JPH09226167A - Manufacture of line light source device, line light source device and image recording device used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the errors of imagery states from generating and can maintain the contrasts of latent images and consequently can realize the high quality of outputted images by a method wherein the relative positional accuracy between light emitting elements and imagery elements is ensured. SOLUTION: Light emitting elements consisting of line light sources 1 are mounted onto the mounting surface 2k of a mounting board 2. At the same time, this line light source device is equipped with imagery elements 4 for forming each image at each predetermined position from the radiant beams emitted from the line light sources 1. A board supporting member 3 having an abutting surface 3k with a predetermined flatness abutting against a mounting surface 2k is positioned under the state that the degree of freedom along the longitudinal direction of the line light sources 1 is kept and, at the same time, bondingly fixed to the mounting surface 2k under the state being abutted against each other.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a line light source device, a line light source device, and an image recording apparatus using the line light source device. For example, a printer or a facsimile device for forming a monochrome image and a color image, a copying machine. In a linear light source device used as an exposure system provided in a recording unit of a machine or the like, the present invention particularly relates to a technique for improving the image formation state of the linear light source device.

[0002]

2. Description of the Related Art Conventionally, when an electrophotographic system is adopted in an image forming apparatus such as a printer, a facsimile, a digital copying machine, a latent image corresponding to an image signal output from an external computer or an image reading system is used. An exposure system is provided to form the on the photoconductor. As this exposure system, a line light source device using a light source in which light emitting elements such as light emitting diodes and semiconductor lasers are arrayed is known. This line light source device requires no scanning optical system in comparison with an exposure system that uses a polygon mirror that rotates at a high speed, is small in size, and has no mechanical drive portion, and thus is a quiet image forming apparatus. Easy to configure.

As described above, such a line light source device uses a light source in which light emitting elements are arrayed. However, when a transfer target agent such as a sheet or paper on which an image is to be formed has a large size. In many cases, a line light source device is configured by arranging a plurality of chips in which the above light emitting elements are arrayed.

The above chip is mounted on a mounting board together with a driver, an IC, a resistor chip and the like. Further, since the light emitting element composed of a light emitting diode, a laser diode, or the like emits diffused light from a predetermined point or a predetermined surface, the diffused light thus diffused is accurately irradiated onto the photoconductor to form a latent image. Need to be formed. Therefore, an image forming element represented by a rod lens array is provided in the linear light source device, and a good spot light is formed by the light emitting element and the image forming element.

[0005]

As described above, in order to form a good spot light by the light emitting element and the imaging element, it is required to secure high processing accuracy and relative positional accuracy. In particular, the focal depth of the imaging element is several tens to several hundreds of μm, which is significantly smaller than that of a lens system used in a conventional scanning optical system or the like. The required position accuracy of is very high.

Therefore, according to the conventional linear light source device,
The mounting board is fixed to a surface of the mounting board opposite to the mounting side on which the light emitting element array chip is mounted by fixing a supporting board also processed with aluminum and having a heat dissipation effect. The surface of the mounting substrate is prevented from warping by following a smooth surface that has been precisely processed or molded, and the image formation state in the optical axis direction is improved.

However, according to such a conventional structure, a supporting plate made of aluminum or the like is fixed on the surface opposite to the mounting surface on which the light emitting element array chip mounted on the mounting substrate is mounted. Therefore, the error in the thickness and flatness of the mounting board and the thermal expansion in the thickness direction of the mounting board directly affect the relative positional accuracy between the light emitting element and the imaging element. When an adhesive is used for fixing the mounting board and the support plate, due to uneven thickness of the adhesive layer,
Placing each element within the tolerances within the depth of focus described above becomes even more difficult.

Further, according to the conventional structure, the positional deviation of each element in the direction of the optical axis appears as it is as an error of the image forming state, resulting in deterioration of the contrast of the latent image and eventually deterioration of the quality of the output image. There is.

Therefore, the present invention has been made in view of the above-mentioned problems, and prevents the occurrence of an error in the imaging state by ensuring the relative positional accuracy between the light emitting element and the imaging element in the linear light source device. In addition, it is an object of the present invention to provide a method of manufacturing a line light source device, a line light source device, and an image recording device using the line light source device, which can maintain the contrast of a latent image and thus realize a high quality of an output image.

