200305515 玖發朋說明 【發明所屬之技術領域】 本發明係關於搭載於電子照相印表機上，藉由透鏡陣列 將發光元件陣列的出射光集光而投影於感光體上的光寫 頭。 【先前技術】 電子照相印表機，係藉由寫入頭曝光感光磁鼓以形成潛 像，藉由增色劑對該潛像予以顯像，並將該增色劑轉寫於 紙上，藉由熱等將增色劑固定在紙上以執行印刷。 藉由寫入頭曝光感光磁鼓的步驟，被分爲led光學系及 雷射光學系。LED光學系的寫入頭係通過正像等倍棒狀透 鏡陣列將LED的發光能曝光於感光磁鼓。 圖1爲搭載於習知電子照相印表機的寫入頭（光寫頭）的 與頭長度方向垂直的方向的剖面圖。在該光寫頭中，發光 元件組裝基板4 0上，沿著掃描方向組裝著行狀配置發光元 件的多個LED晶片（發光元件陣列晶片）42,在該LED晶片 42的發光元件所發光的光軸上，藉由殼體（樹脂蓋）46固定 著正像等倍棒狀透鏡陣列44。正像等倍棒狀透鏡陣列44 的上方設有感光磁鼓48。此外，發光元件組裝基板40周 圍的角部係繫合著殻體46的腳部前端。又，發光元件組裝 基板40的襯底上設有散發LED晶片42的熱用的散熱片 5 0,殼體46及散熱片50間夾著發光元件組裝基板40且藉 由固定件5 2固定。 正像等倍棒狀透鏡陣列44係將LED晶片42的發光元件 5 312/發明說明書(補件)/92-06/92105 870 200305515 的光予以集光，曝光感光磁鼓4 8而於感光磁鼓4 8的表面 形成潛像。 該正像等倍棒狀透鏡陣列44的析像度，無法充分滿足 高析像度的光寫頭的使用。爲此，如日本專利特開 2 0 00-22 1 445號公報所揭示，提出使用正像等倍的積層樹 脂透鏡陣列來取代正像等倍棒狀透鏡陣列，以提升析像度 的光寫頭的方案。 但是，用於高析像度的光寫頭的正像等倍透鏡陣列，其 作動距離（發光點與透鏡入射面間的距離）非常短，現在所 使用的透鏡的允許作動距離，考慮到其誤差而在1 00 // m 以下。爲此，光寫頭具有提高發光位置及透鏡間的距離精 度，以防止成像位置上的焦點模糊引起的印字品質的下降 的必要。此外，還有防止感光磁鼓上的成像焦點模糊引起 的印字品質的下降的必要。 據此，使用積層樹脂透鏡陣列的習知光寫頭，爲了要求 以高平坦度配置透鏡陣列及發光元件，且，以高距離精度 配置透鏡陣列及發光元件，有以非常高的精度加工散熱片 的發光元件組裝基板搭載面及殼體的透鏡陣列搭載面的必 要。此外，有進行發光點及透鏡陣列的位置定位的步驟的 必要，因而招致構成零件數的進一步增加，使得頭的製造 成本上升。 【發明內容】 本發明之目的在於，提供搭載可低價格高品位的印字的 透鏡陣列的光寫頭。 6 312/發明說明書(補件)/92-06/92105870 200305515 本發明之光寫頭，其特徵爲：具備基板，組裝著發光元 件陣列；透鏡陣列，配置在發光元件陣列的發光元件所發 出光的光軸上；及支持機構，支持著基板及透鏡陣列；其 中支持機構係沿著光寫頭長度方向形成凹部，在凹部之長 度方向兩側面沿著長度方向形成突出部，又’在凹部的底 面，在基板的發光元件陣列的正下方部分的位置，沿著光 寫頭長度方向形成突起部，基板係在突起部的上端面及形 成在凹部的兩側面的突出部的下端面而被支持於支持機 構。 透鏡陣列最好被支持在突出部的上端面，此外，突起部 的前端上面及突出部的下端面的間隔X最好爲如下大小。 (基板厚度- 〇.5mm) S 基板厚度 此外，突起部最好於光寫頭長度方向全長形成爲連續或 是不連續，突起部剖面形狀最好爲半圓形、矩形、梯形或 是楔形。 支持機構最好由鋁擠壓材料所形成。此外’支持機構具 備定位於長度方向端面位置部分的定位機構’基板最好藉 由將基板的端面頂接於定位機構以進行基板的長度方向的 定位，又，支持機構最好於長度方向端面位置部分具備備 有不干涉基板及電信號的取入機構的構造的側罩。 此外，支持機構最好於下部具有缺口，而對基板取入電 信號用的配線係從缺口取出。 又，透鏡陣列最好爲積層樹脂透鏡陣列或是棒狀透鏡陣 列，發光元件陣列最好爲自掃描型發光元件陣列° 7 312/發明說明書(補件)/92-06/92105870 200305515 【實施方式】 以下，參照圖式說明成爲本發明之實施形態。 圖2爲顯示本發明之光寫頭的實施形態的局部立體圖， 圖3A爲在圖2所示光寫頭之長度方向中央部的相對長度 方向垂直的方向的剖面圖，圖3B爲圖2所示光寫頭之局 部前視圖。 如圖2所示，殻體10(支持機構）具有支持積層樹脂透鏡 陣列1 2及發光元件組裝基板1 4的構造。 積層樹脂透鏡陣列1 2，係將3片表面以指定間距規則性 地排列微小的凸透鏡的透明平板狀的樹脂透鏡陣列重疊而 構成。 發光元件組裝基板1 4，係在相對於光寫頭之長度方向 (掃描方向）垂直的中央部，沿著長度方向組裝著LED晶片 1 6。此外，發光元件組裝基板1 4具備於長度方向的一端側 取入電信號用的連結器1 8及連接連結器1 8的扁平纜線（配 線）2 0 〇 如圖3 A所示，殻體1 0係沿著光寫頭長度方向形成凹部 1 1，在凹部1 1的長度方向兩側面，沿著長度方向形成突出 部1 3。此外，在凹部1 1的底面，在爲LED晶片1 6正下 方部分的位置，沿著長度方向形成突起部24。發光元件組 裝基板1 4係在該突起部24的前端面及形成於凹部1 1的兩 側面的突出部1 3的下端面的3點，支持於殼體1 0上。積 層樹脂透鏡陣列1 2係以使從LED晶片1 6的發光點至積層 樹脂透鏡陣列1 2的透鏡入射面爲止的距離成爲指定的距 8 312/發明說明書(補件)/92-06/92105870 200305515 離的方式’而由突出部i 3的上端面的搭載面22所支持。 殼體1 〇係由鋁等的非鐵金屬所構成。本實施形態中， 殻體1 〇因爲在光寫頭長度方向爲相同剖面形狀，因此，以 使用可廉價成形形狀的鋁擠壓材料爲佳。此外，突起部2 4 的前端上面係以高平坦性施以切削加工。 Η 4爲由端銑刀（刃物）加工頂接於殼體的發光元件組裝 基板的面時的狀態的圖。殼體1 〇對於發光元件組裝基板 14的頂接面，需要高平坦性。但是，如圖4所示，即使藉 由端銑刀（刃物）34欲以高平坦度加工頂接於殻體的發光元 件組裝基板1 4的面，仍會產生端銑刀（刃物）3 4的切削殘 留部分的下切割部3 6，事實上以高精度進型機械加工的情 況並不可能。據此，本實施形態中，在，在發光元件組裝 基板1 4的發光元件的正下方部分設置突起部，僅在其前端 部的下面施以切削加工，即可提升加工精度。 發光元件組裝基板1 4，係由高精度而被加工其基板的厚 度，此外，頂接積層樹脂透鏡陣列1 2的搭載面也可以高精 度進行機械加工，因此，只要以高精度切削加工突起部24 的前端上面，將發光元件組裝基板1 4安裝於突起部24上， 即可以高精度配置LED晶片1 6及積層樹脂透鏡陣列1 2。 如上所述，殼體1 0雖在頂接積層樹脂透鏡陣列1 2的搭 載面2 2及頂接發光元件組裝基板1 4的面要求高平坦性及 距離精度，但是，藉由在擠壓成形材料的必要部分實施切 削加工即可獲得高精度化。 圖5爲圖3 A的A部放大圖。發光元件組裝基板1 4的下 9 312/發明說明書(補件)/92-06/9210587〇 200305515 面接觸突起部24的前端上面，發光元件組裝基板1 4的上 面接觸突出部13的下端面。若突起部24的前端上面及突 出部1 3的下端面的間隔X小，則在將發光元件組裝基板 14支持固定於殼體10時，發光元件組裝基板14產生過大 的翹曲，由此於發光元件上產生應力，而會有發光不良等 的不良現象。據此，間隔X以如下條件設定爲佳。 (基板厚度- 0.5 mm 基板厚度 將發光元件組裝基板1 4安裝於殼體1 0之作業，係藉由 將搭載LED晶片1 6的發光元件組裝基板1 4，從未具有電 信號取入機構側壓入殼體1 0而進行。發光元件組裝基板 1 4也可使用玻璃環氧基板、金屬基板等。 當將發光元件組裝基板14插入殼體10時，因爲殼體10 的間隔X較發光元件組裝基板1 4的基板厚度窄，因此， 發光元件組裝基板14產生翹曲，藉由該翹曲而在發光元件 組裝基板1 4及殻體1 0的接觸部分發生荷重，藉尤其摩擦 力將發光元件組裝基板1 4固定於殼體1 0。 據此，本發明之光寫頭在將發光元件組裝基板1 4安裝 於殻體1 0時，不需要黏接劑等的固定機構，因而可省略製 造步驟。此外，突起部24的前端上面係以高精度切削加 工’發光元件組裝基板14上面的LED晶片16的高精度， 係模仿殼體1 〇的突起部24的形狀，因此可提升LED晶片 1 6的發光元件的排列的平坦度。 又，在將光寫頭搭載於電子照片印表機時，電子照片印 表機的感光磁股1 5係設於積層樹脂透鏡陣列1 2的上方。 10 312/發明說明書(補件)/92-06/92105870 200305515 圖6爲顯示不具有電信號取入機構側的頭的端面部分的 立體圖。發光元件組裝基板1 4的長度方向的定位’如圖6 所示，也可在不具備電信號的取入機構側的光寫頭的端面 位置部分，使定位銷（定位機構）3 8從殻體1 0側突出’使 發光元件組裝基板1 4的端面突頂接於定位銷3 8。 此外，在將發光元件組裝基板1 4插入殼體1 〇後’如圖 2及圖3 B的虛線所示，也可在光寫頭的端部安裝具有安裝 於殼體1 〇的構造及不干涉發光元件組裝基板1 4及電信號 的取入機構的構造的側罩3 0，藉以進行光寫頭的端部的絕 緣及封裝。 該情況，側罩3 0具有側面備有突起狀的繫止部的固定 件26，藉由將該固定件26的繫止部嵌合於殼體1 〇的側面 所設的溝2 8，即可將側罩3 0安裝於光寫頭的端部。此外， 側罩3 0也可具備在將光寫頭組裝入電子照片印表機時用 作感光磁鼓的位置對準的基準的基準銷3 2。 又，殼體1 〇也可使用混入塡料以使強度提升的樹脂材 料。在殻體1 〇爲樹脂等的絕緣體時，爲了減低殼體1 〇及 感光磁鼓的電位差，也可於殼體10的表面設置導電膜。此 外，也可以導電性材料製作樹脂本身。 在殻體1 〇之凹部1 1的底面，突起部24的剖面形狀最好 爲半圓形、矩形、梯形或是楔形。此外，突起部也可設爲 沿著光寫頭長度方向全長形成爲連續，也可設爲不連續。 此外，上述實施形態中，係將取入電信號用的連結器 1 8，配置在L E D晶片1 6的搭載側的發光元件組裝基板1 4 11 312/發明說明書(補件)/92-06/92105870 200305515 的基板表面側，但是也可配置在基板的背面側。 