TW198052B - - Google Patents

Info

Publication number
TW198052B
TW198052B TW081104694A TW81104694A TW198052B TW 198052 B TW198052 B TW 198052B TW 081104694 A TW081104694 A TW 081104694A TW 81104694 A TW81104694 A TW 81104694A TW 198052 B TW198052 B TW 198052B
Authority
TW
Taiwan
Application number
TW081104694A
Other languages
Chinese (zh)
Original Assignee
Shell Internat Res Schappej B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shell Internat Res Schappej B V filed Critical Shell Internat Res Schappej B V
Application granted granted Critical
Publication of TW198052B publication Critical patent/TW198052B/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/3218Carbocyclic compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
TW081104694A 1991-06-07 1992-06-16 TW198052B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16232091A JP3231808B2 (ja) 1991-06-07 1991-06-07 電気積層板用エポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
TW198052B true TW198052B (https=) 1993-01-11

Family

ID=15752293

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081104694A TW198052B (https=) 1991-06-07 1992-06-16

Country Status (7)

Country Link
EP (1) EP0517337B1 (https=)
JP (1) JP3231808B2 (https=)
KR (1) KR100238566B1 (https=)
CA (1) CA2070618A1 (https=)
DE (1) DE69229932T2 (https=)
ES (1) ES2135395T3 (https=)
TW (1) TW198052B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW340967B (en) * 1996-02-19 1998-09-21 Toray Industries An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device
KR100419063B1 (ko) * 2000-06-10 2004-02-14 주식회사 엘지화학 에폭시 수지 조성물 및 이를 이용한 적층판
JP2025025222A (ja) * 2023-08-09 2025-02-21 日本化薬株式会社 エポキシ樹脂、硬化性樹脂組成物、硬化物及び炭素繊維強化複合材料

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1325208A (fr) * 1961-05-03 1963-04-26 Heyden Newport Chemical Corp Perfectionnements apportés aux éthers polyglycidyliques et aux procédés pour leur production
US3378525A (en) 1964-12-03 1968-04-16 Union Carbide Corp Epoxy resins from polyhydric phenolterpene addition products
DE1595633A1 (de) * 1966-05-27 1970-03-19 Hoechst Ag Verfahren zur Herstellung von Harzen

Also Published As

Publication number Publication date
DE69229932D1 (de) 1999-10-14
EP0517337B1 (en) 1999-09-08
ES2135395T3 (es) 1999-11-01
JPH04359920A (ja) 1992-12-14
KR100238566B1 (ko) 2000-01-15
CA2070618A1 (en) 1992-12-08
JP3231808B2 (ja) 2001-11-26
EP0517337A3 (en) 1992-12-30
KR930000599A (ko) 1993-01-15
EP0517337A2 (en) 1992-12-09
DE69229932T2 (de) 2000-03-16

Similar Documents

Publication Publication Date Title
DE4290261T1 (https=)
DK0498143T3 (https=)
DE4291719T1 (https=)
DE4292255T1 (https=)
DE4291827T1 (https=)
DK0539725T3 (https=)
DE4291721T1 (https=)
DK0511526T3 (https=)
ATA181891A (https=)
DE4193594T1 (https=)
DK132791D0 (https=)
ECSDI910041S (https=)
ECSDI910049S (https=)
ECSM91533U (https=)
ECSM91543U (https=)
ECSM91556U (https=)
ECSM91561U (https=)
AU8138491A (https=)
AU8260191A (https=)
AU8979091A (https=)
AU8983291A (https=)
AU8997191A (https=)
CN3008237S (https=)
CN3009643S (https=)
CN3009746S (https=)