[0010]

In order to solve the above problems and achieve the object, according to the present invention, a light emitting element constituting a line light source is mounted on a mounting surface of a mounting board, and
An image forming element for forming an image of radiation from the linear light source at a predetermined position, and a substrate supporting member having an abutting surface of a predetermined flatness that abuts the mounting surface, in the longitudinal direction of the linear light source. It is characterized in that the positioning is performed while ensuring the degree of freedom in conformity with, and the fixing is performed in an abutting state with respect to the mounting surface.

In the above structure, the mounting substrate on which the light emitting element is mounted is fixed to the substrate supporting member by adhesion with the adhesive filled in the hole provided in the substrate supporting member, whereby high adhesion is achieved. The mounting substrate and the substrate supporting member are fixed to each other by holding the mounting substrate so that the mounting substrate is surely aligned with the contact area of the substrate supporting member.

Further, the mounting board and the second board on which the driving IC for driving the light emitting element, the resistance chip and the like are mounted are separated, and the mounting board and the second board are connected to one heat dissipation member. Thus, the diameter of the photosensitive drum exposed by the linear light source device can be reduced.

Further, unlike the mounting substrate and the second substrate on which the driving IC for driving the light emitting element, the resistance chip, etc. are mounted, the heat radiation member to which the second substrate is connected is fixed, and this heat radiation member is By making the mounting board not connected,
The mounting substrate and the second substrate are thermally separated from each other, so that heat conduction between them can be lost.

Further, since the means for positioning the imaging element is provided on the substrate supporting member, the positioning of the light emitting element and the imaging element becomes simple.

Further, since the image forming element is attached to the support plate for preventing the image forming element from being warped, the image forming element is prevented from being warped.

The imaging element is fixed to the support plate by adhesion with an adhesive filled in a hole provided in the support member. When there are a plurality of holes, the imaging element is substantially centered in the longitudinal direction. The adhesive for fixing the position other than approximately the center is made to have a high elastic property at least after curing, as compared with the adhesive for fixing the position of, so that the thermal expansion coefficient between the imaging element and the supporting member is increased. Even if there is a difference in the image forming element, the image forming element warps even if the image forming element and the supporting member are laterally extended or contracted relative to each other with respect to the substantially center of the light emitting element in the longitudinal direction of the image forming element. You can avoid it.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. First,
FIG. 1 is a sectional view showing a linear light source device according to a first embodiment of the present invention together with a photosensitive drum, and is a sectional view taken along a plane perpendicular to an array direction of a light emitting element array chip. Further, FIG. 2 shows a light emitting element in the linear light source device of the first embodiment,
FIG. 3 is an exploded perspective view showing a state before assembling a mounting substrate, an imaging element and the like, and FIG. 3 is an external perspective view before assembling the imaging element unit of FIG. 2.

First, in FIG. 1, each individual light emitting element for forming a light emitting array chip row 1 (hereinafter referred to as light emitting element row 1) in which a plurality of light emitting element arrays are arranged is a surface emitting type light emitting element. It is composed of a diode, etc. In addition, a circuit pattern (not shown) is provided on the mounting surface 2k of the mounting substrate 2 so that the light emitting element array 1, the driving IC 6, and a current limiting resistor (not shown) can be electrically conducted on the mounting substrate 2. Have been implemented.

The mounting board 2 has a board supporting member 3
Is fixed as described below. Then, on the substrate support member 3, the diffused light emitted from the light emitting element is formed as a minute spot on the surface along the rotation center axis CL of the photosensitive drum 10 which is disposed at an opposed position and is driven to rotate by a predetermined distance. In order to form an image, a rod lens array 4 in which a plurality of rod lenses are filled and fixed with resin or the like is fixed by a lens supporting member 5.

Further, on the back surface 2b of the mounting substrate 2, heat radiation fins are integrally formed in order to effectively radiate the heat generated when the above-mentioned light emitting element, the driving IC 6 and the current limiting resistor are driven. The heat dissipation plate 7 is fixed to the mounting substrate 2 via a relatively thick adhesive layer 8. The mounting substrate 2 configured as described above is further provided with a cover 9 that allows the rod lens array 4 and the supporting member 5 to be exposed to the outside through the opening 9a.

