SU382671A1 - METHOD OF FILLING GAS ACCESSED CAPACITIES WITH SOLVENTS - Google Patents

METHOD OF FILLING GAS ACCESSED CAPACITIES WITH SOLVENTS

Info

Publication number
SU382671A1
SU382671A1 SU1635742A SU1635742A SU382671A1 SU 382671 A1 SU382671 A1 SU 382671A1 SU 1635742 A SU1635742 A SU 1635742A SU 1635742 A SU1635742 A SU 1635742A SU 382671 A1 SU382671 A1 SU 382671A1
Authority
SU
USSR - Soviet Union
Prior art keywords
capacities
solvents
filling gas
acetylene
gas accessed
Prior art date
Application number
SU1635742A
Other languages
Russian (ru)
Inventor
изобретени Авторы
Original Assignee
Ю. В. Далаго, В. П. Степанюк , В. А. Черненко Московский машиностроительный завод Знам труда
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ю. В. Далаго, В. П. Степанюк , В. А. Черненко Московский машиностроительный завод Знам труда filed Critical Ю. В. Далаго, В. П. Степанюк , В. А. Черненко Московский машиностроительный завод Знам труда
Priority to SU1635742A priority Critical patent/SU382671A1/en
Application granted granted Critical
Publication of SU382671A1 publication Critical patent/SU382671A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C5/00—Methods or apparatus for filling containers with liquefied, solidified, or compressed gases under pressures
    • F17C5/06—Methods or apparatus for filling containers with liquefied, solidified, or compressed gases under pressures for filling with compressed gases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2221/00—Handled fluid, in particular type of fluid
    • F17C2221/01—Pure fluids
    • F17C2221/018—Acetylene

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)

Description

1one

Изобретение относитс  к способам хранени  ацетилена в баллонах   других емкост х.This invention relates to methods for storing acetylene in cylinders of other containers.

Известен onocOi6 .наполнени  газообразным ацетиленом непосредственно от генераторов баллонов и Д1ругих емкостей, охлажденных до отрицательных температур, с последующим отогревом дл  повышени  в них давлени . Однако Бследст:вие незначительното давлени  ацетилена в генераторах растворение его в ацетоне, которым пропитана пориста  масса баллонов, протекает медленней, чем при подаче в них ацетилена от компрессоров.OnocOi6 is known. It is filled with acetylene gas directly from cylinder generators and other containers cooled to negative temperatures, followed by heating to increase the pressure in them. However, the insignificant pressure of acetylene in the generators dissolves it in acetone, which the porous mass of cylinders is impregnated with, is slower than with the supply of acetylene to them from compressors.

С целью интенсификации процесса, предлагаетс  e,м кocти охлаждать до температурыIn order to intensify the process, it is proposed to cool e to the temperature

конденсации ацетилена, а ацетилен подавать под равновесным давлением.acetylene condensation, and acetylene to serve under equilibrium pressure.

П р е д LM е т изобретени P rede LM et inventions

Способ наполнени  газообразным ацетиленом ем.костей с растворител ми путем охлаждени  их до отрицательных температур и последующего подолрева до температуры окружающей среды, отличающийс  тем, что, с целью интенсификации процесса, емкости охлаждают до тем1пературы конденсации ацетилена, а ацетилен подают под равновесным давлением.The method of filling acetylene gas with solvent tanks by cooling them to negative temperatures and subsequent heating to ambient temperature, characterized in that, in order to intensify the process, the tank is cooled to the acetylene condensation temperature and acetylene is supplied under equilibrium pressure.

SU1635742A 1971-03-25 1971-03-25 METHOD OF FILLING GAS ACCESSED CAPACITIES WITH SOLVENTS SU382671A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU1635742A SU382671A1 (en) 1971-03-25 1971-03-25 METHOD OF FILLING GAS ACCESSED CAPACITIES WITH SOLVENTS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU1635742A SU382671A1 (en) 1971-03-25 1971-03-25 METHOD OF FILLING GAS ACCESSED CAPACITIES WITH SOLVENTS

Publications (1)

Publication Number Publication Date
SU382671A1 true SU382671A1 (en) 1973-05-25

Family

ID=20469386

Family Applications (1)

