TH79999A - A partially completed wiring circuit board assembly plate and how to manufacture the wiring circuit boards using the panels. - Google Patents

Abstract

DC60 (18/05/55) This invention provides a partially completed circuit board assembly that can prevent the deposition of electroplating metal onto the surface of a thin metal sheet, even in the event that pinholes occur in the insulating layer separating the electroplating junction wire from the thin metal sheet. 100 assemblies of this invention shall contain a thin metal sheet 1, a multi-position circuit board formation area 1A in a slot on the thin metal sheet, and an area 1B for forming the electroplating junction wire, which is located in a slot on the thin metal sheet 1. Each area 1A shall contain 10 partially completed circuit boards. 10 partially completed circuit boards shall consist of a base insulating layer 2, a wiring pattern 3, and a covering insulating layer 4 in area 1B. The first insulating layer 12, the junction wire 13 for electroplating. And a second insulating layer 14 shall be stacked sequentially. An opening 16 of the thin metal sheet 1 shall be created in the section beneath the connecting wire 13. This invention shall provide a partially completed circuit board assembly that can prevent the deposition of the plating metal on the surface of the thin metal sheet, even in the event that pinholes occur in the insulating layer separating the plating connecting wire insulation from the thin metal sheet. The assembly 100 of this invention shall contain a thin metal sheet 1, a multi-position circuit board creation area 1A in the slots on the thin metal sheet, and an area 1B for creating the plating connecting wire, which is located in the slots on the thin metal sheet 1. Each area 1A shall contain a partially completed circuit board 10. The partially completed circuit board 10 shall consist of a base insulating layer 2, a wiring pattern 3, and a covering insulating layer 4 in area 1B, the first insulating layer 12, and the plating connecting wire 13. And the second insulating layer 14 will be stacked on top of each other in sequence. An opening 16 of thin metal sheet 1 will be created in the section beneath the connecting wire 13.

Claims (3)

1. A partially completed circuit board assembly consisting of (A) through (C) as follows: (A) a thin metal sheet; (B) a multi-position circuit board fabrication area in a niche in the thin metal sheet, each containing a partially completed circuit board consisting of a base insulator, wiring pattern, and overlapping insulator layer in sequence, and openings for creating connectors in the designated sections of the overlapping insulator layer; and (C) an area for creating electroplated junction wires, located in a niche in the thin metal sheet, consisting of a first insulator layer, electroplated junction wire, and a second overlapping insulator layer in sequence, where the first insulator layer is fabricated using the same process as the base insulator layer; the through-hole electroplated junction wire is fabricated using the same process as the wiring pattern and is connected to the multi-position wiring pattern in the multi-position circuit board fabrication area (B) to provide power to the multi-position wiring pattern, and its portion is exposed for the creation of the power supply section. A second insulating layer is created using the same process as the outer insulating layer, and in which openings are created on a thin metal sheet (A) beneath the connecting wire used in electrochemical plating. 2. The assembly board as specified in Claim 1, where the wiring circuit board is a suspended substrate containing the circuit. 3. A method for the simultaneous fabrication of multiple partially completed circuit boards, which involves the immersion of the assemblies described in Reputation 1 into a plating solution and the application of electrical power to the wiring patterns of each partially completed circuit board through a junction wire for electrochemical plating of the aforementioned boards, thus creating an electrochemically coated layer in the openings created on the thin metal sheet (A) for creating the connectors of each partially completed circuit board.