JP2002111080A - Peltier module and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a durable Peltier module where a crack or the like is hard to occur at a junction part or a P- or N-type thermoelectric element even if it is repeatedly applied with a thermal stress. SOLUTION: A Peltier module is provided where a plurality of P- and N-type thermoelectric elements are provided side by side between a pair of facing substrates 1 and 1', while a P-type thermoelectric element 2 and an N-type thermoelectric element 3 are connected in series through junction electrodes 4 and 4' so provided as to face the substrates 1 and 1'. An array pattern comprises an angular part at its periphery which comprises the junction electrodes 4 and 4' provided at the pair of substrates 1 and 1'. A plurality of thermoelectric elements having the same characteristics are jointed to facing angular-part junction electrodes 4a and 3'a to form the angular part of the array pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a Peltier module having a P-type thermoelectric element, an N-type thermoelectric element and a bonding electrode between a pair of opposing substrates and used for a cooling device and the like, and a method of manufacturing the same. Things.

[0002]

2. Description of the Related Art Conventionally, as a Peltier module used for a cooling device or the like, a Peltier module between a pair of substrates such as ceramics is used.
Type thermoelectric element and N-type thermoelectric element are arranged, and P-type and N-type
A Peltier module is known in which a P-type thermoelectric element and an N-type thermoelectric element are joined so that they are connected in series via a joining electrode, and a series conduction circuit is formed.

When power is supplied to the Peltier module, one substrate acts as a heat radiation side and the other substrate acts as a heat absorbing side. Therefore, both substrates undergo thermal expansion and thermal contraction. And since this thermal expansion and thermal contraction are repeated,
In the conventional Peltier module, thermal stress is repeatedly applied to the junction or the P-type or N-type thermoelectric element, and cracks or the like are generated in the junction or the P-type or N-type thermoelectric element, thereby shortening the life of the Peltier module. There was something.

[0004]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the conventional Peltier module, and has as its object to provide a junction between a thermoelectric element and a junction electrode and a P-type. Provided is a Peltier module in which cracks and the like are hardly generated in a joint portion, a P-type, and an N-type thermoelectric element even when a thermal stress is repeatedly applied to the N-type thermoelectric element, and the durability is improved, and a method of manufacturing the same. Is to do.

[0005]

According to a first aspect of the present invention, there is provided a Peltier module having a plurality of P-type and N-type thermoelectric elements arranged side by side between a pair of opposing substrates and facing each substrate. A Peltier module in which a P-type thermoelectric element and an N-type thermoelectric element are connected in series via a provided bonding electrode, and an array pattern formed by bonding electrodes provided on each of a pair of substrates has an outer periphery. A Peltier module, comprising: an array pattern having corners, wherein a plurality of thermoelectric elements having the same characteristics are bonded to the corner bonding electrodes which form the corners of the array pattern and face each other. . In addition, about the same characteristic here, for example, 2
When the thermoelectric elements are P-type and P-type or N-type and N-type, the thermoelectric elements have the same characteristics.

The Peltier module according to the first aspect of the present invention is provided with a configuration in which a plurality of thermoelectric elements having the same characteristics are joined to the corner junction electrodes which form the corners of the array pattern and face each other. Therefore, according to the present invention, at the corner of the array pattern where the thermal stress is concentrated, the load can be shared by the plurality of thermoelectric elements, and the bonding area between the bonding electrode and the thermoelectric element can be increased. Thermal stress on the thermoelectric element can be reduced, and defects such as cracks can be reduced. In addition, even if one thermoelectric element among a plurality of thermoelectric elements having the same characteristic that is joined to the opposing corner junction electrode is broken, the other thermoelectric elements can conduct electricity, thereby preventing breakage due to disconnection. it can. Therefore, according to the present invention, a Peltier module with high reliability and improved durability can be configured.

A peltier module according to a second aspect of the present invention is the peltier module according to the first aspect, wherein the arrangement pattern is substantially rectangular.

The Peltier module according to the second aspect of the invention has an advantage that the Peltier module can be easily manufactured as compared with other shapes because the arrangement pattern formed by the bonding electrodes is substantially rectangular.

According to a third aspect of the present invention, in the Peltier module, the arrangement pattern is substantially rectangular, and the long side outer peripheral portion bonding electrode which forms the long side outer peripheral portion of the arrangement pattern and is opposed to the arrangement pattern. 3. The Peltier module according to claim 1, wherein a plurality of thermoelectric elements having the same characteristics are joined.

