TH54950B - An electronic assembly consisting of a solderable thermal joint and manufacturing methods. - Google Patents

Abstract

DC60 (05/02/53) to support the high power density, coupled with high performance integrated circuit, heat is radiated from the mold surface through the surface. Solderable heat exchanger to the lid or integrated heat spreader. In one style The molds are mounted on an organic substrate using C4 and a grid array arrangement. Of the flat part In order to maximize heat dissipation from the mold While reducing twisting Minimize the flexion of the package when it is subjected to heat due to the difference in the relationship. The thermal expansion efficiency between the mold and the organic substrate is applied, which has a melting point. Relatively low from there Relatively high thermal conductivity, production methods, as well as package applications and electronic assemblies. Electronic systems and text processing systems Dung is also described to support the high power density, coupled with high performance integrated circuits, heat is radiated from the mold surface through the surface. Solderable heat exchanger to the lid or integrated heat spreader. In one style The molds are mounted on an organic substrate using C4 and a grid array arrangement. Of the flat part In order to maximize heat dissipation from the mold While reducing twisting Minimize the flexion of the package when it is subjected to heat due to the difference in the relationship. The thermal expansion coefficient between the mold and the organic substrate is used, which has a melting point. Relatively low from there Relatively high thermal conductivity, production methods, as well as package applications and electronic assemblies. Electronic systems and text processing systems Data has been described as well.

Claims (9)

Disclaimer (all) which will not appear on the advertisement page: edit 22/8/2016 1. Assembled kit included. Mold with a surface A metallic adhesive layer that is attached to the surface. A meltable solder layer that is bonded to a layer of glue, a cap, and a solderable heating element that attaches the cap to the meltable solder layer. 2. An assembly referred to in claim 1, where the cover is made up of materials from the assembled group. With copper and aluminum-silicon-carbide 3. The assembly referred to in claim 1, where the solderable heating element It is made up of materials, including one or more alloys from the group containing tin, bismuth, silver, indium and lead. 4.Assembly referred to claim 1, where the cover is assembled with a metal shelf or shelf. At least one layer of organic matter Where the heating elements can be spliced 5. Assembly referred to claim 4, where at least the metal layer or the organic layer One layer is made up of nickel or gold. 6.The assembly referred to in claim 1, and additions are included. The diffusion layer is between the adhesive layer and the meltable solder layer. 7. Assembly referred to claim 6, where the floor consists of materials including metal. One or more blends from a group containing titanium, chromium, zirconium, nickel, vanadium, and gold. 8.An assembly referred to claim 6, where the diffusion layer includes materials including One or more alloys from the group containing titanium, chromium, zirconium, nickel, vanadium, and gold. 9. Assembly referred to claim 6, where the diffusion layer is made up of nickel-vanadium 1. 0. Assembly referred to claim 1, where the solderable heating element Has had a melting temperature of 150 degrees centigrade or less than 1 1. The assembly referred to in claim 1, where the heat conducting element that can be soldered Has had a melting temperature of 140 degrees centigrade or less than 1 2. The assembly referred to in claim 1, where the heat conducting element that can be soldered Has had a melting temperature in the range of 138 to 157 centigrade. 3.The assembly referred to in claim 1, where the adhesive layer is comprised of materials including One or more alloys from the group containing titanium, chromium, zirconium, nickel, vanadium, and gold. 4.The assembly referred to in claim 1, where the adhesive layer consists of titanium 1. 5.Assembly referred to claim 1, where the dissolvable solder layer is assembled. With materials including one or more alloys from a group containing titanium, chromium, zirconium, nickel, vanadium and gold. 6.Assembly referred to claim 1, where the meltable solder layer is assembled. With either nickel or gold 1 7. Integrated circuit package consisting of a molded shunt that is positioned on the surface of the chopper. Where the mold has a surface on the back A metallic adhesive layer formed on the back surface. A meltable solder layer formed on the adhesive layer. The cap is positioned over the mold and a solderable heating element that attaches a meltable solder layer to the cap 1. 8. Integrated circuit package referred to claim 17 where the cover is assembled with assembly parts. Support that is connected to the substrate 1 9. Package of integrated circuits referred to claim 17, where the cover is made up of materials from that group. Copper And aluminum-silicon-carbide 2 0. Integrated circuit package referred to in Claim 17, where the cover consists of a metal layer or At least one organic layer Where the heating element is connected 2 1. Integrated circuit packages referred to in claim 20 where the metal or organic layer is Minimum one layer consists of two nickel or gold. 2. The integrated circuit package referred to in claim 17 where the heat conducting element capable of Solder is made up of materials including one or more alloys from a group containing tin, bismuth, silver, indium and lead. 3. Integrated circuit package referred to in claim 17 where the substrate is an organic substrate. And where the mold is joined to the substrate through the grid array of the flat section 2 4. Integrated circuit packages referred to in Claim 17 and are also included. The diffusion layer is between the adhesive layer and the meltable solder layer 2. 