JP2001199039A - Method for printing pattern and screen printer used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for printing a pattern capable of printing the pattern having a good printing accuracy in a short time without repeating a complicated work and printing a thick film, printing the pattern on a recess part of a base or the like. SOLUTION: The method for printing the pattern on a processing base comprises the steps of placing a screen formed with a screen print pattern mask on the base, then coating the overall surface of the screen with an ink, thereafter spraying the ink by a high pressure gas from a mesh part of the screen to a printer material, and dropping the ink on the base, thereby printing the pattern on the base.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for printing a pattern of a thick film on a substrate or the like and a method for printing a pattern on a concave portion of the substrate, and more particularly to a screen of a screen plate having a pattern formed thereon. After applying the ink to the entire surface, the pattern is printed by spraying the ink from a mesh onto the equipment using high-pressure gas, and the pattern is printed on the recesses such as holes and grooves.Moreover, a space is provided on the printing surface and the printing plate surface The present invention relates to a pattern printing method for performing thick film printing on equipment by repeatedly applying ink to a screen and spraying ink with high-pressure gas.

[0002]

2. Description of the Related Art Conventionally, as a method of printing a pattern on a convex portion of a substrate or the like, there has been a pad printing method in which ink is transferred to the convex portion using a silicon pad.

However, conventionally, there has not been provided an effective method of printing a pattern in a hole or a groove of a substrate or the like. For example, a photosensitive ink is applied to the entire surface of a concave portion to form a pattern in the concave portion by ultraviolet rays. There was no other way.

Further, as a method of performing thick film printing on a substrate, after printing by screen printing, the ink on the substrate is put into a drier to be dried, then repositioned, and the same is performed by screen printing. A method of printing at a position and repeating this process to perform thick film printing has been used.

[0005]

As described above, the method of performing thick film printing, which has been conventionally performed, is a method of overprinting on a substrate by screen printing, and after printing, drying, positioning, and printing again. And repeat this to print,
In this method, alignment is required every time, and the work becomes complicated. In addition, since printing is performed many times at the same position, printing accuracy is deteriorated. Further, since it is necessary to dry each time, processing time is required. There was a problem.

As described above, conventionally, there has been no effective method for printing a pattern on a concave portion, and pattern printing on a concave portion has been practically impossible.

Accordingly, the present invention provides a pattern printing method capable of printing a pattern with good printing accuracy in a short period of time without repeating complicated work, and also capable of printing a pattern on a concave portion of a thick film or a substrate. It is an object to provide a method and a screen printing device for implementing the method.

[0008]

A pattern printing method according to the present invention is a pattern printing method for printing a pattern on a substrate or the like by using a screen printing method. And then apply ink to the entire surface of the screen,
Then, thereafter, ink is sprayed onto the equipment from the mesh portion of the screen by high-pressure gas, whereby the ink is dropped on the processing substrate, and pattern printing is performed on the processing substrate.

A screen printing apparatus according to the present invention is a screen printing apparatus used for performing the above-described pattern printing method according to the present invention. The screen printing apparatus is provided for applying ink on a work substrate. Coating means, and high-pressure gas spraying means for spraying high-pressure gas from the mesh part of the screen to drop ink applied on the screen from the mesh part of the screen onto a processing substrate. .

As described above, in the pattern printing method and the screen printing apparatus according to the present invention, after applying ink to the entire surface of the screen, the ink is sprayed from the mesh portion of the screen onto the equipment by the high-pressure gas, so that the ink is applied to the processing substrate. To enable pattern printing on the processed substrate. Therefore, unlike the case of screen printing in which printing is performed while applying force to the screen, high-precision printing is possible, and pattern printing can be accurately performed in a concave portion of a processing substrate or the like.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the pattern printing method of the present invention,
First, a screen printing pattern mask through which ink does not pass is formed on the screen, and then the screen on which the screen printing pattern mask is formed is placed on a processing substrate, and ink is applied to the entire screen.

Thereafter, high-pressure gas is sprayed onto the mesh portion of the screen to drop the ink onto the processing substrate, and pattern printing is performed on the processing substrate.

Here, a holding layer is formed between the screen and the processing substrate, and more specifically, a holding layer smaller than the pattern and thicker than the ink is formed below the screen printing pattern mask. Thus, it is preferable to keep a certain distance between the portion of the processing substrate on which the ink is applied and the screen plate, and to repeat the application of the ink to the entire surface of the screen and the spraying of the ink to the processing substrate by the high-pressure gas a plurality of times. Then, since the ink can be overprinted while the screen is fixed, the thick film printing can be performed accurately in a short time.

