SU1641832A1 - Epoxy compound - Google Patents

Abstract

This invention relates to epoxy compositions used as casting compounds, bonded to fiberglass. The invention allows to reduce the temperature of the cured composition to 30-60 ° C, increase its viability up to 2-6 days, as well as improve the physicomechanical properties of the composition, cured at 50 and 100% humidity. This result is achieved by using an epoxy composition comprising an aromatic or cycloaliphatic epoxy resin.

Description

This invention relates to epoxy-HBE-I compositions used as casting compounds, binders for glass-reinforced plastics, etc.

The purpose of the invention is to reduce the temperature: cure, increase the viability of the composition and the physicochemical properties of the compositions cured under 50 and 100% moisture content.

The invention is illustrated by the following example.

Example 1. In a heated reactor, with constant stirring, 11.7 wt. Parts are charged. A-oxyethylhydrazip, heated to 65 ± 5ffC and pre-melted para- (dimethylamino) -beisaldehyde (23.3 wt.h.) is added in small portions. During the synthesis, the temperature of the reaction mass spontaneously increases to 90 + 5 ° C. After stopping the supply of para- (dnmethylamino) -benzaldehyde, the reaction mass is continued to be stirred for 1 h at 90 ± 5 ° C. The resulting product has the following characteristics: Appearance Yellow crystals

about

Ј

00

oe yu

Like, maesa

Mp, ° C

Content 1 primary

amino groups,

Content

secondary amino groups,%

206.8 43-46

7.3

The resulting product (35 wt.h.) mixes with epoxy resin mark ED-22 (100 wt.h.) and cures in the following mode 40 C - 2 h, 60 ° C - 2 h, - 4 h.

Example 2. Carried out analogously to example 1, but as the epoxy component of the diglycidyl ester of methyltetrahydrophthalic acid, mark UP-040 in the following ratio of components, May, h, Epoxy resin 100

Hardener45

Example 3. The procedure is carried out as in Example 1, but the tri-glycidyl ether of para-aminophenol of the UP-60 grade is taken as the epoxy component in the following ratio of components, m.ch,:

Epoxidine resin100

Hardener60

Example 4. Carried out analogously to example 1, but during the preparation (hardening) of f-hydroxyethyl hydrazine (A) and para- (dimethylamino) benzaldehyde (B) is taken in the ratio A; B, equal to 20:80. Received The product has the following characteristics} Appearance Yellow crystals

Mol-maesa

M.p.

348-356 67

Content

primary

amino groups,% O

Content

secondary

amino groups,% 4.2

The ratio of the components of the composition, MA.CH .:

Epoxy resin100

Hardener60

Example 5. Carried out analogously to example 1, but in the preparation of cured | 5-hydroxyethyl

0

five

0

five

0

five

Zine (A) and para- (dimeter) -benzaldehyde (B) take s As B ratio of 50:50. The resulting product has the following characteristics: Appearance Resinous product

yellow Mol.massa 13B-141 Content of primary

amino groups,% 10.4 Content of secondary amino groups,% 10.6

The ratio of the components of the composition, ma.ch .;

Epoxy resin 100 otverditep24

The properties of the open polymer compositions are given in the P table.

Claims (1)

Invention Formula An epoxy composition comprising an aromatic or cycloaliphatic epoxy resin and an amine curing agent, characterized in that, in order to reduce the curing temperature and increase the viability of the composition and physicomechanical materials, cured under 50% conditions and 100% moisture compositions, as an amine hardener, it contains the product of the interaction of Y-hydroxyethyl hydrazine and para- (dimethyl-amino) -benzaldegkda with their mass ratio (20-50) t (50-80), respectively, with mol.m. 138-356 and the content of secondary amino groups is 4.2-10.6 /, with the following ratio of the components of the composition, mAh ,: Aromatic or cycloaliphatic epoxy resin 100 The specified amine hardener24-60 Minimum temperature allowed for curing 0,014 0,015 0,012 0,013 0,008 0, 008 incidence with frequency 10e Hz 3.6 3.8 4.0 3.5 3.6 1.8