Next, in FIG. 2, the substrate supporting member 3 is processed so that the projected shape onto the mounting substrate 2 becomes a substantially U-shape as shown in the drawing, and light is emitted in the U-shaped recess. It is configured so that the entire element array 1 is accommodated. In addition, the contact surface 3 of the board supporting member 3 that contacts the mounting board 2
k is previously cut or ground with a predetermined tolerance of several tens to several hundreds of μm so as to have high flatness.

On the other hand, the mounting board 2 is provided with positioning holes 2a, 2b and 2c for fixing it to the support member 1. In addition, the support member 3 has the positioning holes 2a, 2b,
Positioning pins 3a, 3b, 3c are planted in a portion corresponding to 2c. In each of the above positioning holes, the central positioning hole 2a has a close fitting relationship with the central positioning pin 3a of the positioning pins, while the positioning hole 2b has It is a long hole extending along the array direction of the light emitting element array 1,
Further, the positioning hole 2c is set to be larger than the diameter of the positioning pin 3c even in the direction perpendicular to the longitudinal direction of the light emitting element array 1 of the mounting substrate 2 in the array direction.

As described above, the positioning holes and the positioning pins are provided so that the material of the mounting substrate 2 and the substrate supporting member 3 have different coefficients of thermal expansion, and even when the temperature rises. Due to the fitting relationship between the positioning hole 2a and the positioning pin 3a, the positioning in the direction perpendicular to the longitudinal direction of the array direction is completely performed.

As a result, even if the material of the mounting substrate 2 and the substrate supporting member 3 relatively expand or contract due to the temperature rise, the positioning holes 2b and 2c are elongated holes as described above. Since sufficient play is secured, the mounting board 2 is free from distortion and warpage.

As described above, the board supporting member 3 positioned with respect to the mounting board 2 has through holes 3f, 3g, 3h and 3i for bonding which are formed at a predetermined pitch as shown in the drawing.
Then, it is fixed to the substrate supporting member 3 so as to be filled with an adhesive. As described above, according to the method of filling the through holes 3f, 3g, 3h, 3i with the adhesive, the thickness of the adhesive layer is greater than the method of directly applying the adhesive to the contact surface 3k. It becomes possible to prevent warpage due to unevenness or the like. In addition, a type having elasticity that allows relative expansion or contraction caused by a difference in coefficient of thermal expansion between the mounting substrate 2 and the substrate supporting member 3 or a temperature rise condition when the linear light source device is driven. By using the adhesive, it becomes possible to flexibly cope with the situation where the material of the mounting substrate 2 and the substrate supporting member 3 relatively expand or contract.

The mounting surface 2k of the mounting substrate 2 to which the substrate supporting member 3 is fixed as described above, on which the light emitting element array 1 is mounted, completely follows the contact surface 3k of the substrate supporting member 3. Like Therefore, in the direction perpendicular to the mounting surface 2k, a precise position is guaranteed over the entire light emitting element array 1. Further, by forming the substrate supporting member 3 with an insulating member, an insulating film or sheet for insulating the conductive pattern on the mounting substrate 2 can be omitted, which causes a problem when using the insulating film. It becomes possible to completely eliminate the factors of uneven thickness,
Further precise positioning becomes possible.

On the other hand, the diffused light emitted from each light emitting element of the light emitting element array 1 becomes a minute spot by the rod lens array 4 as described above. However, if a difference occurs in the image forming state of each minute spot, it is exposed. The electrostatic latent image becomes uneven on the drum 10, and the quality of the output image is degraded. For this reason,
This rod lens array 4 also requires precise positioning.

Next, referring to FIG. 3, this rod lens array 4 is a rod lens fixed with resin or the like, and since the warp of the rod lens array 4 itself becomes a serious problem, it is perpendicular to the array direction. It is also fixed to the lens supporting member 5 as shown in the drawing, also as positioning in various directions. Similar to the substrate support member 2, the lens support member 5 is precision processed or precision molded so that the contact surface 5k with which the rod lens array 4 contacts has high flatness.

