TW200301665A - Image display device and method of manufacturing the device - Google Patents

Abstract

A method of manufacturing an image display device is disclosed, which comprises the steps of disposing a screen mask having a mesh part or an opening part on a substrate through a specified gap, filling ink into the mesh part or the opening part, and feeding gas from the upper part thereof to transfer the ink on the substrate at specified positions, whereby a high-precision pattern can be transferred onto the substrate having irregularities without contaminating the surface of the substrate.

Description

00301665 A7 B7 V. Description of the Invention (1)-· Technical Field to which the Institute belongs (Please read the precautions on the back before filling out this page) The present invention relates to an image display device and a method for manufacturing the same, and more particularly, to the process of performing it on a substrate, etc. Pattern transfer method for pattern formation. 2. Prior art In recent years, portrait display devices have been used as personal computers, digital satellite broadcasts, DVDs, and other equipment for displaying highly visual information. Especially, instead of CRTs that require a large installation area, the demand for flat panel displays has increased. The flat panel display includes a liquid crystal display, a plasma display, an organic EL panel (electrically excited light panel), and the like. In order to be more popular, it needs to be provided at high performance and low cost. The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed an organic electroluminescence device. Patent Document 1 describes a three-layer structure of a hole transporting layer, a light emitting layer, and a cathode having a typical structure. In addition, in Patent Document 2, There are described a two-layer type that functions as both an electron transport layer and a light-emitting layer and a method that functions as both a hole transport layer and a light-emitting layer. Furthermore, Patent Document 3 describes a three-layer structure in which a carrier blocking layer exists between an electron transporting layer and a hole transporting layer, and functions as an electron transporting light emitting layer and a hole transporting light emitting layer, respectively. The construction. In addition, there are also two-carrier light-emitting layers that transport electrons and holes. If the ambivalent light-emitting layer can find an excellent and high-efficiency light-emitting material, it can be made into a single-layer type device composed of the simplest layered layer. In this way, the organic electroluminescent device can control its function by changing the structure of the light emitting layer. On the other hand, the liquid crystal display is sandwiched between a glass substrate forming a TFT circuit and a color by a polarizing plate that passes only light oscillating in one direction. This paper is in accordance with the Chinese National Standard (CNS) A4 specification (210'〆297). (Mm) -5- :: 00301665 A7 B7 V. Description of the invention (2) (Please read the precautions on the back before filling this page) The color filter used and the glass substrate on which the transparent electrode is fully formed A liquid crystal panel filled with liquid crystal in a sheet substrate, a printed circuit board equipped with an electronic circuit such as a control circuit and a driving circuit for controlling the TFT circuit, and a backlight using a cold cathode tube disposed outside the polarizer on the glass substrate side forming the TFT circuit, and Inverter circuit for controlling the light source. Among the components of the liquid crystal display, a color filter is relatively expensive. The color filter is formed by forming a colored layer of red (R), green (G), and blue (B) at the opening of a film called a black matrix, which is formed in a pattern of a glass substrate in a pattern such as a grid and has excellent light shielding properties. A method for forming a coloring material of a conventional color filter is described in Patent Documents 4 and 5. In addition, the production equipment is disclosed in Patent Documents 6 and 7. [Patent Document 1] Japanese Patent Publication No. 6-323 07 [Patent Document 2] Patent 2879080 [Patent Document 3] Intellectual Property Office, Ministry of Economic Affairs Printed by Employee Consumer Cooperative Patent No. 293 70 1 [Patent Document 4] Japanese Patent Laid-Open No. 1 1-337726 [Patent Document 5] Japanese Patent Laid-Open No. 2002-243928 [Patent Document 6] Patent No. 2734464 This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm) -6-: 00301665 A7 B7 V. Description of the invention (3) [Patent Document 7] Japanese Patent Laid-Open No. 8-227276 (please first (Please read the notes on the back and fill in this page) [Patent Document 8] Japanese Patent Laid-Open Publication No. 1 0-1 23 77 3. SUMMARY OF THE INVENTION In an organic electroluminescent device, in order to realize a full-color display, it is necessary to The pixels are finely patterned in red, green, and blue. Although there are many proposals for the full-color method, in fact, some attempts have been made on the panel trial. It can be presumed that: (1) the shadow mask is used to selectively form red, green, and blue light-emitting elements. The method is (2) a method of combining red, green, and blue color filters and a white light emitting element, and (3) a method of obtaining red and green light by using a blue light emitting element with a color conversion layer. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs These methods have their own advantages and disadvantages. For example, when organic light-emitting layers of three colors of red, green, and blue are arranged on a substrate, a wet process such as a photolithography method may not dissolve the organic layer, so it cannot be used. Therefore, a method for selectively forming each of the red, green, and blue light-emitting elements using a shadow mask for an organic layer in a vacuum evaporation tank is described in Patent Documents 6 and 7 described previously. Since this method requires film formation in a vacuum evaporation tank, there are problems of mass productivity such as long production time, high equipment cost, and large installation area. On the other hand, in recent years, there has been a trend to use inkjet printing used in business color list machines for industrial production. An on-demand method using a piezoelectric element has a feature that it is possible to accurately eject uniform and beautifully shaped ink droplets, which is described in Patent Document 8. Using this inkjet, the paper size is in accordance with Chinese National Standard (CNS) A4 specification (21〇 < 297 mm): 00301665 A7 B7 V. Description of the invention (4) The patterning of printed luminescent polymer is a low The cost of applying a red, green, and blue three-color organic light-emitting layer to a substrate is huge. However, the limit of absolute position accuracy on the substrate side of inkjet printing is about 100 microns, and it is difficult to control the positional accuracy of edges because the dot diameter is enlarged to 60 to 80 microns on the substrate. In order to form a high-definition full-color display, it is required to further refine the ink droplets. In addition, along with the nature of the ink material used, it is necessary to incorporate solvent-resistant or acid-resistant parts and special ink-repellent parts in the inkjet head. From the viewpoint of solvent resistance, long-term use of commercially available listing machines is difficult. In addition, production equipment not only controls the discharge of ink, but also requires maintenance mechanisms such as cleaning and cleaning. In addition, in order to minimize the ink flight curve when the ink is selectively applied to the substrate by ejecting the ink from the inkjet head, there is a problem such as that the gap between the nozzle of the inkjet head and the substrate needs to be narrowed. Therefore, instead of inkjet printing, a screen printing method using a screen mask conventionally used for patterning is considered. Screen printing methods generally have offset contact printing and contact printing. Offset contact printing is a printing method that sets a gap (gap) between the substrate and the screen mask, and forms a paste on the substrate through the opening of the screen mask when the doctor blade passes. However, as the pattern becomes more finely spaced, the interval becomes an important reason for easy penetration and connection. To solve this problem, contact printing without gaps is considered. The contact printing system closely contacts the substrate and the screen mask to prevent penetration and contact. However, in the case of contact printing, it is necessary to add the Chinese standard (CNS) A4 specification (210X297 mm) to the paper size via a screen mask:-• installation-(Please read the precautions on the back before (Fill in this page) Order printed by the Intellectual Property of the Ministry of Economic Affairs and the Consumers' Cooperatives-8- 200301665 A7 B7 V. The opening of the invention description (5) forms a paste on the substrate and separates the substrate and the screen mask Separation works. (Please read the precautions on the back before filling in this page.) In addition, the inkjet printing method is used to apply red, green, and blue organic light-emitting layers to the substrate. Therefore, it is necessary to increase the number of inkjet heads in order to shorten the operation time, but the screen printing method can fully pattern the substrate in a short time. In addition, in realizing a full-color display, in order to perform fine patterning of red, green, and blue at each pixel, it is necessary to form fine patterns of red, green, and blue in a recessed portion in a bank formed to separate pixels. However, these screen printing methods have difficulty in selectively forming a fine pattern in a recessed portion because a substrate and a screen mask are closely adhered to form a pattern. In addition, since the screen mask is closely attached to the substrate, the dirt inside the screen mask may adhere to the substrate. Therefore, without contacting the substrate with the screen mask, it is a problem to form fine patterns of red, green, and blue in the recesses in the bank formed for separating pixels. Printed by the Intellectual Property of the Ministry of Economic Affairs and Consumer Cooperatives. In addition, when the paste used in these screen printing methods is formed on a substrate, in order to maintain the shape of the paste, the viscosity of the paste must be as high as several 100 OPa · S. degree. However, an ink using a light-emitting polymer used in inkjet printing dissolves the light-emitting polymer in an organic solvent to a concentration of 1 ° /. To the extent that the viscosity is extremely low to about 10 mPa · S, the conventional screen printing method cannot be applied. In addition, the organic solvent that can dissolve the light-emitting polymer has its limit, and it is difficult to make the viscosity of the ink as high as that of the paste used in the screen printing method. Therefore, using inks with low-viscosity luminescent polymers, the paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -9- 200301665 A7 ____B7 V. Description of the invention (6) Embankment formed away from pixels The formation of a fine pattern of red, green, and blue in the concave portion in the inner portion becomes the second problem. (Please read the precautions on the back before filling in this page.) On the other hand, the formation of the color layer of the color filter is described in Japanese Patent Application Laid-Open No. 1 1 -3 3 772. In the formation method, it is necessary to further improve the formation accuracy, output rate, and cost. Therefore, an object of the present invention is to provide a pattern transfer method that can perform pattern formation in a short time, high material utilization rate, low cost, and high accuracy, and can perform pattern formation in a recessed portion of a substrate or the like, and a method using the method. Formed image device and manufacturing method thereof. The pattern transfer method of the present invention is a pattern transfer method for forming a pattern on a substrate or the like by using a proximity transfer method, and is characterized in that a screen mask forming a transfer pattern is set on a substrate with a certain interval. After that, apply the ink to the full screen mask, fill the screen portion or opening portion of the screen with ink, and scrape off the excess ink other than the pattern portion with a scraper or squeegee. After that, use a spray gas. The ink is blown onto the substrate from the mesh portion or the opening portion of the aforementioned screen, thereby transferring the ink onto the substrate according to the pattern of the screen mask. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs In addition, the proximity transfer device of the present invention is a proximity transfer device used to implement the pattern transfer method of the present invention, and is characterized by having: The screen portion or opening portion of the mask is filled with ink, and a scraper or a scraper is used to scrape excess ink other than the pattern portion; and the screen portion or the opening portion is above the screen portion Blow out the spray gas, spray the ink coated on the screen onto the substrate through the front or opening of the screen mask, and use the spray gas to spray the paper. The paper size is applicable to Chinese National Standard (CNS) A4. (210X297 mm) -10- 200301665 A7 B7 V. Description of Invention (7) Coating means. (Please read the precautions on the back before filling out this page) The pattern of the screen mask can be made by attaching a mesh of stainless steel, polyester, polyester fiber, nylon, etc. to the screen frame, for example, using a photosensitive resin film A method of forming a pattern on a mesh of a photosensitive resin such as a photosensitive emulsifier, a method of attaching a metal foil to a screen frame, and forming a metal film pattern by etching the metal foil, etc., and attaching a resin to the screen frame Foil, a method of forming a resin film pattern by laser processing a resin foil or the like, or a method of forming a metal pattern on a mesh by an electrical casting method, etc., to form a mesh mask having a highly accurate pattern. This is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In the pattern transfer method and proximity transfer device of the present invention, the ink is fully applied to the screen mask, and the screen portion or the opening portion of the screen mask. Fill the ink with a scraper or a scraper to scrape off the excess ink other than the pattern part, and then use the spray gas to blow the ink from the mesh portion or opening portion of the screen mask to the substrate, thereby blowing the ink off the substrate. It becomes possible to perform pattern transfer on a substrate. Therefore, the present invention is different from the conventional screen printing which prints while applying an external force to the screen mask, and can form a pattern with high accuracy and accurately transfer the pattern in a recess of a substrate or the like. Screen printing can be performed in the same manner as the pattern transfer method of the present invention. That is, the interval control tool is used to control the interval between the screen mask and the glass substrate on the screen. The gap between the screen and the substrate fixing stage is cut off from the outside with a gap control tool, and a small amount of gas is introduced into the gap between the screen and the substrate fixing stage. By increasing the pressure of the gas larger than the outside, the screen mask and glass can be maintained. Space between substrates. This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm) -11-200301665 A7 ___ B7 V. Description of the invention (8) (Please read the precautions on the back before filling this page) It is necessary to use the plate separation by the tension of the screen mesh. Therefore, it can be the same as the pattern transfer method of the present invention, can form a high-precision pattern, and it is 10 to 15 of the screen 3 with respect to the conventional pattern formation area. %, The pattern formation area in the screen plate 3 can be enlarged to 30 to 50%. Fourth Embodiment The following describes an embodiment of the present invention. A day image display device using organic electric excitation light will be described as an example. The organic electroluminescence device is sequentially performed: a process of forming a bank for element separation on an anode electrode formed on a glass substrate, forming a hole having at least an anode electrode that guides light into the hole, and Electrode transport in the light-emitting layer, the separation of each element, and the separation of the organic film that emits red, green, and blue light to make it emit light. The cathode electrode transports electrons. Electron cathode electrode. Printed by the Intellectual Property of the Ministry of Economic Affairs, the Consumer Cooperative, and Organic Light Excitation Device is a device that emits light by applying an electric field to a fluorescent compound to excite it. The light-emitting mechanism is caused by implanting electrons and holes from the outside, and exciting the light-emitting center by recombining energy with them. The structure of the organic electroluminescent device will be described below. First, an anode (ITO electrode), a hole transporting layer, a light emitting layer, and a cathode are sequentially laminated on a glass substrate. If an electric field is applied between the anode and the cathode, the hole is implanted from the anode's ITO electrode toward the hole transporting layer; on the other hand, the electrons from this paper size apply the Chinese National Standard (CNS) A4 specification (210X297 mm) -12 · 200301665 A7 B7 V. Description of the invention (9) (Please read the notes on the back before filling this page) The cathode is implanted toward the light-emitting layer, and the electrons and holes are combined to emit light. The materials used here are anode metal oxide (indium / tin oxide) and cathode metal (magnesium / aluminum, etc.), but the hole transporting layer / light emitting layer is an organic compound. The typical structure of an organic electroluminescent device is a three-layer structure as described in Patent Document 1, but Patent Document 2 describes a two-layer type that functions as both an electron transport layer and a light-emitting layer and also serves as a hole transport layer. Way with luminescent layer. In this method, the holes of the light emitting layer are implanted from the anode, and are closed in the light emitting layer by the electron transport layer. Therefore, as in the case where the electron transporting layer is also a light emitting layer, the recombination efficiency is improved. In addition, in the three-layer structure, Patent Document 3 describes that a carrier blocking layer exists between the electron transporting layer and the hole transporting layer, and each acts as an electron transporting light emitting layer and a hole transporting light emitting layer. Proposed role. In this method, the light emitting colors can be mixed because the upper and lower light emitting layers function separately. Printed by the Intellectual Property of the Ministry of Economic Affairs ^ 7 Employees' Cooperatives In addition, there are also bipolar light-emitting layers that are transported by both electrons and holes. If an amphiphilic light-emitting layer can find an excellent and highly efficient light-emitting material, it may become a single-layer element formed of the simplest organic layer. In this way, the organic electroluminescent device can control its function by changing the structure of the light emitting layer. Charge carriers (carriers) are chemically anionic (electron) and cationic (hole). That is, at the cathode-organic compound interface, an organic molecule is given electrons to reduce it to generate an anionic group. At the cathode-organic compound interface, electrons are seized and oxidized to generate a cationic group. The size of this organic paper is applicable to the Chinese National Standard (CNS) A4 (210X297 mm) -13- 200301665 A7 B7 V. Description of the invention (1 () The electron movement in the compound is imparted by electrons between adjacent molecules Jumping mechanism. The conditions of the light-emitting layer can include: high quantum absorption, good film formation, high carrier transportability, etc. Element characteristics expect high brightness and luminous efficiency (quantum absorption) and long life. Although luminescent materials can be used Low-molecular fluorescent pigments, fluorescent polymers, metal complexes, etc., but these materials need to meet ... When an electric field is applied, holes can be implanted from the anode side, and electrons can be implanted from the cathode side. Into the charge transfer, the hole and electron recombination site, high luminous efficiency, etc. Here, in order to easily implant the hole, the ionization energy of the light-emitting layer is expected to be 6. OeV or less, in order to easily implant the electron, the electron is expected Affinity is above 2.5eV. Well-known light emitters include: tris (8-quinoline) aluminum complex (Alq), bis (benzoquinoline) beryllium complex (BeBq), and tris (benzopyrene) first Phenanthroline fluorene fluorene complex (Eu (DBM) 3 (Phen)), dimethyl fluorene vinyl biphenyl (DTVBi), etc. These compounds are described in Japanese Patent Laid-Open No. 59-1 94393, Japanese Patent Japanese Patent Application Laid-Open No. 9-241629, Japanese Patent Application Laid-Open No. 1 1-1 to 85957, etc. The polymer light-emitting body has a fluorescent poly (p-phenylene vinyl), and a 5 conjugate such as polyalkylthiolocene. Polymers. Among these polymers, various types of polymers can be synthesized from carrier transportability to electron transportability through the introduction of substitution groups to control carrier transportability. These compounds are described in Japanese Patent Laid-Open No. 3-273 Gazette No. 087. In organic electroluminescent devices, a laminated structure that separates the light-emitting layer from the carrier transport layer is usually used. Most of the hole transport layers are derived from aromatic amines. The paper dimensions are applicable to Chinese National Standard (CNS) A4 specifications ( 210X297 mm) ------: --- install-(Please read the notes on the back before filling this page), order d Printed by the Ministry of Economic Affairs Intellectual Property 笱 Employee Consumer Cooperatives -14- 200301665 A7 B7 5 2. Description of the invention (ii) (Please read the (Please fill in this page if necessary). TPD is widely used as a hole transporting material because its ionization potential is as small as 5.4eV and the vapor deposition film shows a high hole mobility of 0.001cm2 / Vs. These compounds are described in Japanese Patent Laid-Open No. 4-212287. The hole-transporting layer of a polymer compound that incorporates TPD into the main chain and side chains is also being investigated. Electronic transport materials can use 1, 3, and 4-oxazole derivatives. And 1, 2, 4-triacetic acid derivatives (TAZ). These compounds are described in Patent Publication No. 293 70 15, Japanese Patent Application Laid-Open No. 1 0-25 1 634, and the like. In particular, TAZ has an ionization potential as large as 5.9 eV and high hole blocking properties. Therefore, if a hole-transporting compound laminated TAZ can be used as a hole-transporting light-emitting layer, the TPD can be used as a hole-transporting layer. By stacking with TAZ, the function of the light-emitting layer can also be exerted. The materials used in the anode of organic electroluminescent devices use holes to implant electrically conductive compounds of metals and alloys with high energy and large power functions. Examples of such compounds are: gold, copper iodide, tin oxide, ITO, and the like. In order to obtain light emission from these electrodes, those having high transmittance in the visible light region are preferred. ITO with high transmittance is used the most. Printed by the Intellectual Property of the Ministry of Economic Affairs and the Consumer Cooperatives, the cathode uses metals and alloys with a small power function (below 4. OeV). Although alkali metals, alkaline earth metals, and Group III metals such as gallium and indium can be considered, magnesium, which is cheaper and more chemically stable, is most widely used. Because magnesium is easily oxidized in air, silver and copper are added. 5 ~ 10% to prevent oxidation. In addition, this improves the adhesion between the organic layer and the electrode. In addition, alloying for preventing deterioration is also being investigated. Next, it will be explained that the most common ITO / hole transport layer / light-emitting layer / this paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) -15- 200301665 A7 B7 V. Description of the invention (1 彡

Manufacturing method of organic electroluminescent device formed by Mg alloy. (Please read the precautions on the back before filling out this page) The anode system will be used as a substrate for those who produce ITO films on the glass by evaporation or sputtering. An organic thin film is formed on this ITO glass by a vacuum evaporation method or the like. The vacuum evaporation system first puts hole transport materials and luminescent materials on other substrates or crucibles, puts them into a vacuum tank, and evacuates them to a vacuum. Next, the substrate or the crucible is heated (resistance-heated) so that the vapor deposition rate of the organic compound becomes specific. The cathode is also formed on an organic thin film by a vacuum evaporation method. A mask matching the shape of the electrode was placed on the organic thin film and evaporated. In the case where an electrode made of an alloy of two or more metals is produced, an individual substrate or crucible is used to control the evaporation rate to a specific composition. The methods that replace the vacuum evaporation method include a spin coating method and a die casting method. These methods are methods in which an organic compound is dissolved in a volatile solvent, coated on a rotating substrate or a stationary substrate, and the solvent is evaporated to obtain a thin film. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs An embodiment of the organic electroluminescent device of the present invention will be described in detail with reference to the drawings. In the organic electroluminescence device, the organic materials used in the part that contributes to light emission include low-molecular material systems and high-molecular material systems. The present invention is not limited thereto, and may be a mixture of both. The structure of the organic electro-optical device based on low molecular materials is generally glass substrate / anode electrode / hole implantation layer / hole transport layer / light emitting layer / electron transport layer / cathode electrode. On the other hand, the structure of an organic light emitting diode device based on a polymer material is generally a glass substrate, a cathode electrode, a hole transporting layer, a light emitting layer, and a cathode electrode. In the case of organic electroluminescence devices of polymer materials, there are holes in this paper. The size of the paper is applicable to Chinese National Standard (CNS) A4 (210X 297 mm) -16- 200301665 A7 B7 V. Description of the invention (1present (please (Please read the precautions on the back before filling in this page.) The transport layer has both a hole implantation layer and a hole transport layer in a low molecular material organic electroluminescent device. In the organic electroluminescent device of the present system, there is a case where only the cathode electrode is used instead of the electron transport layer / cathode electrode of the organic electroluminescent device of the low molecular material type. In addition, it is not limited to the materials used in this embodiment, The composition, etc., is an embodiment for realizing the organic electroluminescent device. The device for realizing the pattern transfer method of the present invention will be described with reference to the outline drawing in Fig. 1. In Fig. 1, the 1 series is coated with ink. 6 coating method (squeegee), 2 series spraying method (beam spray nozzle) for spraying gas 7. In addition, the 3 series device has a screen with a screen mask for transfer opening pattern 4 and the 5 series Transfer pattern In addition, the 8-series control device is a tool (interval control tool) for the space between the screen cover of the screen 3 and the dike-containing substrate 5 and the 9-series control device is fixed to the dike-containing substrate 5 under reduced pressure and fixed. Worktable (substrate fixing table) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs as shown in Figure 1. Set the substrate 5 including the bank on the substrate fixing table 9 and use the fine holes provided in the substrate fixing table 9 The suction opening is fixed under reduced pressure. In addition, the transfer opening pattern 4 of the screen 3 of the screen mask of the apparatus is aligned with the transfer position of the bank substrate 5 including the bank, and the device is controlled by the interval control tool 8 The distance between the screen mask of screen screen 3 and the substrate with embankment 5. If the screen screen 3 becomes larger, the tension between the screen screen and the screen becomes impossible to control the interval between the screen mask and the bank with embankment 5, and the screen can be expected. The central part of the mask may be loosened due to its own weight. In this case, the interval control tool 8 can be used to separate the space between the screen 3 and the substrate fixing table 9 and the outside. The Chinese paper standard (CNS) A4 specification is applicable for this paper size (210X297 (Mm) -17 · 200301665 A7 B7 V. Description of the invention (with ---------― 丨 (please read the precautions on the back before filling this page), cut off and introduce some trace gas into the screen 3 The distance from the substrate fixing table 9 can maintain the distance between the screen mask and the bank-containing substrate 5 by making the pressure higher than the external air pressure. In this case, depending on the nature of the ink, there may be a faster drying speed. Therefore, Since the ink 6 is dried due to the introduced gas, the opening portion 4 of the screen mask may be blocked, and the ink 6 may not be quantitatively transferred. In this case, the gas between the screen plate 3 and the substrate fixing table 9 may be blocked. It can be kept in a gaseous environment containing the solvent in the ink to prevent the ink 6 from drying. D Next, place the ink 6 on the screen mask so that the scraper 1 is in close contact with the screen mask, and the screen mask At an angle of about 70 ° with the doctor blade 1, the ink 6 is scraped off with the doctor blade 1 while the ink 6 is filled in the opening pattern 4 for transfer. In Figure 1, this is achieved by moving the scraper from left to right. Next, the beam-shaped spray nozzle 2 is brought into close contact with the screen mask, and the spray gas 7 is blown out from the nozzle. As with the scraper 1, 'the scraper can be moved from left to right, so that the grave can be filled in the opening pattern for transfer. The ink 6 of 4 is transferred into the bank of the substrate 5. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. For other devices used to implement the pattern transfer method of the present invention, reference is made to the outline drawing of Figure 2 for explanation. Here, 10 is a coating method (squeegee) for coating the ink 6 and is set to be a method of filling the ink 6 while scraping the ink while facing the screen opening pattern 4 while being almost perpendicular to the screen mask. Except for the coating means for applying the ink 6, the method is the same as that shown in Fig. 1, and the ink 6 can be transferred to the bank containing the bank substrate 5. In addition, screen printing can be performed by the same method as the pattern transfer method of the present invention. A glass substrate is set on the substrate fixing table, and it is fixed under reduced pressure by using pores provided in the substrate fixing table. In addition, the paper size used in this paper applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -18- 200301665 A7 _B7 V. Description of the invention (1 cold (please read the precautions on the back before filling this page) After aligning the opening pattern of the screen of the mask with the pattern formation position of the glass substrate, the interval control tool is used to control the interval between the screen mask and the glass substrate of the device on the screen. Large, the tension of the screen mesh becomes unable to control the interval between the screen mask and the glass substrate. It is expected that the center of the screen mask may loosen due to its own weight. In this case, the interval control can be used. The tool cuts off the space between the screen and the substrate fixing stage and introduces a small amount of gas into the space between the screen and the substrate fixing stage. By making the pressure higher than the external air pressure, the screen mask and the glass substrate can be maintained. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, because the plates are not separated by the tension of the screen mesh, compared to the conventional pattern formation area is 10 to 15% of the plate can expand the pattern formation area in the screen to 30 to 50%. In addition, when a small amount of gas is introduced into the space between the screen and the substrate fixing table, depending on the nature of the ink, There are also those with a high drying speed. Therefore, the ink may be dried due to the introduced gas, which may block the opening of the screen mask and fail to form a pattern. In this case, the gas between the screen and the substrate fixing table may be used. Circulation can be maintained in the gas environment of the solvent contained in the paste, which can prevent the paste from drying due to the gas. Next, place the paste on the screen mask so that the scraper is in close contact with the screen mask. When the angle between the screen mask and the squeegee is about 90 °, scrape the paste with the squeegee and fill the paste with the opening pattern. Next, make the scraper and the screen mask in close contact with each other. By moving the scraper, the paste filled with the opening pattern can be transferred to the glass substrate. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -19- 200301665 A7 B7 V. Description of the invention ( (Please read the note on the back first Please fill in this page for details.) Although the embodiment of the present invention is an organic electroluminescent device, this technology is not limited to this. It can also be used in inorganic electroluminescent devices, plasma display devices, field emission display devices, etc. For example, in inorganic electro-optical devices, transparent electrode formation on front substrates, bus electrode formation, dielectric film formation, address electrode formation on back substrates, dielectric film formation, and light-emitting layer formation can be used. In addition, in the plasma display device, bus electrode formation on the front substrate, dielectric film formation, address electrode formation on the back substrate, dielectric film formation, rib formation, phosphor formation, etc. can be utilized. In the emission display device, transparent electrode formation on the front substrate, black matrix formation, phosphor film formation, address electrode formation on the rear substrate, electron source electrodes (including nano carbon tubes), formation, and rib fixing can be utilized. Formation of frit glass (frit g 1 ass), etc. In addition, these pattern transfer methods are not limited to the method of manufacturing an image display device, and they can also be used for general thick film electrode wiring and insulation layer formation. Printed by the Intellectual Property Agency of the Ministry of Economic Affairs and the Consumer Cooperative (Embodiment 1) An embodiment of the pattern transfer method of the present invention will be described with reference to FIG. In Fig. 3, 1 is a coating means (squeegee blade) for applying ink, and 2 is a spraying means (jet nozzle) for spraying gas. In addition, 3 is a screen plate in which the device has a screen mask of the opening pattern 4 for transfer. Reference numeral 5 is a substrate including a bank for transferring graphics. Here, the scraper 1 is not applicable to the ink 6 and the paper size of the ink. Chinese national standard (CNS) A4 specification (210X297 mm) -20- 200301665 A 7 B7 V. Description of the invention (1 is (please read first Note on the back, please fill out this page again) Those affected by the solvent contained in 6. Therefore, in the manufacturing process of the organic electroluminescent device of the present invention, materials such as a hole transport layer and a light emitting layer are considered, and the scraper 1 is used Silicone rubber. In addition, although the blade 10 is made of stainless steel, but it is slightly corroded, a resin coating is used to improve the corrosion resistance. In addition, the screen 3 is made of stainless steel and polyester on the screen frame. Networks such as Teflon, Nylon, etc., are formed on the network by forming a pattern (a film pattern through which ink does not pass) opposite to the pattern transferred to the substrate. The pattern portion of the substrate is formed with a screen mask with openings. Intellectual property of the Ministry of Economic Affairs and the employee consumer cooperative are printed in the pattern transfer method of the present invention, as shown in FIG. 3A. First, in the mesh shape, After passing through the film, the screen mask forming the opening 4 in the specific pattern portion is set at a certain interval and set on the bank substrate 5. The ink is placed on the screen mask, and the scraper 1 or the scraper is used. 1 〇 Remove excess ink other than the pattern part, and fill the screen part or opening part of the screen mask with ink. After that, as shown in FIG. 3B, the spraying gas 7 is blown toward For the screen mask, the ink 6 filled in the mesh part or the opening part 4 of the screen mask is blown off the bank substrate 5 and the pattern transfer is performed on the bank substrate 5. With this, the completion The embankment-containing substrate 5 of the transfer ink 6 shown in Fig. 3C. After that, the solvent contained in the ink 6 is dried and removed in a drying furnace, and the substrate shown in Fig. 3D can be produced. Using Figs. 4 to 6 Explain the embodiment of the organic electro-optical excitation device of the present invention. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -21-200301665 A7 B7_ V. Description of the invention By the sputtering method, the size is 340 mm square and the thickness is 0. 7mm glass plate (Please read the precautions on the back before filling in this page) 11 (Conning # 1 73 7) ITO with area resistivity of about 10n / cm2 or less. After applying a protective resist on the side of the ITO film forming surface of this glass plate, it was cut into a square of 125 mm, the surface was chamfered, and the protective resist was removed with acetone. Next, the glass substrate 11 was subjected to ultrasonic cleaning with IP A, and after drying, the thickness of the ITO film forming surface was evaporated to 0. 1 // m of Cr. In addition, after ultrasonic cleaning and drying with IPA, a positive resist (FPR-800, manufactured by Tokyo Yingkao Chemical Co., Ltd., and a viscosity of 30 mPa_s) were spin-coated on the substrate with a spin number of 1,300 rpm and 60 seconds. ), Pre-bake in a baking oven at 90 ° C for 25 minutes. A glass dry plate having a specific mask pattern is aligned, and exposure (20sec) and development are performed (OFPR / DE-3, manufactured by Tokyo Chemical Co., Ltd.). After development, the Cr film was etched with uranium nitrate second ammonia solution, washed with water, and dried. This is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs to form the same Cr pattern as the wiring pattern of ITO. In order to check the Cr pattern through light, when a disconnection or pinhole occurs, at this point, use The resist is corrected. Here, by performing vapor deposition of the Cr film, it is not only easy to perform a microscope inspection with transmitted light during pattern inspection, but also to protect the ITO film during TIO etching. After that, it was baked in a baking oven at 120 ° C for 30 minutes. Next, the mixed solution of ferric chloride and hydrochloric acid was used to etch the ITO film at a liquid temperature of 3 ° C, washed with water, and dried. Thereafter, the positive resist was peeled off while applying ultrasonic waves with acetone, and ultrasonic cleaning was performed with IPA. 、 Dry. The pattern inspection of ITO is the leakage inspection of the testing machine. In the case of leakage, the paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -22- 200301665 A7 B7 V. Description of the invention (1 session (Please read the precautions on the back before filling in this page), and use the laser method to cut off the laser and repair it. At this time, the probe of the testing machine is not directly in contact with the ITO film, and it is on the Cr film. It is also possible to prevent damage caused by the stylus. Next, the Cr film is removed by etching with a second aqueous solution of acid and acid. In this case, in order to facilitate the alignment of post-processing, the Cr film is Before the etching is removed, only the alignment mark portion is protected with asphalt to prevent it from being etched. In this way, the anode electrode 12 is formed on the glass plate 11 shown in FIG. 4A. (2) The insulation layer forms the intellectual property of the Ministry of Economic Affairs. Consumer cooperatives The glass substrate 11 was washed with IPA to form the anode electrode 12 and dried. Then, the film thickness was 1 # m by an electron beam method at a deposition rate of 3 A / sec and a temperature of 300 ° C. Cu. In addition, after ultrasonic cleaning and drying with IPA, a positive resist (OFPR-800 manufactured by Tokyo Chemical Co., Ltd., viscosity: 30 mPa.  s), pre-bake in a baking oven at 90 ° C for 25 minutes. A glass dry plate formed with a specific mask pattern is aligned, exposed (20sec), and developed (OFPR / DE-3 manufactured by Tokyo Chemical Co., Ltd.), and baked in a baking oven at 120 ° C for 30 minutes. Thereafter, the Cu film 'was etched with an aqueous solution of ammonium persulfate, washed with water, and dried. In addition, a glass positive anti-uranium agent was applied with acetone and ultrasonic waves, and IP A was used for ultrasonic cleaning and drying. Next, a SiO 2 film and an AI 2 O 3 film were formed by a sputtering method. The Si02 film was set to three types of film thicknesses of 500A, 1000A, and 2000A, and the Al203 film was set to 200 persons. After that, the Cu film was removed by etching with a nitric acid aqueous solution, and the paper was washed and dried. The paper size is in accordance with the Chinese National Standard (CNS) A4 (210X297 mm) -23- 200301665 A7 B7 5. Description of the invention (2 () (Please read first Note on the back side, please fill in this page again.) In this way, the Si02 film of the insulating layer is not formed by the uranium etching of the Si02 film of the fluoric acid-based etching solution, which can prevent damage to the glass plate and ITO, surface changes, etc. Although the insulating material can only satisfy the insulating property with the Si02 film, in this embodiment, in order to improve the adhesion of the polyimide used in the embankment formation in the later process, the ai2o3 film is formed. In this way, the film is formed as in Section 4A. The pattern of the insulating layer 1 3 of the Si02 film and the Al203 film shown in the figure. (3) Embankment formation After the glass substrate 11 formed to the insulating layer is ultrasonically cleaned and dried with IPA, the number of revolutions is 2000r * mp. The polyurethane paste (PIX-3400 manufactured by Hitachi Chemical Co., Ltd.) was spin-coated for 80 seconds, and pre-baked at 140 ° C for 20 minutes. A positive resist was spin-coated on the substrate at 1 300 rpm for 60 seconds. Agent (ofpr -800, viscosity 60cp), pre-baking in a baking oven at 90 ° C for 25 minutes. The film thickness of the polyurethane after pre-baking is 12 // m ° Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs After the glass dry plate having a specific mask pattern was aligned and exposed (30 sec), OFPR / DE-3 manufactured by Tokyo Induction Co., Ltd. was used to pattern the polyimide at the same time as the development of the positive antifoam agent. Bake in a baking oven at 120 ° C for 30 minutes. After that, wash with water and dry, check the polyimide pattern under a microscope, immerse it in acetone, and peel off the positive resist. After washing with IPA The glass substrate formed into a bank shape of polyimide is heat-treated at 200 ° C for 30 minutes, and then heat-treated at 350 ° C for 1 hour to harden it. This paper is applicable to China Standard (CNS) A4 specification (210X297 mm) -24- 200301665 A7 B7 V. Description of invention (21) (Please read the precautions on the back before filling this page) In this project, for example, on the surface of IT 0 of the anode electrode Pollution caused by organic matter 'cannot obtain special characteristics required on ITO surface A sufficient work function. Therefore, it needs to be cleaned by oxygen plasma treatment, ultraviolet / ozone treatment, ultrasonic cleaning treatment, etc. In this embodiment, a dry etching device is used to set the oxygen gas flow rate. 150sccm, controlling the pressure in the cavity to 200mTorr, and performing oxygen plasma treatment with RF power 1 kW for 15 seconds. In the formation of the hole transporting layer of the post-engineering, in order to reduce the wetting of the hole transporting layer on the surface of the dyke material In order to form a uniform thickness on the anode electrode, a plasma treatment with CF6 gas is required. Same as oxygen plasma treatment, CF4 gas was set to a flow rate of 100 sccm using a dry etching device, the pressure inside the cavity was controlled at 200 mT0rr, and CF 6 plasma treatment was performed with RF power of 1 kW for 15 seconds. To carry out the liquid-repellent treatment. In this way, a glass substrate 11 can be formed to form a bank 14 of polyimide as shown in Fig. 4B. The shape of this dyke of polyurethane is 9. 