Application Number Title Priority Date Filing Date
SU1635742A SU382671A1 (en) 1971-03-25 1971-03-25 METHOD OF FILLING GAS ACCESSED CAPACITIES WITH SOLVENTS

Country Status (1)

Country Link
SU (1) SU382671A1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100297853A1 (en) * 2008-06-04 2010-11-25 Novellus Method for purifying acetylene gas for use in semiconductor processes
US8435608B1 (en) 2008-06-27 2013-05-07 Novellus Systems, Inc. Methods of depositing smooth and conformal ashable hard mask films
US8563414B1 (en) 2010-04-23 2013-10-22 Novellus Systems, Inc. Methods for forming conductive carbon films by PECVD
US8664124B2 (en) 2005-10-31 2014-03-04 Novellus Systems, Inc. Method for etching organic hardmasks
US8669181B1 (en) 2007-02-22 2014-03-11 Novellus Systems, Inc. Diffusion barrier and etch stop films
US8962101B2 (en) 2007-08-31 2015-02-24 Novellus Systems, Inc. Methods and apparatus for plasma-based deposition
US9023731B2 (en) 2012-05-18 2015-05-05 Novellus Systems, Inc. Carbon deposition-etch-ash gap fill process
US9304396B2 (en) 2013-02-25 2016-04-05 Lam Research Corporation PECVD films for EUV lithography
US9320387B2 (en) 2013-09-30 2016-04-26 Lam Research Corporation Sulfur doped carbon hard masks
US9362133B2 (en) 2012-12-14 2016-06-07 Lam Research Corporation Method for forming a mask by etching conformal film on patterned ashable hardmask
US9589799B2 (en) 2013-09-30 2017-03-07 Lam Research Corporation High selectivity and low stress carbon hardmask by pulsed low frequency RF power
US11837441B2 (en) 2019-05-29 2023-12-05 Lam Research Corporation Depositing a carbon hardmask by high power pulsed low frequency RF

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8664124B2 (en) 2005-10-31 2014-03-04 Novellus Systems, Inc. Method for etching organic hardmasks
US8669181B1 (en) 2007-02-22 2014-03-11 Novellus Systems, Inc. Diffusion barrier and etch stop films
US8962101B2 (en) 2007-08-31 2015-02-24 Novellus Systems, Inc. Methods and apparatus for plasma-based deposition
US8309473B2 (en) * 2008-06-04 2012-11-13 Novellus Systems, Inc. Method for purifying acetylene gas for use in semiconductor processes
US20100297853A1 (en) * 2008-06-04 2010-11-25 Novellus Method for purifying acetylene gas for use in semiconductor processes
US9240320B1 (en) 2008-06-27 2016-01-19 Novellus Systems, Inc. Methods of depositing smooth and conformal ashable hard mask films
US8435608B1 (en) 2008-06-27 2013-05-07 Novellus Systems, Inc. Methods of depositing smooth and conformal ashable hard mask films
US8563414B1 (en) 2010-04-23 2013-10-22 Novellus Systems, Inc. Methods for forming conductive carbon films by PECVD
US9023731B2 (en) 2012-05-18 2015-05-05 Novellus Systems, Inc. Carbon deposition-etch-ash gap fill process
US9362133B2 (en) 2012-12-14 2016-06-07 Lam Research Corporation Method for forming a mask by etching conformal film on patterned ashable hardmask
US10192759B2 (en) 2012-12-14 2019-01-29 Lam Research Corporation Image reversal with AHM gap fill for multiple patterning
US9304396B2 (en) 2013-02-25 2016-04-05 Lam Research Corporation PECVD films for EUV lithography
US9618846B2 (en) 2013-02-25 2017-04-11 Lam Research Corporation PECVD films for EUV lithography
US9320387B2 (en) 2013-09-30 2016-04-26 Lam Research Corporation Sulfur doped carbon hard masks
US9589799B2 (en) 2013-09-30 2017-03-07 Lam Research Corporation High selectivity and low stress carbon hardmask by pulsed low frequency RF power
US11837441B2 (en) 2019-05-29 2023-12-05 Lam Research Corporation Depositing a carbon hardmask by high power pulsed low frequency RF

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