示將連結器配置於發光元件組裝基板的基板背面 連結器的部位切斷的狀態的剖面圖。 又，如圖7所示，殼體爲在通過扁平纜線的部 口 19,通過缺口 19而可從殼體下方插入扁平纜,¾ 圖8爲可從殻體下插入附設扁平纜線的連結器的 體圖。也可從殼體下通過缺口 1 9插入附設扁平纜 器（未圖示），在發光元件組裝基板（未圖示）的連I 部位固定連結器。 此外，上述實施形態中，說明了將積層樹脂透 於正像等倍棒狀透鏡陣列的光寫頭的情況，本發 於殼體的基板安裝固定方法，也可適用於將圖1 透鏡陣列4 4安裝於圖5的搭載面2 2的光寫頭。 可適用於掃描器等的光讀頭。 此外，上述實施形態中，也可將自掃描型發光 用於LED晶片。又，自掃描型發光元件陣列係指 描電路，具有順序傳輸發光點的功能的發光元件 關於自掃描型發光元件陣列，在日本專利特開 1-238962號公報、特開平2-14584號公報、特開平 號公報、特開平2- 926 5 1號公報等’揭示有作爲 用光源而在組裝上簡便的情況、可將發光元件間 的情況及可製作小型印表機頭的情況等。此外’ 開平2 - 2 6 3 6 6 8號公報中，提出有將傳輸元件陣列 部，而與發光部的發光元件陣列隔離的構造的自 312/發明說明書(補件)/92-06/92105870 圖7爲顯 側，而在 位具有缺 良的構成。 殻體的立 線的連結 吉器連接 鏡陣列用 明之安裝 所示棒狀 此外，也 元件陣列 內建自掃 〇 平 :2-92650 印表機頭 隔微細化 在曰本特 作爲移動 掃描型發 12 200305515 光元件陣列。 圖9顯示將移動部及發光部隔離的構造的自掃描型發光 元件陣列晶片的等效電路圖。移動部具有傳輸元件T !、 Τ2、Τ3、…，發光部具有寫入用發光元件Ll、L2、L3、…。 此等傳輸元件及發光元件，係由3端子發光矽控整流器所 構成。移動部的構成爲使用二極體D ^ D 2、D 3、…以便相 互電性連接傳輸元件的閘。Vgk爲電源（通常爲5 V)，經由 負載電阻Rl與各傳輸兀件的聞極Gi、G2、〇3、…連接。 此外，傳輸元件的閘極G!、G2、G3、…也連接於寫入用發 光元件的閘極。傳輸元件T !的閘極上施加有起動脈衝Φ s， 傳輸元件的陽極電極上施加有交錯傳輸用時脈脈衝Φ 1、Φ 2，寫入用發光元件的陽極電極上施加有寫入信號Φ!。 又，圖中，Rl、R2、Rs、Ri分別顯示電流限制電阻。 簡單說明動作。首先，傳輸用時脈脈衝φ 1的電壓爲Η 位準，且傳輸元件Τ2爲導通狀態。此時，閘極G2的電位 從VGK的5V降爲大致0V。該電位下降的影響係藉由二極 體D2傳輸至閘極G3，該電位約設定在1 V(二極體D2的順 方向上升電壓（等於擴散電位））。但是，因爲二極體D!爲 反偏向狀態，因此不進行對於閘極G,的電位連接，於是閘 極G!的電位仍成爲5V。因爲發光矽控整流器的導通電壓 近似於閘極電位+pn接面的擴散電位（約IV)，因此，只要 將下一傳輸用時脈脈衝φ 2的Η位準電壓設定約爲2V(導 通傳輸元件Τ3所需要的電壓）以上，且約4V(導通傳輸元 件Τ5所需要的電壓）以下，即可單單導通傳輸元件Τ3，此 13 312/發明說明書(補件)/92-06/92105870 200305515 以外的傳輸元件可就此爲截止狀態。據此’由2根傳輸用 時脈脈衝傳輸著導通狀態。 起動脈衝Φ s係爲開始如此之傳輸動作用的脈衝’將起動 脈衝Φ S設爲Η位準（約爲0 V)’同時’將傳輸用時脈脈衝 Φ 2設爲Η位準（約爲2 V〜4 V )，使傳輸元件Τ !導通。此後’ 起動脈衝Φ s立即返回Η位準。 此時，當傳輸元件Τ2爲導通狀態時，閘極G2的電位約 成爲0V。據此，若寫入信號Φ !的電壓爲pn接面的擴散電 壓（約爲IV)以上，即可使發光元件L2爲發光狀態。 相對於此，閘極G1約爲5 V，閘極G 3約爲1V。據此’ 發光元件的寫入電壓約爲6V，發光元件L3的寫入電壓 約爲2V。此後，僅寫入發光元件L2的寫入信號φ !的電壓 爲1〜2V的範圍。當發光元件L2導通，亦即進入發光狀 態時，發光強度由流動於寫入信號Φ I的電流量所決定，於 任意強度即可進行畫像的寫入。此外，爲將發光狀態傳輸 給發光元件，有暫時將寫入信號Φ !的在線電壓降爲0V， 而使發光中的發光元件暫時截止的必要。 (產業上的可利用性） 如上述說明，本發明之光寫頭，係藉由減少光寫頭的構 成零件數，來實現製造成本的降低。如圖1所示，習知光 寫頭必須要有殼體、散熱片及固定件的3個零件，但是， 上述光寫頭只需以1個殼體來取代此等，因此，可大幅減 少零件數。200305515 Explanation of the present invention [Technical field to which the invention belongs] The present invention relates to an optical writing head mounted on an electrophotographic printer and collecting light emitted from a light-emitting element array by a lens array and projecting the light onto a photoreceptor. [Prior art] An electrophotographic printer uses a writing head to expose a photosensitive drum to form a latent image, develops the latent image with a toner, and transfers the toner to paper. The toner is fixed on the paper to perform printing. The step of exposing the photosensitive drum by the write head is divided into a led optical system and a laser optical system. The writing head of the LED optical system exposes the light-emitting energy of the LED to the photosensitive drum through an equal-magnification rod lens array. Fig. 1 is a cross-sectional view of a writing head (optical writing head) mounted on a conventional electrophotographic printer in a direction perpendicular to the longitudinal direction of the head. In this optical writing head, a plurality of LED chips (light-emitting element array wafers) 42 in which light-emitting elements are arranged in a row are mounted on a light-emitting element assembly substrate 40 along a scanning direction, and light emitted from the light-emitting elements of the LED wafer 42 On the axis, an orthographic equal-magnification rod lens array 44 is fixed by a case (resin cover) 46. A photosensitive drum 48 is provided above the positive-magnitude equal-magnitude rod lens array 44. The corners around the light-emitting element assembly substrate 40 are connected to the front ends of the legs of the case 46. A light-emitting element assembly substrate 40 is provided on the substrate of the light-emitting element assembly substrate 40, and a heat sink 50 for emitting heat from the LED chip 42 is sandwiched between the case 46 and the heat-sink fin 50 and fixed by a fixing member 52. The positive-magnification equal-magnitude rod lens array 44 collects light from the light-emitting element 5 312 of the LED chip 42 / Invention Specification (Supplement) / 92-06 / 92105 870 200305515 and exposes the photosensitive drum 4 8 to the photosensitive magnet. The surface of the drum 48 forms a latent image. The resolution of this orthographic equal-magnitude rod lens array 44 cannot sufficiently satisfy the use of a high-resolution