5. The integrated circuit package referred to in Claim 24, where the floor consists of materials including One or more alloys from the group containing titanium, chromium, zirconium, nickel, vanadium, and gold. 6. The package of the integrated circuit referred to claim 17, where the heating element capable of The solder has a melting temperature in the range of 138 to 157 centigrade. 7. Electronic assembly That includes At least one integrated circuit package. It consists of a molded chopper that is positioned on the surface of the chopstick. Where the mold has a surface on the back A metallic adhesive layer formed on the back surface. A meltable solder layer formed on the adhesive layer. The cap is positioned over the mold and a solderable heating element that attaches a meltable solder layer to the cap 2. 8.Electronic assembly referred to in claim 27, where the cover is included. Support assembly that is connected to the substrate 2. 9. Electronic assembly referred to in claim 27, where the heat conducting element Solder can be made up of materials that include one or more alloys from the group containing tin, bismuth, silver, indium and lead 3. 0.Electronic assembly referred to claim 27, where the substrate is an organic substrate and with the mold coupled to the substrate through the grid array of the flat sections. For the chop of the straight 3 1. Electronic assembly referred to in claim 27, and additionally included. The diffusion layer is between the adhesive layer and the meltable solder layer 3. 2.An assembly referred to claim 31 where the floor includes materials including One or more alloys from the group containing titanium, chromium, zirconium, nickel, vanadium, and gold for that alloy. 3.Electronic system integrated electronic assembly with integrated circuit package. At least one package contains a die shunt that is positioned on the surface of the chopper. Where the mold has a surface on the back A metallic adhesive layer formed on the back surface. A meltable solder layer that is formed on the adhesive layer for that solder layer. The cap is positioned over the mold and a solderable heating element that attaches a meltable solder layer to the cap 3. 4. Electronic systems referred to in claim 33, where the heating element Solder can be made up of materials that include one or more alloys from the group containing tin, bismuth, silver, indium and lead 3. 5. Electronic systems referred to in claim 33, where the substrate is an organic substrate, where the mold is connected to the substrate through the grid array of the flat sections and by The cover is assembled with a support assembly that is connected to the substrate 3. 6. Electronic systems referred to in claim 33, and are also supplemented. The diffusion layer is between the adhesive layer and the meltable solder layer 3. 7. Electronic systems referred to in claim 36, where the class consists of materials including One or more alloys from the group containing titanium, chromium, zirconium, nickel, vanadium, and gold. 8. Assembled kit included. Mold with a surface The metal adhesive layer formed on the surface and the meltable solder layer formed on the adhesive layer. To accommodate the heating element That can be soldered 3 9.Assembly referred to claim 38, where the adhesive layer is comprised of materials including One or more alloys from the group containing titanium, chromium, zirconium, nickel, vanadium, and gold. 0. Assembly referred to claim 38, where the adhesive layer is made up of titanium 4. 1.Assembly referred to claim 38, where the dissolvable solder layer is assembled. With materials including one or more alloys from a group containing titanium, chromium, zirconium, nickel, vanadium and gold 4. 2. Assembly referred to claim 38 where the meltable solder layer is assembled. With one nickel and one gold 4 3. Assembly referred to claim 38, where solderable heating elements It is made up of materials that include one or more alloys from the group containing tin, bismuth, silver, indium and lead. 4. Assembly referred to claim 38, where solderable heating elements Has a melting temperature in the range of 138 to 157 centigrade 4 5. Assemblies referred to in claim 38, and are also included. The formed diffusion layer is between the adhesive layer and the meltable solder layer 4. 6.Assembly claimed pursuant to claim 45, where the diffusion layer includes materials including One or more alloys from the group containing titanium, chromium, zirconium, nickel, vanadium, and gold. 7.An assembly referred to claim 45, where the diffusion layer is made up of nickel-vanadium 4. 8. Assembled kit included. Mold with a surface A metallic adhesive layer that is attached to the surface. A meltable solder layer that is attached to the cap adhesive layer and the thermal interface of the solder material to connect the cap to the 4 melting solder layer. 9. Assembly referred to claim 48, where solder material is comprised of materials including One or more alloys from the group containing tin, bismuth, silver, indium and lead 5. 0. Assembly referred to claim 48 where the solder material has a melting temperature of 150 degrees centigrade or less 5. 1. Assembly referred to claim 48 where the solder material has a melting temperature of 140 degrees centigrade or less 5. 