6 // m, rectangle with an opening size of 72 // mX128 // m, and rectangle with a size of 56 // mX112 // m in the lower (glass substrate side). Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs In this embodiment, although a common photoetching method is used to form the dyke of polyurethane, as long as a specific shape can be obtained, it is not limited to this embodiment. For example, the pattern transfer method of the present invention and the conventional screen printing technique can also be used to form a bank. The dyke materials used in this case include polyimide paste for screen printing, maleimide vanishine, polyimide paste, etc. High denaturation is preferred, and organic or inorganic additives can be dispersed. In addition, as the dike material, the paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) -25- 200301665 A7 B7 V. Description of the invention (2 $ (Please read the precautions on the back before filling this page) 'It is not limited to polyimide-based materials, as long as it has low hygroscopicity, and the production process and the use of display gas as a display device have less gas generation. In addition,' black pigments and black can be dispersed in the embankment material. The dyke is used as a black matrix. (4) Formation of the hole transporting layer First, the method of manufacturing the screen mask 15 used to form the hole transporting layer by the pattern transfer method will be explained. The screen frame is attached with a mesh 16 of stainless steel, polyester, Tedlon, nylon, etc., and a pattern opposite to the pattern transferred on the substrate is formed on the mesh 16 (the film pattern 17 that the ink does not pass through) By doing so, a screen mask 15 with an opening can be formed on the pattern portion transferred to the substrate. The employee's cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints this screen mask 15 to form a transfer With the method of opening patterns, The method is to put a stainless steel mesh 16 on the screen frame, and use a photosensitive emulsion 17 to form a pattern on the screen mask 15. In addition, a method of forming a transfer opening pattern on the screen mask 15 There is a method of putting a mesh 16 of polyester, tetoron, nylon, etc. on a screen frame, for example, a method of forming a pattern on the mesh by using a photosensitive resin 17 such as a photosensitive resin film or a photosensitive emulsion. And a method of putting a metal foil on a screen frame, forming a metal film pattern by etching the metal foil, etc., a method of putting a resin foil on a screen frame, and forming a resin film pattern by laser processing the resin foil, or the like The method of forming a metal pattern on a mesh by an electric casting method, etc. In either case, it is possible to form a paper with high accuracy for transfer. The size of this paper is applicable to China National Standard (CNS) A4 (210X297 mm)- 26- 200301665 A7 B7 V. Description of the invention (screen mask 15 with a two-point opening pattern.) In this embodiment, a photo-screen resin for screen mask formation manufactured by (Stock) Tokyo Manufacturing Services is used. The mesh of the plate is patterned (screen mask pattern is formed). On that occasion, the stainless steel mesh uses a 500 mesh with a wire diameter of 18 // m, an opening size of 33 // m, and an opening area of 42% The photosensitive resin for screen mask formation is based on the use of an emulsion with excellent solvent resistance (product name: NSL, manufactured by Tokyo Process Services: NSL), and a film thickness of 1 5 // m. In addition, the pattern of the opening portion only needs to be It is sufficient to have a volume capable of keeping the amount of ink used for filling the levee formed on the substrate. The screen mask used in this embodiment has a discharge amount of 14. 3ml / m2, can form a film thickness of 14. 3 // m person. Therefore, it is necessary to calculate the volume of ink filling in the bank formed on the substrate to determine the opening of the screen mask. Therefore, the area of the screen mask opening is set to be approximately 40% smaller than the area of the upper part of the embankment. The screen frame is made of aluminum casting without distortion, high tension and high precision printing. In addition, when a screen frame uses an aluminum tube for weight reduction, a cross has been provided inside the tube in order to increase rigidity. In the pattern transfer method of the present invention, as shown in Fig. 4C, after a film (emulsion 17) is formed on the mesh 16 first, a mesh of openings is formed in a specific pattern portion. The plate mask 15 is set on the glass substrate 11 forming the bank 14 and the insulating layer 13 so as to have a certain interval. On the screen mask 15, an ink 18 for transporting materials by holes is placed. The scraper scrapes off the excess hole 18 to transport the material's ink 18 other than the pattern part, and the mesh 16 or the opening part of the screen mask is charged with the hole 18 to transport the material's ink 18. This paper size applies to China National Standard (CNS) A4 (210 X297 mm ^) (Please read the notes on the back before filling.  : Write this page} Printed by the Intellectual Property of the Ministry of Economic Affairs ^ Printed by Employee Consumer Cooperatives -27- 200301665 A7 B7 V. Description of the invention (24 Here '18 of the ink used for hole transport materials is a polymer using conductive polymers (3, 4_ Ethylene dioxosulfur) and a dopant-containing polystyrene stone wind acid colloidal solution (BYTRON P-CH-8000 manufactured by Bayer). The concentration of this ink is about 1%, and the volume after drying becomes about 1/100 Therefore, in order to form a thickness of 100 nm, a thickness of about 100 times needs to be transferred. From the concentration of the ink used and the thickness formed, according to the height of the embankment 14, the mesh 16 used for the screen mask It is important to adjust the amount of transfer, such as the size of the emulsion, the thickness of the emulsion 17, and the size of the opening. In addition, in this embodiment, although a squeegee or a squeegee is used to screen the mesh 1 of the screen 1 5 6 or the opening part 塡 charge the hole to convey the ink 18 of the material, but it can also be filled with ink on the screen 16 of the screen mask 15 or the opening part by rollers. Then, as shown in Figure 4D As shown, the spray gas is blown onto the screen mask 15 to charge The ink 16 on the mesh 16 of the mask 15 or the hole-transporting material of the opening part is ejected on the glass substrate 11 forming the bank 14 and the insulating layer 13, and the hole-transporting material is carried out in the bank 14. The transfer of the ink 18. By this, as shown in FIG. 4D, the dike-containing substrate of the ink 18 that transfers the hole transport material in the dike 14 is completed. At this time, the substrate and the screen are covered. The interval of the cover 15 is kept at 0. 15 mm to prevent the dyke 14 on the substrate from contacting the screen mask 15. The interval between the substrate and the screen mask 15 is changed according to the characteristics of the ink used, and is not limited to this interval. In addition, by 〇.  lmm wide gap with 0. The gas pressure of 5kg / cm2 is blown out by the beam-shaped gas injection nozzle, thereby filling the mesh 16 or the opening portion of the screen mask with the Chinese paper standard (CNS) A4. (210X297 public director) --------- 0 ^ —— (Please read the precautions on the back before filling this page), -port 4 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-28- 200301665 A7 B7 V. Description of the invention (2 Cold (please read the precautions on the back before filling this page) Ink 1 8 is ejected from the glass substrate 1 1 forming the dike 14 and the insulating layer 1 3, and surrounded by the dike 14 The transfer of the ink 18 of the hole-conveying material is performed in a specific frame. As a result, a sufficient amount of ink can be ejected to form a bank within a bank of about 10 μm in height on the substrate. Thus, if the pattern is transferred according to this embodiment, In the printing method, the ink is sprayed on the substrate by a jet gas to perform pattern transfer, and the screen mask is not deformed as in the conventional screen printing method, and high-precision pattern formation can be performed. In addition, it is possible to form a pattern. Easy to learn It is difficult to form the pattern of the recessed portion in the printing method. In addition, if the pattern transfer method according to this embodiment is formed by inkjet printing having multiple heads, it may be less than about 1/100 The time (about 10 seconds) is formed. Then, the solvent contained in the ink 18 of the hole transport material is dried and removed in a drying furnace, as shown in FIG. 4E, and the hole transport layer 18 is formed on each bank. (5) The light-emitting layer forms the printed light-emitting layer of the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, as shown in Figure 5A. The hole-transporting layer 18 is formed on each bank to form the hole-transporting layer 1 8 is formed in the same way. In the pattern transfer method of the present invention, as shown in FIG. 5B, first, a film (emulsion 17) that does not pass through the ink is formed on the mesh 16 and then a specific pattern is formed. The screen mask 15 forming the opening portion is set on the glass substrate 11 forming the hole transporting layer in the dyke 14 so as to have a certain interval, and the ink of the green light-emitting material is placed on the screen mask 15 1 9. Use scrap paper size Use China National Standard (CNS) A4 specification (210X297 mm) -29- 200301665 A7 B7 V. Invention description (2 cold (please read the precautions on the back before filling this page) knife or scraper, scrape the pattern Ink 19 of extra luminescent material other than the ink of the luminous material is filled in the 16 portions of the mesh of the screen mask or the opening 19. Here, the ink of the luminous material that emits green light uses 1 and 1. 2, 3, 4-tetramethylbenzene blends Dow's Green-K in the ink. The concentration of this ink is about 1. 43%, the volume is about 1/70 after drying. Therefore, in order to form a thickness of 100 nm, it is necessary to transfer about 70 times its thickness. After that, as shown in FIG. 5C, the gas for spraying is sprayed onto the screen mask 15 to fill the screen 16 of the screen mask 15 or the light-emitting material of the opening portion. The ink 19 is ejected to a specific position on the glass substrate 11 forming the hole transporting layer 18, and the light-emitting material ink 19 is transferred on the hole transporting layer 18 in the bank 14. Thereby, as shown in FIG. 5C, the substrate for transferring the ink 19 of the luminescent material on the hole transporting layer 18 in the bank 14 is completed. After that, the solvent containing the ink 19 contained in the light-emitting material is dried and removed in a drying furnace, and a substrate for forming a green light-emitting layer 19 on a specific bank is prepared as shown in FIG. 5D. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. In addition, the red light-emitting layer 20 and the blue light-emitting layer 21 are formed in the same manner as the green light-emitting layer 19, as shown in FIG. 5E. The bank forms a substrate of the red light-emitting layer 20 and the blue light-emitting layer 2 1. Here, the ink 20 of the red-emitting luminescent material is prepared by blending Dow's Red-F with 1, 2, 3, and 4-tetramethylbenzene in the ink. In addition, the ink 21 of a blue-emitting luminescent material is prepared by blending Blue-J made by Dow with 1, 3, and 5 trimethylbenzene in the ink. This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) -30- 200301665 A7 B7 V. Description of the invention (2 is (6) cathode electrode formation (please read the precautions on the back before filling this page) at As shown in FIG. 6A, the substrate for forming the red, green, and blue light-emitting layers (20, 19, 21) on a specific dyke, as shown in FIG. 6B, is aligned and set to form a specific pattern. As shown in FIG. 6C, the metal mask 22 is formed with a cathode electrode 23 made of Al / Ca only at the opening portion of the metal mask 22 by a vacuum evaporation method. As a result, a cathode electrode pattern is formed. The cathode electrode is only required to have a small work function, and is not limited to Al / Ca. In this way, an organic electroluminescence device as shown in FIG. 6D can be formed. (7) The display is formed by using FIG. 7 and FIG. 8, The manufacturing method of the display using the organic electroluminescent device formed by the present invention will be described. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs First, the use of the organic electroluminescent device (image display section) 25 to cover the outside air will be described. Off-use sealed tank 29. 