optical writing head. For this reason, as disclosed in Japanese Patent Laid-Open No. 2 00-22 1 445, it is proposed to use a laminated resin lens array of equal magnification for positive images instead of a rod lens array of equal magnification for positive images, in order to improve the resolution of optical writing. Head scheme. However, the working distance (the distance between the light-emitting point and the incident surface of the lens) of an ortho-equivalent lens array used in a high-resolution optical writing head is very short. The allowable operating distance of the lenses currently used, considering its The error is below 1 00 // m. For this reason, it is necessary for the optical writing head to improve the accuracy of the light emitting position and the distance between the lenses, in order to prevent the deterioration of the printing quality caused by the focus blur at the imaging position. In addition, it is necessary to prevent degradation of print quality caused by blurring of the imaging focus on the photosensitive drum. Accordingly, in the conventional optical write head using a laminated resin lens array, in order to arrange a lens array and a light emitting element with a high degree of flatness, and to arrange a lens array and a light emitting element with a high distance accuracy, there is light emission in which a heat sink is processed with very high accuracy. The component mounting substrate mounting surface and the lens array mounting surface of the housing are necessary. In addition, it is necessary to perform a step of positioning the light emitting points and the lens array, and therefore, the number of constituent parts is further increased, which increases the manufacturing cost of the head. SUMMARY OF THE INVENTION An object of the present invention is to provide an optical write head equipped with a lens array capable of printing at a low price and high quality. 6 312 / Invention Specification (Supplement) / 92-06 / 92105870 200305515 The optical write head of the present invention is characterized in that: it is provided with a substrate, which is assembled with a light-emitting element array; a lens array, which emits light from a light-emitting element arranged in the light-emitting element array On the optical axis; and a supporting mechanism supporting the substrate and the lens array; wherein the supporting mechanism forms a recessed portion along the length direction of the optical writing head, and a protruding portion is formed along the length direction on both sides of the lengthwise direction of the recessed portion, and On the bottom surface, a protrusion is formed along the length of the optical writing head at a position directly below the light emitting element array of the substrate. The substrate is supported on the upper end surface of the protrusion and the lower end surface of the protrusion formed on both sides of the recess. To support organizations. The lens array is preferably supported on the upper end surface of the protruding portion, and the distance X between the upper surface of the front end of the protruding portion and the lower end surface of the protruding portion is preferably as follows. (Substrate thickness-0.5mm) S Substrate thickness In addition, it is preferable that the protrusions are formed continuously or discontinuously along the entire length of the optical writing head, and the protrusions are preferably semicircular, rectangular, trapezoidal, or wedge-shaped in cross section. The support mechanism is preferably formed from an aluminum extruded material. In addition, the 'support mechanism has a positioning mechanism positioned at the end surface position portion in the longitudinal direction'. The substrate is preferably positioned in the longitudinal direction of the substrate by pressing the end surface of the substrate against the positioning mechanism, and the support mechanism is preferably positioned at the end surface in the length direction. Some are equipped with a side cover with a structure that does not interfere with the substrate and the electrical signal take-in mechanism. In addition, it is preferable that the supporting mechanism has a notch in the lower portion, and the wiring for taking in electrical signals to the substrate is taken out from the notch. In addition, the lens array is preferably a laminated resin lens array or a rod lens array, and the light-emitting element array is preferably a self-scanning light-emitting element array. 