TH1901006750A - Pre-treatment mixtures for electroless plating, basic treatment methods for non-electroless plating, and electroplating methods. - Google Patents
Pre-treatment mixtures for electroless plating, basic treatment methods for non-electroless plating, and electroplating methods.Info
- Publication number
- TH1901006750A TH1901006750A TH1901006750A TH1901006750A TH1901006750A TH 1901006750 A TH1901006750 A TH 1901006750A TH 1901006750 A TH1901006750 A TH 1901006750A TH 1901006750 A TH1901006750 A TH 1901006750A TH 1901006750 A TH1901006750 A TH 1901006750A
- Authority
- TH
- Thailand
- Prior art keywords
- electroless plating
- methods
- treatment
- mixtures
- ions
- Prior art date
Links
- 238000007772 electroless plating Methods 0.000 title claims abstract 8
- 238000000034 method Methods 0.000 title claims abstract 7
- 239000000203 mixture Substances 0.000 title claims abstract 7
- 238000011282 treatment Methods 0.000 title claims 5
- 238000009713 electroplating Methods 0.000 title claims 3
- 238000002203 pretreatment Methods 0.000 title abstract 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract 4
- 238000011221 initial treatment Methods 0.000 claims abstract 3
- 229910052709 silver Inorganic materials 0.000 claims abstract 3
- 239000004332 silver Substances 0.000 claims abstract 3
- -1 silver ions Chemical class 0.000 claims abstract 3
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 claims abstract 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052763 palladium Inorganic materials 0.000 claims abstract 2
- 238000007747 plating Methods 0.000 claims abstract 2
- 239000000463 material Substances 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 150000002500 ions Chemical class 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 229910001437 manganese ion Inorganic materials 0.000 abstract 1
Abstract
DEPCT63 การประดิษฐ์นี้ให้สารผสมการทรีตเบื้องต้นสำหรับการชุบที่ไม่ใช้ไฟฟ้า, วิธีการทรีตเบื้องต้น, และวิธีการการชุบที่ไม่ใช้ไฟฟ้า ที่แสดงสมรรถนะการเกาะจับการชุบที่สูง โดยปราศจากการใช้ โครมิคแอซิดที่อันตราย และแพลเลเดียมที่แพง, ขณะที่ลดจำนวนของขั้นตอน การประดิษฐ์นี้ให้ สารผสมการทรีตเบื้องต้นสำหรับการชุบที่ไม่ใช้ไฟฟ้าที่มี 10 มิลลิกรัม/ลิตร หรือมากกว่า ของแมงกานิสไอออน และ 10 มิลลิกรัม/ลิตร หรือมากกว่า ของโมโนวาเลนท์ซิลเวอร์ไอออน ----------------------------------------------------------- DEPCT63 The present invention provides primary treatment mixtures for electroless plating, primary treatment methods, and electroless plating methods. that shows high plating adhesion performance without using Dangerous chromic acid and expensive palladium, while reducing the number of steps This invention provides Pre-treatment mixture for electroless plating containing 10 mg/L or more of manganese ions and 10 mg/L or more of monovalent silver ions. -------------------------------------------------- ---------
Claims (1)
Publications (1)
Publication Number | Publication Date |
---|---|
TH1901006750A true TH1901006750A (en) | 2021-02-08 |
Family
ID=
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY176735A (en) | Composition for pretreatment for electroless plating, pretreatment method for electroless plating, and electroless plating method | |
TW200730248A (en) | Palladium complex and catalyst-imparting treatment solution using the same | |
WO2007034117A3 (en) | Electroplating method for coating a substrate surface with a metal | |
EP1878812A4 (en) | Copper surface treatment method and copper | |
TW200619418A (en) | Pretreatment agent for electroless plating and copper clad laminate for a flexible circuit board | |
TW200639269A (en) | Plating method | |
DE602008005195D1 (en) | Electrode wire for electric discharge | |
MX2010004165A (en) | Novel method. | |
PH12016500567A1 (en) | Reductive electroless gold plating solution, and electroless gold plating method using said plating solution | |
MY186814A (en) | Film formation method | |
EP2014801A3 (en) | An acidic gold alloy plating solution | |
WO2007102999A3 (en) | Cb1 antagonists and inverse agonists | |
MY189133A (en) | Semiconductor device and method of manufacture | |
EA202192224A1 (en) | UNDERGROUND PROCESSING | |
MX2017001750A (en) | Treatment for electroplating racks to avoid rack metallization. | |
TW200632146A (en) | Immersion process for electroplating applications | |
EP3498884A4 (en) | Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring board | |
TH1901006750A (en) | Pre-treatment mixtures for electroless plating, basic treatment methods for non-electroless plating, and electroplating methods. | |
MX355419B (en) | Zincating aluminum. | |
EP3757250A4 (en) | Electroless palladium plating solution and palladium coating | |
MY197351A (en) | Lead-frame structure, lead-frame, surface mount electronic device and methods of producing same | |
EP3257967A4 (en) | Pretreatment agent for electroless plating, and pretreatment method and manufacturing method for printed wiring board in which pretreatment agent for electroless plating is used | |
MX2016012292A (en) | Plated steel sheet. | |
MX2021005299A (en) | Satin copper bath and method of depositing a satin copper layer. | |
MY190168A (en) | Method of manufacturing tin-plated copper terminal material |