[0010] In the Peltier module according to the third aspect of the present invention, a plurality of thermoelectric elements having the same characteristics are joined to the long side outer peripheral joining electrode in addition to the corner joining electrode. Therefore, according to the present invention, the load can be shared by the plurality of thermoelectric elements and the bonding area between the bonding electrode and the thermoelectric element can be increased at the corners and the outer periphery on the long side of the array pattern where the thermal stress is concentrated. Therefore, thermal stress on the joint and the thermoelectric element can be reduced, and defects such as cracks can be reduced. Further, even if one thermoelectric element among a plurality of thermoelectric elements having the same characteristics and joined to the opposed corner junction electrode and the opposed long side outer peripheral junction electrode is damaged, another thermoelectric element is damaged. Since conduction can be achieved by the element, breakage due to disconnection can be prevented. Therefore, according to the present invention, a Peltier module with high reliability and improved durability can be configured.

According to a fourth aspect of the present invention, there is provided a Peltier module according to the present invention, wherein a P-type thermoelectric element and an N-type thermoelectric element are connected to each other in series via a junction electrode, and are located at positions which are to be folded portions of a planar circuit pattern. The Peltier module according to any one of claims 1 to 3, wherein a plurality of thermoelectric elements having the same characteristics are bonded to the opposing bonding electrodes.

In the Peltier module according to the present invention, in addition to the corner junction electrodes, a planar circuit pattern in which a P-type thermoelectric element and an N-type thermoelectric element are connected in series via a junction electrode. And a configuration in which a plurality of thermoelectric elements having the same characteristics are bonded to the opposing bonding electrodes at positions where the folded portions are formed. Therefore, according to the present invention, the load can be shared by the plurality of thermoelectric elements and the junction area between the junction electrode and the thermoelectric element can be increased at the corners of the array pattern where the thermal stress is concentrated and at the folded portions of the circuit pattern. Therefore, thermal stress on the joint and the thermoelectric element can be reduced, and defects such as cracks can be reduced. Further, even if one of the thermoelectric elements having the same characteristics and being joined to the opposing corner bonding electrode and the opposing bonding electrode at the position to be the folded portion is broken. Since conduction can be achieved by other thermoelectric elements, breakage due to disconnection can be prevented.
Therefore, according to the present invention, a Peltier module with high reliability and improved durability can be configured.

According to a fifth aspect of the present invention, there is provided a method of manufacturing a Peltier module, comprising:
Joining across multiple joining electrodes on one substrate,
Thereafter, a rod-shaped thermoelectric element material is cut into individually separated thermoelectric elements, and then a bonding electrode on the other substrate is joined to the individually separated thermoelectric elements to produce a Peltier module. In manufacturing the Peltier module according to claim 2 or 3, an outer peripheral side of an outer peripheral bonding electrode forming one outer peripheral part of a pair of opposite sides of an array pattern formed by the bonding electrode of one substrate. A plurality of rod-shaped thermoelectric element materials having the same characteristics are used as the rod-shaped thermoelectric element materials to be joined over the Peltier module.

In the method for manufacturing a Peltier module according to the fifth aspect of the present invention, when manufacturing the Peltier module according to the second or third aspect, bonding is performed by straddling the outer peripheral side of the outer peripheral bonding electrode on the substrate. Since a plurality of rod-shaped thermoelectric element materials having the same characteristics are used as the rod-shaped thermoelectric element materials, it is possible to manufacture the Peltier module according to claim 2 or 3 very easily. Become.

According to a sixth aspect of the present invention, in the method of manufacturing a Peltier module according to the fifth aspect, all the rod-shaped thermoelectric element materials having the same characteristics to be used have the same sectional shape. Is the way.

In the method for manufacturing a Peltier module according to the present invention, since all the rod-shaped thermoelectric element materials having the same characteristics to be used have the same cross-sectional shape, a new shape of the thermoelectric element material is prepared. Without this, the Peltier module according to claim 2 or 3 can be manufactured.

According to a seventh aspect of the present invention, in the method of manufacturing a Peltier module, the height of the rod-shaped thermoelectric element material having a substantially quadrangular cross section is the same, and the relative height of the arrangement pattern formed by the bonding electrodes on one of the substrates is reduced. The outermost side of a plurality of rod-shaped thermoelectric element materials having the same characteristic, which is joined to the outer peripheral side of the outer peripheral joining electrode forming the outer peripheral portion on one side of the pair of sides, is joined. 6. The Peltier module according to claim 5, wherein the rod-shaped thermoelectric element material having the same characteristic to be joined is larger than the width of the rod-shaped thermoelectric element material having the same characteristic disposed on only one joint electrode. It is a manufacturing method.

