SU852914A1 - Epoxy composition - Google Patents
Epoxy composition Download PDFInfo
- Publication number
- SU852914A1 SU852914A1 SU792856356A SU2856356A SU852914A1 SU 852914 A1 SU852914 A1 SU 852914A1 SU 792856356 A SU792856356 A SU 792856356A SU 2856356 A SU2856356 A SU 2856356A SU 852914 A1 SU852914 A1 SU 852914A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- composition
- resin
- cured
- heat resistance
- properties
- Prior art date
Links
Landscapes
- Epoxy Resins (AREA)
Description
(54) ЭПОКСИДНАЯ КОМПОЗИЦИЯ(54) EPOXY COMPOSITION
Изобретение относитс к области получени композиций на основе эпоксидных смол, котоЕ ае могут быть использованы в качестве заливочных и прописочных составов, пресс-композиций , а также клеев, способных работать при повышенных температурах (до 2500с). Известна эпоксидна композици , содержаща эпоксидную диановую смолу и отвердитель - ароматический диамин например 4,4-диаминодифенилметан ( ДЦМ):. Недостатком известной композиции вл етс низка жизнеспособность (20 ч при 23°С и 30 мин при ) и невысока теплостойкость (122-135 по Мартенсу). Известно также, что дл повышени теплостойкости в качестве отвердител используют 4,4-диаминодифенилсул фон (157-175°С по Мартенсу) 21Однако и в этом случае жизнеспособность невелика, а теплостойкость недостаточна. Кроме этого, 4,4-ди . аминодифенилсульфон требует длитель ного высокотемпературного режима от верждени (24 ч при 120°С и 4-8 ч пр Х75-20рОс). Наиболее близким из известных реений к изобретению вл етс эпоксидна композици , содержаща эпоксидную диановую смолу и ароматический аминный отвердитель - м-фенилендиамин (МФДА) 11 . Дл этой композиции характерны те же самые недостатки: низка жизнеспособность и невысока теплостойкость . Кроме этого, МФДА имеет высокую летучесть. Попытки уменьшить летучесть путем модификации МФДА, например, кислотами (салициловой, акриловой) привод т к снижению теплостойкости . Цель изобретени состоит в повышении жизнеспособности композиции -на холоде и увеличении теплостойкости отвержденных материалов. Поставленна цель достигаетс тем, что эпоксидна композици , включающа эпоксидную диановую.. смолу и отвердитель - ароматический диамин , в качестве ароматического диамина содержит 5-амино-2-(п-аминофенол )-бенэоксазол в Количестве 10-30% от веса.композиции.The invention relates to the field of making compositions based on epoxy resins, which can be used as casting and sealing compositions, press compositions, as well as adhesives capable of working at elevated temperatures (up to 2500 s). A known epoxy composition containing an epoxy resin and a hardener is an aromatic diamine, for example 4,4-diaminodiphenylmethane (DCM) :. A disadvantage of the known composition is low viability (20 hours at 23 ° C and 30 minutes at) and low heat resistance (122-135 according to Martens). It is also known that 4,4-diaminodiphenylsulyl background (157-175 ° C according to Martens) is used as a hardener to increase heat resistance. 21 However, in this case too, the pot life is low and the heat resistance is insufficient. In addition, 4,4-di. Aminodiphenylsulfone requires a long-lasting high-temperature regime from conviction (24 hours at 120 ° C and 4–8 hours at X75-20 ° C). The closest known solution to the invention is an epoxy composition containing an epoxy resin Dianova and an aromatic amine hardener, m-phenylenediamine (MFDA) 11. The same disadvantages are characteristic of this composition: low viability and low heat resistance. In addition, MFDA has a high volatility. Attempts to reduce volatility by modifying MFDA, for example, with acids (salicylic, acrylic) lead to a decrease in heat resistance. The purpose of the invention is to increase the viability of the composition in the cold and to increase the heat resistance of hardened materials. The goal is achieved by the fact that the epoxy composition comprising an epoxy resin .. resin and hardener - an aromatic diamine, as an aromatic diamine contains 5-amino-2- (p-aminophenol) -beneoxazole in an amount of 10-30% by weight of the composition.
