CN117177461A - Printing process of thick film circuit board - Google Patents
Printing process of thick film circuit board Download PDFInfo
- Publication number
- CN117177461A CN117177461A CN202311275123.1A CN202311275123A CN117177461A CN 117177461 A CN117177461 A CN 117177461A CN 202311275123 A CN202311275123 A CN 202311275123A CN 117177461 A CN117177461 A CN 117177461A
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- China
- Prior art keywords
- circuit board
- board substrate
- screen printer
- thick film
- adjusting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000007639 printing Methods 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 113
- 238000007790 scraping Methods 0.000 claims abstract description 25
- 238000001035 drying Methods 0.000 claims abstract description 17
- 239000002390 adhesive tape Substances 0.000 claims description 14
- 238000002360 preparation method Methods 0.000 claims description 14
- 238000010586 diagram Methods 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 238000004513 sizing Methods 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 238000011068 loading method Methods 0.000 claims description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 2
- GNLCAVBZUNZENF-UHFFFAOYSA-N platinum silver Chemical compound [Ag].[Ag].[Ag].[Pt] GNLCAVBZUNZENF-UHFFFAOYSA-N 0.000 claims description 2
- 238000005259 measurement Methods 0.000 description 10
- 238000011049 filling Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Screen Printers (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a printing process of a thick film circuit board. The thickness of the circuit board substrate and the thickness of the resistor are kept with higher precision, and the reject ratio of the circuit board substrate is reduced by controlling the mesh number of the silk screen printer, the gap between the circuit board substrate and the silk screen of the silk screen printer, the pressure between the scraping plate of the silk screen printer and the circuit board substrate, the drying time of the circuit board substrate and the range of the included angle between the moving direction of the scraping plate and the length direction of the circuit board substrate in the printing process.
Description
[ field of technology ]
The invention relates to the technical field of thick film circuit board production, in particular to a printing process of a thick film circuit board.
[ background Art ]
In the production process of thick film circuit boards, the steps of printing, leveling, drying and sintering are generally included. In the printing process, a screen printing process of a craftsman is more common and suitable for large-scale manufacturing production. The first step of screen printing is to design a circuit pattern and to make a screen containing an opening pattern according to the designed circuit pattern. The paste for conductors, electronic components, and the like is then printed on the substrate by a screen printing process.
In the prior art, it is basically disclosed how to form a thick film on a substrate. The prior art, for example, patent publication DE68920783D1, discloses a method of forming a thick film on a substrate, comprising: sequentially forming thick films having a predetermined common pattern on a plurality of the substrates by screen printing; drying and sintering the plurality of substrates formed with the predetermined pattern; placing the substrates one by one on a movable stage, wherein movement of the stage is controlled based on the thick film pattern formed by the first step; and sequentially forming thick films having different patterns on the respective substrates by using direct writing, wherein the regions of the substrate having the thick film formed by the direct writing are frequently subjected to pattern change.
In summary, the prior art reveals the basic steps of the printing process of thick film circuit boards, but specific steps, pressure control, gap control for the thick film circuit board printing process are not mentioned. According to the method disclosed by the prior art, although printing and subsequent processing of the thick film circuit board can be realized, the printing thickness of the manufactured thick film circuit board is not easy to grasp, so that the numerical variation fluctuation of electronic components (especially resistors) on the thick film circuit board is large, the subsequent drying and sintering processes are difficult to carry out, and the reject ratio of the thick film circuit board is even increased.
[ invention ]
The invention provides a printing process of a thick film circuit board, which aims to solve the technical problem that the high reject ratio of the thick film circuit board is caused by large fluctuation of the thickness of the thick film circuit board and the numerical value of electronic components in the prior art.
The invention provides a printing process of a thick film circuit board, which comprises the following steps:
s01, loading the sizing agent into a screen printer, wherein the mesh number of a screen of the screen printer ranges from 400 meshes to 600 meshes;
s02, adjusting the position of the screen printer to realize the position correspondence of the screen printer and the circuit board substrate;
s03, adjusting a gap between the circuit board substrate and a silk screen of the silk screen printer, wherein the gap is in a range of 200-400 μm;
and S04, adjusting the pressure between the scraping plate of the screen printer and the circuit board substrate, wherein the pressure ranges from 200N to 300N.