In the method of manufacturing a Peltier module according to the present invention, the outermost side of a plurality of rod-shaped thermoelectric element materials having the same characteristics joined over the outer peripheral side of the outer peripheral bonding electrode. Since the width of the rod-shaped thermoelectric element material having the same characteristics to be bonded is set to be only one, and the width of the rod-shaped thermoelectric element material having the same characteristics disposed on the bonding electrode is only one,
At the corners and the outer periphery of the array pattern where the thermal stress is concentrated, it is possible to manufacture a Peltier module in which the bonding area between the bonding electrode and the thermoelectric element or the total cross-sectional area of the thermoelectric element is increased. It is possible to manufacture a Peltier module with high reliability and improved durability, in which cracks and the like hardly occur in the thermoelectric element. Here, the height and the width represent the height and the width when a rod-shaped thermoelectric element material having a substantially square cross section is laid horizontally on the substrate.

According to a eighth aspect of the present invention, in the method of manufacturing a Peltier module, the heights of the rod-shaped thermoelectric element materials whose cross sections are substantially square are all equal, and the relative positions of the arrangement patterns formed by the bonding electrodes on one substrate are different. The total dimension of the widths of a plurality of rod-shaped thermoelectric element materials having the same characteristics to be joined by straddling the outer peripheral side of the outer peripheral junction electrode forming the outer peripheral portion on one side of the pair of sides is joined. 6. The width of a rod-shaped thermoelectric element material having the same characteristics provided on only one bonding electrode having the same characteristics and having the same characteristics.
It is a manufacturing method of the described Peltier module.

In the method for manufacturing a Peltier module according to the present invention, the total dimension of the widths of a plurality of rod-shaped thermoelectric element materials having the same characteristics to be joined over the outer peripheral side of the outer peripheral junction electrode is defined as: Since only one rod-shaped thermoelectric element material having the same characteristics to be joined has the same width as the rod-shaped thermoelectric element material having the same characteristics disposed on the joining electrode, the element cross-sectional area of the PN pair is Since the outer peripheral portion manufactured by joining a plurality of rod-shaped thermoelectric element materials to the joining electrode and the central portion produced by joining one rod-shaped thermoelectric element material to the joining electrode can be made the same, A highly reliable Peltier module with improved durability can be manufactured without causing a reduction in the amount of heat absorbed in the outer peripheral portion.

According to a ninth aspect of the present invention, there is provided a method of manufacturing a Peltier module in which the arrangement pattern formed by the bonding electrodes on one substrate is laid over the outer peripheral side of the outer peripheral bonding electrode on one side of a pair of opposing sides. A plurality of rod-shaped thermoelectric element materials having the same characteristics to be joined, and a plurality of rod-shaped thermoelectric element materials having the same characteristics to be joined by straddling the outer peripheral side of the outer peripheral joining electrode on the other side of the pair of sides, The method for manufacturing a Peltier module according to any one of claims 5 to 8, wherein the thermoelectric element materials have the same characteristics.

In the method for manufacturing a Peltier module according to the ninth aspect of the present invention, the rod-shaped thermoelectric element material having the same characteristics is disposed on the outer peripheral side of both outer peripheral junction electrodes on the pair of opposite sides of the array pattern. , Both sides are equal in strength,
A Peltier module with more stable quality can be obtained.

According to a tenth aspect of the present invention, there is provided a method of manufacturing a Peltier module according to the ninth aspect, wherein a plurality of rods having the same characteristics are joined so as to extend over the outer peripheral side of the outer peripheral junction electrode. Wherein the properties of the thermoelectric element materials are all P-type.

In the method of manufacturing a Peltier module according to the tenth aspect of the present invention, all of the plurality of rod-shaped thermoelectric element materials having the same characteristics joined over the outer peripheral side of the outer peripheral bonding electrode are P-type. is there. Since the P-type thermoelectric element material generally has higher strength than the N-type thermoelectric element material, according to the Peltier module manufacturing method of the present invention, it is possible to obtain a Peltier module having better durability. It becomes possible.

[0025]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a Peltier module according to an embodiment of the present invention.