1one
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU792856356A SU852914A1 (en) | 1979-12-20 | 1979-12-20 | Epoxy composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU792856356A SU852914A1 (en) | 1979-12-20 | 1979-12-20 | Epoxy composition |
Publications (1)
Publication Number | Publication Date |
---|---|
SU852914A1 true SU852914A1 (en) | 1981-08-07 |
Family
ID=20866478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU792856356A SU852914A1 (en) | 1979-12-20 | 1979-12-20 | Epoxy composition |
Country Status (1)
Country | Link |
---|---|
SU (1) | SU852914A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1700874B1 (en) * | 2003-12-16 | 2011-05-25 | Toyo Boseki Kabushiki Kaisha | Curable composition |
CN112384546A (en) * | 2018-10-17 | 2021-02-19 | 东洋纺株式会社 | Thermally conductive resin composition |
-
1979
- 1979-12-20 SU SU792856356A patent/SU852914A1/en active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1700874B1 (en) * | 2003-12-16 | 2011-05-25 | Toyo Boseki Kabushiki Kaisha | Curable composition |
CN112384546A (en) * | 2018-10-17 | 2021-02-19 | 东洋纺株式会社 | Thermally conductive resin composition |
CN112384546B (en) * | 2018-10-17 | 2024-01-16 | 东洋纺株式会社 | Thermally conductive resin composition |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE190680T1 (en) | SEALING MATERIAL | |
DE69007325D1 (en) | Composition for the stabilization of dentures. | |
SU1766263A3 (en) | Polymeric composition | |
PT80683A (en) | PROCESS FOR PREPARING NEW N- (2-NITROPHENYL) -2-AMINO-PYRIMIDINE DERIVATIVES | |
SU852914A1 (en) | Epoxy composition | |
DE59005991D1 (en) | Preparations containing (meth) acrylic acid esters containing carbonamide groups, for use as adhesive components for the treatment of collagen-containing materials in medicine, and preparation of these preparations. | |
KR920004459A (en) | Adducts of epoxy resins and active hydrogen-containing compounds containing mesogenic residues | |
EP0697426A1 (en) | Hardener for Epoxy resins | |
EP0249263A3 (en) | Thermoplastic polymer composition having thermosetting processing characteristics | |
CA1332113C (en) | Palladium alloy containing germanium and/or lithium and dental restorations utilizing same | |
DK202787A (en) | INTERMETAL COMPOUNDS, THEIR HYDRIDES AND PROCEDURES FOR THEIR PREPARATION | |
SU1060652A1 (en) | Composition | |
SU545353A1 (en) | Composition for filling teeth | |
SU468940A1 (en) | Epoxy composition | |
FI101482B1 (en) | Low temperature curable coating compositions based on polyaromatic aldehyde group containing compounds and ketiminated polyamino compounds | |
DE69417045D1 (en) | GELLED REACTIVE RESIN COMPOSITIONS | |
ATE134503T1 (en) | COMPOSITION WITH IMPROVED TASTE FOR STABILIZING DENTAL PROSTHESES | |
RU1818832C (en) | Glue composition for tensoresistor glueing | |
SU376409A1 (en) | ALL SONONEZNA ^ tm ^ m-l-J. ^ '- * | |
ATE16936T1 (en) | NEW MICROBICIDES, PROCESSES FOR THEIR PRODUCTION AND THEIR USE TO COMBAT MICROORGANISMS. | |
SU530046A1 (en) | Epoxy composition | |
SU806713A1 (en) | Adhesive composition | |
SU927834A1 (en) | Composition for sealing applications | |
SU529195A1 (en) | Epoxy composition | |
SU1694594A1 (en) | Polymer composition |