TH34064B - Methods for Recycle Printed Circuit Boards - Google Patents

Abstract

DC60 (28/02/46) This invention provides a method and device for conducting printed circuit boards. through the process for Recycle for separating and recovering metal materials. which will include printed metal material and insulating material, both of which make up printed circuit board Both metal and insulating materials, which are separated and recovered, are possible for reprocessing. in the method for bringing printed circuit board through the process to be reused. The hot filtration device 4a and the resin-metal separation device 51 are used in the process for hot filtration P400. The damaged printed circuit board 1 is heated. and is forcefully filtered so that only insulating material 1a passes through the filter. Subsequently, insulating material 1a and metallic material 1b are separated and recovered. It is desirable that the insulating body base 23 of printed circuit board 100, as a waste printed circuit board, was made of thermoplastic resin or a mixture of thermoplastic resins and inorganic packaging materials. as a result, when metal materials are recovered and the insulating material is recovered. that is necessary to Processed to be recycled, respectively, both metal materials. and insulating materials are possible for reuse. This invention provides methods and devices for conducting printed circuit boards. through the process for Recycle for separating and recovering metal materials. which will include printed metal material and insulating material, both of which make up printed circuit board Both metal and insulating materials, which are separated and recovered, are possible for reprocessing. in the method for bringing printed circuit board through the process to be reused. The hot filtration device 4a and the resin-metal separation device 51 are used in the process for hot filtration P400. The damaged printed circuit board 1 is heated. and is forcefully filtered so that only insulating material 1a passes through the filter. Subsequently, insulating material 1a and metallic material 1b are separated and recovered. It is desirable that the insulating body base 23 of printed circuit board 100, as a waste printed circuit board, was made of thermoplastic resin or a mixture of thermoplastic resins and inorganic packaging materials. as a result, when metal materials are recovered and the insulating material is recovered. that is necessary to Processed to be recycled, respectively, both metal materials. and the insulating material will be possible for reuse.

Claims (6)

Disclaimers (all) that will not appear on the advertisement page: 1. Methods of reusing printed circuit boards for separation and recovery of insulating materials and Metal materials from a broken printed circuit board Which is used in broken electrical equipment or the waste produced in the process of Manufacture of electrical equipment Where the printed circuit board consists of Insulating materials and metal materials Where the insulating material is created Only from thermoplastic resins or a mixture of thermoplastic resins and inorganic filling materials and where metal materials are composed of Printed metal material By the method consists of steps of Heating and filtering the printed circuit board in order to pass through the insulating material only so that Insulating materials and metallic materials are separated and retrieved and either insulating material or metallic material is Few have been recycled 2. A method of recycling of printed circuit boards according to claim 1, where force filtering is performed. This is accomplished by sieving the printed circuit board by heating and compression. 3. The method of recycling of the printed circuit board according to claim 1, where the printed circuit board consists of a base, an insulating body, which is made up of an insulating material, and a conductive printed circuit that is made up of metal material and Correct Placed on the surface of the insulated body base and where, through the printed circuit board, a multi-layer printed circuit board. Which is built in such a way as at the insulated body base A number of printed circuits with a number of leads that are stacked and bolted together by means of Hot and compression 4. A method of recycling printed circuit boards according to claim 3, where the modulus of the revinter Plastics are in the range of 1-1000 MPa at heating temperatures, where the heating and compression in The process of force filtration is performed. 5. Methods of reuse of the reinforced plank according to claim 3, where the insulating body base is composed of a film resin formed from only thermoplastic resin or a mixture of thermoplastic resins. plastic And one of the inorganic filler materials Where the fuselage base, insulator, including through holes and water products are Together in through hole Where conductive printed circuits are electrically connected with conductive products and where conductive products are made only from metallic materials or metal materials and thermoplastic resins. One containing plastic The insulating body base or mixture of thermoplastic resins and inorganic filler materials containing The body base is also insulated. 6. Methods for separation and recovery of thermoplastic resins from plate-packed printed circuit boards. Printed circuit containing thermoplastic resin Which contains the essential parts of Separation of printed circuit boards to components containing thermoplastic resin and packaged components. Metallic materials by simultaneous heating and filtration of the printed circuit board at the melting temperature Components containing thermoplastic resin, while components containing metal materials remain hardened and undergoing A component containing thermoplastic resin that is moltened through a filter without passing through the solid component. The metal material is loaded through a filter and recovered. Each part of the filtered component containing thermoplastic resin and the Contains a non-filtered material containing a metal material and the recycling of a component containing a recovered thermoplastic resin. At least And components that were returned to contain metal materials