S05, adjusting the movement length of the screen printer, wherein the difference between the movement length of the screen printer and the length of the circuit board substrate is more than or equal to two inches.
S06, adjusting the movement direction of the scraping plate so that an included angle between the movement direction of the scraping plate and the length direction of the circuit board substrate is 30 degrees to 45 degrees.
The mesh number of the screen may be 400 mesh, 450 mesh, 500 mesh, 550 mesh, and 600 mesh.
The gap may be in the range of 200 μm, 250 μm, 300 μm, 350 μm, and 400 μm.
It should be noted that the pressure values may be 200N, 220N, 240N, 260N, and 300N.
The included angle may be 30 °, 35 °, 40 °, 42 °, and 45 °.
Compared with the prior art, the printing process of the thick film circuit board provided by the invention ensures that the thickness of the circuit board substrate and the thickness of the resistor keep higher precision and the reject ratio of the circuit board substrate by controlling the mesh number of the silk screen printer, the gap between the circuit board substrate and the silk screen of the silk screen printer, the pressure between the scraping plate of the silk screen printer and the circuit board substrate, the drying time of the circuit board substrate and the range of the included angle between the moving direction of the scraping plate and the length direction of the circuit board substrate in the printing process.
[ description of the drawings ]
For a clearer description of the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the description below are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art, wherein:
FIG. 1 is a block flow diagram of a printing process of a thick film circuit board provided by the invention;
FIG. 2 is a block flow diagram of step S02 in the printing process of the thick film circuit board shown in FIG. 1;
fig. 3 is a chart showing the circuit board substrate and the resistance dispersion statistics according to the first to fifth embodiments of the present invention.
[ detailed description ] of the invention
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, the printing process of the thick film circuit board provided by the invention comprises the following steps:
s01, loading the sizing agent into a screen printer, wherein the mesh number of a screen of the screen printer ranges from 400 meshes to 600 meshes;
s02, adjusting the position of the screen printer to realize the position correspondence of the screen printer and the circuit board substrate;
s03, adjusting a gap between the circuit board substrate and a silk screen of the silk screen printer, wherein the gap is in a range of 200-400 μm;
and S04, adjusting the pressure between the scraping plate of the screen printer and the circuit board substrate, wherein the pressure ranges from 200N to 300N.
S05, adjusting the movement length of the screen printer, wherein the difference between the movement length of the screen printer and the length of the circuit board substrate is more than or equal to two inches.
S06, adjusting the movement direction of the scraping plate so that an included angle between the movement direction of the scraping plate and the length direction of the circuit board substrate is 30 degrees to 45 degrees.
S07, drying the circuit board substrate in a high-temperature environment for 30-60 min.
Referring to fig. 2, fig. 2 is a block flow diagram of step S02 in the printing process of the thick film circuit board shown in fig. 1.
The step S02 includes:
s21, covering a preparation adhesive tape on the circuit board substrate, and then operating a screen printer to print a circuit diagram on the preparation adhesive tape;
s22, judging whether the positions of the screen printer and the circuit board substrate correspond to each other;
and S23, if the positions of the screen printer and the circuit board substrate deviate, performing position adjustment.
When the paste is a palladium-silver conductor or a platinum-silver conductor, the thickness of the circuit board substrate after drying is in the range of 28 μm to 32 μm.
When the paste is a gold conductor, the thickness of the circuit board substrate after drying is in the range of 20 μm to 22 μm.
The circuit board substrate is provided with a resistor, and the thickness of the resistor is 35+ -3 μm.
In step S07, the circuit board substrate is dried in a high-temperature environment in which the high temperature is in a range of 120 degrees celsius to 140 degrees celsius.