7 312 / Invention Specification (Supplement) / 92-06 / 92105870 200305515 [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 2 is a partial perspective view showing an embodiment of the optical writing head of the present invention, FIG. 3A is a cross-sectional view in a direction perpendicular to the longitudinal direction of the central portion of the longitudinal direction of the optical writing head shown in FIG. 2, and FIG. Partial front view of the optical write head. As shown in FIG. 2, the case 10 (supporting mechanism) has a structure that supports the laminated resin lens array 12 and the light-emitting element assembly substrate 14. The laminated resin lens array 12 is constituted by stacking three transparent resin lens arrays in which minute convex lenses are regularly arranged on a surface at a predetermined pitch. The light-emitting element assembly substrate 14 is a central portion perpendicular to the longitudinal direction (scanning direction) of the optical write head, and the LED chip 16 is assembled along the longitudinal direction. In addition, the light-emitting element assembly substrate 14 includes a connector 18 for taking in electric signals at one end side in the longitudinal direction and a flat cable (wiring) 2 0 connecting the connector 18. As shown in FIG. 3A, the housing 10 is a recessed part 11 formed along the longitudinal direction of the optical writing head, and protruding parts 13 are formed along the longitudinal direction on both side surfaces of the recessed part 11 in the longitudinal direction. In addition, on the bottom surface of the recessed portion 11, a protruding portion 24 is formed along the longitudinal direction at a position directly below the LED chip 16. The light emitting element assembly substrate 14 is supported on the housing 10 at three points on the front end surface of the protruding portion 24 and the lower end surface of the protruding portion 13 formed on both side surfaces of the recessed portion 11. The laminated resin lens array 12 is such that the distance from the light emitting point of the LED wafer 16 to the lens incident surface of the laminated resin lens array 12 is a specified distance 8 312 / Invention Specification (Supplement) / 92-06 / 92105870 The 200305515 separation method is supported by the mounting surface 22 on the upper end surface of the protrusion i 3. The case 10 is made of a non-ferrous metal such as aluminum. In this embodiment, since the housing 10 has the same cross-sectional shape in the longitudinal direction of the optical writing head, it is preferable to use an aluminum extruded material that can be formed at a low cost. The upper surface of the front end of the protruding portion 2 4 is subjected to cutting processing with high flatness. Fig. 4 is a view showing a state when a surface of a light-emitting element assembly substrate abutted to a housing is processed by an end mill (blade object). The housing 10 requires a high flatness to the contact surface of the light-emitting element assembly substrate 14. However, as shown in FIG. 4, even if the surface of the light-emitting element assembly substrate 1 4 abutted to the housing is to be processed with a high flatness by the end mill (blade) 34, an end mill (blade) 3 4 is still generated. In fact, the lower cutting portion 36 of the cutting residual portion is actually impossible to be machined with high precision. Accordingly, in this embodiment, a protrusion is provided in a portion directly below the light-emitting element of the light-emitting element assembly substrate 14, and machining is performed only under the front end portion thereof to improve the processing accuracy. The light-emitting element assembly substrate 14 is processed with a high-precision thickness of the substrate. In addition, the mounting surface of the laminated resin lens array 12 can also be machined with high precision. Therefore, as long as the protrusions are cut with high precision, On the front end of 24, the light-emitting element assembly substrate 14 is mounted on the protruding portion 24, that is, the LED wafer 16 and the laminated resin lens array 12 can be arranged with high accuracy. As