The rod lens array 4 is attached to the lens supporting member 5 and the bonding holes 5 are formed in the lens supporting member.
It is fixed by an adhesive filled in f, 5g, 5h, 5i and 5j. Here, the bonding state in the central bonding hole 5f is completely fixed using an adhesive having a lower elasticity than the bonding by the other holes 5g, 5h, 5i, 5j, and the central bonding hole is relatively fixed. The rod lens array 4 is positioned and fixed in the longitudinal direction of the array by the adhesive filled in the use holes 5f.

Therefore, the rod lens array 4 is adhered in such a state that it can be extended or contracted in the left-right longitudinal direction around the central adhesion hole 5f. By bonding in this way, the distortion due to the difference in the thermal expansion coefficient between the resin supporting member for fixing the rod lens of the rod lens array 4 and the lens supporting member is prevented in substantially the same manner as the fixing of the mounting substrate 2 described above. can do. The rod lens array 4 and the lens supporting member 5 thus integrally configured are positioned by fitting the positioning pins 3d and 3e (FIG. 2) provided on the substrate supporting member 3 into the positioning holes 5d and 5e. Then, they are fixed by adhesion or fixing means such as screws (not shown).

Again, in FIG. 1, the heat dissipation plate 7 is for effectively dissipating the heat generated in the mounting substrate 2, but it is relatively thick and has a high thermal conductivity.
It is connected to the mounting substrate 2 via. By doing so, the heat dissipation plate 7 does not follow the back surface 2b of the mounting substrate 2. Further, a positioning portion (not shown) may be provided on the substrate supporting member 3, the heat dissipation plate 7 may be positioned, and then an adhesive layer may be formed by filling an adhesive agent having good thermal conductivity. Even by the method, the back surface with which the mounting substrate 2 contacts can be configured so as not to follow the flatness of the heat dissipation plate side.

As described above, according to the linear light source device according to the first embodiment of the present invention, the light emitting element array chip array 1
Also, the rod lens array 4 of the image forming element can be precisely positioned in the optical axis direction of the image forming element, and an electrostatic latent image with high resolution can be formed on the photosensitive drum. In an image forming apparatus such as a printer using this line light source device, it is possible to obtain a high quality image output. Next, FIG. 4 is a sectional view showing a linear light source device and a photosensitive drum of a second embodiment of the present invention.
5 is a three-dimensional exploded view of FIG.

In FIG. 4 and FIG. 5, the same reference numerals are given to the already described configurations, and the description will be omitted. The different configurations will be described. A light emitting array chip row 1 in which a plurality of light emitting element arrays are arranged side by side. Is provided with a light shielding member 11 having an opening 11a shaped so as to surround.

For this purpose, the mounting substrate 2 is attached to the substrate supporting member 3.
Further, the image forming unit including the rod lens array 4 and the lens supporting member 5 is positioned and attached in substantially the same manner as in the first embodiment described above. Here, the substrate support member 3 is a member made of a metal or a resin material. However, in order to correct the warp of the mounting substrate 2 and to position the light emitting element array 1, the U-shape of the substrate support member 3 is used. It is effective to reduce the distance D of the concave portion of the mold as much as possible to increase the contact area with the mounting substrate 2.

By setting the recesses in this way, the end face 3p in FIG. 5 can be made closer to the light emitting element array 1, and the light emitted from the light emitting elements has a relatively small directivity of a light emitting diode or the like and is completely emitted. Even in the case of light emission in a state close to diffusion, diffused light is reflected on the end face 3p, and a part of the reflected light enters the rod lens array 4 to cause flare on the photosensitive drum 10. As a result, an offset occurs in the electrostatic latent image.

Therefore, in this embodiment, the light shielding member 11 is provided in order to prevent harmful reflection on the end face 3p, and the inner surface of the opening 11a is coated with a paint that absorbs the emission wavelength from the light emitting element array 1. Alternatively, the entire light blocking member 11 is made of a material that absorbs the emission wavelength. In this way, reflection on the end face 3p is prevented.