Example 1
The printing process of the thick film circuit board of the embodiment comprises the following steps:
s01, filling the sizing agent into a screen printer, wherein the mesh number range of a screen of the screen printer is 400 meshes;
s02, covering a preparation adhesive tape on the circuit board substrate, and then operating a screen printer to print a circuit diagram on the preparation adhesive tape; judging whether the positions of the screen printer and the circuit board substrate correspond to each other or not; if the positions of the screen printer and the circuit board substrate deviate, the position adjustment is carried out;
s03, adjusting a gap between the circuit board substrate and a silk screen of the silk screen printer, wherein the gap is 400 mu m;
s04, adjusting pressure between a scraper of the screen printer and the circuit board substrate, wherein the pressure range is 200N;
s05, adjusting the movement length of the screen printer, wherein the difference between the movement length of the screen printer and the length of the circuit board substrate is two inches.
S06, adjusting the movement direction of the scraping plate, so that an included angle between the movement direction of the scraping plate and the length direction of the circuit board substrate is 30 degrees.
S07, drying the circuit board substrate in a high-temperature environment for 60min.
And measuring the thickness of the dried circuit board substrate, and selecting 3 measuring points of the upper left corner, the center (close to the center) and the lower right corner of the circuit board substrate for measurement in the measuring process. The thickness variation of the circuit board substrate is 31.3 mu m, 32 mu m and 30.1 mu m, and the fluctuation range from the thickest part to the thinnest part is 1.9 mu m.
And similarly, 3 measuring points of the upper left corner, the center (close to the center) and the lower right corner of the resistor are selected for measurement. The thickness variation of the resistor was 33.4 μm, 38 μm, 35.8 μm, and the fluctuation range from the thickest to the thinnest was 4.6 μm.
Example two
The printing process of the thick film circuit board of the embodiment comprises the following steps:
s01, filling the sizing agent into a screen printer, wherein the mesh number range of a screen of the screen printer is 450 meshes;
s02, covering a preparation adhesive tape on the circuit board substrate, and then operating a screen printer to print a circuit diagram on the preparation adhesive tape; judging whether the positions of the screen printer and the circuit board substrate correspond to each other or not; if the positions of the screen printer and the circuit board substrate deviate, the position adjustment is carried out;
s03, adjusting a gap between the circuit board substrate and a silk screen of the silk screen printer, wherein the gap is 250 μm;
s04, adjusting the pressure between the scraping plate of the screen printer and the circuit board substrate, wherein the range of the pressure is 220N;
s05, adjusting the movement length of the screen printer, wherein the difference between the movement length of the screen printer and the length of the circuit board substrate is two inches.
S06, adjusting the movement direction of the scraping plate, so that an included angle between the movement direction of the scraping plate and the length direction of the circuit board substrate is 35 degrees.
S07, drying the circuit board substrate in a high-temperature environment for 60min.
And measuring the thickness of the dried circuit board substrate, and selecting 3 measuring points of the upper left corner, the center (close to the center) and the lower right corner of the circuit board substrate for measurement in the measuring process. The thickness variation of the circuit board substrate is 31.1 mu m, 31.5 mu m and 30.3 mu m, and the fluctuation range from the thickest part to the thinnest part is 1.2 mu m.
And similarly, 3 measuring points of the upper left corner, the center (close to the center) and the lower right corner of the resistor are selected for measurement. The thickness variation of the resistor was 32.7 μm, 36.9 μm, 34.8 μm, and the range of fluctuation from the thickest to the thinnest was 4.2 μm.
Example III
The printing process of the thick film circuit board of the embodiment comprises the following steps:
s01, filling the sizing agent into a screen printer, wherein the mesh number range of a screen of the screen printer is 500 meshes;
s02, covering a preparation adhesive tape on the circuit board substrate, and then operating a screen printer to print a circuit diagram on the preparation adhesive tape; judging whether the positions of the screen printer and the circuit board substrate correspond to each other or not; if the positions of the screen printer and the circuit board substrate deviate, the position adjustment is carried out;
s03, adjusting a gap between the circuit board substrate and a silk screen of the silk screen printer, wherein the gap is 300 mu m;
s04, adjusting the pressure between the scraping plate of the screen printer and the circuit board substrate, wherein the range of the pressure is 240N;
s05, adjusting the movement length of the screen printer, wherein the difference between the movement length of the screen printer and the length of the circuit board substrate is two inches.
