SU885243A2

SU885243A2 - Polymeric composition

Info

Publication number: SU885243A2
Application number: SU782676272A
Authority: SU
Inventors: Александр Александрович Киричек; Владимир Александрович Дятленко; Алексей Иванович Зюбрик; Любомир Петрович Особа; Игорь Викторович Смольянинов; Галина Ивановна Гостинская; Олег Николаевич Розанов; Кирилл Максимович Салдадзе; Наталья Борисовна Галицкая; Валентина Борисовна Каргман
Original assignee: Предприятие П/Я В-8525
Priority date: 1978-10-23
Filing date: 1978-10-23
Publication date: 1981-11-30

Description

1one

Изобретение относитс к получению полимерных композиций, используемых в качестве адгезивов при- аддитивном способе изготовлени печатныхплат .This invention relates to the preparation of polymer compositions used as adhesives in an additive method for the manufacture of printed circuit boards.

По основному авт.св. № 707939 известна полимерна композици , включающа эпоксидную диановую смо-, лу, полиамидный отвердитель, бутадиеновый карбоксилатный каучук и об-метилстирольный каучук. В качестве тиксотропного агента в состав композиции рекомендуетс вводить до 20 вес.ч. аэросила l.According to the main auth. No. 707939 is a known polymeric composition comprising epoxy resin, polyamide curing agent, carboxydiene carboxylate rubber and methyl methyl styrene rubber. As a thixotropic agent, up to 20 parts by weight is recommended for the composition. Aerosil l.

Недостатком известной композиции вл етс необходимость проведени сложных операций сенсибилизации и активации перед последующим химическим меднением.A disadvantage of the known composition is the need for complex sensitization and activation operations prior to subsequent chemical copper plating.

Цель изобретени - обеспечение возможности металлизироватьс без сенсибилизации и активации.The purpose of the invention is to provide an opportunity to metallize without sensitization and activation.

Поставленна цель достигаетс тем, что полимерна композици дополнительно содержит анионит на основе сополимеров винил- или алкилвинилпиридинов с дивинильными соединени ми , насьлценный ионами серебра или паллади в количестве 2,530 ,0 вес.ч.This goal is achieved by the fact that the polymer composition additionally contains an anion exchange resin based on copolymers of vinyl or alkyl vinyl pyridines with divinyl compounds, nasalcene with silver ions or palladium in an amount of 2.530, 0 parts by weight.

Пример 1. Сначала готов т анионит АН-251 на базе сополимеров винил- или алкилБИНилпиридинов с дивинильными соединени ми, содержащий в качестве ионогенных групп азот пиридинового кольца. После этого навеску гранулированного анионит а АН-251 помещают в емкость с 5%-ным раствором едкого натра и пе0 ремешивают в течение 2 ч, отфильтровывают и промывают дистиллированной водой до нейтральной реакции (рН 77 ,5). Сушат до полного удалени влаги при 80-90с. Затем сухой анио15 нит помещают в холцедованные барабаны , добавл ют метиловый спирт и измельчают на планетарной мельнице до порошкообразного состо ни . Полученный порошок высушивают до полногоExample 1. First, anion exchange resin AN-251 based on copolymers of vinyl or alkylBINylpyridines with divinyl compounds containing nitrogen of the pyridine ring as ionic groups is prepared. After that, the weighed granulated anion exchanger AH-251 is placed in a container with a 5% sodium hydroxide solution and is stirred for 2 h, filtered and washed with distilled water until neutral (pH 77, 5). Dry to dry at 80-90 seconds. The dry anio15 nit is then placed in hollowed drums, methyl alcohol is added and ground in a planetary mill to a powder. The resulting powder is dried to complete

20 удалени метилового спирта. Приготовленный анионит помещают в сол нокислый раствор Pd (из расчета на 100 г анионита - 10 г Ра) или в водный раствор АО; (из расчета на 100 г20 remove methyl alcohol. The prepared anion exchanger is placed in a hydrochloric acid solution of Pd (10 g Pa per 100 g of anion exchanger) or in an aqueous solution of AO; (based on 100 g

25 анионита - 10 г Ао{) и провод т25 anion exchange resin - 10 g Ao {) and carried out

Claims

sorption of ionometals under static conditions; contact of the anion exchanger with the solution is carried out until equilibrium is established (10-14 days). The magnitude of the sorbent capacity was determined by metric titration. The catalyst thus obtained was filtered off, washed with distilled water, dried with VO-EO C to completely remove moisture and added to the polymer composition by stirring (1 to complete distribution by volume). Component ratio, parts by weight: Epoxy resin, ED-20100 Polyamide resin, L-1850 L-Methyl styrene rubber, SKMS-ZORP10 Butadienecarboxylate rubber, SKD-1A10 Anionite, containing Pd ions Aerosil, A-380 This polymer composition impregnated with fiberglass, drying to the prepreg of the prepreg is filled with pas and pressed .The resulting dielectric, substrate is applied to the same composition, and cured for 4.5 hours. The material obtained in this way is used in the manufacture of printed circuit boards. Example

2. Content of components, parts by weight: Epoxy resin, ED-20100 Polyamide resin, L-18100 cz1, - Methyl styrene rubber OKMS-ZORP30 Butadienecarboxylate rubber, SKD-1A30 Anionite, containing ionis Rifili yrosil, A-38020 Preparation of the composition composition Example 1. Example

3. The content of the components is indicated in weight, h .: Epoxy resin, ED-20 100 Polyamide resin, L-18 100 c1-Methyl styrene rubber SKMS-ZORP.20 Butadienecarboxylate rubber, SKD-1A20 Anionite containing ions 16 Aerosil20 Preparation of the composition is similar Example 1. The resulting material is subjected to metallization by known methods without activation and sensitization, and the adhesion strength is 450 g / 3 mm. Dielectric properties of the material: Specific volume resistance, Ohm-cm 5.3-10 Tangent of dielectric loss angle 0.025 Specific surface resistance. Ohm 19-10 Dielectric permeability, E 6 Isolation resistance, mOm7lO Thus, the use of a catalytic additive (ion exchange resin containing Pig-or Af ions) provides high activity and quality during metallization, excluding sensitization and activation operations. At the same time, high adhesion of the metal coating with the dielectric and dielectric properties are maintained. The invention of the Polymer composition, by author. No. 707939, characterized in that, in order to provide the possibility of metallizing without sensitization and activation, it additionally contains anion exchange resin based on copolymers of vinyl or alkyl vinyl pyridines with divinyl compounds, saturated with silver ions or palladium in an amount of 2.5-30 , 0 weight.h. Sources of information taken into account during the examination 1. USSR Author's Certificate No. 707939, cl. C 08L 63/00, 1976.