Further, the light shielding member 11 is provided with a flange portion 11b as shown in FIG. 5, and is fixed to the substrate supporting member 3 with an adhesive or a screw (not shown). Further, as shown in FIG. 4, the rod lens array 4 adhesive portion of the lens supporting member 5 is the flange portion 1 of the light shielding member 11.
It is configured not to interfere with 1b. Further, the light shielding member 11 is used as the substrate supporting member 3 or the lens supporting member 5.
It may be integrally molded with.

As described above, according to the linear light source device of the second embodiment of the present invention, among the diffused light from the light emitting element array chip, the light that does not pass through the rod lens array 4 as the imaging element is a component. It is possible to prevent the electrostatic latent image from being adversely affected by flare and the like by being reflected on the image forming element and to form an electrostatic latent image with high resolution on the photosensitive drum 10, and thereby, a line can be formed. An image forming apparatus such as a printer using a light source device can output a high-quality image.

FIG. 6 is a sectional view showing the linear light source device and the photosensitive drum 10 of the third embodiment of the present invention cut along a plane perpendicular to the array direction of the light emitting element array chip. In this figure, the same components as those already described are denoted by the same reference numerals, description thereof will be omitted, and only different components will be described.

In this figure, the mounting substrate 2 on which the light emitting element array 1 is mounted is the second substrate 12 which is the second mounting substrate.
Are connected via a wiring 13 so that power can be supplied to the light emitting element array 1. For this reason, the drive IC 6 and the current limiting resistor etc. are provided on the surface 1 of the second substrate 12.
The heat radiating plate 7 mounted on the surface 2a and effectively radiating the heat generated by the driving is attached to the back surface 1 as shown in the figure.
The rod lens array 4 and the lens support member, which are provided so as to abut on 2b, protect the mounting components by the cover 9 and are fixed accurately to the light emitting element array 1 mounted on the mounting substrate 2. 5 is exposed from the opening 9a of the cover 9.

According to the above construction, the linear light source device can be sufficiently accommodated within the diameter d even when the diameter d of the photosensitive drum 10 is reduced with the downsizing of the image forming apparatus such as a printer. it can. That is, the mounting substrate 2 on which the light emitting element array 1 is mounted and the second substrate 12 on which the drive IC 6 and other current limiting resistors (not shown) are mounted are separated from each other and extend in the front and back direction of the paper surface of FIG. The linear light source device can be configured in a shape.

The mounting substrate 2 is assembled so as to abut the mounting surface of the supporting member 3 having a good flatness, and the light emitting element array 1 is positioned. Is attached with a rod lens array unit including a rod lens array 4 and a lens supporting member 5. On the other hand, since the second substrate 12 on which the drive IC 6 and the like are mounted is fixed so as not to be involved in image formation and therefore does not require precise positioning, the heat dissipation member 7 is directly attached. Also. The heat dissipation member 7 is arranged so as to partially contact the mounting substrate 2 as well.
Is used so that the mounting substrate 2 does not follow the heat radiation member side.

As described above, by dividing the mounting substrate into the mounting substrate 2 and the second substrate 12, the surface of the substrate supporting member 3 which comes into contact with the mounting substrate 2 becomes smaller, and the substrate supporting member 3 has high planarity. Since the area to be processed or molded into is smaller, the cost can be reduced.

As described above, the line light source device according to the present embodiment is inexpensive, and it is possible to realize a compact image forming apparatus by using this line light source device.

Finally, FIG. 7 is a sectional view showing the linear light source device and the photosensitive drum of the third embodiment of the present invention cut along a plane perpendicular to the array direction of the light emitting element array chip. In this figure, the same components as those already described are denoted by the same reference numerals, description thereof will be omitted, and only different components will be described.

In this figure, in the present embodiment, the mounting substrate is divided in substantially the same manner as the third embodiment, and since the heat generation amount of the light emitting element is small, the heat generation of the drive IC 6 and the current limiting resistor is caused. This is an effective configuration when the heat generation amount is large and is dominant in the drive IC 6 and the current limiting resistance.