S06, adjusting the movement direction of the scraping plate so that an included angle between the movement direction of the scraping plate and the length direction of the circuit board substrate is 40 degrees.
S07, drying the circuit board substrate in a high-temperature environment for 60min.
And measuring the thickness of the dried circuit board substrate, and selecting 3 measuring points of the upper left corner, the center (close to the center) and the lower right corner of the circuit board substrate for measurement in the measuring process. The thickness variation of the circuit board substrate is 30.2 mu m, 30.5 mu m and 29.7 mu m, and the fluctuation range from the thickest part to the thinnest part is 0.8 mu m.
And similarly, 3 measuring points of the upper left corner, the center (close to the center) and the lower right corner of the resistor are selected for measurement. The thickness variation of the resistor was 32.3 μm, 35.8 μm, 33.5 μm, and the fluctuation range from the thickest to the thinnest was 3.5 μm.
Example IV
The printing process of the thick film circuit board of the embodiment comprises the following steps:
s01, filling the sizing agent into a screen printer, wherein the mesh number range of a screen of the screen printer is 550 meshes;
s02, covering a preparation adhesive tape on the circuit board substrate, and then operating a screen printer to print a circuit diagram on the preparation adhesive tape; judging whether the positions of the screen printer and the circuit board substrate correspond to each other or not; if the positions of the screen printer and the circuit board substrate deviate, the position adjustment is carried out;
s03, adjusting a gap between the circuit board substrate and a silk screen of the silk screen printer, wherein the gap is 350 μm;
s04, adjusting pressure between a scraper of the screen printer and the circuit board substrate, wherein the pressure range is 260N;
s05, adjusting the movement length of the screen printer, wherein the difference between the movement length of the screen printer and the length of the circuit board substrate is two inches.
S06, adjusting the movement direction of the scraping plate so that an included angle between the movement direction of the scraping plate and the length direction of the circuit board substrate is 42 degrees.
S07, drying the circuit board substrate in a high-temperature environment for 60min.
And measuring the thickness of the dried circuit board substrate, and selecting 3 measuring points of the upper left corner, the center (close to the center) and the lower right corner of the circuit board substrate for measurement in the measuring process. The thickness variation of the circuit board substrate is 29.7 mu m, 30.1 mu m and 29.6 mu m, and the fluctuation range from the thickest part to the thinnest part is 0.5 mu m.
And similarly, 3 measuring points of the upper left corner, the center (close to the center) and the lower right corner of the resistor are selected for measurement. The thickness variation of the resistor was 32.1 μm, 33.1 μm, 32.4 μm, and the fluctuation range from the thickest to the thinnest was 1 μm.
Example five
The printing process of the thick film circuit board of the embodiment comprises the following steps:
s01, filling the sizing agent into a screen printer, wherein the mesh number range of a screen of the screen printer is 600 meshes;
s02, covering a preparation adhesive tape on the circuit board substrate, and then operating a screen printer to print a circuit diagram on the preparation adhesive tape; judging whether the positions of the screen printer and the circuit board substrate correspond to each other or not; if the positions of the screen printer and the circuit board substrate deviate, the position adjustment is carried out;
s03, adjusting a gap between the circuit board substrate and a silk screen of the silk screen printer, wherein the gap is 400 mu m;
s04, adjusting pressure between a scraper of the screen printer and the circuit board substrate, wherein the pressure range is 300N;
s05, adjusting the movement length of the screen printer, wherein the difference between the movement length of the screen printer and the length of the circuit board substrate is two inches.
S06, adjusting the movement direction of the scraping plate, so that an included angle between the movement direction of the scraping plate and the length direction of the circuit board substrate is 45 degrees.
S07, drying the circuit board substrate in a high-temperature environment for 60min.
And measuring the thickness of the dried circuit board substrate, and selecting 3 measuring points of the upper left corner, the center (close to the center) and the lower right corner of the circuit board substrate for measurement in the measuring process. The thickness variation of the circuit board substrate was 28 μm, 29.1 μm, 28.6 μm, and the range of fluctuation from the thickest to the thinnest was 1.1 μm.