密The can sealing 29 is formed by hot stamping a glass plate into a cross-sectional shape as shown in Fig. 7. The physical properties of the can 29 are equal to those of the substrate material forming the organic electroluminescent device (image display portion). In addition, in order to reduce the thermal stress after sealing, the thickness of the glass material is preferably equivalent. In this embodiment, the same material is used for press forming. The adsorption is performed by an organic electroluminescence device (the image shows The adsorbent (drying agent) 25 for the gas generated in the manufacturing process 25, the gas generated in the manufacturing process, and the gas that penetrates through the sealing material 30 is set inside the sealed tank 29 with a filtering device 27, and in the sealed tank 29 The surrounding area uses a dispenser to coat the sealing material 30 in a dry nitrogen environment. Then, the size of the paper used to form the organic electro-excitation light is applied to the Chinese National Standard (CNS) A4 specification (210X 297 mm) -31-200301665 A7 B7 V. Description of the invention (2 Cold (please read the precautions on the back before filling in this page) Set (image display section) the glass substrate 24 in the dry nitrogen to align the above project The produced sealed can 29 was sealed at S ° C for 30 seconds. With this, the nitrogen gas (dry) 28 can be sealed inside. According to the sealing material, there is a material that is hardened by ultraviolet rays. However, when ultraviolet rays are irradiated, ultraviolet rays are The light is diffused and irradiated to the organic electroluminescent device (day image display portion) 25 which is close to the sealing material, and there is a possibility that the brightness is deteriorated (the life is reduced). In addition, regarding the sealing conditions, if the temperature exceeds 100 ° C The temperature is sealed, as in the case of ultraviolet rays, and there is a possibility of deterioration in brightness (reduction in life). Next, by connecting a circuit to the external terminal 31, a display can be manufactured. This display allows daylight images to be viewed through a glass substrate forming an organic electroluminescent device (image display section). The organic electroluminescence device of the present invention can form a hole transporting layer of uniform thickness and a light-emitting layer for achieving desired light-emitting characteristics without unevenness. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. As shown in FIG. 8, instead of the sealed can 29, the sealing film 32 is directly sealed with the organic resin 33 and the organic electroluminescent device (daytime image display section) 25 is sealed at 80. ° C, sealed for 30 seconds. In this case, the image can be viewed in a direction opposite to that shown in FIG. 7 (through the sealing film 32 and from the top). Therefore, in this case, it is important to make the cathode electrode transparent. In order to reduce the wiring resistance and to supply power to the cathode electrode, a bus electrode is formed on the bank. The organic electroluminescent device of the present invention has an aperture ratio larger than that of FIG. 7. 6 times, even in the case of the same light emission, the light can be taken out to the outside a little, and the brightness is increased by about 1. 6 times. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -32-200301665 A7 B7 V. Description of the invention (2 orders (Example 2) (Please read the precautions on the back before filling this page) In addition to the The ink materials for forming the light-emitting layer that emits red, green, and blue light are sequentially supplied to the inside and outside of the same bank, and an organic electroluminescent device is manufactured in the same manner as in Example 1. That is, when the cathode electrode is formed, After the bank for component separation is formed on the substrate, the ink quantitative supply tool is arranged in a non-contact manner for the bank, and the formation of individual supply of the ink quantitative supply tool has at least the functions of hole introduction, hole transportation, light emission, and electron transportation. After the ink material for the layer is sequentially supplied into the aforementioned embankment, a cathode electrode is formed above the electron transport layer. At this time, the ink material for forming the light-emitting layer is a material emitting red, green, and blue light, and is sequentially supplied to the same embankment. In this case, the red, green, and blue light emitted in the same embankment became white light. Materials that emit red, green, and blue light, In order to set the color temperature of white and control the thickness of materials that emit red, green, and blue light, it can be used as a black and white display by making it emit light in the same way as in Example 1 above. Printed by the bureau ’s consumer cooperative. In addition, in order to achieve full display, each element can be formed by forming red, green, and blue color filters equivalent to those used in liquid crystal panels. Glass substrates on liquid crystal panels The black matrix is formed as a light-shielding film so as to prevent the transmission of light from an unnecessary gap portion to the display surface side, thereby reducing the contrast and the like. However, in this embodiment, the material of the black dyke can also be used for light-shielding The function of the film. The light-shielding film is formed of a film with high insulating properties that does not affect the light, and does not affect the electrodes. In this implementation, the Chinese National Standard (CNS) A4 specification (210X297 mm) is applied to this paper size- 33- 200301665 A7 B7 V. Description of the invention (3 () (Please read the precautions on the back before filling this page) In the example, the black pigment is mixed into the bank It is formed of polyimide as a material for shielding. The light-shielding film is formed in a matrix form of the pixels in each row in the vertical, horizontal, and left-right directions. This line distinguishes the effective display area of each row and column. Therefore, the outline of the pixels with each row and column is blocked by light. The effect of the film is clear. Use Figure 9 to explain the method of constructing the color filter on the glass substrate. The color filter is red, green, and blue are repeatedly formed into stripes at the position facing the pixel. Color filter The color sheet is formed so as to overlap the edge portion of the black embankment material used as the light-shielding film. Here, the color filter may be formed as follows. First, an acrylic resin or the like is formed on the surface of the glass substrate 34. The substrates of the red, green, and blue pigments are patterned using photolithography to sequentially form color filters (3, 5, 36, 37) of each color (red, green, and blue). In order to make the color purity higher, pigments of other colors such as cyan may be mixed. The thick coating film 38 is provided, for example, for the purpose of preventing the leakage of the dye of the color filter and the flattening due to the step of the color filter. The thick coating film 38 is formed of a transparent resin material such as acrylic resin or epoxy resin. Printed by the Intellectual Property of the Ministry of Economy ¾ Employee Consumer Cooperatives In addition, the substrate forming the color filter can be viewed on the inside of the glass substrate 34 on the side where the image is viewed. (Embodiment 3) Instead of the glass substrate forming the cathode electrode, an organic electroluminescent device was produced in the same manner as in the above embodiments 1 and 2 except that the glass substrate forming the thin film transistor was used. Although the manufacturing method of the thin film transistor is as follows: the size of this paper with insulation on the surface applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -34- 200301665 A7 B7 V. Description of the invention (3) l (Please (Read the precautions on the back before filling in this page.) The process of coating the organosiloxane nano atom groups on the substrate, the process of oxidizing the organosiloxane nano atom groups to form a silicon oxide film, and the formation of a source region. , The project of the island region non-single-crystal silicon film in the drain region and the channel region sandwiched by them, the project of forming the gate insulating film on the island-shaped non-single-crystal silicon film, and the intermediation in the channel region It is formed by a process of forming a gate electrode by a gate insulating film. However, generally known methods can be used in each process. Here, the organosilicon nano atomic group system is soluble in organic solvents, and the band gap is made of 3eV 1. The 2eV organosilicon compound is obtained by reacting a tetrahalosilane with an organic halide in the presence of an alkali metal or an alkaline earth metal, and then treating it with a hydrofluoric acid. It is also possible to replace part of the tetrahalosilane with trihalosilane or dihalosilane. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. The organosiloxane nano atom group thus obtained can be dissolved in common organic solvents such as hydrocarbons, ethanol, ether, aromatic solvents, and polar solvents. In addition, at the end of the synthesis, by performing a hydrofluoric acid treatment, oxygen atoms in the silicon nano atomic group taken out by the oxygen and water in the reaction system and the stopper can be excluded. When these oxygen atoms are intended to obtain a silicon thin film, the cause of the silicon oxide film is not ideal. By performing a hydrofluoric acid treatment, a silicon nano atom group which is a precursor of a silicon thin film containing no oxygen atom can be obtained. The thin film of the organosilane nano atom group can be obtained by a general thin film forming method of a wet method such as a spin coating method or a dipping method, by dissolving the organosiloxane nano atom group solution in an appropriately selected solvent. If the formed organosilane nano atom group is heated in the environment without oxygen or reducing environment, or it is irradiated with ultraviolet rays, the silicon thin paper can be obtained. The paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm). ) '' -35- 200301665 A7 B7 5. Description of the invention (film, if heated in an oxidizing environment or ultraviolet radiation, you can get a silicon oxide film. (Please read the precautions on the back before filling this page) You can also combine the above Heating and ultraviolet irradiation. In addition, it is also possible to obtain a silicon thin film by laser irradiation in an environment where oxygen is substantially absent or a reducing environment. In this case, a silicon oxide film based on the organosiloxane nanometer atomic group is used as a precursor. The TFT is formed on the top. As mentioned above, the organosilicon nano-atom group is based on tetrahalo-salane as the raw material, and the organosilicon nano-atom group is the precursor of the silicon oxide film containing halogen. The halogen has sodium ion, potassium The effect of segregation by ions, etc., can effectively prevent the impurities from being diffused by the glass substrate to the TFT. In addition, to prevent the impurities from diffusing The thicker the silicon oxide film thickness, the greater the effect. The organosilane nano atomic group can be formed by spin coating, and it is easy to form a thick film with a large area, which can suppress the critical fluctuation of impurities due to impurities, and will not cause deformation and turtles. Therefore, the present invention is extremely useful in the manufacture of organic electroluminescent devices using large-area glass substrates. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In addition, a suitable combination of oxidation of organosiloxane nanometer atomic projects And the project of not forming a silicon film without oxidation, can form an island-shaped silicon layer and a silicon oxide film surrounding it, can realize a structure that reduces the step difference of the end portion of the island-shaped semiconductor layer, and can prevent The reduction in insulation withstand voltage due to thin film formation. Moreover, this technique can form an island-shaped semiconductor layer and its process with fewer processes than conventional island-shaped semiconductor layer formation methods such as exposure, development, and etching after forming a semiconductor layer. The surrounding insulation film can reduce the manufacturing cost. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -36- 200301665 A7 B7 V. Description of the invention ((Please read the precautions on the back before filling this page) The thin film transistor system of the present invention has: a silicon oxide film provided on a substrate with an insulating surface, and An island-shaped non-single-crystal semiconductor layer having a plurality of main surfaces and end surfaces, and a source region, a drain region, and a channel region sandwiched by them in the island-shaped non-single-crystal silicon semiconductor layer are only related to The first insulating film on the silicon oxide film in contact with the end face of the island-shaped non-single-crystal semiconductor layer, the second insulating film covering the island-shaped non-single-crystal semiconductor layer and the first insulating film, and the second insulating film In the structure of the gate electrode, the source region and the drain region on the channel region, and the source electrode and the drain electrode in contact with the source region and the drain region, the aforementioned silicon oxide film is configured to contain a halogen element. Since the island-shaped non-single-crystal semiconductor layer and the first insulating film are in contact with only the end surface, the step difference is small, and it is possible to prevent a reduction in insulation withstand voltage due to the thinning of the gate insulating film. In addition, the silicon oxide film contains a halogen element, which can effectively prevent the infiltration of impurities in the gate oxide film from the glass substrate. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs First, the method for preparing the organosiloxane nano-atom solution is explained. A round-bottomed flask was charged with a cutting-shaped Mg metal (64 mmol) of alkali metal. After heating and cooling under vacuum at 12 ° C, the above reaction system was set to a nitrogen atmosphere and dehydrated tetrahydrofuran (THF) was added. Ot is irradiated with ultrasonic waves (60W), and tetrachlorosilane (16mmol) is added to make it react. In 2. After 5 hours of reaction, the resulting dark brown reaction solution was reacted with tert-butyl bromide (16 mmol). After 1 hour reaction, the temperature of the reaction solution was 50 ° C, and further reacted to 0. 