MX2011012226A
(es )
2011-12-08
Retardantes de flama derivados de 10-oxido de 9,10-dihidro-9-oxa-10-fosfafenantreno (dopo) y composicion de resinas epoxi.
SG11201505058PA
(en )
2015-08-28
Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring board
SG10201903484XA
(en )
2019-05-30
Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar
EP2194098A4
(en )
2011-05-11
EPOXY RESIN COMPOSITION, PREPREG USING THE EPOXY COMPOSITION, METAL-COATED LAMINATE AND CONDUCTOR PLATE
SG11201509490PA
(en )
2015-12-30
Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same
MY200914A
(en )
2024-01-23
Resin composition for printed wiring board, copper foil with resin, copper-clad laminate board, and printed wiring board
SG11201502604RA
(en )
2015-05-28
Resin composition, prepreg, laminate plate, metallic foil clad laminate, and printed circuit board
EP2562195A4
(en )
2016-09-28
EPOXY RESIN COMPOSITION, PREPREG, METALLIC COATING LAMINATE AND PRINTED BOARD
MY169978A
(en )
2019-06-19
Low dielectric loss thermoset resin system at high frequency for use in electrical components
SG11201600586XA
(en )
2016-02-26
Prepreg, metal foil-clad laminate, and printed wiring board
EP2662395A3
(en )
2015-03-04
Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound
WO2012091320A3
(en )
2012-09-13
Epoxy resin compound and radiant heat circuit board using the same
MY169238A
(en )
2019-03-19
Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board
WO2016075290A3
(fr )
2017-03-30
Structure composite comportant une resine chargee avec des feuillets plans de graphene a conductivite thermique et conductivite electrique renforcees, notamment pour satellite
EP3290453A4
(en )
2018-10-31
Epoxy resin composition, thermoconductive material precursor, b-stage sheet, prepreg, heat-dissipating material, laminated plate, metal substrate, and printed circuit board
MY178642A
(en )
2020-10-19
High tg epoxy formulation with good thermal properties
SG11201700803VA
(en )
2017-03-30
Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board
MY157470A
(en )
2016-06-15
Prepreg, metal foil-clad laminate, and printecd wiring board
EP2698400A3
(en )
2016-12-14
Epoxy resin compound and radiant heat circuit board Using the same
TH149298A
(th )
2016-04-26
องค์ประกอบเรซิน และ พรีเพรก และ ลามิเนตที่ใช้สิ่งเดียวกันนั้น
WO2016042415A2
(ja )
2016-03-24
硬化性樹脂組成物、硬化性樹脂成形体、硬化物、積層体、複合体および多層プリント配線板
TWI563035B
(en )
2016-12-21
Composition for preparing thermosetting resin, cured product of the composition, prepreg having the cured product, and metal clad laminate and printed circuit board having the prepreg
TH149298B
(th )
2016-04-26
องค์ประกอบเรซิน และ พรีเพรก และ ลามิเนตที่ใช้สิ่งเดียวกันนั้น
TH147258A
(th )
2016-03-04
องค์ประกอบเรซิน, พรีเพรก (prepreg) และลามิเนต
EP2540754A4
(en )
2017-05-31
Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board