SU1780469A1 - Термореактивная пластмасса для герметизации полупроводниковых приборов и интегральных схем - Google Patents

Термореактивная пластмасса для герметизации полупроводниковых приборов и интегральных схем

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Publication number
SU1780469A1
SU1780469A1 SU4808409/21A SU4808409A SU1780469A1 SU 1780469 A1 SU1780469 A1 SU 1780469A1 SU 4808409/21 A SU4808409/21 A SU 4808409/21A SU 4808409 A SU4808409 A SU 4808409A SU 1780469 A1 SU1780469 A1 SU 1780469A1
Authority
SU
USSR - Soviet Union
Prior art keywords
semiconductor devices
plastic material
thermosetting plastic
integrated circuits
sealing semiconductor
Prior art date
Application number
SU4808409/21A
Other languages
English (en)
Inventor
Л.Г. Царева
К.Г. Куваев
В.А. Крячков
С.А. Носухин
Original Assignee
Александровский завод им.50-летия СССР
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Александровский завод им.50-летия СССР filed Critical Александровский завод им.50-летия СССР
Priority to SU4808409/21A priority Critical patent/SU1780469A1/ru
Application granted granted Critical
Publication of SU1780469A1 publication Critical patent/SU1780469A1/ru

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Использование: герметизация полупроводниковых приборов средней и большей мощности. Сущность изобретения: термореактивная пластмасса содержит эпоксидную смолу, отвердитель, смазку и наполнитель, в качестве которого используют смесь порошков кварцевого песка и синтетического алмаза. 3 табл.
SU4808409/21A 1990-02-12 1990-02-12 Термореактивная пластмасса для герметизации полупроводниковых приборов и интегральных схем SU1780469A1 (ru)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU4808409/21A SU1780469A1 (ru) 1990-02-12 1990-02-12 Термореактивная пластмасса для герметизации полупроводниковых приборов и интегральных схем

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU4808409/21A SU1780469A1 (ru) 1990-02-12 1990-02-12 Термореактивная пластмасса для герметизации полупроводниковых приборов и интегральных схем

Publications (1)

Publication Number Publication Date
SU1780469A1 true SU1780469A1 (ru) 1995-10-27

Family

ID=60533215

Family Applications (1)

Application Number Title Priority Date Filing Date
SU4808409/21A SU1780469A1 (ru) 1990-02-12 1990-02-12 Термореактивная пластмасса для герметизации полупроводниковых приборов и интегральных схем

Country Status (1)

Country Link
SU (1) SU1780469A1 (ru)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6875099B2 (en) * 2000-10-24 2005-04-05 Kodratenko Vladimir Stepanovich Polishing tool and a composition for producing said tool
RU2645789C1 (ru) * 2016-12-12 2018-02-28 Акционерное общество "Научно-исследовательский институт Приборостроения имени В.В. Тихомирова" Теплопроводящая диэлектрическая композиция
RU2650818C1 (ru) * 2017-04-17 2018-04-17 Акционерное общество "Научно-исследовательский институт Приборостроения имени В.В. Тихомирова" Теплопроводящий диэлектрический компаунд
WO2019046745A1 (en) * 2017-08-31 2019-03-07 Texas Instruments Incorporated INTEGRATED CIRCUIT BOX WITH STRESS DISTRIBUTION MATERIAL
US10371891B2 (en) 2017-10-31 2019-08-06 Texas Instruments Incorporated Integrated circuit with dielectric waveguide connector using photonic bandgap structure
US10444432B2 (en) 2017-10-31 2019-10-15 Texas Instruments Incorporated Galvanic signal path isolation in an encapsulated package using a photonic structure
US10497651B2 (en) 2017-10-31 2019-12-03 Texas Instruments Incorporated Electromagnetic interference shield within integrated circuit encapsulation using photonic bandgap structure
US10553573B2 (en) 2017-09-01 2020-02-04 Texas Instruments Incorporated Self-assembly of semiconductor die onto a leadframe using magnetic fields
US10557754B2 (en) 2017-10-31 2020-02-11 Texas Instruments Incorporated Spectrometry in integrated circuit using a photonic bandgap structure
US10833648B2 (en) 2017-10-24 2020-11-10 Texas Instruments Incorporated Acoustic management in integrated circuit using phononic bandgap structure

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100781800B1 (ko) * 2000-10-24 2007-12-04 혼하이 프리시젼 인더스트리 컴퍼니 리미티드 연마기와 그 연마기 제조를 위한 조성물
US6875099B2 (en) * 2000-10-24 2005-04-05 Kodratenko Vladimir Stepanovich Polishing tool and a composition for producing said tool
RU2645789C1 (ru) * 2016-12-12 2018-02-28 Акционерное общество "Научно-исследовательский институт Приборостроения имени В.В. Тихомирова" Теплопроводящая диэлектрическая композиция
RU2650818C1 (ru) * 2017-04-17 2018-04-17 Акционерное общество "Научно-исследовательский институт Приборостроения имени В.В. Тихомирова" Теплопроводящий диэлектрический компаунд
WO2019046745A1 (en) * 2017-08-31 2019-03-07 Texas Instruments Incorporated INTEGRATED CIRCUIT BOX WITH STRESS DISTRIBUTION MATERIAL
US10622270B2 (en) 2017-08-31 2020-04-14 Texas Instruments Incorporated Integrated circuit package with stress directing material
US10553573B2 (en) 2017-09-01 2020-02-04 Texas Instruments Incorporated Self-assembly of semiconductor die onto a leadframe using magnetic fields
US10833648B2 (en) 2017-10-24 2020-11-10 Texas Instruments Incorporated Acoustic management in integrated circuit using phononic bandgap structure
US10444432B2 (en) 2017-10-31 2019-10-15 Texas Instruments Incorporated Galvanic signal path isolation in an encapsulated package using a photonic structure
US10557754B2 (en) 2017-10-31 2020-02-11 Texas Instruments Incorporated Spectrometry in integrated circuit using a photonic bandgap structure
US10497651B2 (en) 2017-10-31 2019-12-03 Texas Instruments Incorporated Electromagnetic interference shield within integrated circuit encapsulation using photonic bandgap structure
US10788367B2 (en) 2017-10-31 2020-09-29 Texas Instruments Incorporated Integrated circuit using photonic bandgap structure
US10371891B2 (en) 2017-10-31 2019-08-06 Texas Instruments Incorporated Integrated circuit with dielectric waveguide connector using photonic bandgap structure

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