SU1431903A1 - Structure of soldered joint of parts from heterogeneous materials - Google Patents

Abstract

The invention relates to the soldering of dissimilar materials and can be used in mechanical engineering in the manufacture of refractory walls. The goal is to increase the efficiency and manufacturability of the steam structure. The device consists of a ceramic part 1, a metal base 2 and an intermediate layer 3 interposed between them of flexible wire elements with a curved side surface. The intermediate layer is made of a textile weave grid, profiled in the form of a wavelength surface with the placement of all grid nodes on the tops of the waves connected to the ceramic part and to the base. Such an embodiment of the intermediate layer ensures the uniform arrangement of the paired contacts, increases the efficiency of the structure and facilitates its manufacture. 1 hp ff, 3 ill.

Description

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The invention relates to the parts of soldering of dissimilar materials and can be used in machine building industries for the manufacture of refractory walls.

The purpose of the invention is to increase the working capacity and manufacturability of the soldered structure.

FIG. 1 shows a solder joint, a cut; in fig. 2 and 3 are embodiments of the intermediate layer.

The construction of a solder joint of dissimilar materials contains a ceramic part 1, a metal base 2 and an intermediate layer 1 placed between them of flexible wire elements with a curved side surface, made of a textile weave grid, profiled in the form of a polywave surface with the placement of all grid points on the walls waves connected to the ceramic part and the base.

The height of the intermediate layer may be (2.5-30) d, where d is the diameter of the wire from which the mesh is made.

The presence of a wave-like wire mesh in the paired structure as an intermediate layer allows for uniform contact arrangements and layer stiffness; this eliminates overvoltage and increases the reliability of the connection. The simplicity of assembly, storage and transportation enhances the manufacturability of the design. The location of all grid nodes on the vertices soldered to the base and ceramic part eliminates the occurrence of 1-monitored junctions on the side surfaces of the waves, which could increase the local rigidity of the intermediate layer. I The wave-like mesh can be easily: made from the standard Flat Mesh manufactured by the industry by squeezing it between profiled punches.

A polywave mesh surface is created by pulling or corrugating. The wire mesh is formed in such a way that the tops of its waves touch one connected plane, and the troughs another, parallel to the first. Experiments have shown that when the height of the wire mesh layer is equal to or greater than 2.5d, it is possible to form welds without forming through hard links between the joining surfaces of the ceramic part and the metal base, which appear when the wire is melted . Through connections are formed with a weakly expressed bulk of the wire mesh layer, when the solder melt is held by capillary pressure not only in the weld grooves, but also outside them. When the height of the wire mesh layer is equal to or less than 30d, the stability of wave cells is ensured when exposed to technological and operational loads. In connection with increasing; cloniness

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loss of wave cells at a height of 30d, the positive effect of the present invention does not manifest itself in this ratio.

FIG. 2 shows a wave-wave layer with cylindrical waves for a parallelepiped-shaped ceramic part, FIG. 3 — a layer with puckled waves for a hexagonal ceramic part with extrusion of each adjacent node in opposite directions.

Example. The pa on the structure, intended as an element of a heat-resistant wall, consists of a copper base 47 mm long, 15 mm wide, 30 mm high, a layer of flexible elements (wire mesh) and three ceramic parts made of lanthanum chromite 30 mm high, 15 mm long and mm each, spaced mm apart. The layer of flexible elements is made of wire mesh No. 2, 5. The mesh size is 2, 5 mm, the wire diameter is 0.5, the material is L-80 brass. A 47 mm long wire mesh preform is profiled using a mold and a punch, giving it a wave form with the waves arranged along the preform. In this case, the profiling operation is performed in such a way that it ensures the placement of grid nodes on the tops and troughs of the waves. The wavelength of the wavelength layer is 2, 5 mm, the wavelength is 3, 4 mm. To the ceramic parts and the copper base, an intermediate layer made of polywave wire mesh was welded in a known manner, in which the welded surface of the ceramic elements was metallized.

 The positive effect of using the proposed design is to reduce the number of steam elements destroyed by thermal and vibration loads, achieved by

This is due to an increase in the uniform distribution of the contacts of the wire mesh layer with the surface of the ceramic part and the decrease in the number of hard jumpers formed during the soldering process between the joined surfaces of the ceramic and the metal base. In addition, fixtures fixing the solder elements are simplified and the assembly time for soldering is reduced, i.e., the reliability and manufacturability of the design is increased.

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Claims (2)

1. The construction of a solder joint of parts from dissimilar materials, mainly a refractory wall, containing 52 ceramic parts, a metal base and an intermediate layer of flexible wire elements with a curvilinear side surface, connected to the ceramic part and with the base, between them In order to improve the performance and manufacturability of the structure, the intermediate layer is made of a textile weave mesh, profiled in the form of poly VW Fie.2 wave surface with the placement of all grid nodes on the tops of the waves. 2. The construction of claim I, wherein the heme is that the height of the intermediate layer is (2.5-30) J, where d is the diameter of the wire from which the mesh is made. Fig.Z