FIG. 1 is a plan view of a Peltier module according to an embodiment (first embodiment) of the present invention, in which an upper substrate 1 'is omitted. In the first embodiment,
As shown in FIG. 1, a P-type thermoelectric element 2 and an N-type thermoelectric element 3 are disposed between upper and lower substrates 1 and 1 ′ made of a pair of ceramics such as alumina (the upper substrate 1 ′ is not shown). Are arranged side by side. Bonding electrodes 4, 4 ′ are provided on the respective substrates 1, 1 ′ so as to face each other. In FIG. 1, the lower bonding electrode 4 provided on the lower substrate 1 is indicated by a solid frame.
The upper bonding electrode 4 'provided on the lower surface of the upper substrate 1' (not shown in the figure) is indicated by a broken-line frame. As shown in FIG. 1, the P-type thermoelectric element 2 or the N-type is placed at a position where the lower bonding electrode 4 provided on the lower substrate 1 and the upper bonding electrode 4 'provided on the upper substrate 1' face each other. The thermoelectric element 3 is joined, and the P-type thermoelectric element 2 and the N-type thermoelectric element 3 are connected in series via the lower bonding electrode 4 or the upper bonding electrode 4 '. In FIG. 1, reference numeral 6 indicates a lead wire. In FIG. 1, the P-type thermoelectric element 2 is denoted by P, and the N-type thermoelectric element 3 is denoted by N.

Each of the arrangement patterns formed by the lower bonding electrode 4 and the upper bonding electrode 4 'has a square shape as shown in FIG. Type thermoelectric element 3 is 5 (row) × 5 (row)
Are connected in series via the lower bonding electrode 4 or the upper bonding electrode 4 '. Here, opposing bonding electrodes 4, 4 '
Even if two thermoelectric elements having the same characteristics are joined, the number of columns connected in series is one. The lower bonding electrode 4 and the upper bonding electrode 4 ′ have the same characteristics as the corner bonding electrodes 4 A and 4 ′ A which form and face the corners of an array pattern formed in a square shape. 2 thermoelectric elements
Individually joined. Further, a lower bonding electrode 4 shown in FIG.
In the arrangement pattern formed by the upper bonding electrodes 4 ', a planar circuit pattern connecting the P-type thermoelectric element 2 and the N-type thermoelectric element 3 in series via the bonding electrode (4 or 4'). Are all the outer peripheral portions of the array pattern. As shown in FIG. 1, in the first embodiment, the outer peripheral junction electrodes 4B and 4 'which are located at positions where the planar circuit pattern is to be turned back and face each other.
B also has two thermoelectric elements having the same characteristics. Note that some of the corner junction electrodes 4A and 4'A are located at positions where the planar circuit pattern is folded, and correspond to the outer peripheral junction electrodes 4B and 4'B facing each other. .

Then, the bonding electrodes 4 of the thermoelectric elements 2 and 3
The area of the junction electrode joining two thermoelectric elements having the same characteristic is larger than the area of the junction electrode joining only one thermoelectric element having the same characteristic. are doing.

In the first embodiment, the corner bonding electrodes 4A, 4'A facing each other and the outer peripheral bonding electrodes 4B, 4B facing each other are located at positions to be folded portions of the planar circuit pattern. The area of the bonding electrode where two thermoelectric elements with the same characteristics are bonded to B and the two thermoelectric elements with the same characteristics is the same as the bonding electrode where only one thermoelectric element with the same characteristics is bonded. Is larger than the area. Therefore, at the corners of the array pattern where the thermal stress is concentrated and the folded portions of the circuit pattern, the load can be shared by the two thermoelectric elements, and the bonding area between the bonding electrode and the thermoelectric element is increased. Furthermore, 1 out of 2 thermoelectric elements having the same characteristics
Even if one thermoelectric element is destroyed, conduction can be obtained with another thermoelectric element. Therefore, the Peltier module of the first embodiment is a Peltier module with high reliability and improved durability, in which defects such as cracks are less likely to occur in the joints and the thermoelectric elements.

Although not shown, it is possible as a modified form of the first embodiment to provide the folded portion of the circuit pattern at an intermediate position of the array pattern instead of the outer peripheral portion of the array pattern. .

Next, FIG. 2 is a plan view omitting an upper substrate 1 'for describing a different embodiment (second embodiment) of the Peltier module of the present invention. In the second embodiment, as shown in FIG. 2, a P-type thermoelectric element is provided between upper and lower substrates 1, 1 'made of a pair of ceramics, such as alumina, facing each other (the upper substrate 1' is not shown). A plurality of 2 and N-type thermoelectric elements 3 are arranged in parallel. Bonding electrodes 4, 4 ′ are provided on the respective substrates 1, 1 ′ so as to face each other. In FIG. 2, the lower bonding electrode 4 provided on the lower substrate 1 is indicated by a solid frame, and The upper bonding electrode 4 'provided on the lower surface of' (not shown in the figure) is indicated by a broken-line frame. As shown in FIG. 2, the lower bonding electrode 4 provided on the lower substrate 1
The P-type thermoelectric element 2 or the N-type thermoelectric element 3 is bonded to a position where the upper bonding electrode 4 ′ provided on the upper substrate 1 ′ faces the lower bonding electrode 4 or the upper bonding electrode 4. ′, The P-type thermoelectric element 2 and the N-type thermoelectric element 3 are connected in series. In FIG. 2, reference numeral 6 denotes a lead wire. In FIG. 2, the P-type thermoelectric element 2 has P, N
The type thermoelectric element 3 is denoted by an N symbol.

