention. In the embodiment shown, an information panel with a selection bar is displayed. The selection bar can be used to select other GUI screen on the other hand, a navigation tree can be used to display and select other screens. A user can configure the screen using sensors, such as the sensor 0ES. Most sense data) owned embodiment, illustrated by the actuator may be a standard screen of the screen. GUI Settings -33- (31) (31) 200403554 screen to review and edit --- related sensor parameters. For example, 'shows two parameters, but this is not necessary for the present invention. The motion sensor can have any number of parameters associated with it. A list of setting items for the selected sensor can be displayed on the screen. The edit button can be used to display the sensor setting item screen as shown in Figure 8. This screen allows the user to modify selected parameters based on a selected valuejype. The sensor setting screen includes an item name field, an item 値 field, a narrative field, and an I s _ 0 p t i ο n a 1 field, which can be used to control access to data. For example, the user can select the parameters for this data collection, if the IS_Optional variable is true. FIG. 8 shows an exemplary diagram of sensor setting items of a data collection plan screen according to an embodiment of the present invention. In the embodiment shown, an information panel with selection columns is displayed. Selection tabs can be used to select other GUI screens. Alternatively, a navigation tree can be used to display and select other GUI screens. A user can use a sensor configuration screen, such as a sensor setting item screen, to configure the parameters of a motion sensor. For example, the information of an "operating frequency" parameter is displayed, but this is not necessary for the present invention. The motion sensor can have any number of parameters associated with it. The screen may include a name field, which may be displayed as a title, and a narrative / instruction / help field to provide instructions and / or help information to the user. The sensor setting item screen can also include a list of item fields and selected item fields. Both are shown as table columns. -34- (32) (32) 200403554 The Save button can be used to save data from this screen to the database. Cancel button can be used to enter the original (default) data of all fields. The Join button can be used to add a selected sensor instance, from the right to the left table. The remove button can be used to remove the selected sensor type from the left column to the right column. A pop-up message window will display a confirmation, and an entry can be added back to the table on the right. The sensor setting item screen provides an easy-to-use mechanism to configure a motion sensor and / or change parameters related to a motion sensor. The example shown shows an indication that a user can be provided with the mode of operation of a particular motion sensor. Instruction messages provide the user with a sense of security and avoid mistakes. Item lists can be provided to users, and buttons can be provided that allow users to move items to and from selected item lists. The sensor setting item (edit) screen of the selected parameter depends on the value_type of the selected parameter. For the example screen, the value_type can be selected. When installing a new sensor or changing an existing sensor on the module, the APC system and sensor installation application can take a module offline. For example, the sensor cable (RS23 2, Ethernet, fiber, etc.) connected to any sensor can be disconnected and reconnected; the network address of a sensor can be changed; the sensor settings can be changed Configuration; and a sensor that can be tested, including manually setting the sensor (that is, manually activating the sensor, monitoring the sensor data in real time, stopping the sensor, storing the sensor data collected as a file, And storing the sensor as a file) without interrupting the operation of other modules. FIG. 9 shows another example of a sensor setting item according to an embodiment of the present invention. (35) (33) (33) 200403554 screen. In the illustrated embodiment, the ' Way is an information panel with a selection bar. The selection bar can be used to select other GUI screens. Alternatively, a navigation tree can be used to display and select other GUI screens. A user can use a sensor configuration screen, such as a sensor setting item screen, to configure the parameters of a dynamic sensor. The screen may include a name field, which may be displayed as a title, and a narrative / instruction / help field to provide instructions and / or help information to the user. The sensor setting screen can also include several fields to provide a frame. This figure shows a default setting field, an insertion setting field, a minimum limit field, a maximum limit field, and a selected item field. They are all displayed as tables. The Save button can be used to save data from this screen to the database. Cancel button. Can be used to enter the original (default) data of all fields. The sensor setting screen provides a mechanism for configuring a motion sensor and / or changing parameters related to a motion sensor. The example shown shows that one user can be instructed to insert one of the "MF sample times", while the other fields provide information that makes the selection less error-prone. Extra fields provide security concepts to users and avoid mistakes. The sensor setting item (edit) screen of the selected parameter may depend on the value_type of the selected parameter, and for the screen, its value_type may be an integer. FIG. 10 shows an exemplary diagram of a parameter storage screen according to an embodiment of the present invention. In the illustrated embodiment, an information panel with a selection bar is displayed. Selection tabs can be used to select other GUI screens. On the other hand, a navigation tree can be used to display and select other GUI screens.