In FIG. 7, a light emitting array chip array 1 in which a plurality of light emitting element arrays are arranged is mounted on a mounting substrate 2, and the mounting substrate 2 is assembled on the surface of the substrate supporting member 3 having good flatness. Positioning of the light emitting element array is performed. In addition, the substrate support member 3 includes a rod lens array 4
A rod lens array unit including the lens supporting member 5 is attached to the mounting substrate 2. On the other hand, drive IC
The second substrate 12, on which 6 and the like are mounted, is attached to the heat dissipation member 7 because it does not participate in the image formation relationship and does not require precise positioning. The heat dissipation member 7 is attached to the cover 9.

Here, the mounting substrate 2 is not in contact with the heat dissipation member 7, and the mounting substrate 2 and the second substrate 12 are electrically connected by the wiring 13. In this way, when the mounting substrate 2 and the second substrate 12 are in contact with the heat dissipation member 7, and the heat generated by the mounting components such as the drive IC 6 on the second substrate 12 is mounted on the mounting substrate 2. In the case where the size of the light emitting element array 1 is much larger than that of the light emitting element array 1, the amount of heat radiated from the second substrate 12 flows in through the heat radiating member 7 is larger than the amount of heat radiated from the mounting substrate 2, and the light emitting element is expected. The temperature may rise above the specified value. Such a significant increase in the temperature of the light emitting element has a bad influence on the light emitting state such as a shift in the light emitting wavelength, thermal deformation of the light emitting element array chip or the mounting substrate 2, and a decrease in the light emitting output.

Therefore, as described above, the mounting substrate 2 and the second substrate 12 are mechanically separated from each other, and heat conduction is not generated between them, so that the light emitting state can be stabilized. Become. In this way, when the mounting substrate is divided, the heat generation amount of the light emitting element is small, whereas the heat generation amount of the drive IC and the current limiting resistor is large, and the heat generation amount is dominant in the heat generation amount of the line light source device. In, the linear light source device can provide a stable light emission state and can form a good electrostatic latent image.

As described above, according to the present invention, by fixing the substrate supporting member on the surface of the mounting substrate on which the light emitting element emits light, the direction of the optical axis of the image forming element is not affected by unevenness in the thickness of the substrate. As a result of enabling accurate positioning of the light emitting element in, high quality image formation can be performed. In addition, by forming the substrate support member in a U-shape,
By increasing the contact area between the mounting substrate and the substrate supporting member, it becomes possible to more stably correct the warp of the mounting substrate.

Further, in order to prevent reflection of the substrate supporting member which is affected by the light emitted from the light emitting element, a means for absorbing at least light having an emission wavelength of the light emitting element is provided to prevent disturbance light such as flare. It becomes possible to prevent the offset of the electrostatic latent image on the photosensitive drum.

Further, the substrate supporting member is not affected by the unevenness of the thickness of the insulating film or the like, which enables the light emitting element to be precisely positioned with higher accuracy.

The mounting board on which the light emitting element is mounted is
Since the mounting substrate and the substrate supporting member are fixed to each other with high adhesiveness by fixing with the adhesive filled in the hole provided in the substrate supporting member, the contact surface of the substrate supporting member can be securely attached. The mounting substrate can be made to follow the pattern, and the light emitting element can be positioned with higher accuracy.

Further, the mounting substrate on which the chip having a plurality of light emitting elements is mounted and the second substrate on which the driving IC for driving the light emitting elements, the resistance chip, etc. are mounted are divided and connected to each other. By configuring the substrate to be connected to one heat radiation member, the diameter of the photosensitive drum to be exposed by the linear light source device of the present invention can be reduced, and as a result, the size of the image forming apparatus such as a printer in which the linear light source device is incorporated can be reduced. Can be converted.

Further, a mounting board on which a chip having a plurality of light emitting elements is mounted and a second board on which an IC for driving the light emitting elements, a resistance chip, etc. are mounted are divided, and a heat radiating member to which the second board is connected is divided. However, the mounting board is not connected to the heat dissipation member, so that the mounting board and the second board are thermally separated from each other, and heat conduction between them can be eliminated. When the amounts of heat generated in comparison with each other are extremely large, it is possible to prevent the heat from being transmitted to the substrate on the side of the low heat generation amount and adversely affecting the operation.

