TN2012000314A1 - Process of manufacturing osb boards and wafer boards out of palms - Google Patents
Process of manufacturing osb boards and wafer boards out of palmsInfo
- Publication number
- TN2012000314A1 TN2012000314A1 TNP2012000314A TN2012000314A TN2012000314A1 TN 2012000314 A1 TN2012000314 A1 TN 2012000314A1 TN P2012000314 A TNP2012000314 A TN P2012000314A TN 2012000314 A TN2012000314 A TN 2012000314A TN 2012000314 A1 TN2012000314 A1 TN 2012000314A1
- Authority
- TN
- Tunisia
- Prior art keywords
- flakes
- board
- boards
- chips
- flake
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N1/00—Pretreatment of moulding material
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
THE INVENTION DEALS RELATES TO A PROCESS OF MANUFACTURING FLAKE BOARDS COMPRISING AT LEAST THREE LAYERS MADE OUT OF LIGNOCELLULOSIC FLAKES AND/OR FLAKES CONTAINING CELLULOSE. THE FLAKE BOARD IS AN OSB BOARD OR A WAFER BOARD. THE FLAKE ARE PRODUCED FROM PALM, IN PARTICULAR DATE AND OIL PALM, FRONDS WHICH, AFTER REMOVED FROM THE PALMS ARE FREED FROM LEAFLETS AND IF PRESENT, FROM THROMS. THUS OBTAINED MIDRIBS ARE THEN PROCESSED INTO LONGISH CHIPS. THE CHIPS ARE SUBSEQUENTLY FLAKED INTO THE FLAKES, WHICH ARE OF DIFFERENT SIZES. THE OBTAINED FLAKES ARE DRIED AND SEPARATED INTO AT LEAST COARSE AND FINE FLAKES. AFTER THAT THE FLAKES ARE GLUED, SCATTERED AS A MAT AND PRESSED TO THE BOARD. ACCORDING TO THE PRESENT INVENTION THE CHIPS ARE MOISTENED AND THEN THERMALLY TREATED WITH SATURATED STEAM AT A TEMPERATURE OF 100-140 C° DIRECTLY AFTER THERMAL TREATMENT. ACCORDING TO THE PRESENT INVENTION IMPROVEMENT OF QUALITY WITH RESPECT TO THE BENDING STRENGTH IS ACHIEVED.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011107398 | 2011-07-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
TN2012000314A1 true TN2012000314A1 (en) | 2013-12-12 |
Family
ID=47426678
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TNP2012000314A TN2012000314A1 (en) | 2011-07-07 | 2012-06-21 | Process of manufacturing osb boards and wafer boards out of palms |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102011118009A1 (en) |
TN (1) | TN2012000314A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DK2915640T3 (en) * | 2014-03-05 | 2017-01-02 | SWISS KRONO Tec AG | Method and apparatus for making an OSB plate |
EP3280575B1 (en) * | 2015-04-10 | 2019-10-02 | Mayfair Vermögensverwaltungs SE | Panel |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19838860A1 (en) | 1998-08-26 | 2000-03-02 | Kvaerner Panel Sys Gmbh | Production of boards and other shaped bodies uses palm leaves as raw material which are compressed while green to be chopped into particles to form scattered web |
-
2011
- 2011-11-09 DE DE201110118009 patent/DE102011118009A1/en not_active Ceased
-
2012
- 2012-06-21 TN TNP2012000314A patent/TN2012000314A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
DE102011118009A1 (en) | 2013-01-10 |
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