5 hours. This reaction solution was dropped into distilled water, and an insoluble component was recovered by filtration. Disperse the recovered insoluble component in 47% fluoric acid, stir for 30 minutes, and filter to obtain a different paper size. Applicable to China National Standard (CNS) A4 specification (210X297 mm) -37- 200301665 A7 ___B7 V. Invention Explanation (The insoluble content of. Use toluene as a solvent to prepare a 16% by weight solution of this insoluble content as an organosiloxane nano-atom solution. (Please read the precautions on the back before filling this page) Use the description of the first 〇 coating A method for constructing a thin film transistor on a glass substrate. A spin coating method for adjusting the number of rotations is used to coat an alkali-free glass substrate 39 (600mm × 400mm) with a strain point of 6 70 ° C, so that The film thickness was 500 nm, and it was dried on a hot plate at 80 ° C for 1 minute. Then, it was irradiated with ultraviolet light for 3 minutes in an oxygen environment with a 500W ultra-high mercury lamp to obtain a silicon oxide (Si02) film 40 In addition, an amorphous silicon layer was deposited by a plasma CVD method at a thickness of 50 nm. Next, an XeCl laser was irradiated to crystallize the amorphous silicon layer to obtain a polycrystalline silicon film. Next, a well-known photolithography was used. Engineering, patterning the polycrystalline silicon film to obtain an island-like polycrystalline silicon layer 41. Then, a 70 nm Si02 film that became the gate insulating film 42 was deposited by plasma CVD, and Nb was deposited by a sputtering method to a thickness of 25 nm. Through well-known photo-etching process, Nb was patterned to form Wenji 43. Printed by K-Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs and then “for N-channel thin film transistors, using gate 43 as a mask, using ion implantation After the high-resistance N-type polycrystalline silicon layer 44 is formed, a resist is used as a mask to form a low-resistance N-type polycrystalline silicon layer 45. On the other hand, for a P-channel thin film transistor, the gate 43 is used as a mask and ions are used. Implanted to form a low-resistance P-type polycrystalline silicon layer 46. The sheet resistance of the high-resistance polycrystalline silicon layer is expected to be in the range of 20k Ω to 100k Ω, and the sheet resistance of the low-resistance polycrystalline silicon layer is expected to be in the range of 500 Ω to 10000 Ω In addition, the interlayer insulating film 47 formed of Si 02 is formed to cover the entire surface, and the contact through hole provided in the interlayer insulating film 47 is formed to form the paper standard applicable to the Chinese National Standard (CNS) A4 specification (210X297). Mm) ~ " -38- 20 0301665 A7 _B7_

V. Invention Description (3) B (Please read the precautions on the back before filling this page)

A source electrode 50, a drain electrode 51, and wirings formed of three layers of Ti / Al / Ti metal films. Here, three metal films are used to reduce the contact resistance between the low-resistance polycrystalline silicon layer and A1, and the contact resistance between the pixel electrode (ITO) 48 and A1. After the source electrode 50, the drain electrode 51, and the wiring are patterned, a protective insulating film 49 having a thickness of 500 nm formed of Si3N4 is formed so as to cover the entire surface. In addition, via contact holes provided in the protective insulating film 49, The pixel electrode (ITO) 48 is brought into contact with the source electrode 50 of the N-channel thin film transistor 45 of the pixel display portion. The oxidation of the silicon nano-atomic group during the formation of the underlayer film may be performed by a heating method, or a combination of an ultraviolet irradiation method and a heating method. In this case, ultraviolet irradiation is effective in improving the yield, and heating is effective in improving the film quality such as film densification. In addition, the underlying film is not only a silicon oxide film, but also a laminated film of silicon oxide and thin silicon nitride can be used. If silicon nitride is used as a buffer layer, it is more effective to prevent impurities in the glass substrate from diffusing into the gate insulating film. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives, The crystallization method of the amorphous system can be a solid phase growth method via thermal annealing, or a combination of thermal annealing and laser annealing. The gate insulating film may be an oxide film of an organosiloxane nano atom group. By the action of the halogen in the film, the activities of sodium, potassium, etc. are suppressed. The method for depositing the insulating film such as an interlayer film or a protective film may be a known deposition method such as a plasma CVD method. In addition, the electrode materials of the gate, source, and drain electrodes may be well-known electrode materials such as A1, Ti, and Ta. In addition, before the XeCl laser is irradiated, under the vacuum condition, the paper size of the paper applies the Chinese National Standard (CNS) A4 (210X297 mm) -39- 200301665 A7 B7 V. Description of the invention (3 prepared (lXl0-5torr) , 500 ° C, 1 hour heating, this project can also be carried out in the environment where the oxygen is absent on the essence (please read the precautions on the back before filling this page), or in a reducing environment, or combine the two. Ultraviolet radiation is effective in improving the output rate, and heating is effective in improving the film quality such as densification of the film. In addition, this process can also be omitted, and the thunder is carried out in an environment where substantially no oxygen exists or in a reducing environment. It is irradiated to crystallize. In this case, the manufacturing process can be simplified, and the manufacturing cost can be reduced. In addition, the oxidation method of the organosilicon nano atom group can also be heating in an oxidizing environment. Here In some cases, it is desirable to form an island-shaped semiconductor layer before oxidation. Through heat treatment after the formation of the island-shaped semiconductor layer, a dense film can be obtained. Another manufacturing method is to mask The method of covering the portion of the island-shaped semiconductor layer and heating it in an oxidizing environment to form the island-shaped semiconductor layer and the surrounding insulating film at the same time is also effective in simplifying the manufacturing process. In addition, the mask is removed, and It is irradiated with ultraviolet rays or laser light to improve the film quality of the semiconductor layer. Intellectual Property of the Ministry of Economic Affairs, Employee Consumer Cooperative Co., Ltd. printed a spin coating method to form an organosiloxane nano atom group, and then a silicon oxide film or non-single crystal The silicon film is effective in the process of using large substrates. In addition, the silicon oxide film formed by the organosilane nano atomic group contains halogen, which can prevent the thin film transistor characteristics caused by impurities in the glass substrate. In addition, it can realize a structure that reduces the step of the island-shaped semiconductor layer end, and can prevent the reduction of the insulation withstand voltage caused by the thin film of the gate insulating film. This technology and the conventional exposure, development, Compared with the etching method of the island-shaped semiconductor, only exposure and heating, or exposure can be used. National Standard (CNS) A4 specification (210X297 mm) -40- 200301665 A7 B7 V. Description of the invention (欤 (Please read the precautions on the back before filling this page) The number of projects with little knowledge to form island semiconductors Layer and the surrounding insulating film can reduce the manufacturing cost. In addition, the island-shaped semiconductor layer and the surrounding insulating film contain halogen, which can prevent the thin film caused by the diffusion and infiltration of impurities in the gate insulating film in the glass substrate. Inferior transistor characteristics In the above-mentioned manufacturing method of the present invention, instead of the conventional CVD method, the spin coating method can be used to reduce power consumption during film formation. Therefore, a highly reliable and inexpensive liquid crystal can be provided. Display device. Of course, only the manufacturing method of non-single-crystal silicon thin film is changed from the conventional CVD method to the spin coating method of the present invention, and a uniform film can be formed on a large substrate, which can reduce power consumption during film formation. With these advantages, manufacturing costs can be reduced, and an inexpensive liquid crystal display device can be provided. Printed by the Intellectual Property of the Ministry of Economic Affairs and Consumer Cooperatives in the film-forming method described above. After the spin-coating method is used to form the organosilicon nano-atom, it can also be used in an environment where substantially no oxygen exists or in a reducing environment. , UV irradiation, or heating. It is also possible to combine the two. Ultraviolet radiation is effective in improving the yield, and heating is effective in improving the film quality such as film densification. After ultraviolet irradiation or heating, if further laser irradiation is performed, the crystallinity of silicon is improved, and the characteristics of thin film transistors will be improved. In addition, the process of ultraviolet irradiation or heating may be omitted, and laser irradiation may be performed in an environment where substantially no oxygen exists or a reducing environment to crystallize it. In this case, because manufacturing is simplified, manufacturing costs can be reduced. The manufacturing method of the thin film transistor is not limited to this embodiment, and may be a conventional liquid crystal panel or the like. This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) " -41-200301665 A7 B7 V. Description of the invention (3 preparations (Example 4) (Please read the precautions on the back before filling this page) The cross-sectional view of FIG. 11 is used to explain the color ocher sheet that forms the colored layer by the pattern transfer method of the present invention. In FIG. 11, 52 is a glass substrate, 53 is a black matrix with light-shielding properties, and 54 is The red colored layer formed by the pattern transfer method of the present invention, 5 5 is a green colored layer formed in the same manner, 56 is a blue colored layer formed in the same manner, and 57 is a relief of surface segment difference. It is a thick coating to prevent the diffusion of impurities from the colored layer and the black matrix. Method of forming the black matrix 53 After the silicon film is formed on the glass substrate 52 by Dafa, it is patterned by the photouranium method. Forming method, a method of forming a mixture of dispersed black pigments such as epoxy resin and polyurethane resin on a glass substrate by a spinner and a coating method, and then forming a pattern by photolithography Borrow the same material Screen printing and other methods for simultaneous film formation and patterning. In addition, the black matrix formed by chromium formed by sputtering has a large reflection. For low reflection, a two-layer film structure of chromium and chromium oxide is used. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In addition, the materials of the coloring layers of red 54, green 55, and blue 56 are colored using pigments, etc. and containing energy by heat treatment or light irradiation. A hardened colored resin composition of a hardened resin. For the resin composition, a combination of a well-known resin and a bridging material described in Japanese Patent Laid-Open No. 2002-243928 can be used. Specifically, the thermosetting resin includes melamine resin. , Epoxy resin, polyurethane resin, etc .; light-hardening resin composition to use the city's paper standards to apply Chinese National Standard (CNS) A4 specifications (210X297 mm) -42- 200301665 A7 B7 V. Description of the invention (3 (Please read the precautions on the back before filling out this page) The negative resist sold is better. In addition, the thick coating 57 is formed by spinner and coating method, using epoxy resin Highly transparent materials such as grease, polyurethane resin, etc. Figures 12 and 12 are explanatory diagrams showing a series of processes for manufacturing a color filter according to the fourth embodiment of the present invention. In Figure 12, 52 It is a glass substrate, 58 is a chromium oxide film, 59 is a chromium film, 60 is a black matrix, 61 is a colored layer transfer opening pattern, and 62 is a red colored layer material. In this embodiment, first, as shown in FIG. 12A In general, a chromium oxide film 58 having a thickness of 0.05 / zm is formed on one side of the glass substrate 12 by sputtering. In the same manner, a chromium film 59 is deposited thereon to a thickness of 0.05. // After m, they are patterned by a light process to form a black matrix 60. The glass substrate 12 is a glass substrate (# 1 73 7 manufactured by Conning) with a size of 348 mm × 267 mm and a thickness of 0.7 mk. The black matrix 60 is formed in a grid pattern. The size of the black background 60 is the opening size 250 // mX80 // m, and the line width is 20 // m both vertically and horizontally, making it 768 in the vertical direction and 1024X3 colors (R, G, B) in the horizontal direction. Seventy-two are formed in a 15-inch diagonal 4: 3 area. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Next, as shown in FIG. 12B, the glass substrate 12 forming the black matrix 60 is fixed on the substrate fixing table 9 and the opening pattern of the color layer of the screen 3 is transferred. 6 1 and the position of the opening of the black matrix 60 formed on the glass substrate 12 are arranged in a state where the glass substrate 1 2 is slightly separated from the screen substrate 3, and the red coloring layer material 62 is filled into the screen plate 3 by the scraper 1. The coloring layer transfer opening pattern 61 〇 The coloring layer transfer opening pattern 6 1 is set to be larger than the opening of the black matrix 60. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -43- 200301665 A7 B7__ V. Description of the invention (砟 (Please read the precautions on the back before filling this page) The small size of 260 / zmX60 / zm 'configuration is formed in the opening for the black bottom 60 and overlaps every 3' centers in the horizontal direction The distance between them. This is because the three openings of the black matrix 60 forming the three-color (R, G, B) coloring layer become 1 pixel, and different coloring layers are formed adjacent to each other. In addition, the red coloring layer material 62 is used in polyurethane resin in a volume ratio of 5% It is mixed with Nishi Ai (Shi-7 4) chemical product (NanoTek red pigment). Then, as shown in Fig. 12C, the "gas 7" is ejected from the beam-shaped gas injection nozzle to fill the screen. The red colored layer material 62 of the colored layer transfer opening pattern 61 of 3 is applied to the openings of the black matrix 60 on the glass substrate 52 fixed to the lower side of the screen plate 3 every 3 in the horizontal direction. As shown in FIG. 12D, the red colored layer material 62 applied to the opening of the black matrix 60 every three times is heated at 60 degrees and 30 minutes, and then heated at 180 degrees and 30 minutes to harden it. A red colored layer 54 with a film thickness of 1.5 # m was formed. Printed by the Intellectual Property of the Ministry of Economic Affairs of the Consumer Cooperative and, as shown in FIG. 12E, the red colored layer 54 on the glass substrate that has formed the red colored layer 54 has been aligned. After the openings of the adjacent black matrix 60 and the coloring layer of the screen 3 are transferred to the opening pattern 61, the green colored layer material is applied beside the red colored layer 54 in the same manner as in the 12B to D, Heating under the same hardening conditions as the red colored layer 54 to form a film thickness 1.5 // m green coloring layer 55. In addition, the green coloring layer 5 5 is made of polyimide resin mixed with Nishi Ai (Shi-7 <) Chemical Co., Ltd. (Nippon Kaisha) Those who are green pigments. If the screen version 3 can complete the transfer of the colored layer, the paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) -44- 200301665 A7 __ ___B7 V. Description of the invention (4) 1 (please first (Please read the notes on the back and fill in this page) The cleaning of the opening pattern 61 can be used in common for the coloring layer materials of 3 colors (R, G, B). However, in order to prevent color mixing of the coloring layer material due to poor cleaning, it is better to prepare different screens for each color. In addition, if different devices are prepared for different colors, the output rate can be further improved. Next, as shown in FIG. 12F, the openings of the black substrate 60 on which the red colored layer 54 and the green colored layer 55 have not been formed on the glass substrate on which the red colored layer 54 and the green colored layer 55 are formed are aligned, and the colored layer transfer openings of the screen 3 are transferred. The pattern 61 is coated with the blue coloring layer material between the red coloring layer 54 and the green coloring layer 55 in the same manner as in the 12B to D, and then hardened in the same manner as the red coloring layer 54 and the green coloring layer 55. Under conditional heating, a blue colored layer 56 having a film thickness of 1.5 // m was formed. The material of the blue coloring layer 56 is a material in which a polyimide resin is mixed with a NanoTek blue pigment manufactured by Xi Ai Chemical Co., Ltd. at a concentration of 5% by volume. After printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, as shown in Figure 12G, a film thickness of 1.0 / zm is formed on the coloring layer of red 54, green 55, blue 56 and 60 by a spinner. Thick coating 57. The thick coating is made of polyimide resin, which is heated at 90 ° C and 30 minutes, and then heated at 180 ° C and 60 minutes to harden. The film thickness of the black matrix is 60%. The chromium layer is 0.1 / zm, and the film thickness of the colored layers of each color is 1.5 // m. Although there are surface differences, the thickness of the surface can be reduced to 0.7 // m by thick coating 57. In this embodiment, although the hardening conditions of the respective coloring layer materials are the same, as long as the respective coloring materials do not cause discoloration during heating, it does not matter if the hardening conditions are different. In addition, the hardening conditions of the thick coating layer need to be performed in a range that does not cause discoloration of the colored layer. Using this color filter, the paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) '-45- 200301665 A7 B7 5. Description of the invention (4 moxibustion tablets, making a 15-inch TFT LCD display, found that it can Look at the day image with good hair color. (Please read the precautions on the back before filling this page) (Example 5) The screen printing method is used to form the black matrix except that it is made in the same manner as in Example 4 above. Color filters. Figures 13 and 13 are explanatory diagrams showing a series of processes formed by the black matrix of the screen printing method according to the fifth embodiment of the present invention. In Figure 13, 63 is a black matrix transfer opening pattern , 64 is a black matrix paste, 65 is a black matrix for printing. In this embodiment, first, as shown in FIG. 13A, the formation area of the black matrix transfer opening pattern 63 of the screen 3 is aligned. The glass substrate 12 is fixed on the substrate fixing table 9 at the center and the center of the glass substrate 12. Next, a black matrix paste 64 'is placed on the screen 3 to move the squeegee 10 in a state of contacting the screen 3. On one side, the black matrix paste 64 is scraped off. — On the black matrix, the opening pattern 63 is transferred. Black filling paste 64. In Figure 13A, from right to left, move the scraper 10 to achieve the filling action. Printed by the Intellectual Property of the Ministry of Economic Affairs and the Consumer Consumption Cooperative. In this example, the black background Paste 64 is used in the polyurethane resin mixed with Xi Ai (Si 7 74) chemical (stock) color ultrafine particles Nanotek Black-1 in a concentration of 3% by volume. In addition, the screen version 3 is used online 1 8 μm, opening size is 33 // m, opening area is 42 ° /. No. 500 stainless steel mesh, photosensitive for screen mask formation with excellent solvent resistance manufactured by (Stock) Tokyo Manufacturing Services Emulsion (product name: NSL) formed by a non-reactive resin is a pattern. This paper size is applicable to China National Standard (CNS) A4 (210X297 mm) -46- 200301665 A7 B7 V. Description of the invention ((Please read the back Please fill in this page again.} Then, as shown in Fig. 13B, with the scraper 1 in contact with the screen 3, move it from left to right while rolling the black matrix paste 62, while filling the paddle. The black matrix paste 64 of the black matrix transfer opening pattern 63 is transferred to the glass substrate 1 2. The screen printing method used here can also be formed by the same method as the pattern transfer method of the present invention. The glass substrate 12 is set on the substrate fixing table 9 and the fine The holes are fixed under reduced pressure. In addition, after the black matrix transfer opening pattern 63 of the screen plate 3 of the device screen mask is aligned with the pattern formation position of the glass substrate 12, the gap control tool 8 is used to The control device is located between the screen mask of the screen 3 and the glass substrate 12. The screen screen 3 printed by the 8th Industrial Cooperative Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs becomes large, and the screen mask cannot be controlled only by the tension of the screen screen. The space between the cover and the glass substrate 12 can be expected to cause a slack in the central portion of the screen mask due to its own weight. In this case, the gap control tool 8 is used to isolate the gap between the screen 3 and the substrate fixing table 9 from the outside, and a small amount of gas is introduced into the gap between the screen 3 and the substrate fixing table 9 to increase the pressure ratio to the outside. The large air pressure can make the space between the screen mask and the glass substrate 12 keep 0.1 mm ~ 2 for the size of the 85 square screen frame. Omm 〇 It is not used due to the tension of the screen mesh. The reason for the separation of the plate 'is 10 ~ 15% of the screen pattern 3 in the conventional pattern formation area, and the pattern formation area in the screen pattern 3 can be enlarged to 30 ~ 50%. In addition, when a small amount of gas is introduced into the gap between the screen plate 3 and the substrate fixing table 9, depending on the nature of the paste, a person with a high drying speed can be expected. This paper size is in accordance with Chinese National Standard (CNS) A4 (210X297 mm) -47- 200301665 Printed by the Intellectual Property of the Ministry of Economic Affairs and Consumer Cooperative A7 B7 V. Description of the invention (4) l Therefore, due to the gas introduced, the black background The paste 64 dries and blocks the opening 4 of the screen mask, and the black matrix transfer opening pattern 63 may not be formed. On that occasion, by circulating the gas in the gap between the screen 3 and the substrate fixing table 9, it can be kept in the gas environment of the solvent contained in the black matrix paste 64. The black matrix paste due to gas can be prevented Drying of pulp 64. Next, place a black matrix paste 64 on the screen mask, so that the scraper 10 is in close contact with the screen mask, and scrape off with the scraper 10 at an angle of about 90 degrees between the screen mask and the scraper 10. The black matrix paste 64 is filled with the black matrix paste 64 while facing the black matrix transfer opening pattern 63. Next, the squeegee 1 is brought into close contact with the screen mask. By moving the squeegee 1 in the same manner as the squeegee 10, the black matrix paste 64 filled with the black matrix transfer opening pattern 63 can be formed on the glass substrate 12. Next, as shown in FIG. 13C, the black matrix paste 62 transferred on the glass substrate 12 was heated at 90 ° C for 30 minutes, and then heated at 180 ° C for 60 minutes to harden, Form a print with a film thickness of 1.5 // m to form a black matrix 65. In addition, the pattern size of the black matrix 65 formed by printing is the same as that of the black matrix 60 formed by the chromium and chromium oxide in Example 4 above, and the opening size is 280 / zmX80 / zm, and the line width is 20 // m 15: 15 inches diagonally forming the area 4: 3. Next, in the same manner as in the above-mentioned Example 4 (Figures 12B to D), the colored layers of R, G, and B each having a film thickness of 1.5 // m are sequentially formed by the pattern transfer method of the present invention. After that, a thick coating with a thickness of 0.2 // m was formed on the surface by the spinner. Fig. 14 is a sectional view showing a color filter manufactured in this embodiment. It is formed with the goal of making the film thickness of the black matrix 65 and the thickness of each colored layer all the same and the same thickness, and can obtain a flat color paper with a small surface segment difference. Applicable to China National Standard (CNS) A4 specifications (210X: 297) (Mm) Order I (please read the precautions on the back before filling this page) -48- 200301665 A7 B7 V. Description of the invention (4 right color filter. (Please read the precautions on the back before completing this page) In this embodiment, the design of the film thickness is 1.5 // m, which can suppress the surface segment difference below 0.1 # m. It is not for the relief of the surface segment difference, but for the formation of a black matrix and the colored layers for printing. Impurities are prevented from spreading, and a thick coating layer with a film thickness of 0.2 // m is formed on the surface by a spinner. Using this color filter, a 15-inch TFT liquid crystal display can be produced, and a good color image can be viewed. Example 6) On the ITO electrode pattern of a substrate on which a TFT circuit is formed, a conductive colored layer is formed by the pattern transfer method of the present invention to produce a TFT circuit substrate with a color filter. Intellectual Property Bureau, Ministry of Economic Affairs Staff consumption Figures 15 and 16 printed by the cooperative are explanatory diagrams showing a series of manufacturing processes for one of the TFT circuit substrates having the color filter of the sixth embodiment of the present invention. In Figure 15, 66 is a TFT glass. The substrate and 67 are IT 0 electrodes. In Fig. 16, 68 is a red conductive colored layer material, 69 is a red conductive colored layer, 70 is a green conductive colored layer, and 71 is a blue conductive colored layer. In this embodiment, first, as shown in FIG. 15A, a TFT circuit and an ITO electrode 67 are formed on a TFT glass substrate 66. The ITO electrode 67 is in a range of 280 // m in length and 80 // m in width. Patterned so as not to overlap TFT elements, with a pitch of 20 // m to make it 768 in the vertical direction and 1 02 4X3 colors (R, G, B) in the horizontal direction, a total of 3072 are arranged at a diagonal of 4: 3 1 5 In the area of inches. This corresponds to the size of the printed paper formed in the above Example 5. The Chinese National Standard (CNS) A4 specification (210X297 mm) -49- 200301665 A7 B7 V. Description of the invention (4 prepared in black The size of the pattern of the bottom 65 and the pattern of each colored layer formed in the above-mentioned Examples 4 and 5. (Please read the precautions on the back before filling this page.) Next, as shown in Figures 15B to D, the unformed portion of the ITO electrode 67 on the TFT glass substrate 66 and the black matrix of the screen 3 are transferred. The opening pattern 63 is fixed on the substrate fixing table 9. In the same manner as in FIGS. 13A to C, a black matrix 65 is formed on the TFT glass substrate 66 by printing with a film thickness of 1.5 // m. Next, as in FIG. 16A As shown in Figures C to C, the TFT circuit substrate 65 is fixed on the substrate fixing table 9 by registering the positions of the openings of the black matrix 65 and the coloring layer of the screen 3 to transfer the opening patterns 61, as shown in FIG. Next, as shown in Figures 12B to D, after coating the red conductive colored layer material 68, it was dried to form a red conductive colored layer 69 having a film thickness of 1.5 #m. The red conductive coloring layer material 68 is used in a polyimide resin mixed with a NanoTek red pigment manufactured by Xi Ai (Si-7 4) Chemical Co., Ltd. at a volume ratio of 5%, and mixed with an ITO paste at a concentration of 10% by weight. By. In addition, the hardening condition was that heating was performed at 90 ° C for 30 minutes, and then heating was performed at 200 ° C for 60 minutes. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. As shown in Figs. 16D to E, the green conductive coloring layers 70 and 1.5 are formed in the same order as those in Figs. 16A to C. Blue conductive colored layer 71. The green conductive coloring layer is made of polyimide resin mixed with NanoTek green pigment manufactured by Xi Ai 7 < Chemical Co., Ltd. at a volume ratio of 5%, and mixed with ITO paste at a concentration of 10% by weight. The blue conductive coloring layer is made of a blue pigment and mixed with ITO paste at a concentration of 10% by weight. In addition, the hardening conditions are the same as the Chinese standard (CNS) A4 specification (210X297 mm) -50- 200301665 A7 B7 for this paper size. 5. Description of the invention (The red conductive coloring layer material 68 is the same. (Please read the back of the first Note: Please fill in this page again.) Although the TFT glass substrate with unevenness that forms the ITO electrode 67 is used, 1.5 mm // m is used to form the black matrix 65 and the thickness of each conductive colored layer. To obtain a color filter with a flat surface. In addition, in order to ensure the conductivity of the conductive colored layer of each color on the surface of the TFT circuit substrate with the color filter, a thick coating that reduces the conductivity cannot be used directly. In contact with the liquid crystal, it is necessary to eliminate as much as possible impurities that deteriorate the electrical characteristics from the conductive colored layers and the black matrix 65 formed by printing. Using a TFT circuit substrate with this color filter to produce a 15-inch film "Inch Display LCD Monitor" You can watch portraits with good color development and no unevenness. As explained above, the present invention is a comprehensive coating of ink on screen, in After the screen portion or the opening portion of the mask is filled with ink, the ink is transferred onto the substrate by supplying the ejection gas to the screen portion or the opening portion. Compared with the lithographic printing method, it is possible to perform high-precision pattern formation and pattern formation on a substrate with unevenness. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Although the above examples illustrate many embodiments of the present invention, it goes without saying that The embodiment may have various changes and modifications without departing from the gist of the present invention. Therefore, the present invention is not limited to the above embodiments, and the present invention covers all changes and modifications. V. Brief Description of Drawings 1 The paper size of the pattern transfer device used for the pattern transfer method is applicable to the Chinese National Standard (CNS) A4 specifications (210X297 mm) -51-200301665 A7 B7 V. Description of the invention (mute sketches. (Please read the figure on the back first) Please fill in this page again for attention.) Figure 2 is a schematic diagram illustrating a pattern transfer device used in the second pattern transfer method. Figure 3 is a diagram illustrating the pattern transfer method in the first embodiment. Fig. 4 is a process drawing for explaining the manufacturing method of the first organic electroluminescent device. Fig. 5 is a view for explaining the formation of the light emitting layer of the first organic electroluminescent device. Fig. 6 is an illustration Fig. 7 is a diagram for forming the electric shock of the organic electroluminescent device. Fig. 7 is a schematic diagram for explaining a display using the organic electroluminescent device of the first embodiment. Fig. 8 is a diagram illustrating the use of the first embodiment. The schematic diagram for the display of the electromechanical excitation light device. Fig. 9 is a diagram for explaining the method of forming the color filter of the second embodiment. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 3 shows the method of the thin film transistor. Fig. 11 is a sectional view for explaining the structure of a color filter of a fourth embodiment. Fig. 12 is a diagram for explaining a series of manufacturing processes of one of the color filters manufactured in the fourth embodiment. Figure 13 illustrates the paper size produced in the fifth embodiment by screen printing applied to the Chinese National Standard (CNS) A4 specification (210X297 mm) -52- Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 200301665 A7 B7 V. Description of the invention (4 diagrams for the formation of the black matrix. Figures 14 and 14 are cross-sectional views illustrating the structure of the color filter manufactured in the fifth embodiment. Figure 15 is a diagram illustrating Drawings for manufacturing processes up to the formation of the black matrix of the TFT circuit substrate of the color filter manufactured in the sixth embodiment. Figure 16 illustrates a TFT circuit substrate having the color filter manufactured in the sixth embodiment. The drawing of the manufacturing process from the beginning of the formation of the colored layer. The comparison table of the main components 1 Scraper 2 Beam jet nozzle 3 Stencil 4 Opening pattern for transfer 5 Substrate with storage area 6 Ink 7 Gas 8 Tools for interval control 9 Substrate fixing Table 10 Squeegee 11 Glass substrate 12 Anode electrode 13 Insulation layer 14 Storage area 15 Screen mask This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm) Packing II Order I (Please read the back first Please pay attention to this page and fill in this page again) -53- 200301665 A7 V. Description of the invention (5) Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 16 Mesh 17 Film pattern 18 Ink 19 Green light-emitting layer 20 Red light-emitting layer 2 1 Blue light-emitting layer 22 Metal shield 23 Cathode electrode (please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) Α4 specification (210 × 297 mm) -54-

Claims (1)

200301665 A8 B8 C8. D8 ·. 6. Scope of patent application 1 (Please read the precautions on the back before filling out this page) 1 · A manufacturing method of image display device is aimed at having above the substrate: a bank for component separation And a method for manufacturing an organic electro-optical device having at least a hole introduction layer, hole transportation, light emission, and electron transportation function layer that contributes to light emission, and an electrode, which are characterized by: The ink materials for the functional layers of hole introduction, hole transportation, light emission, and electron transportation are transferred and supplied to the inside of the embankment through a non-contact ink quantitative supply tool for the substrate. 2 · A method for manufacturing an image display device, characterized in that: after forming a bank for element separation on a substrate on which an anode electrode is formed, an ink dosing device is disposed in a non-contact manner to the bank, and the ink is individually supplied to the ink dosing device The ink material used for forming the holes that has at least the functions of introduction of holes, hole transportation, light emission, and electron transportation is sequentially supplied into the levee, and a cathode electrode is formed above the electron transportation function layer. to make. 3. A method for manufacturing an image display device, characterized in that: printed by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs on the substrate forming the anode electrode to form a bank for element separation, and a non-contact ink supply device is arranged for the bank After the ink materials that are individually supplied to the ink quantitative supply tool and have the functions of at least hole introduction, hole transportation, light emission, and electron transportation that are helpful for the aforementioned luminescence are sequentially supplied in the aforementioned embankment, A cathode electrode is formed above the electron transport layer, and the ink material for forming the light-emitting layer is a material that emits red, green, and blue light, and is separately supplied to each of the banks. This paper size applies to the Chinese National Standard (CNS) of 8 4 pounds (210 father 297 mm) ΓΓ 1: -55-200301665 8 8 8 8 ABCD 6. Application for patent scope 2 4. A method for manufacturing an image display device, which The characteristics are: (Please read the precautions on the back before filling in this page) After forming a bank for element separation on the substrate forming the anode electrode, a non-contact amount of ink supply tool is arranged for the bank to individually supply the ink 疋 S The forming of the supply tool has at least the functions of introducing holes, introducing holes, emitting light, and electrons. The ink materials used in the embankment are sequentially supplied in the embankment, and above the function layer having the electrons. The cathode material formed by forming the cathode electrode is a material that emits red, green, and blue light, and is sequentially supplied in the same bank. 5. A method of manufacturing an image display device, comprising: (1) a process of forming an anode electrode on a substrate; and (2) a process of forming a bank for element separation on the anode electrode; and (3) a The project of forming a functional layer with hole introduction and hole transportation within the aforementioned dike; and (4) Separately forming a red, green and blue printed on the functional layer with hole transportation as described above. Project of colored light emitting layer; and (5) project of forming a functional layer with electron transport on the aforementioned light emitting layer; and (6) project of forming a cathode electrode on the aforementioned electron transport layer; at least the above (3) to The process of (5) is made by transferring and supplying the ink material formed by the organic matter supplied to the ink quantitative supply tool arranged on the bank in a non-contact manner. 6. The method for manufacturing a daytime image display device according to item 1 of the scope of patent application, wherein the ink dosing device is provided with a transfer mask formed on the opening portion of the mesh using an emulsion, and is held in the opening portion. A specific amount of the aforementioned ink material. This paper size applies Chinese National Standard (CNS) A4 specification (210X29 * 7mm) -56- 200301665 A8 B8 C8. _ D8 " 申请, patent application scope 3 (Please read the precautions on the back before filling this page) 7 · The method for manufacturing a daytime image display device as described in item 丨 of the patent application range, wherein the aforementioned ink quantitative supply tool is a transfer mask patterned to form an opening portion, and a specific amount of the foregoing is held in the opening portion. Made of ink materials. 8. The method for manufacturing an image display device according to item 1 of the scope of patent application, wherein the ink material held in the opening portion of the ink dosing tool is supplied into the bank by using a jet gas. 9 · The method for manufacturing an image display device described in any one of the scope of claims 1 to 5 of the scope of patent application, wherein, in the manufacturing method of the scope of scope of the patent application 1, the cross section of the levee for component separation is formed as A shape that widens toward the substrate side. 1 〇—A method for manufacturing an image display device is provided on a substrate including: a gate electrode, a gate insulating film, a semiconductor film, a source electrode, a drain electrode, and a pixel electrode, which are electrically connected to the aforementioned drain electrode. Above the above-mentioned pixel electrode of the electrode is provided with a bank for separating elements, a functional layer for introducing holes, transporting holes, emitting light, and transporting electrons, and a method for manufacturing an organic electroluminescent device for electrodes , Which is characterized by: printed by the Ministry of Intellectual Property / $-Bureau employee consumer cooperatives to form ink materials with functional layers that help at least the aforementioned hole introduction, hole transportation, light emitting, and electronic transportation. The ink is quantitatively supplied to the substrate in a non-contact manner, and transferred to the inside of the bank. 1 1 · The method for manufacturing an image display device according to item 10 of the scope of patent application, wherein the semiconductor film is formed of a polycrystalline silicon film. 1 2 · —A kind of manufacturing method for daytime image display device is to apply Chinese National Standard (CNS) A4 specification (210 X 297 mm) to the paper size of the substrate -57- 200301665 A8 B8 C8. D8 " Patent application scope 4 The manufacturing method of a liquid crystal display-type day-image display device with a black bottom that shields light leakage between elements is characterized by: (Please read the precautions on the back before filling this page) Form red, green, and blue The ink material for the colored coloring layer is transferred and supplied to the inside of the black matrix to form a color filter through an ink quantitative supply tool arranged in a non-contact manner to the substrate. 13. The method for manufacturing an image display device as described in item 12 of the scope of patent application, wherein the aforementioned black matrix is formed by a screen printing method. 14 · A daylight image display device, characterized in that: a conductive colored layer formed by transferring and supplying a conductive material having red, green, and blue by a non-contact arrangement of an ink quantitative supply tool is arranged in a mask Leakage of light between components of the drive circuit board is on the drive electrodes inside the black matrix. 1 5 · An image display device characterized by: printed by a consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs with a substrate and a sealed can, a sealing material and an external terminal, and formed on top of the aforementioned substrate. 13 The day image display section produced by the method according to any one of items 13, and the image display section is electrically connected to the external terminal, and the sealing material is formed around the substrate, and the substrate and the sealed can The aforementioned image display unit is enclosed and integrated. 16 · The image display device described in item 15 of the scope of patent application, wherein the physical properties of the materials constituting the substrate and the sealed can are slightly equal. 17. The day image display device described in item 15 of the scope of patent application, wherein the aforementioned sealed can is a transparent sealing film. -1 8 · —A kind of portrait display device, which has the following characteristics: This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -58- 200301665 A8 B8 C8. D8 Above the substrate, a thin film transistor having a pixel electrode; and an image display section made by the method of any one of claims 1 to 5 of the scope of patent application; the anode electrode of the image display section is also the aforementioned The pixel electrode is formed above the thin film transistor. (Please read the notes on the back before filling out this page) Printed by the Consumers' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs This paper uses the Chinese National Standard (CNS) Λ4 grid (210X29? Mm)