-36- (34) (34) 200403554 Act. A user can use a sensor configuration screen, such as a parameter storage screen, to determine the dynamic sensor parameters that should be stored in the database. The parameter storage screen displays a parameter list of a selected sensor instance in a selected data collection plan. The database storage plan is provided with a link to each parameter in the parameter storage screen. The parameter storage screen can include a list of items for the selected sensor, which contains the name of the selected sensor setting item. The parameter storage screen can also include an edit button that enables the panel; a join button that can be used to add a new parameter name using a specific formula; and a summary information button. The summary information button can be used to select a parameter for storage and enable the screen shown in Figure 11. The Cancel button can be used to load the original into all fields, and the Save button can be used to save the selection of check boxes in the m_valiie table. The listed items include parameter names, new parameter names, formulas, and save selection check boxes. FIG. 11 shows an exemplary diagram of a formula information screen according to an embodiment of the present invention. In the illustrated embodiment, an information panel with a selection bar is displayed. The formula information screen provides a formula editor related to selected parameters of a motion sensor. For example, the user can assign a new parameter name to an existing parameter in the new parameter name field. The parameter name field displays the original name of the parameter. A stored plan parameter field may contain a list of parameters in the selected data collection plan. An Add button can be used to add selected saved plan parameters from the drop-down box to the formula description field. The save button can be used to save information to a r u η __ v a 1 U e table. The software performs a formula check and decides whether the specified parameter name -37- (35) (35) 200403554 is said to be unique. The Cancel button can be used to cancel its changes. The save checkbox can be used to select the parameters of the data collection plan and also enables the screen shown in Figure 12. FIG. 12 shows an exemplary diagram of a parameter collection information screen according to an embodiment of the present invention. In the illustrated embodiment, an information panel with selection columns is displayed. The parameter collection information screen provides a mechanism for editing summary data collection information about selected parameters of a motion sensor. For example, the parameter collection information screen may include a name field that displays the selected parameter name. The new button enables the right field for input; the edit button can be used to enter in the right field. Set points, percentages, and absolute check boxes are used to select one of these data collection types for the parameters in the data collection plan. Threshold threshold, low spike, high spike, and clipping check boxes are used to select one or more of these data preprocessing items and enable corresponding text fields. The save button can be used to store information from the right field in the param_limits table. The Cancel button can be used to cancel its changes. The sensor type may be a general term corresponding to the function of the sensor. A sensor instance pairs the sensor type to a specific sensor on a process module (room) and tool. At least one sensor instance is configured for each actual sensor which is mounted to a tool. The sensor type can include all the variables required for a particular sensor type for which it sets the operating time. These variables can all be static (that is, all sensors of this type have the same 値), configurable by the instance (ie, each instance of the sensor type can have a unique 値), or can be provided by- 38- (36) (36) 200403554 The material collection program is configured (ie, each time the sensor is activated at the operating time, it can be provided with a different pump). For example, the "configurable by example" variable can be the probe IP address. This address varies from instance to instance (for each process room) but does not vary from operation to operation. "It can be configured by the data collection plan, and the variable can be a list of the harmonic frequencies of the probe. This sensor can be dynamic, and its variable can be configured according to one of the context's processes. For example, the process context information can be Contains tool ID, module ID, slot ID, handler ID, cassette ID, start time and end time. Applications that are connected to motion sensors are flexible and configurable. For example, such as IP address, tool ID The information that depends on the consumer can be system-dependent, and after the consumer or field engineer configures its settings, the information can be used at the next startup. The motion sensor application can operate on several different Operating systems, such as Windows NT and Windows 2000. Function buttons can be set along the bottom and / or top of the GUI screen. Because the same function buttons are displayed on many screens, users can navigate from any screen to any Functions without going through a