Further, the screen printing apparatus of the present invention comprises a screen mounted on a processing substrate, on which a coating pattern impermeable to ink is formed, an application means for applying ink on the screen, and a mesh of the screen. A high-pressure gas spraying means for spraying high-pressure gas from the portion to drop ink applied onto the screen from the mesh portion of the screen onto a processing substrate.

Further, in the screen plate of the present invention, an ink-impermeable film pattern is formed on the upper surface, and a holding layer smaller than the film pattern and thicker than the ink film is formed below the film pattern. It is characterized by.

[0016]

Embodiment 1 A first embodiment of a pattern printing method and a screen printing apparatus for carrying out the method according to the present invention will be described with reference to FIG.
Is a processed substrate for printing a pattern, and 3 is a screen plate in the figure. Further, in the figure, reference numeral 1 denotes an application unit for applying ink,
Is a blowing means for injecting high pressure gas.

Then, the screen plate 3 has
At the time of printing, a film pattern which is a portion where ink does not get on is formed. Specifically, the screen plate 3 is
A mesh made of stainless steel, tetron, nylon, or the like is placed on the screen frame to form a portion on which no ink is applied during printing, that is, a reverse pattern of printing on the mesh. To make a plate.

Examples of the method of forming the film pattern 4 include a method of forming a pattern on a screen using a photosensitive resin such as a photosensitive resin film and a photosensitive emulsion, and a method of forming a metal plate on the screen. There is a method of forming a metal film pattern on an attached metal plate by etching or the like, or a method of forming a metal pattern on a mesh by electroforming.

In the following, the portion where this ink impermeable pattern is formed on the screen (portion 4 in FIG. 1) is referred to as a screen printing pattern mask.

Then, in the pattern printing method according to the present embodiment, the screen printing pattern mask 4 is placed under the screen printing pattern 3 under the screen printing pattern mask 4 so that the screen does not come into contact with ink.
A smaller holding layer 7 is formed.

The screen printing pattern mask 4 and the holding layer 7 may be formed by etching a single stainless steel plate twice, for example, by etching stainless steel, or may be formed on a mesh by electroforming. A holding layer may be further formed by forming a metal pattern.

Further, after forming the screen printing pattern mask 4 using the photosensitive film, the photosensitive film may be pasted again to form the holding layer 4.
The screen printing pattern mask and the holding layer may be formed by combining these methods.

Next, as shown in FIG.
Is placed on the processing substrate 5, and thereafter, the ink 6 is uniformly applied on the mesh by the squeegee 1 or the like as an ink applying means. In this case, ink may be applied to the mesh by a roll or the like other than the squeegee 1.

Thereafter, as shown in FIG. 1B, high-pressure gas is blown toward the screen plate 3 using a high-pressure gas injection nozzle 2 as a high-pressure gas blowing means.
Then, the ink other than the screen print pattern mask 4 is sprayed toward the processing substrate with the ink on the screen 3, whereby a print pattern can be formed on the substrate 5.

As described above, according to the pattern printing method and the screen printing apparatus of the present embodiment, the ink is sprayed onto the processing substrate by the high-pressure gas to perform the pattern printing. It is possible to perform pattern printing with a high printing system without going through work.

After the printing pattern is formed on the processed substrate by the above-described method, the application of the ink 6 on the screen 3 and the spraying with the high-pressure gas are repeated, and the ink 6 is stacked on the substrate 5. Thus, thick film printing can be performed in a short time without repeating complicated operations. FIGS. 1C and 1D show this process.

However, the present invention is characterized in that the ink is applied onto the entire surface of the screen, and then the ink is dropped onto the processing substrate by a high-pressure gas to perform pattern printing. No need to do.

When thick film printing is not performed, it is not always necessary to interpose a holding layer between the screen and the processing substrate.

In the first embodiment,
A pattern was formed on the screen mesh of the screen plate using a photosensitive resin film for screen printing manufactured by Murakami Co., Ltd. (screen printing pattern mask formation). And the screen mesh is 320 mesh,
A screen printing photosensitive resin film having a thickness of 50 μm was used.

Then, a screen-printed photosensitive resin film is stuck on the printing surface side of the screen on which the screen-printing pattern mask has been formed, and a screen 100 μm smaller than one side of the screen-printing pattern mask is used. The holding layer 7 was formed.
When the holding layer 7 is formed, the film thickness is 200
Using a μm screen printing photosensitive resin film,
Using an ultraviolet curable ink, the ink was applied to the entire screen with a squeegee.

Then, 3 kg from a 0.2 mm slit
High-pressure air was blown from the high-pressure gas injection nozzle 2 at an air pressure of / cm 2, whereby the ink on the screen was blown onto the glass substrate to perform printing. As a result, the thickness of the ink after printing was 20 μm.