Further, since the means for positioning the image forming element is provided on the substrate supporting member, the means for mounting the image forming element is mounted on the support plate for preventing the warpage of the light emitting element and the image forming element. The warp can be prevented, and the change in the image formation state on the photosensitive drum can be eliminated in the array direction of the light emitting elements.

The imaging element is fixed to the support plate by adhesion with an adhesive filled in the hole provided in the support member. Adhesives that fix positions other than approximately the center, rather than adhesives that fix positions, should have a property of high elasticity at least after curing, so that the coefficient of thermal expansion between the imaging element and the support member is different. However, even if there is a relative lateral extension or contraction of the image forming element and the support member with reference to the approximate center in the longitudinal direction of the light emitting element of the image forming element, the image forming element does not warp. , It becomes possible to eliminate the change in the image formation state on the photosensitive drum in the array direction of the light emitting elements.

[0058]

As described above, according to the present invention,
By ensuring the relative positional accuracy between the light emitting element and the image forming element in the line light source device, it is possible to prevent an error in the image forming state, maintain the contrast of the latent image, and realize a high quality output image. It is possible to provide a method of manufacturing a linear light source device, a linear light source device, and an image recording device using the linear light source device.

[0059]

[Brief description of drawings]

FIG. 1 is a sectional view showing a linear light source device according to a first embodiment of the present invention together with a photosensitive drum, and is a sectional view taken along a plane perpendicular to an array direction of a light emitting element array chip.

FIG. 2 is an exploded perspective view showing a state before assembling a light emitting element, a mounting substrate, an image forming element and the like in the linear light source device of the first embodiment.

FIG. 3 is an external perspective view illustrating an imaging element unit in the linear light source device according to the first embodiment of the present invention.

FIG. 4 is a sectional view of a linear light source device according to a second embodiment of the present invention.

FIG. 5 is a perspective view of a linear light source device according to a second embodiment of the present invention.

FIG. 6 is a sectional view of a linear light source device according to a third embodiment of the present invention.

FIG. 7 is a sectional view of a linear light source device according to a fourth embodiment of the present invention.

[Explanation of symbols]

 1 Light-Emitting Element Array Chip Row 2 Mounting Substrate 3 Substrate Supporting Member 4 Rod Lens Array 5 Lens Supporting Member 6 Driving IC 7 Heat Sink 9 Cover 10 Photosensitive Drum 11 Light-Shielding Member 12 Second Substrate

Claims (22)

[Claims] 1. A line light source comprising a light emitting element forming a line light source mounted on a mounting surface of a mounting substrate, and an image forming element for forming an image of radiated light from the line light source at a predetermined position. A method for manufacturing an apparatus, wherein a substrate supporting member having an abutting surface having a predetermined flatness that abuts on the mounting surface is positioned with a degree of freedom along the longitudinal direction of the linear light source secured, and the substrate supporting member is abutted against the mounting surface. A method of manufacturing a linear light source device, which comprises adhesively fixing in a contact state. 2. The substrate supporting member is formed in a substantially U-shape and has a concave portion, and in order to prevent light emitted from the light emitting element from being reflected at the concave portion,
2. The method of manufacturing a linear light source device according to claim 1, further comprising: a shielding means that is surface-treated to have a wavelength that absorbs at least the emission wavelength of the light emitting element so as to surround the linear light source. 3. The board supporting member is formed from an electric insulating material by a predetermined process, and the electric insulating sheet on the mounting surface of the mounting board is omitted to perform the adhesive fixing. Manufacturing method of linear light source device. 4. The mounting substrate is adhered and fixed to the substrate supporting member by an adhesive previously filled in a through hole or a bottomed hole formed in the substrate supporting member. The method for manufacturing a linear light source device according to claim 1, wherein 5. A light emitting element that constitutes the linear light source is mounted on the mounting board, and a driving element that drives the light emitting element in a predetermined manner is mounted on a second board, and the driving element is mounted between the mounting board and the second board. 2. The method for manufacturing a linear light source device according to claim 1, wherein the heat radiation member is fixed on the second substrate by electrically connecting the. 6. The method of manufacturing a linear light source device according to claim 1, further comprising fixing means for positioning and fixing the imaging element on the substrate supporting member. 7. The method of manufacturing a linear light source device according to claim 6, wherein the imaging element is attached to a support plate that prevents warpage along the longitudinal direction of the imaging element. 8. The image forming element, with respect to the support plate,
The method for manufacturing a line light source device according to claim 7, wherein the linear light source device is bonded and fixed by an adhesive agent filled in a through hole portion or a bottomed hole portion provided in the support member. 9. An adhesive for fixing a position other than substantially the center rather than an adhesive for fixing the substantially central position of the imaging element in the longitudinal direction by providing a plurality of the through holes or the holes. The method for manufacturing a linear light source device according to claim 8, wherein the adhesiveness is fixed so as to increase elasticity. 10. A line light source comprising a light emitting element forming a line light source mounted on a mounting surface of a mounting substrate, and an image forming element for forming an image of radiated light from the line light source at a predetermined position. In the device, the substrate supporting member having an abutting surface of a predetermined flatness that abuts the mounting surface is secured and positioned with a degree of freedom along the longitudinal direction of the linear light source, and in a contact state with the mounting surface. A line light source device characterized by being adhesively fixed. 11. The substrate supporting member is formed in a substantially U shape and has a recess.
The linear light source device according to. 12. In order to prevent light emitted from the light emitting element from being reflected by the recess, a shielding means that has been subjected to a surface treatment of a wavelength that absorbs at least an emission wavelength of the light emitting element surrounds the linear light source. The linear light source device according to claim 11, wherein the linear light source device is provided. 13. The linear light source device according to claim 10, wherein the substrate supporting member is formed by predetermined processing from an electrically insulating material. 14. The mounting substrate is adhered and fixed to the substrate supporting member by an adhesive previously filled in a through hole or a bottomed hole formed in the substrate supporting member. The line light source device according to claim 10. 15. The mounting board and a second board on which a driving component for driving the light emitting element is mounted are divided and electrically connected, and the mounting board and the second board are separated by a common heat dissipation member. The linear light source device according to claim 10, wherein the linear light source device is configured to radiate heat. 16. A light emitting element that constitutes the linear light source is mounted on the mounting board, and a drive element that drives the light emitting element in a predetermined manner is mounted on a second board, and a space between the mounting board and the second board is mounted. 11. The linear light source device according to claim 10, wherein the linear light source device is electrically connected and a heat radiation member is fixed on the second substrate to radiate heat. 17. The linear light source device according to claim 10, further comprising fixing means for positioning and fixing the imaging element on the substrate supporting member. 18. The linear light source device according to claim 17, wherein the imaging element is attached to a support plate that prevents warpage along the longitudinal direction of the imaging element. 19. The image forming element is fixed to the support plate by adhesion with an adhesive filled in a through hole portion or a bottomed hole portion provided in the support member. The linear light source device according to claim 17. 20. An adhesive for fixing a position other than substantially the center, rather than an adhesive for providing a plurality of the through holes or the holes and fixing the substantially central position of the imaging element in the longitudinal direction. 20. The linear light source device according to claim 19, wherein the linear light source device is adhesively fixed so as to increase elasticity. 21. A line light source comprising a light emitting element forming a line light source mounted on a mounting surface of a mounting substrate, and an image forming element for forming an image of radiated light from the line light source at a predetermined position. An image recording apparatus using the apparatus, wherein the line light source device according to any one of claims 10 to 20 is configured to expose a photosensitive drum as a line light source. Image recording apparatus using a. 22. A light emitting element that constitutes the linear light source is mounted on the mounting board, and a driving element that drives the light emitting element in a predetermined manner is mounted on a second board, and a space between the mounting board and the second board is mounted. While electrically connecting and fixing the heat dissipation member on the second substrate, the mounting surface of the mounting substrate is directed toward the photosensitive drum, and the second substrate is substantially along the normal line direction of the photosensitive drum. 22. The image recording apparatus using the linear light source device according to claim 21, wherein the linear light source device is configured to fit within the diameter of the photosensitive drum.