series of menus. A logout button can be displayed in the title panel and it is used to log out of the system. A reminder message can be provided when the information has been modified or When stored. In addition, a 'help button can be displayed' and it can be used with content specific or general documents to help users understand the information they are presented to users and / or the information requested by users. Based on the above teachings, various modifications and changes of the present invention can be produced. Therefore, it should be understood that the present invention can be implemented in a manner other than those specifically described herein within the scope of the appended patent application. -39- (37) ( 37) 200403554 [Brief description of the drawings] The following drawings (which are incorporated into and constitute a part of the description) illustrate the embodiment of the invention, and cooperate with the general description above and the detailed description below to explain the present invention. A more complete understanding of the present invention will be obtained by referring to the following detailed description, especially when the accompanying drawings are taken into consideration to consider the temple, where: Figure 1 shows a simplified block diagram of an advanced process control (APC) semiconductor manufacturing system According to an embodiment of the present invention; FIG. 2 shows a simplified diagram of a flowchart for monitoring a processing tool in a semiconductor processing system. An embodiment of the invention; FIG. 3 shows an exemplary relationship diagram between a strategy and a plan, according to an embodiment of the present invention; FIG. 4 An irregular flowchart between a strategy and a plan, according to an embodiment of the present invention Figure 5 shows an exemplary diagram of a selection screen according to an embodiment of the invention; Figure 6 shows an exemplary diagram of the data collection plan information screen according to an embodiment of the invention; Figure 7 shows according to the invention An exemplary diagram of a sensor setting screen according to an embodiment; FIG. 8 shows an exemplary diagram of a secondary screen of a data collection plan according to an embodiment of the present invention. 'This data collection plan defines a harmonic based Sensor setting of a sensor; FIG. 9 shows an exemplary setting diagram of a sensor setting item -40- (38) (38) 200403554 according to an embodiment of the present invention, and another exemplary display screen of the secondary screen of the exposure time; 10 shows an exemplary diagram of a parameter storage screen according to an embodiment of the present invention; FIG. N shows an exemplary diagram of a formula information screen according to an embodiment of the present invention; and FIG. 12 shows an exemplary diagram of a formula information screen according to an embodiment of the present invention; One implementation One exemplary illustration of parameters used to collect information firefly screen, this screen parameter information collection system for using a dynamic set point drive type of filtration process. Main component comparison table 100 Semiconductor manufacturing environment 10 5 Factory system 110 Semiconductor processing tools 115 E-diagnosis system 120 Process module 130 Sensor 140 Sensor interface 145 APC system 15 0 Interface server 160 APC server 170 Client workstation 180 GUI component 19 0 Database

Claims (1)

200403554 Π) Patent application scope 1. A method of using graphic user interfaces (GUIs) to set a motion sensor in a semiconductor processing environment, the method includes: performing a data collection plan; using the data collection plan to Determine a motion sensor setting plan; run a motion sensor setting plan to set the motion sensor. 2. The method according to item 1 of the patent application scope, further comprising: using a plan list GUI screen to determine a data collection plan; and using a plan GUI screen to determine one of the motion sensor plans selected motion sensing Device instance. 3. The method according to item 2 of the patent application scope, further comprising: selecting a motion sensor instance from a list of sensor instances on the plan GUI screen; and adding the selected motion sensor instance to the selected list of the plan. Instance. 4. The method according to item 2 of the patent application scope, further comprising: selecting a motion sensor instance from the selected instance of the schedule on the plan GUI screen; and moving the selected dynamic from the selected instance of the schedule Sensor instance to sensor instance list. 5. The method of claim 1 further comprising: using a multi-level guide tree on a selection GUI screen to select a data collection plan. 6. The method according to item 5 of the patent application scope, wherein the multi-level guide tree-42- (2) (2) 200403554 includes a tool level, a module level, a strategy level, a context level, and a Data collection plan stage. 7. The method according to item 6 of the scope of patent application, wherein the strategy stage includes a control strategy stage and an analysis strategy stage. 