And similarly, 3 measuring points of the upper left corner, the center (close to the center) and the lower right corner of the resistor are selected for measurement. The thickness variation of the resistor was 32 μm, 34.2 μm, 33.4 μm, and the range of fluctuation from the thickest to the thinnest was 2.2 μm.
After a lot of experimental data statistics, the summary of the dimensional fluctuation of the thickness of the circuit board substrate and the resistor after the printing and drying treatment in the above embodiment is shown in table 1 and fig. 3, wherein table 1 is the statistical result of the bubble in the conductor after the thick film circuit gold conductor paste is printed and sintered, and fig. 3 is the statistical chart of the circuit board substrate and the resistor dispersion in the embodiment one to the embodiment five of the present invention.
TABLE 1
As can be seen from the accompanying drawings and table 1, the printing process of the thick film circuit board provided by the invention improves the precision of the thickness of the surface of the printed thick film circuit board and the thickness of the resistor by controlling the mesh number of the silk screen printer, the gap between the circuit board substrate and the silk screen of the silk screen printer, the pressure between the scraper of the silk screen printer and the circuit board substrate, the moving direction of the scraper and the included angle between the scraper and the length direction of the circuit board substrate, thereby leading to smaller dispersion of the thick film circuit board substrate and the resistor and further indicating better stability. In particular, under the condition of the fourth embodiment of the present invention, the thickness precision of the thick film circuit board substrate and the resistor obtained is highest.
While the invention has been described with respect to the above embodiments, it should be noted that modifications can be made by those skilled in the art without departing from the inventive concept, and these are all within the scope of the invention.
Claims (8)
1. A process for printing a thick film circuit board, comprising the steps of:
s01, loading the sizing agent into a screen printer, wherein the mesh number of a screen of the screen printer ranges from 400 meshes to 600 meshes;
s02, adjusting the position of the screen printer to realize the position correspondence of the screen printer and the circuit board substrate;
s03, adjusting a gap between the circuit board substrate and a silk screen of the silk screen printer, wherein the gap is in a range of 200-400 μm;
and S04, adjusting the pressure between the scraping plate of the screen printer and the circuit board substrate, wherein the pressure ranges from 200N to 300N.
2. The process for printing a thick film circuit board of claim 1, further comprising:
s05, adjusting the movement length of the screen printer, wherein the difference between the movement length of the screen printer and the length of the circuit board substrate is more than or equal to two inches.
3. The process for printing a thick film circuit board of claim 2, further comprising:
s06, adjusting the movement direction of the scraping plate so that an included angle between the movement direction of the scraping plate and the length direction of the circuit board substrate is 30 degrees to 45 degrees.
4. The printing process of the thick film circuit board of claim 1, wherein the step S02 comprises:
s21, covering a preparation adhesive tape on the circuit board substrate, and then operating a screen printer to print a circuit diagram on the preparation adhesive tape;
s22, judging whether the positions of the screen printer and the circuit board substrate correspond to each other;
and S23, if the positions of the screen printer and the circuit board substrate deviate, performing position adjustment.
5. A process for printing a thick film circuit board as claimed in claim 3, further comprising:
s07, drying the circuit board substrate in a high-temperature environment for 30-60 min.
6. The process of claim 5, wherein when the paste is a palladium-silver conductor or a platinum-silver conductor, the thickness of the circuit board substrate after drying ranges from 28 μm to 32 μm.
7. The process of claim 5, wherein when the paste is a gold conductor, the thickness of the circuit board substrate after drying ranges from 20 μm to 22 μm.
8. The process of claim 6, wherein the circuit board substrate is provided with a resistor having a thickness of 35±3 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311275123.1A CN117177461A (en) | 2023-09-28 | 2023-09-28 | Printing process of thick film circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311275123.1A CN117177461A (en) | 2023-09-28 | 2023-09-28 | Printing process of thick film circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117177461A true CN117177461A (en) | 2023-12-05 |
Family
ID=88933749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311275123.1A Pending CN117177461A (en) | 2023-09-28 | 2023-09-28 | Printing process of thick film circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117177461A (en) |
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2023
- 2023-09-28 CN CN202311275123.1A patent/CN117177461A/en active Pending
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