Each of the arrangement patterns formed by the lower bonding electrode 4 and the upper bonding electrode 4 'has a rectangular shape in the second embodiment, as shown in FIG. Two or four thermoelectric elements having the same characteristics are joined to the corner junction electrodes 4A and 4'A which form the corners of the arrangement pattern and face each other. In addition, the lower-side bonding electrode 4 and the longer-side outer-peripheral-part bonding electrodes 4B and 4'B which form and oppose the longer-peripheral-side peripheral portions of the array pattern formed by the upper-side bonding electrode 4 'are also provided. , Two or four thermoelectric elements having the same characteristics
Individually joined. The corner junction electrodes 4A, 4'A are:
It also corresponds to the long side outer peripheral bonding electrodes 4B, 4'B.
The bonding area between the thermoelectric elements 2 and 3 and the bonding electrodes 4 and 4 ′ is all the same, and two or 4 thermoelectric elements having the same characteristics
The area of the bonding electrodes that are individually bonded is larger than the area of the bonding electrodes that are formed by bonding only one thermoelectric element having the same characteristics.

In the second embodiment, a plurality of thermoelectric elements having the same characteristics are joined to the opposed corner junction electrodes 4A, 4'A and the opposed outer peripheral junction electrodes 4B, 4'B. Corner junction electrode 4A, 4'A and outer peripheral junction electrode 4
B, 4′B, the thermoelectric elements having the same characteristics
The area is set to be larger than the area of the bonding electrode in which only the electrodes are bonded. Therefore, at the corners and the long side outer periphery of the array pattern where the thermal stress is concentrated, the load can be shared by the plurality of thermoelectric elements, and the bonding area between the bonding electrodes and the thermoelectric elements is increased. Further, even if one thermoelectric element among a plurality of thermoelectric elements having the same characteristic is broken, conduction can be obtained with another thermoelectric element. Therefore, the Peltier module of the second embodiment is a Peltier module with high reliability and improved durability, in which defects such as cracks are less likely to occur in the joint and the thermoelectric element.

In the second embodiment, the P-type thermoelectric element 2
And the N-type thermoelectric element 3 are connected in series via a bonding electrode (4 or 4 ′), and are located at positions that are to be folded portions of a planar circuit pattern. , Which correspond to the outer peripheral bonding electrodes 4B and 4'B which are formed to form the outer peripheral portion on the long side, and improve the durability even at the folded portion of the circuit pattern where thermal stress is concentrated. It will be.

Next, an embodiment of a method for manufacturing a Peltier module according to the present invention will be described.

A method of manufacturing the Peltier module according to the second embodiment shown in FIG. 2 will be described. First, as shown in FIG. 3, a lower substrate 1 made of ceramic such as alumina to which the lower bonding electrode 4 is fixed is prepared. The lower bonding electrode 4 is formed of a metal plate such as a copper plate. Next, as shown in FIG. 4, P-type and N-type rod-like thermoelectric element materials 7 and 8 having the same cross-sectional shape and having a quadrangular prism shape are combined with a plurality of lower bonding electrodes 4 on the lower substrate 1. And then joined. The joint in this case is
For example, it can be performed by applying a solder paste to a predetermined position of the lower bonding electrode 4 and heating it.
Regarding the arrangement of the rod-shaped thermoelectric element materials 7 and 8, the outer peripheral bonding electrode 4 that forms the outer peripheral part on one side of the long side opposite to the arrangement pattern (rectangular shape) formed by the lower bonding electrode 4.
Two P-type thermoelectric element members 7 are arranged so as to extend over the outer peripheral sides of B, 4B, and. Then, the two P-type thermoelectric element materials 7 are similarly spread over the outer peripheral side of the outer peripheral bonding electrodes 4B, 4B, and ‥ forming the outer peripheral part on the other long side of the array pattern opposite to each other. Have been placed. Then, one rod-shaped P-type thermoelectric element material 7 and one rod-shaped N-type thermoelectric element material 8 are bonded to the bonding electrodes 4 independent of the outer peripheral bonding electrodes 4B, 4B, and ