JPS60116479A - Printer using light-emitting diode - Google Patents
Printer using light-emitting diodeInfo
- Publication number
- JPS60116479A JPS60116479A JP58225066A JP22506683A JPS60116479A JP S60116479 A JPS60116479 A JP S60116479A JP 58225066 A JP58225066 A JP 58225066A JP 22506683 A JP22506683 A JP 22506683A JP S60116479 A JPS60116479 A JP S60116479A
- Authority
- JP
- Japan
- Prior art keywords
- led
- light
- lens array
- led array
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 238000003384 imaging method Methods 0.000 claims description 13
- 108091008695 photoreceptors Proteins 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000004397 blinking Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/024—Details of scanning heads ; Means for illuminating the original
- H04N1/032—Details of scanning heads ; Means for illuminating the original for picture information reproduction
- H04N1/036—Details of scanning heads ; Means for illuminating the original for picture information reproduction for optical reproduction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K15/00—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers
- G06K15/02—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers
- G06K15/12—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by photographic printing, e.g. by laser printers
- G06K15/1238—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by photographic printing, e.g. by laser printers simultaneously exposing more than one point
- G06K15/1242—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by photographic printing, e.g. by laser printers simultaneously exposing more than one point on one main scanning line
- G06K15/1247—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by photographic printing, e.g. by laser printers simultaneously exposing more than one point on one main scanning line using an array of light sources, e.g. a linear array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/40—Picture signal circuits
- H04N1/40025—Circuits exciting or modulating particular heads for reproducing continuous tone value scales
- H04N1/40031—Circuits exciting or modulating particular heads for reproducing continuous tone value scales for a plurality of reproducing elements simultaneously
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Multimedia (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
- Facsimile Heads (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は画像形成用露光装置として発光ダイオード（Ｌ
ｉｇｈｔ ｍｍｍ１ｔｔｉｎ Ｄｉｏｄｅ 、以下ＬＥ
Ｄと称す）アレイを搭載したＬＥＤプリンタヘッドを利
用した電子写真式光プリンタに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention uses a light emitting diode (L) as an exposure device for image formation.
light mmm1ttin Diode, hereinafter LE
The present invention relates to an electrophotographic optical printer using an LED printer head equipped with an array (referred to as D).
この種の電子写真式光プリンタは一般的な電子写真式複
写装置のスリット露光−原稿像結像光学系のかわりに、
主走査方向−外分の輝点列をドラム上に結像でき、任意
に輝点の点燈、清澄を可能にした画像形成用露光装置を
組み込んだものであり、特にＬＥＤアレイプリンタは、
輝点列発生の手段として、微小ＬＥＤを数十個−列もし
くは複数列に並べ、これの像をドラム面上に結像する結
像光学系を一体にしたものを画像形成用露光装置として
用いたものである。This type of electrophotographic optical printer replaces the slit exposure and original image forming optical system of general electrophotographic copying devices.
It incorporates an exposure device for image formation that can form an image of a row of bright spots outside the main scanning direction on a drum, and can optionally turn on and clarify the bright spots.In particular, LED array printers are
As a means of generating a row of bright spots, an image-forming exposure device is used in which dozens of small LEDs are arranged in rows or in multiple rows, and an image-forming optical system that forms an image of the LEDs on the drum surface is integrated. It was there.
第１図に従来のＬＥＤアレイプリンタの概略構成図を示
す。FIG. 1 shows a schematic configuration diagram of a conventional LED array printer.
１０１は感光ドラムで矢印ａの向きに回転する。101 is a photosensitive drum that rotates in the direction of arrow a.
１０２は１次帯電器で感光ドラム１０１の表面を均一に
帯電する。１０３は従来のＬＥＤプリンタヘッドであり
、ここで感光ドラム１０１の表面において輝点が結像さ
れた部分の電荷のみ移動し、その他の部分の電荷はその
ままで残る。すなわち静電潜像が形成される。次に現像
器１０４を通過すると、そのときの感光ドラム１０１の
表面の電荷の有無に従来
い、トナーの付着、未着がおこり、感光ドラム１０１上
の画像が顕像化する。以上の過程において、ＬＥＤプリ
ンタヘッド１０６により輝点を照射した感光ドラム１’
０１の部分にトナーを付着させるか否霞
かけ、帯露器１０２の磁性および現像器１０４に入れた
トナーの極性等の組合せ如何により、任意に決定できる
のは周知のとおりである。A primary charger 102 charges the surface of the photosensitive drum 101 uniformly. Reference numeral 103 denotes a conventional LED printer head, in which only the charge on the surface of the photosensitive drum 101 where a bright spot is imaged moves, and the charge on other parts remains unchanged. That is, an electrostatic latent image is formed. Next, when the toner passes through the developing device 104, depending on the presence or absence of charge on the surface of the photosensitive drum 101 at that time, toner may or may not adhere, and the image on the photosensitive drum 101 becomes visible. In the above process, the photosensitive drum 1' is irradiated with a bright spot by the LED printer head 106.
As is well known, the toner can be arbitrarily determined depending on the combination of whether or not toner is attached to the portion 01, the magnetism of the dewdropper 102, the polarity of the toner put in the developing device 104, etc.
現像器１０４を通過して顕像化したトナーによる画像は
、転写帯電器１０５によりカセット１０６もしくはカセ
ット１０７より供給される紙に転写される。The toner image that has passed through the developer 104 and has been visualized is transferred by a transfer charger 105 to paper supplied from a cassette 106 or 107.
この紙の定着器１０８の通過時に、感光ドラム１０１よ
り転写したトナーが紙に定着する。１０９は感光ドラム
１０１上に残ったトナーのクリーナであり、１１０は除
電ランプである。When the paper passes through the fixing device 108, the toner transferred from the photosensitive drum 101 is fixed on the paper. 109 is a cleaner for toner remaining on the photosensitive drum 101, and 110 is a static elimination lamp.
第２図はＬＥＤプリンタヘッド１０３を構成するＬＥＤ
アレイ基板２０１の斜視図である。２０２は放熱板を兼
ねた基板であり、２０３ 、２０４ 、２０５はセラミ
ック基板等で構成される配線手段である。筬２０７は画
像信号や電源との接続を行うためのケーブルである。
２０８−１〜２０８−ｎは中央にＬＥＤを１列に並べた
ＬＥＤアレイチップであり、２０９−１〜２０９−ｎ及
び２１０−１〜２１０−ｎは、ＬＥＤアレイチップ２０
８−１〜２０Ｂ−ｎを駆動するドライバ回路、即ち、ケ
ーブル２０６．２０７より入力される画像信号のシリア
ルパラレル変換回路等を内蔵したＬＦｉＤドライブ集積
回路（Ｉｎｔｅｇｒａｔｅｄ ０１ｃｕｉｔ 、以下Ｉ
Ｃと称す）。FIG. 2 shows the LEDs that make up the LED printer head 103.
2 is a perspective view of an array substrate 201. FIG. 202 is a substrate that also serves as a heat sink, and 203, 204, and 205 are wiring means made of ceramic substrates or the like. The reed 207 is a cable for connecting to an image signal and a power source.
208-1 to 208-n are LED array chips in which LEDs are arranged in a row in the center, and 209-1 to 209-n and 210-1 to 210-n are LED array chips 20
8-1 to 20B-n, that is, an LFiD drive integrated circuit (Integrated 01cuit, hereinafter referred to as I
(referred to as C).
である。このＬＥＤアレイチップ２０８−ｍとＬＥＤド
ライブＩ Ｃ２０９−ｍ 、 ２１０−ｍの部分を拡大
したものを第６図に示す。３０１−１．３０１−２．３
０１−３．３０１−４・０はＬＥＤであり、ＬＥＤアレ
イチップ２０３−ｍのほぼ中央に一列に並べである。奇
数番のＬＥ’Ｄ３０１−Ｌ３０１−３．・・・は上側に
、偶数番のＬ ＥＤ ３０１−２．３０１−４．・・・
は下側にそれぞれ配線によって引き出され、ＬＥＤドラ
イブＩ Ｃ２０９ｍ、 ２１０−ｍの各ＬＥＤ駆動用端
子３０２−１．３０２−２．・・・３０３−１．３０３
−２．・・・にそれぞれワイヤボンディングしである。It is. FIG. 6 shows an enlarged view of the LED array chip 208-m and the LED drive ICs 209-m and 210-m. 301-1.301-2.3
01-3.301-4.0 are LEDs, which are arranged in a line approximately in the center of the LED array chip 203-m. Odd number LE'D301-L301-3. . . . are the even numbered LEDs 301-2, 301-4. ...
are drawn out by wiring to the lower side, and are connected to each LED drive terminal 302-1, 302-2, of the LED drive IC 209m, 210-m. ...303-1.303
-2. ... are wire bonded to each other.
以上の様にＬＥＤアレイ基板２０１は構成されており、
ケーブル２０６．２０７より画像信号を１列分逐次、Ｌ
ＥＤドライブＩ Ｃ２０９−１〜２０９−ｎ 、 ２１
０−１〜２１０−ｎが入力し、１列分のデータをシフト
した後、これを並列にＬＥＤ駆動端子３０２−１．３０
２−２．・・・３０５−１．３０６−２．・・会に出力
し、これに従い各ＬＥＤが点燈、清澄し、−外分の画像
形成用の輝点が発生する。The LED array board 201 is configured as described above.
Sequentially send image signals for one column from cables 206 and 207, L
ED drive IC209-1~209-n, 21
0-1 to 210-n are input, and after shifting one column of data, this is connected to the LED drive terminal 302-1.30 in parallel.
2-2. ...305-1.306-2. According to this, each LED lights up and becomes clear, and a bright spot for forming an image outside of - is generated.
第４−１図にＬＥＤ発光部とドラム面結像点の関係図を
示す。FIG. 4-1 shows a diagram of the relationship between the LED light emitting section and the imaging point on the drum surface.
ＬＥＤアレイチップ２０８−ｍは、セルフォックレンズ
アレイ等の結像系４０１によって感光ドラム１０１上に
結像される。ここでＬＥＤ３０１−１からの光束Ｌ１は
角度θが小さいと、結像系４０１により光束Ｌ１−ｔと
なり入射するが角度θが大きくなると、光束の一部が入
射しなくなる。そして入射した光束Ｌ１−ｔのみが感光
ドラム１０１上に到達し、結像されるＬＥＤ３０１−１
の光の配光特性は第４−２図の様になっており、角度θ
がかなり大きな方向にまで光束密度が高くなっている。The LED array chip 208-m is imaged onto the photosensitive drum 101 by an imaging system 401 such as a SELFOC lens array. Here, when the angle θ of the light beam L1 from the LED 301-1 is small, the light beam L1-t is incident on the imaging system 401, but when the angle θ becomes large, a part of the light beam does not enter. Then, only the incident light beam L1-t reaches the photosensitive drum 101 and is imaged on the LED 301-1.
The light distribution characteristics of the light are as shown in Figure 4-2, and the angle θ
The luminous flux density increases even in the direction where the distance is considerably large.
この様に球にほぼ等しい配光特性を有する発光体からの
光束を角度θまではすべて結像糸４０１に入射しθ以上
は入射しないと近似し、発光体の出力光エネルギーに対
する入力エネルギーの比を計算し、まとめたものが表１
である。In this way, it is approximated that all the light flux from the light emitter having light distribution characteristics that is almost equal to that of a sphere is incident on the imaging thread 401 up to the angle θ, and it is not incident above θ, and the ratio of the input energy to the output light energy of the light emitter is Table 1 shows the calculated and summarized results.
It is.
表１ ′
るものでも第４−１図における１１及びｌＯが３ｍｍ５
ｌａが９ ｍｒｎ程度でありθは１５°程度である。従
って伶
結像器４０１中の光の減衰を無視しても、ＬＥＤ３０１
−１の全光エネルギーの約１６％しか感光ドラム１０１
上に伝達することができない。Table 1' Even if 11 and lO in Figure 4-1 are 3mm5
la is about 9 mrn and θ is about 15°. Therefore, even if the attenuation of light in the imager 401 is ignored, the LED 301
- Only about 16% of the total light energy of the photosensitive drum 101
Unable to communicate above.
第５−１図にＬＥＤ発光部の形状を示す。図中５０１は
ＬＥＤチップであり、５０２が有効発光面、５０３が電
極であり、５０４が電極とＬＥＤの接続面である。従っ
て１画素分のＬＥＤのＰＮ接合面の大きさは、有効発光
面５０２と接続面５０４を加えたものになっている。Figure 5-1 shows the shape of the LED light emitting section. In the figure, 501 is an LED chip, 502 is an effective light emitting surface, 503 is an electrode, and 504 is a connection surface between the electrode and the LED. Therefore, the size of the PN junction surface of the LED for one pixel is the sum of the effective light emitting surface 502 and the connecting surface 504.
以上説明したように、複数個のＬＥＤの点滅による輝点
パターンは、放熱基板２０２の上面より垂直方向に放射
される。この発光パターンを感光ドラム１０１の表面に
結像させるためには、放熱基板２０２の上面に垂直に光
軸を調整した結像光学系が必要になる。As described above, the bright spot pattern created by blinking the plurality of LEDs is emitted from the upper surface of the heat dissipation board 202 in the vertical direction. In order to form an image of this light emission pattern on the surface of the photosensitive drum 101, an imaging optical system whose optical axis is adjusted perpendicular to the upper surface of the heat dissipation substrate 202 is required.
第５−２図に結像光学系としてセルフォックレンズアレ
イ４０１を用いたときの取付例を示した。FIG. 5-2 shows an example of mounting when a SELFOC lens array 401 is used as an imaging optical system.
取付用り字ブロック５０５を放熱基板２０２に固着しチ
オき、Ｌ字フロック５０５ノ内面５０５ ’、 ５０５
’ ニセルフオツクレンズアレイ４０１の壁面と底面
を密着させねじどめしである。The mounting block 505 is fixed to the heat dissipation board 202, and the inner surface 505', 505 of the L-shaped block 505 is fixed.
' The wall and bottom of the double self-cleaning lens array 401 are brought into close contact with each other and screwed together.
ところが前述したように、θの大きなセルフォックレン
ズアレイを用いてＬＥＤの光の伝達効率を上げる必要が
あるが、このような１１．ｌｌｏが３ ｍｍ１Ｃが９
ｍｍ程度のセルフォックレンズアレイの被写界深度は非
常に狭く、±１００μｍ以内の焦点誤差で固定しなけれ
ば鮮明な像が得られない。However, as mentioned above, it is necessary to increase the light transmission efficiency of the LED by using a SELFOC lens array with a large θ. llo is 3 mm1C is 9
The depth of field of the SELFOC lens array, which is about mm, is extremely narrow, and a clear image cannot be obtained unless the focus error is fixed within ±100 μm.
栄
また、セルフォックレンズアレイは集光性ロッドレンズ
を俵積みしたものであるため、ＬＥＤ発光面のように微
小な列を結像するとき、俵桔みの中心列からＬＥＤの列
が平行にずれたとき、集束性ロッドレンズの直径のピッ
チで、結像面に明暗がでてしまう。１１．ｌｌｏが３ｍ
ｍ、ｌｃが９ ｍｍ程度のセルフォックレンズアレイを
用いたときは、そのずれを±１００μｍ程度までにおさ
えなければならない。In addition, since the SELFOC lens array is made by stacking condensing rod lenses in a stack, when imaging a minute row like an LED light emitting surface, the rows of LEDs are parallel to each other from the center row of the row. When misaligned, brightness and darkness appear on the image plane depending on the pitch of the diameter of the focusing rod lens. 11. llo is 3m
When using a SELFOC lens array with m and lc of about 9 mm, the deviation must be kept within about ±100 μm.
第５−２図を見て明らかな様に、Ｌ字ブロック５０５の
内面５０５ ’、 ５０５ ’とセルフォックレンズア
レイ４０１の間に薄膜等を挿入することにより発光面と
セルフォックレンズアレイの中心を両側付近ではかなり
正確に調整することは可能である。しかし、セルフォッ
クレンズアレイ４０１の光軸に平行方向の厚みは９ｎｕ
ｎに対し、垂直方向の厚みは４ ｍｍ程度であり、長さ
はＡ６版のプリントまで可能にする場合には少くとも３
００ ｍｍは必要である。従ってセルフォックレンズア
レイ４０１の中心付近はたわんでしまい、時にセルフォ
ックレンズアレイの俵積みの中心とのずれを±１００μ
ｍにおさえるのは非常に困難であり、あえて精度良くセ
ルフォックレンズアレイを取付けるには大幅なコストア
ップをまねかざるを得なかった。As is clear from FIG. 5-2, by inserting a thin film or the like between the inner surfaces 505', 505' of the L-shaped block 505 and the SELFOC lens array 401, the light emitting surface and the center of the SELFOC lens array can be aligned. It is possible to make fairly accurate adjustments near both sides. However, the thickness of the SELFOC lens array 401 in the direction parallel to the optical axis is 9 nu.
n, the vertical thickness is about 4 mm, and the length is at least 3 mm if printing is possible up to A6 size.
00 mm is required. Therefore, the vicinity of the center of the SELFOC lens array 401 is bent, and sometimes the deviation from the center of the SELFOC lens array 401 is ±100μ.
It is extremely difficult to keep the distance to m, and in order to daringly mount a SELFOC lens array with high precision, there is no choice but to incur a significant increase in cost.
本発明は、結像光学系を精度良くかつ安価に取り付ける
ことにより、鮮明で濃度むらのない低コストのＬＥＤプ
リンタを提供することを目的とする。An object of the present invention is to provide a low-cost LED printer that is clear and has no density unevenness by installing an imaging optical system with high precision and at low cost.
以下、本発明の実施例を図面を用いて説明する。Embodiments of the present invention will be described below with reference to the drawings.
第６図に本発明のＬＥＤアレイ基板６０１の斜視図を示
す。６０２は放熱板をかねた基板であり、６０６はセラ
ミック基板等で構成される配線手段である。６０４は画
像信号や電源との接続を行うためのケーブルである。６
０５−１．６０５−２．φ・・は端面発光のＬＥＤをチ
ップの端に、複数個並べたＬＥＤアレイチップであり、
６０６−１．６０６−２．・０は、ＬＢＤアレイチップ
６０５−１．６０５−２．・・・を駆動するドライバ回
路、即ちケーブル６０４より入力される画像信号のシリ
アルパラレル変換回路等を内蔵したＬＥＤドライブＩＣ
である。このＬＥＤアレイチップ６０５ ｍとＬＥＤド
ライブＩ Ｃ６０６−ｍ （７）部分全拡大したものを
第７図に示す。FIG. 6 shows a perspective view of an LED array substrate 601 of the present invention. 602 is a substrate that also serves as a heat sink, and 606 is a wiring means made of a ceramic substrate or the like. 604 is a cable for connecting to an image signal and a power source. 6
05-1.605-2. φ... is an LED array chip in which multiple edge-emitting LEDs are arranged at the edge of the chip.
606-1.606-2. -0 is LBD array chip 605-1.605-2. . . . A driver circuit that drives..., that is, an LED drive IC that has a built-in serial-parallel conversion circuit for image signals input from the cable 604, etc.
It is. FIG. 7 shows a fully enlarged view of the LED array chip 605 m and LED drive IC 606-m (7).
ＬＥＤアレイチップ６０５−ｍは端面発光形式ＬＥＤ７
０１−１．７０１−２・・拳を１列に並べたモノリシッ
クＬＥＤアレイで、それぞれのＬ Ｅ Ｄ ７０１−１
．７０１−２０・ＰＮ接合面はＬＥＤアレイチップ６０
５−ｍと配線基板６０３との接着面と平行になっている
。そして光は、端面７０２−１．７０２−２．７０２−
５より矢印すの方向に出射する。Ｌ Ｅ Ｄ ７０１−
１．７０１−２・・φの電極は上面にあり、これとＬＥ
ＤドライバＩＣのＬＥＤドライブ端子７０３−１．７０
３−２．・・・とワイヤボンディングしである。The LED array chip 605-m is an edge-emitting type LED7
01-1.701-2...A monolithic LED array arranged in a row, each LED 701-1
．． 701-20・PN junction surface is LED array chip 60
5-m and the bonding surface of wiring board 603. And the light is the end face 702-1.702-2.702-
5, the light is emitted in the direction of the arrow. LED701-
The electrode of 1.701-2...φ is on the top surface, and this and LE
D driver IC LED drive terminal 703-1.70
3-2. ...and wire bonding.
第８図にＬＨＤ７０１−１の発光面７０２−１と感光ド
ラム１０１の面上の結像点の関係図を示す。本図は基本
的に第４−１図と同様であり、発光部分のＩＪＤの形状
がかわったものである。すなわち端面発光形式のＬＥＤ
を用いた場合においても発光面の結像形態は従来のまま
である。FIG. 8 shows a relationship diagram between the light emitting surface 702-1 of the LHD 701-1 and the imaging point on the surface of the photosensitive drum 101. This figure is basically the same as FIG. 4-1, except that the shape of the IJD of the light emitting part is different. In other words, an edge-emitting type LED
Even when using a light emitting surface, the imaging form of the light emitting surface remains the same as before.
第９図の（＆） （ｂ）に本発明のＬＥＤアレイ基板と
結像器の取付方法を示した。セルフォックレンズアレイ
４０１は高さ調整板９０１の厚みを調整し、ＬＥＤアレ
イチップ６０５１上の各ＬＥＤの発光面が、セルフォッ
クレンズアレイ４０１の集束性ロッドレンズの俵積みの
中心になる様にする。そして共役点をあわせた上で基体
９０２と、セルフォックレンズアレイ４０１、高さ調整
板９０１、ＬＥＤアレイ基板６０２を固定する。固定す
る際には、ねじどめで調整を行ってもよいし、共役点を
あわせるよう調整した上で、接着剤を各接合面に流し込
み固定する方法を用いてもよい。また、第９［Ｍ（ｂ）
のようにＬＥＤの発光面側を延長したＬＥＤアレイ基板
９０５上に配線手段６０３、ＬＥＤアレイチップ６０５
ｎ 等とセルフォックレンズアレイ４０１を共に載せ
てもよい。この様に端面発光式のＬＥＤアレイチップを
画像形成用の輝点発生器として用いて、ＬＥＤアレイチ
ップの接着面と平行な面にセルフォックレンズアレイ等
の結像器の１面を密着させ固定することにより、−行全
体に関し、発光面とセルフォックレンズアレイの集束性
ロッドレンズの俵積の中心とのずれの誤差を小さくする
ことが可能になった。FIG. 9(b) shows a method of attaching the LED array substrate and imager of the present invention. The SELFOC lens array 401 adjusts the thickness of the height adjustment plate 901 so that the light emitting surface of each LED on the LED array chip 6051 becomes the center of the stack of convergent rod lenses of the SELFOC lens array 401. . After aligning the conjugate points, the base body 902, SELFOC lens array 401, height adjustment plate 901, and LED array substrate 602 are fixed. When fixing, adjustments may be made using screws, or a method may be used in which the conjugate points are adjusted and then adhesive is poured into each joint surface and fixed. Also, the 9th [M(b)
As shown in FIG.
n etc. and the SELFOC lens array 401 may be mounted together. In this way, an edge-emitting LED array chip is used as a bright spot generator for image formation, and one surface of an imager such as a SELFOC lens array is tightly attached and fixed to a surface parallel to the adhesive surface of the LED array chip. By doing so, it became possible to reduce the error in the deviation between the light emitting surface and the center of the barrel area of the focusing rod lens of the SELFOC lens array for the entire - row.
以上説明したように、ＬＥＤプリンタにおいてＬＥＤア
レイとして端面発光式のＬＥＤアレイを用い、ＬＥＤア
レイチップの接合面と平行な面に結像系の１面を固着す
ることにより、すべてのＬＥＤの像を鮮明にかつ湯度む
らなく結像することが可能となり、しかも固定方法が単
純であり安価なプリンタを提供することが可能となる。As explained above, by using an edge-emitting type LED array as the LED array in an LED printer and fixing one surface of the imaging system to a surface parallel to the bonding surface of the LED array chip, the images of all the LEDs can be It becomes possible to form an image clearly and with uniform hot water temperature, and it is also possible to provide an inexpensive printer with a simple fixing method.
第１図は従来のＬＥＤプリンタの構成を示す概１′３
略図、第２図、第６図夫々従来のＬＥＤプリンタヘッド
の構成を示す概略図、第４−１図は従来のＬＥＤプリン
タにおけるＬＥＤ発光部と感光ドラムとの結像関係を示
す図、第４−２図は従来のＬＥＤの配光特性を示す図、
第５−１図は従来のＬＥＤアレイの発光面形状を示す図
、第５−２図は従来のＬＥＤプリンタにおける結像器の
取付方法を説明する図、第６図、第７図は夫々本発明に
用いるＬＥＤアレイ基板の構成を示す概略図、第８図は
本発明のプリンタの一実施例におけるＬＥＤ発光部と感
光ドラムとの結像関係を示す図、第９図（ａ）、（１）
）は各々本発明のＬＥＤプリンタにおける結像器の取付
方法を説明する図である。
６０１、９０３・・・ＬＥＤアレイ基板、６０２・・・
放熱板をかねた基板、６０３・・・配線手段、６０４・
・・ケーブル、６０５−１，６０５−２．・・番、６０
５−ｎ・・・端面発光のＬＥＤアレイチップ、
６０６−１，６０６−２．・・ｅ６０６−ｎ・・０ＬＥ
ＤドライブＩＣ。
７０１−１．７０１−２．７０１−′５・・・端面発光
のＬＥＤ。
７０２−１．７０２−２．７０２−３・・Φ端面、７０
３−１．７０３−２．７０３−３・・・ＬＥＤドライブ
端子、９０１・・・高さ調整板、９０２・・・基体。
出願人 キャノン株式会社Figure 1 is a schematic diagram showing the configuration of a conventional LED printer, Figures 2 and 6 are schematic diagrams showing the configuration of a conventional LED printer head, and Figure 4-1 is a schematic diagram showing the configuration of a conventional LED printer. FIG. 4-2 is a diagram showing the image formation relationship between the light emitting part and the photosensitive drum, and FIG. 4-2 is a diagram showing the light distribution characteristics of a conventional LED.
Fig. 5-1 is a diagram showing the shape of the light emitting surface of a conventional LED array, Fig. 5-2 is a diagram explaining how to attach an imager in a conventional LED printer, and Figs. FIG. 8 is a schematic diagram showing the configuration of the LED array board used in the invention; FIG. )
) are diagrams each illustrating a method of attaching an imager in the LED printer of the present invention. 601, 903...LED array board, 602...
Board serving as a heat sink, 603... Wiring means, 604.
... Cable, 605-1, 605-2. ...No. 60
5-n... Edge-emitting LED array chip, 606-1, 606-2.・・e606-n・・0LE
D drive IC. 701-1.701-2.701-'5... Edge-emitting LED. 702-1.702-2.702-3...Φ end surface, 70
3-1.703-2.703-3...LED drive terminal, 901...Height adjustment plate, 902...Base. Applicant Canon Co., Ltd.
Claims (1)
光ダイオードアレイの各発光ダイオードを選択的に点燈
させ、該発光ダイオードアレイの発光面を結像系によっ
て感光体上に結像してドツト分割した像を形成する発光
ダイオードを用いたプリンタにおいて、 前記発光ダイオードアレイを、端面発光するモノリシッ
ク発光ダイオードアレイチップにより構成し、該発光ダ
イオードアレイチップの基板への接着面と平行な面に、
前記結像系の１面を固着したことを特徴とする発光ダイ
オードを用いたプリンタ。(1) Each light-emitting diode in a light-emitting diode array in which a plurality of light-emitting diodes are arranged in at least one row is selectively turned on, and the light-emitting surface of the light-emitting diode array is imaged on a photoreceptor by an imaging system to form a dot. In a printer using a light emitting diode that forms a segmented image, the light emitting diode array is constituted by a monolithic light emitting diode array chip that emits light from an edge, and a surface parallel to a surface of the light emitting diode array chip that is bonded to the substrate,
A printer using a light emitting diode, characterized in that one surface of the imaging system is fixed.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58225066A JPS60116479A (en) | 1983-11-29 | 1983-11-29 | Printer using light-emitting diode |
| DE3438949A DE3438949C2 (en) | 1983-10-25 | 1984-10-24 | Printing device |
| GB08427039A GB2150395B (en) | 1983-10-25 | 1984-10-25 | Image formation apparatus |
| US07/004,318 US4700206A (en) | 1983-10-25 | 1987-01-08 | Image formation apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58225066A JPS60116479A (en) | 1983-11-29 | 1983-11-29 | Printer using light-emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60116479A true JPS60116479A (en) | 1985-06-22 |
Family
ID=16823499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58225066A Pending JPS60116479A (en) | 1983-10-25 | 1983-11-29 | Printer using light-emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60116479A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6240853U (en) * | 1985-08-28 | 1987-03-11 | ||
| JPS63199380A (en) * | 1987-02-16 | 1988-08-17 | Fuji Xerox Co Ltd | Optical printer |
| US5606181A (en) * | 1994-03-29 | 1997-02-25 | Ricoh Company, Ltd. | Edge emitting type light emitting diode array heads |
| JPH0985985A (en) * | 1995-09-25 | 1997-03-31 | Nippon Sheet Glass Co Ltd | Photoprinting head and rod lens unit |
| JP2000141745A (en) * | 1998-11-05 | 2000-05-23 | Ricoh Co Ltd | Optical apparatus |
| US8081360B2 (en) | 2009-03-18 | 2011-12-20 | Fuji Xerox Co., Ltd. | Light-collecting device, light-collecting device array, exposure device and image-forming apparatus |
| US8654421B2 (en) | 2010-02-12 | 2014-02-18 | Fuji Xerox Co., Ltd. | Exposure device and image forming device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5659260A (en) * | 1979-09-26 | 1981-05-22 | Siemens Ag | Charged latent image forming device for electronic printing |
| JPS5714058A (en) * | 1980-06-28 | 1982-01-25 | Ricoh Co Ltd | Printer |
-
1983
- 1983-11-29 JP JP58225066A patent/JPS60116479A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5659260A (en) * | 1979-09-26 | 1981-05-22 | Siemens Ag | Charged latent image forming device for electronic printing |
| JPS5714058A (en) * | 1980-06-28 | 1982-01-25 | Ricoh Co Ltd | Printer |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6240853U (en) * | 1985-08-28 | 1987-03-11 | ||
| JPS63199380A (en) * | 1987-02-16 | 1988-08-17 | Fuji Xerox Co Ltd | Optical printer |
| US5606181A (en) * | 1994-03-29 | 1997-02-25 | Ricoh Company, Ltd. | Edge emitting type light emitting diode array heads |
| JPH0985985A (en) * | 1995-09-25 | 1997-03-31 | Nippon Sheet Glass Co Ltd | Photoprinting head and rod lens unit |
| JP2000141745A (en) * | 1998-11-05 | 2000-05-23 | Ricoh Co Ltd | Optical apparatus |
| US8081360B2 (en) | 2009-03-18 | 2011-12-20 | Fuji Xerox Co., Ltd. | Light-collecting device, light-collecting device array, exposure device and image-forming apparatus |
| US8654421B2 (en) | 2010-02-12 | 2014-02-18 | Fuji Xerox Co., Ltd. | Exposure device and image forming device |
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