SU368954A1 - Solder for cutting of cutting plates on the body - Google Patents

Solder for cutting of cutting plates on the body

Info

Publication number
SU368954A1
SU368954A1 SU1656272A SU1656272A SU368954A1 SU 368954 A1 SU368954 A1 SU 368954A1 SU 1656272 A SU1656272 A SU 1656272A SU 1656272 A SU1656272 A SU 1656272A SU 368954 A1 SU368954 A1 SU 368954A1
Authority
SU
USSR - Soviet Union
Prior art keywords
solder
cutting
plates
ferrosilicon
copper
Prior art date
Application number
SU1656272A
Other languages
Russian (ru)
Inventor
П. Г. Ваурин А. А. Швецо В. И. Житник
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to SU1656272A priority Critical patent/SU368954A1/en
Application granted granted Critical
Publication of SU368954A1 publication Critical patent/SU368954A1/en

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Description

Даи11ГО€ ивобрете ие офноситс  к области пайки, точнее, к составу припо  дл  напайК|И1 режущих пластин на «Qpinyc инструме1нта . Известен припой дл  напайки режущих пластин на .корпус инструмента, содержащий ферросилиций - 32%, медь - 16%, стальна  стружКа - 10%, бура - 32%, сода 10%. Дл  повышени  эксплуатационной стойKOcTHi инструме1нта при налайке режущих пл а1сти1Н ,из бьштрорежущей стали компоненты припо  берут в следующем соотношении , %: Ферросилиций70- 90 Медь10-30 Предложбнный припой имеет температуру плавлени , бливкую к эакалочной дл  быстрорежущих сталей (темпбратура нагрева пластин при пайке на 20-40°С выше темнературы плавлени  при1по. ) и поэвол ет успешно и достатоЗДО на1де(Ж1НО л уществл ть одновременно процессы и пайки и. закалки режущего ииструмеита, что снижает Т1рудоeiMiKOCTb его изготовлен и-  и обеспечивает получение оптимальной режущей стойкос ти. При изготовлении припо  ферросилиций раз мельчают до порошкообразного состо и , а медь берут в виде опилок, после чего ферросилиций и медь перемешивают друг с друго:м в указанных пропорци х. В качестве флюса примен етс  бура в количестве 20-30% к весу припо . Флюс может вводитьс  в соединение как в предварительно перемешанном с припоем состо нии , так и отдельно. На подготовленные под пайку корпуса режущего инструмента при помощи мерки ввод т предварителыно приготовленные прилой с флюсюм, накрыв;ают пластиной из бьктрорежущей стали и тока1ми высокой частоты произво.д т нагрев в И1ндукторе до температуры полного расплавлени  припо . Предмет изобретени  Припой дл  напайки режущих пластин на корпус инструмента, содержащий медь, ферросилиций, отличающийс  тем, что, с целью повышени  эксплуатационной стойкости инструме нта, компоненты припо  вз ты в следующем соотношении, %: Ферросилиций70-90 Медь10-30This product is recognized in the soldering area, more precisely, the composition of the solder for napaiK | I1 cutting plates on the Qpinyc tool. Known solder for soldering cutting plates on the tool body containing ferrosilicon - 32%, copper - 16%, steel chips - 10%, drill - 32%, soda 10%. In order to increase the operational stability of the tool when naliky cutting a1sti1N, from tstrorezuyuschey steel components are soldered in the following ratio,%: Ferrosilicon 70-90 Copper 10-30 The proposed solder has a melting point, similar to that used for high-speed steels (the heating pattern of the plate, a pattern is applied. 40 ° С above the melting temperature when it is used.) And it is successful and sufficiently DETAILED at once (it is necessary to simultaneously process and solder and quench the cutting and trimmerite, which reduces T1Md and MiKOCTb, it is made and - and provides Learning the optimal cutting ability. In the manufacture of ferrosilicon solder, the powder is crushed and powdered, and the copper is taken as sawdust, after which the ferrosilicon and copper are mixed together: m in the indicated proportions. 20- 30% by weight of the solder. Flux can be introduced into the joint both in the state that was previously mixed with solder or separately. bktrorezhuschey dissolved plate of steel and a high frequency toka1mi proizvo.d m I1nduktore heating to a temperature in the completely melted solder. Subject of the invention: Solder for soldering the cutting plates to the tool body containing copper, ferrosilicon, characterized in that, in order to increase the tool life, the solder components are taken in the following ratio,%:

SU1656272A 1971-04-28 1971-04-28 Solder for cutting of cutting plates on the body SU368954A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU1656272A SU368954A1 (en) 1971-04-28 1971-04-28 Solder for cutting of cutting plates on the body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU1656272A SU368954A1 (en) 1971-04-28 1971-04-28 Solder for cutting of cutting plates on the body

Publications (1)

Publication Number Publication Date
SU368954A1 true SU368954A1 (en) 1973-02-08

Family

ID=20475123

Family Applications (1)

Application Number Title Priority Date Filing Date
SU1656272A SU368954A1 (en) 1971-04-28 1971-04-28 Solder for cutting of cutting plates on the body

Country Status (1)

Country Link
SU (1) SU368954A1 (en)

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