SU417454A1 - - Google Patents

Info

Publication number

SU417454A1

SU417454A1 SU1827062A SU1827062A SU417454A1 SU 417454 A1 SU417454 A1 SU 417454A1 SU 1827062 A SU1827062 A SU 1827062A SU 1827062 A SU1827062 A SU 1827062A SU 417454 A1 SU417454 A1 SU 417454A1

Authority

SU

USSR - Soviet Union

Prior art keywords

resin

polyaminoimidazoline

thermal conductivity

boron nitride

epoxy

Prior art date

1972-09-11

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000853 adhesive Substances 0.000 description 7
• 230000001070 adhesive effect Effects 0.000 description 7
• YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 4
• 229910052582 BN Inorganic materials 0.000 description 4
• PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 4
• 229920005989 resin Polymers 0.000 description 4
• 239000011347 resin Substances 0.000 description 4
• 239000004593 Epoxy Substances 0.000 description 3
• 229910021419 crystalline silicon Inorganic materials 0.000 description 3
• YQHLDYVWEZKEOX-UHFFFAOYSA-N cumene hydroperoxide Chemical compound OOC(C)(C)C1=CC=CC=C1 YQHLDYVWEZKEOX-UHFFFAOYSA-N 0.000 description 3
• 239000012764 mineral filler Substances 0.000 description 3
• ROLAGNYPWIVYTG-UHFFFAOYSA-N 1,2-bis(4-methoxyphenyl)ethanamine;hydrochloride Chemical compound Cl.C1=CC(OC)=CC=C1CC(N)C1=CC=C(OC)C=C1 ROLAGNYPWIVYTG-UHFFFAOYSA-N 0.000 description 2
• ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
• XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
• 229910052796 boron Inorganic materials 0.000 description 2
• RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 2
• 230000000694 effects Effects 0.000 description 2
• 239000003822 epoxy resin Substances 0.000 description 2
• 239000000203 mixture Substances 0.000 description 2
• 229920000647 polyepoxide Polymers 0.000 description 2
• 229910052710 silicon Inorganic materials 0.000 description 2
• 239000010703 silicon Substances 0.000 description 2
• -1 Butylglycidyl Chemical group 0.000 description 1
• MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
• 150000001875 compounds Chemical class 0.000 description 1
• 239000013078 crystal Substances 0.000 description 1
• 239000000945 filler Substances 0.000 description 1
• 239000003292 glue Substances 0.000 description 1
• 238000010438 heat treatment Methods 0.000 description 1
• QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 description 1
• 230000035939 shock Effects 0.000 description 1