described above, although the housing 10 requires high flatness and distance accuracy on the mounting surface 22 of the laminated resin lens array 12 and the surface of the light emitting element assembly substrate 14, it is formed by extrusion molding. Cutting required parts of the material can achieve high precision. Fig. 5 is an enlarged view of part A of Fig. 3A. The lower surface of the light emitting element assembly substrate 14 9 312 / Invention specification (Supplement) / 92-06 / 9210587〇 200305515 The upper surface of the front surface of the light emitting element assembly substrate 14 contacts the lower end surface of the projection 13. When the distance X between the upper surface of the front end of the protruding portion 24 and the lower end surface of the protruding portion 13 is small, when the light emitting element assembly substrate 14 is supported and fixed to the case 10, the light emitting element assembly substrate 14 is excessively warped, and thus Stress is generated in the light-emitting element, and defects such as poor light emission may occur. Accordingly, the interval X is preferably set under the following conditions. (Substrate thickness-0.5 mm Substrate thickness The mounting of the light-emitting element assembly substrate 14 to the housing 10 is performed by mounting the light-emitting element assembly substrate 14 on which the LED chip 16 is mounted, which has no electrical signal take-in mechanism side Pressing into the housing 10 is performed. The light-emitting element assembly substrate 14 can also be a glass epoxy substrate, a metal substrate, etc. When the light-emitting element assembly substrate 14 is inserted into the housing 10, the space X of the housing 10 is smaller than the light-emitting element. The substrate thickness of the assembly substrate 14 is narrow. Therefore, the light-emitting element assembly substrate 14 is warped, and a load is generated at a contact portion between the light-emitting element assembly substrate 14 and the housing 10 by the warpage. The component assembly substrate 14 is fixed to the housing 10. According to this, when the light writing head of the present invention mounts the light emitting component assembly substrate 14 to the housing 10, a fixing mechanism such as an adhesive agent is not needed, and thus can be omitted. Manufacturing steps. In addition, the upper surface of the front end of the protruding portion 24 is processed with high precision by cutting the LED chip 16 on the light emitting element assembly substrate 14 with high accuracy, and the shape of the protruding portion 24 of the housing 10 is simulated, so that the LED chip can be improved. The flatness of the arrangement of the light emitting elements of 16. When the optical writing head is mounted on an electronic photo printer, the photosensitive magnetic strand 15 of the electronic photo printer is provided above the laminated resin lens array 12. 10 312 / Invention Specification (Supplement) / 92-06 / 92105870 200305515 Fig. 6 is a perspective view showing an end surface portion of a head without an electric signal taking-in mechanism side. The positioning of the light-emitting element assembly substrate 14 in the longitudinal direction is shown in the figure. As shown in FIG. 6, the positioning pin (positioning mechanism) 3 8 may be protruded from the housing 10 side of the optical writing head on the side of the end portion of the optical writing head that does not have an electric signal pickup mechanism. The end surface protrudes from the positioning pin 38. In addition, after the light-emitting element assembly substrate 14 is inserted into the housing 10, as shown by the dotted lines in FIG. 2 and FIG. The side cover 30, which has a structure mounted on the housing 10 and does not interfere with the structure of the light-emitting element assembly substrate 14 and the structure of the electrical signal take-in mechanism, is used to insulate and package the ends of the optical write head. In this case, the side cover 30. A fixing member 26 having a protruding stopper portion on the side, The side cover 30 can be attached to the end of the optical write head by fitting the locking portion of the fixing member 26 to the groove 28 provided on the side surface of the housing 10. Alternatively, the side cover 30 can The reference pin 3 2 is used as a reference for the alignment of the photosensitive drum when the optical write head is assembled in an electronic photo printer. The housing 10 can also be made of a resin material mixed with a filler to increase the strength. When the case 10 is an insulator such as a resin, a conductive film may be provided on the surface of the case 10 to reduce the potential difference between the case 10 and the photosensitive drum. In addition, the resin itself may be made of a conductive material. The cross-sectional shape of the bottom surface of the concave portion 11 of the housing 10 and the protruding portion 24 is preferably a semicircular shape, a rectangular shape, a trapezoidal shape, or a wedge shape. In addition, the protrusion may be formed to be continuous along the entire length of the optical head, or may be discontinuous. In addition, in the above-mentioned embodiment, the light-emitting element assembly substrate 1 4 11 312 / Invention Manual (Supplement) / 92-06 / 92105870 200305515 on the substrate front side, but it can also be placed on the rear side of the substrate. A cross-sectional view showing a state where the connector is disposed on the back surface of the substrate of the light-emitting element assembly substrate and the connector portion is cut. In addition, as shown in FIG. 7, the case is a flat cable through the opening 19 of the flat cable, and the flat cable can be inserted from below the case through the cutout 19, and FIG. 8 is a connection with a flat cable that can be inserted from under the casing. Body diagram. Alternatively, a flat cable (not shown) can be inserted through the notch 19 from the bottom of the housing, and the connector can be fixed at the connection part I of the light emitting element assembly substrate (not shown). In addition, in the above-mentioned embodiment, the case where the laminated resin is transmitted through the optical writing head of the equal-magnification rod lens array is described. The substrate mounting and fixing method of the present invention can also be applied to the lens array 4 in FIG. 1 4 An optical write head mounted on the mounting surface 22 of FIG. 5. Applicable to optical pickups such as scanners. In the above-mentioned embodiment, a self-scanning light-emitting device may be used for the LED chip. The self-scanning light-emitting element array refers to a tracing circuit, and a light-emitting element having a function of sequentially transmitting light-emitting points is disclosed in Japanese Patent Laid-Open No. 1-238962, Japanese Patent Laid-Open No. 2-14584, Japanese Unexamined Patent Publication No. Hei, Japanese Unexamined Patent Publication No. 2-926 5 and the like disclose a case where the assembly is simple as a light source, a case where light-emitting elements can be interposed, and a case where a compact printer head can be produced. In addition, Kaiping 2-2 6 3 6 6 8 proposes a self-312 / invention specification (Supplement) / 92-06 / 92105870 that proposes a structure that isolates the light-emitting element array of the transmission element array portion from the light-emitting element array portion. Figure 7 shows the dominant side, but the in-place has a defective structure. The vertical line of the housing is connected to the camera. The mirror array is rod-shaped as shown in the figure. In addition, the element array is built-in self-scanning. Flat: 2-92650 The miniaturization of the printer's head is made as a mobile scanning type. 12 200305515 Optical element array. Fig. 9 shows an equivalent circuit diagram of a self-scanning light-emitting element array wafer having a structure in which a moving portion and a light-emitting portion are isolated. The moving unit includes transmission elements T1, T2, T3, ..., and the light emitting unit includes writing light-emitting elements L1, L2, L3, .... These transmission elements and light-emitting elements are composed of 3-terminal light-emitting silicon controlled rectifiers. The moving part is constituted by using diodes D ^ D2, D3, ... so as to mutually electrically connect the gates of the transmission elements. Vgk is a power source (usually 5 V), and is connected to the sense electrodes Gi, G2, 03, ... of each transmission element via a load resistor R1. The gates G !, G2, G3, ... of the transmission element are also connected to the