8. The method according to item 5 of the patent application, wherein the selection GUI screen includes at least one from English multi-level guide tree, Japanese multi-level guide tree, Taiwanese multi-level guide tree, Chinese Multi-level guide tree, Korean multi-level guide tree, German multi-level guide tree, and French multi-level guide tree. 9. The method according to item 5 of the patent application, wherein the selection GUI screen includes a title panel, an information panel, and a control panel. 10. The method according to item 9 of the scope of patent application, wherein the title panel includes: a company trademark block to display version information, a user ID block to display the current user ID, and a warning message block, To display a warning message, a current date and time block when there is an active alert, to display the current date and time of the server, a current screen name block to display the current screen name, and a communication status area Block to display the current status of the communication link between the server and the tool, a tool ID block to display the ID of the tool being monitored, a logout block to allow the user to log out, and a choice Screen section to see a list of all available screens. 1 1 · The method according to item 9 of the patent application scope, wherein the control panel includes a tool status button, a module button, a chart button, a warning button, an SP button, a control setting button, and a help button. (3) (3) 200403554 1 2. If the method in the scope of patent application is the second item, further use a plan list GUI screen to determine the collection plan. This plan list GUI screen contains at least one from the English screen, Japanese screen, Taiwanese screen, Chinese screen, Korean screen, German screen, and French screen screens. 03. For the method of the first scope of the patent application, the GUI includes at least one screen, which contains the To the right tab, right to left tab, top to bottom tab, and bottom to top tab of the selection group of the group. 14. The method according to item 2 of the scope of patent application, further comprising: using a plan list to select a tab on the GUI screen to select a data collection plan. 15. The method according to item 2 of the scope of patent application, further comprising using a sensor to set the GUI screen to determine at least one setting parameter of its selected dynamic sensor instance. 16. The method according to item 15 of the scope of patent application, further comprising: selecting an instance of a motion sensor on the project GUI screen; triggering a part of the project GUI screen to activate a sensor setting GUI screen; and identifying the selected screen Setting items of the motion sensor instance. 17. The method according to item 15 of the scope of patent application, further comprising: selecting an instance of a motion sensor on the project GUI screen; triggering a part of the project GUI screen to activate a parameter storage screen, and identifying its parameter positive Is stored. -44-(4) (4) 200403554 1 8. The method according to item 16 of the patent application scope further includes: selecting a sensor to set a dynamic parameter on the GUI screen; triggering the sensor to set a part of the GUI screen to start a Sensor setting item GUI screen; and selected item identifying the selected dynamic parameter. 19. The method according to item 18 of the scope of patent application, further comprising: selecting an item from an item list on a sensor setting item GUI screen; and adding the selected item to the selected item list of the selected motion sensor. 20. The method according to item 18 of the scope of patent application, further comprising: selecting an item from a selected item list of a selected motion sensor on a sensor setting item GUI screen; and a selected item list from a selected motion sensor Remove selected items. 2 1. The method according to item 18 of the scope of patent application, further comprising: selecting a field from most fields of the dynamic parameters on the GUI screen of the sensor setting item; modifying the selected field; and saving the modified field Dynamic parameters. 2 2. The method according to item 2 of the scope of patent application, further comprising: activating a parameter storage screen; and identifying that the correct dynamic parameters are being stored. 2 3. The method according to item 2 of the scope of patent application, further comprising: activating a parameter collection information screen; and identifying that the type of data collection used for the stored dynamic parameters is correct -45- (5) (5) 200403554 24. The method according to item 2 of the patent application scope, further comprising: activating a formula information screen; entering a new parameter name; and using a formula that includes at least one of the set parameters of the selected sensor instance to generate a new dynamic parameter . 25. The method of claim 2 further includes implementing a control strategy to determine a data collection plan. 26. The method according to item 25 of the scope of patent application, further comprising using a process context to determine a control strategy. The process context depends on at least one process in progress, an instance of a dynamic sensor, a processing module under monitoring, and one One of the tools in surveillance.