SU1575251A1 - Device for cooling instruments - Google Patents

Abstract

The invention relates to electronics and can be used in the electronics industry. The aim of the invention is to reduce power consumption and expand the operational capabilities of the device. The objective is achieved in that the device has a tank 12 partially filled with a liquid, in particular a heat-transfer fluid. Tank connected by pipe 13 with the evaporator 4, pipe 14 - with the lower part of the condenser 2, and pipe 15 with its upper part. Capacitor 2 is a cylindrical volume and has a baffle 3 with a cylindrical surface. The cavity of the condenser 2 is separated from the cavity of the evaporator 4 bottom 11. 1 Il.

Description

The invention relates to cooling devices and can be used in the electronic industry.

The aim of the invention is to reduce energy costs and increase operational capabilities.

The drawing shows the proposed device.

The device contains a sump 1, located in the lower part of the device, filled with coolant and representing a cylindrical volume, a condenser 2 located in the middle part of the device and also representing - itself a cylindrical volume, a partition 3 having a cylindrical surface and rigidly connected with cylindrical walls of the housing located inside the evaporator 4. The evaporator is located in the upper part of the device and is a closed cylindrical volume filled with coolant, the output echenie 5 located in the upper part of the transport channel 6 which is located inside the device and is a cylindrical tube is rigidly attached to the end wall of the evaporator, a heat conductive rod 7, having a thermal insulation

; 8 over the entire surface, except the open end, and the open end. the rod is placed in the inlet section of the transport channel located in the settling tank, bottom 19, located in the lower part of the evaporator and separating the cavity of the condenser from the evaporator cavity, tank 10 located above the upper point of the non-evaporator and filled with heat carrier pipe 11, connecting the evaporator and the tank, pipe 12, connecting the upper part of the tank and the lower part of the condenser, pipe 13, connecting the upper part of the condenser to the pipe 12.

The device works as follows.

When the evaporator 4 is located above the condenser 2, the heat-transfer fluid is collected in the sump 1. When the heat flow in the evaporator 4 is supplied both from the cylindrical side and from the end surface, some heat enters the heat-conducting rod 8, the open end of which heats up, as a result of which a vapor-liquid heat carrier mixture is formed in the lower part of the transport channel 6 lower density compared to the heat-transfer fluid in the settling tank 1. As a result of the presence of a density difference, the vapor-liquid heat transfer mixture rises to channel 6 to its upper part in which the outlet section 5 of the transport channel is located, through which the vapor-liquid mixture enters the evaporator 4. In the evaporator under the influence of heat flow, a heat carrier boils, and the presence of a bottom 9 separating the evaporator from the condenser allows on the side of the cylindrical surface of the evaporator, and on the side of its end surface. The boiling coolant enters through pipe 11 into tank 10, from which it goes out and through pipe

0

five

0

five

0

five

0

for cooling the heat generating device, since there is no electric heater for pumping the vapor-liquid mixture due to the density difference; operational capabilities are enhanced by supplying heat flow from the end of the evaporator.

Claims (1)

Formula isobteni A device for cooling devices, comprising a sealed cylindrical body with end walls, partially filled with heat-transfer fluid, with an evaporation zone, a condensation zone located beneath it and a settling tank located under the condensation zone, a cylindrical partition installed coaxially in the housing in its evaporation zone and rigidly connected to cylindrical walls of the body; and the output is in the evaporation zone of the housing, the heater located at the inlet section of the transport channel, and the installation sites for devices located on the outer surface of the housing in its evaporation zone are different, in order to reduce energy costs and expand the operational possibilities, it is provided with a tank, partially filled with a heat-transfer fluid, and a partition located between the evaporation and condensation zones of the housing, hermetically connected along the perimeter of the cylindrical walls of the housing and transport th channel, and the heater is in the form waters 12 and 13 enters the heat insulated rod condenser from 2, where the coolant vapor condenses and flows under the force of gravity into the sump 1, where the heat transfer fluid is collected. The process then repeats. Pipeline 13 serves to overflow the heat-transfer fluid from condenser 2 through tank 10 into evaporator 4 with opposite orientation of the device (as compared with the drawing). When using the proposed I device, energy consumption is reduced. 50 55 thermally conductive material with a closed end passing through the guard, condensation zones and the housing, the open end of the rod is heated at the entrance to the transport channel and the other end of the rod is rigidly connected to the end of the evaporation zone of the housing a pipe system with evaporation zones and a conde and is located with its free volume above the evaporation zone. insulated rod from heat-conducting material with one open end passing through the settling tank, condensation and evaporation zones of the housing, with the open end of the heating rod located at the entrance section of the transport channel, and the other end of the heating rod is rigidly connected to the end wall of the evaporation zone of the housing, while the tank is connected a piping system with evaporation and condensation zones and is positioned with its free volume above the evaporation zone.