gate of the light emitting element for writing. A start pulse Φ s is applied to the gate of the transmission element T!, An interleaved clock pulse Φ 1 and Φ 2 is applied to the anode electrode of the transmission element, and a write signal Φ! Is applied to the anode electrode of the writing light-emitting element. . In the figure, R1, R2, Rs, and Ri show current limiting resistors, respectively. Briefly explain the action. First, the voltage of the transmission clock pulse φ1 is at the Η level, and the transmission element T2 is in an on state. At this time, the potential of the gate G2 decreases from 5V of VGK to approximately 0V. The effect of this potential drop is transmitted through the diode D2 to the gate G3, and the potential is set to about 1 V (forward voltage (equivalent to the diffusion potential) of diode D2). However, because the diode D! Is in a reverse biased state, the potential connection to the gate G, is not performed, so the potential of the gate G! Remains at 5V. Since the on-voltage of the light-emitting silicon controlled rectifier is approximately the gate potential + the diffusion potential of the pn junction (about IV), as long as the threshold voltage of the next transmission clock pulse φ 2 is set to about 2V (on-transmission The voltage required for element T3) is more than 4V (the voltage required to turn on transmission element T5) is less than that, it is possible to turn on transmission element T3 alone. The transmission element can be turned off. Accordingly, the conduction state is transmitted by the two transmission clock pulses. The start pulse Φ s is a pulse used to start such a transmission operation. 'Set the start pulse Φ S to Η level (about 0 V)' and 'set the transmission clock pulse Φ 2 to Η level (about 2 V to 4 V) to turn on the transmission element T !. After that, the starting pulse Φ s immediately returns to the Η level. At this time, when the transmission element T2 is on, the potential of the gate G2 becomes approximately 0V. Accordingly, if the voltage of the write signal Φ! Is equal to or higher than the diffusion voltage (approximately IV) of the pn junction, the light-emitting element L2 can be made to emit light. In contrast, the gate G1 is approximately 5 V, and the gate G 3 is approximately 1 V. Accordingly, the writing voltage of the light-emitting element is about 6V, and the writing voltage of the light-emitting element L3 is about 2V. After that, the voltage of the write signal φ! Written only to the light-emitting element L2 is in the range of 1 to 2V. When the light-emitting element L2 is turned on, that is, when it enters the light-emitting state, the light-emitting intensity is determined by the amount of current flowing in the writing signal Φ I, and the writing of the image can be performed at an arbitrary intensity. In addition, in order to transmit the light-emitting state to the light-emitting element, it is necessary to temporarily reduce the online voltage of the write signal Φ! To 0 V, and temporarily turn off the light-emitting element during light emission. (Industrial Applicability) As described above, the optical write head of the present invention reduces the manufacturing cost by reducing the number of components of the optical write head. As shown in FIG. 1, the conventional optical write head must have three parts including a housing, a heat sink and a fixing member. However, the optical write head only needs to be replaced with a housing, so the number of parts can be greatly reduced. .
此外，本發明之光寫頭，因爲殼體的表面全面成爲LED 14 312/發明說明書(補件)/92-06/92105870 200305515 晶片發熱的散熱面，因此，可降低光寫頭本身發熱引起的 led發光光量的衰減。 此外，本發明之光寫頭，係藉由減少光寫頭的組裝步 驟，來實現製造成本的降低。習知光寫頭有使用固定件將 發光元件組裝基板固定於散熱片的固定步驟（若不使用固 定件則爲使用黏接劑的黏接步驟）的必要，但是，本發明之 光寫頭，如圖2所示，因爲由設於殼體的突起部及基板的 上面接觸面夾著基板，因此，可削減固定步驟（或是黏接步 驟）。 又，本發明之光寫頭，因爲係由強度優良的非鐵金屬來 構成殼體，因此可提升光學零件的配置精度。此外，因爲 殻體在光寫頭的長度方向上具有相同的剖面形狀，因此可 將對於降低材料成本極佳的鋁擠壓材料用於殼體，可實現 零件成本的降低。 【圖式簡單說明】 圖1爲使用棒狀透鏡陣列之習知光寫頭的剖面圖。 圖2爲顯示本發明之光寫頭的實施形態的局部立體圖。 圖3A爲在圖2所示光寫頭之長度方向中央部的相對長 度方向垂直的方向的剖面圖。 圖3 B爲圖2所示光寫頭之局部前視圖。 圖4爲由端銑刀（刃物）加工頂接於殻體的發光元件組裝 基板的面時的狀態的圖。 圖5爲圖3A的A部放大圖。 圖6爲顯示不具有電信號取入機構側的頭的端面部分的 15 312/發明說明書(補件)/92-06/92105870 200305515 立體圖。 圖7爲顯示將連結器配置於發光元件組裝基板的基板背 面側，而在連結器的部位切斷的狀態的剖面圖。 圖8爲可從殻體下插入附設扁平纜線的連結器的殼體的 立體圖。 圖9爲自掃描型發光元件陣列的等效電路圖。 (元件符號說明）In addition, the optical writing head of the present invention, because the surface of the housing becomes the LED 14 312 / Invention Manual (Supplement) / 92-06 / 92105870 200305515, the heat radiation surface of the chip, so it can reduce the heat generated by the optical writing head itself. Attenuation of the amount of led light. In addition, the optical write head of the present invention achieves reduction in manufacturing cost by reducing the number of assembly steps of the optical write head. It is known that the optical writing head needs a fixing step of fixing the light-emitting element assembly substrate to the heat sink using a fixing member (if no fixing member is used, it is an adhesion step using an adhesive), but the optical writing head of the present invention is as shown As shown in FIG. 2, since the substrate is sandwiched between the projections provided on the case and the upper surface of the substrate, the fixing step (or the bonding step) can be reduced. In addition, since the optical write head of the present invention is constituted by a non-ferrous metal having excellent strength, the accuracy of disposing optical components can be improved. In addition, since the case has the same cross-sectional shape in the length direction of the optical writing head, an aluminum extruded material that is excellent in reducing material cost can be used for the case, and the cost of parts can be reduced. [Brief Description of the Drawings] FIG. 1 is a sectional view of a conventional optical writing head using a rod lens array. Fig. 2 is a partial perspective view showing an embodiment of the optical writing head of the present invention. Fig. 3A is a cross-sectional view in a direction perpendicular to the longitudinal direction of the central portion in the longitudinal direction of the optical writing head shown in Fig. 2. FIG. 3B is a partial front view of the optical writing head shown in FIG. 2. Fig. 4 is a view showing a state in which a surface of a light-emitting element assembly substrate abutted to a housing is processed by an end mill (blade). FIG. 5 is an enlarged view of part A of FIG. 3A. FIG. 6 is a perspective view of 15 312 / Invention Specification (Supplement) / 92-06 / 92105870 200305515 showing an end face portion of the head without the electric signal taking-in mechanism side. Fig. 7 is a cross-sectional view showing a state where the connector is arranged on the substrate back surface side of the light-emitting element assembly substrate and is cut at a portion of the connector. Fig. 8 is a perspective view of a case where a connector with a flat cable attached can be inserted from under the case. FIG. 9 is an equivalent circuit diagram of a self-scanning light-emitting element array. (Description of component symbols)
10 殻體（支持機構） I 11 凹部 12 積層樹脂透鏡陣列 13 突出部 14 發光元件組裝基板 16 LED晶片 18 連結器 19 缺口 20 扁平纜線（配線） φ 22 搭載面 2 4 突起部 26 固定件 28 溝 30 側罩 32 基準銷 34 端銑刀（刃物） 36 下切割部 16 312/發明說明書(補件)/92-06/92〗05870 200305515 3 8 定位銷（定位機構） 40 發光元件組裝基板 42 LED晶片（發光元件陣列晶片） 44 正 像 等 倍 棒 狀 46 殼 體 (樹脂蓋） 48 感 光 磁 鼓 50 散 熱 片 52 固 定 件 X 間 隔 T】、 τ2、 T 3 N … Li > L2、 L 3 Λ … D]、 D 2、 D 丨3、 V G K 電 源 Rl 負 載 電 阻 G】、 G2、 G 3、 • Φ s 起 動 脈 衝 Φ 1 傳 輸 用 時 脈 脈 φ 2 傳 輸 用 時 脈 脈 Φ I 寫 入 信 號 R1 電 流 限 制 電 阻 R2 電 流 限 制 電 阻 Rs 電 流 限 制 電 阻 Ri 電 流 限 制 電 阻 透鏡陣列 傳輸元件 寫入用發光元件 二極體 閘極 衝 衝10 Housing (supporting mechanism) I 11 Recessed part 12 Laminated resin lens array 13 Projection part 14 Light-emitting element assembly substrate 16 LED chip 18 Connector 19 Notch 20 Flat cable (wiring) φ 22 Mounting surface 2 4 Projection part 26 Fixing member 28 Groove 30 Side cover 32 Reference pin 34 End mill (blade) 36 Lower cutting part 16 312 / Invention manual (Supplement) / 92-06 / 92〗 05870 200305515 3 8 Positioning pin (positioning mechanism) 40 Light-emitting element assembly substrate 42 LED chip (light emitting element array chip) 44 Equal-magnitude rod shape 46 Housing (resin cover) 48 Photoreceptor drum 50 Heat sink 52 Fixing member X interval T], τ2, T 3 N… Li > L2, L 3 Λ… D], D 2, D 丨 3, VGK power supply R1 Load resistance G], G2, G 3, • Φ s Start pulse Φ 1 Transmission clock φ 2 Transmission clock Φ I Write signal R1 Current limiting resistor R2 Current limiting resistor Rs Current limiting resistor Ri Current limiting resistor Lens array transmission element Writing light-emitting element The gate electrode material rushing
312/發明說明書(補件)/92-06/92105870 17312 / Invention Specification (Supplement) / 92-06 / 92105870 17