2. The assembly referred to claim 48 where the solder material has a melting temperature in the range of 138 to 157 centigrade. -------------------------------------------------- -------------------------------------- 1. Assembly for mold It contains the following components, caps and soldered conductive heat elements. Yes, to connect the mold with the cap 2. An assembly described in claim 1 where the lid will be assembled. With materials from the assembled group With copper and alu Minum-Silicon-Carbide 3. An assembly described in claim 1 where elements That uses heat to conduct electricity at Solderable will contain materials that Include the One or more alloys from the group containing tin, bismuth, silver, indium and lead. 4. The assembly described in claim 1 where the lid may consist of at least one metal. Or organic layers which can be Connected to elements that use heat to conduct electricity 5. An assembly described in claim 4 where at least one metal or organic layer is composed of nickel or gold. 6. The assembly described in claim 1, which still consists of a mold consisting of at least one metal layer, which Can be connected to the elements used Five solderable heat leads 7. The assembly is described in claim 6 where the metal floor At least one layer is made up of materials including One or more alloys from A group containing titanium, chromium, zirconium, nickel, vanadium and gold. 8.Package of integrated circuits It contains the following components, a mold chopper that is positioned on the surface of the chopper. The cap is positioned over the mold and the conductive heat element is attached to the mold. Solderable and lid 9. The integrated circuit package described in Claim 8, where the lid will contain assembled parts. For support that is attached to the substrate 1 0. The package of the integrated circuit is described in claim 8, where the cover contains materials from the group. Coppery And Alumina-Sulicon-Carbide 1 1. The package of the integrated circuit as described in claim 8, where the cover contains metal. At least one or more or more organic layers in which Can be connected to the elements that use heat conductive 1 2. The package of integrated circuits described in claim 11 where at least one metal or The organic layer will Contains nickel or gold 1 3. The package of the integrated circuit described in claim 8 where the heat-conducting element The solderable conductivity contains materials. Which includes the part that is One or more alloys from A group consisting of tin, bismuth, silver, indium and lead. 4.Package of integrated circuits described in claim 8 where the substrate is a substrate that is Organic matter and by which mold Will be sandwiched to the substrate by the grid array of the flat area 1. 5. The package of the integrated circuit described in claim 8 where the mold is composed of at least one metal layer. Which is connected to the element that uses the conductive heat 1 6. The package of the integrated circuit described in claim 15 where at least one metal layer will consist of a material including a component. One or more alloys From a group containing titanium, chromium, zirconium, nickel, vanadium and gold 1 7.Electronic assembly At least one of the following components: A package of integrated circuits. It contains the following components, a mold chopper that is positioned on the surface of the chopper. The cap is positioned over the mold and the heat conducting element is attached to the mold. Solderable holder and cap 1 8.The electronic assembly described in claim 17 where the lid contains Support assembly that is attached to the substrate 1 9. The electronic assembly described in claim 17, where applicable elements The solderable heat conducts Consists of materials including One or more alloys from the group containing tin, bismuth, silver, indium and lead 2. 0.The electronic assembly described in claim 17, where the substrate is Chopped organic strains and The mold is sandwiched to the substrate through a grid array of flat sections 2. 1. an electronic system that consists of electronic assemblies Electronics package integrated circuit At least one of the following components of the chopper that is positioned on the surface of the chopper. The cap is positioned over the mold and the heat conducting element is attached to the mold. Solderable and lid 2 2. The electronic system described in claim 21, where the heating element Solderable will Consisting of a material incorporating an alloy or More from A group consisting of tin, bismuth, silver, indium and lead 2. 3. The electronic system described in claim 21 where the substrate is a substrate that is Organic matter, where The mold is attached to the substrate through a grid array of the flat sections, and where the lid consists of a supporting assembly that Articulated with substrate 2 4. Data processing system Which contains the following components A bus that connects components in a data processing system. Display device connected to the bus The memory is spliced, the external bus, and the processor is connected to the bus, and contains the physical assembly. Electronics, which include at least part of the integrated circuit package One, which contains the following components, a molded chopper that is positioned on the surface of the chopper. The cap is positioned over the mold and the heat conducting element is attached to the mold. Solderable and lid 2 5. The system calculates the results described in claim 24 where the heating element Solderable will Material Which includes the part that is One alloy or More from A group consisting of tin, bismuth, silver, indium and lead 2. 6.The data processing system described in claim 24 where the substrate is an organic substrate and where The mold is sandwiched to the substrate through a grid array of flat sections 2. 7. A method for creating an integrated circuit package, in which the method has the following components, creating at least one metal layer on the mold surface. Installing the mold on the chopstick Set the lid surface position next to the layer made. By feeding the solder material between at least one metal layer and the surface of the cap, the melting melting of the solder is applied to the cover. Under the mold 2 8. The method is described in claim 27 where the solder material Has a relatively low thermal conductivity High side and relatively low melting capacity 2 9. The method described in claim 27, wherein the substrate will Contains organic materials which With coefficient of road expansion Relative high heat to mold 3 0. The method described in claim 27 still consists of at least one metal or organic layer. Layer on the surface of the cap before feeding the solder material