Thereafter, the application of the ink and the application of the high-pressure air were repeated five times, and thereafter, the ink was cured with ultraviolet rays, and a pattern printing with a film thickness of 100 μm was performed.

[Embodiment 2] Next, a second embodiment of the pattern printing method of the present invention will be described with reference to FIG. 2. In this embodiment, a pattern is formed in a concave portion formed in the processing substrate 8. A case in which printing is performed will be described.

In this embodiment, first, a pattern is formed on the screen plate 3 using a photosensitive emulsion (formation of a screen printing pattern mask 4).

Next, as shown in FIG. 2A, after the pattern-formed screen plate 3 is placed on a processing substrate 8 having recesses such as grooves and holes formed by etching, sand blasting, pressing or the like, The ink 6 is uniformly applied on the screen plate 3 by the squeegee 1 or the like. In this case, in addition to the squeegee, it may be applied by a roll or the like.

Then, as shown in FIG. 2B,
By spraying a high-pressure gas onto the screen plate 3 using the high-pressure gas injection nozzle 2, ink other than the screen printing pattern mask 4 is sprayed on the substrate 8 to perform pattern printing on the recesses, and pattern printing on the recesses. The processed substrate 8 subjected to the above is completed (see FIG. 2C).

As described above, according to the present embodiment, it is possible to effectively perform pattern printing even in a concave portion of a processed substrate, which has been conventionally difficult.

In this embodiment, a silver electrode pattern 6 having a pattern width of 50 μm is formed in a groove of an alumina substrate 8 having a groove having a depth of about 100 μm formed by a mold using a patterned screen. Was done. In this case, the screen mesh is 320 mesh, and the film thickness of the photosensitive resin film for screen printing is 50 mesh.
μm, and a silver paste manufactured by Namics Corporation was used as the silver paste to be used.

Then, after applying the ink 6 on the screen 3 with the squeegee 1, 3 kg /
At an air pressure of 2 cm 2, high-pressure air is injected from the high-pressure gas injection nozzle 2 to drop the silver paste into the grooves of the alumina substrate, thereby performing printing. After printing, the substrate 8 is heated at 450 degrees, and A silver electrode pattern 6 was formed.

[0040]

According to the present invention, after the ink is applied to the entire surface of the screen, the ink is dropped on the processing substrate by spraying the ink from the mesh portion of the screen to the equipment using a high-pressure gas, and the pattern is printed on the processing substrate. Unlike screen printing, where printing is performed while applying force to the screen,
High-precision printing is possible, and pattern printing can be accurately performed in a concave portion of a processing substrate or the like.

Further, by interposing a holding layer between the screen and the processing substrate and repeating the application of the ink and the spraying with the high-pressure gas, it is possible to perform the thick film printing with high accuracy without repeating the complicated work.

[Brief description of the drawings]

FIG. 1 is a process chart for explaining a first embodiment of a pattern printing method of the present invention.

FIG. 2 is a process chart for explaining a second embodiment (printing on a concave portion) of the pattern printing method of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 squeegee 2 high-pressure gas injection nozzle 3 screen plate 4 screen printing pattern mask 5 processed substrate 6 ink 7 screen holding layer 8 processed substrate with recess

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B41N 1/14 B41N 1/14

Claims (5)

[Claims] 1. A pattern printing method for printing a pattern on a substrate or the like by using a screen printing method, wherein a screen on which a screen printing pattern mask is formed is placed on a processing substrate, and then ink is applied to the entire surface of the screen. And thereafter, a high-pressure gas is used to spray ink from the mesh portion of the screen onto the equipment, thereby dropping the ink onto the processing substrate and printing the pattern on the processing substrate. 2. The pattern printing method according to claim 1, further comprising a holding layer, which is smaller than the pattern and larger than the thickness of the ink, below the screen printing pattern mask. 3. The pattern printing method according to claim 1, wherein the application of the ink to the entire surface of the screen and the spraying of the ink to the processing substrate by the high-pressure gas are repeated a plurality of times. 4. A screen printing apparatus used for carrying out the pattern printing method according to claim 1 or 2 for applying ink to a screen mounted on a processing substrate (5). The ink (6) applied on the screen (3) by spraying a high-pressure gas from an application means (1) and a mesh part of the screen (3) onto the processing substrate (5) from the mesh part of the screen (3). A high-pressure gas blowing means (2) for dropping the screen into a screen. 5. A screen used for carrying out the pattern printing method according to claim 1 or 2, wherein a film pattern (4) that does not allow ink to pass through is formed on the upper surface, and the film pattern (4) is formed. A screen plate, wherein a holding layer (7) smaller than the film pattern and larger than the film thickness of the ink is formed at the lower part of 4).