TH178469A - Resin compositions for printed circuit boards, prepres, metal foil-clad laminates, resin panels, and printed circuit boards. - Google Patents

Resin compositions for printed circuit boards, prepres, metal foil-clad laminates, resin panels, and printed circuit boards.

Info

Publication number
TH178469A
TH178469A TH1701004190A TH1701004190A TH178469A TH 178469 A TH178469 A TH 178469A TH 1701004190 A TH1701004190 A TH 1701004190A TH 1701004190 A TH1701004190 A TH 1701004190A TH 178469 A TH178469 A TH 178469A
Authority
TH
Thailand
Prior art keywords
printed circuit
circuit boards
resin
prepres
metal foil
Prior art date
Application number
TH1701004190A
Other languages
Thai (th)
Inventor
โคบายาชิ นายทาคาชิ
ทาคาโนะ นายเคนทาโร่
Original Assignee
นางดารานีย์ วัจนะวุฒิวงศ์
นางสาวสนธยา สังขพงศ์
Filing date
Publication date
Application filed by นางดารานีย์ วัจนะวุฒิวงศ์, นางสาวสนธยา สังขพงศ์ filed Critical นางดารานีย์ วัจนะวุฒิวงศ์
Publication of TH178469A publication Critical patent/TH178469A/en

Links

Claims (1)

: ข้อถือสิทธิ์ (ข้อที่หนึ่ง) ซึ่งจะปรากฏบนหน้าประกาศโฆษณา :: Claims (number one) which will appear on the advertisement page 1. องค์ประกอบเรซินสำหรับแผ่นวงจรพิมพ์ (printed wiring board) ที่ประกอบรวมด้วย สารประกอบไซยาเนต (A) ที่ถูกแทนโดยสูตรทั่วไป (1) ต่อไปนี้: (สูตร) (1) ที่ซึ่ง n แทนจำนวนเต็ม 1 หรือมากกว่า; และ อีพอกเรซิน (B)แท็ก :1.Resin elements for printed wiring boards that are included. The cyanate compound (A) is represented by the following general formula (1): (formula) (1) where n represents an integer 1 or more; And epoxy resin (B).
TH1701004190A 2016-01-29 Resin compositions for printed circuit boards, prepres, metal foil-clad laminates, resin panels, and printed circuit boards. TH178469A (en)

Publications (1)

Publication Number Publication Date
TH178469A true TH178469A (en) 2018-07-26

Family

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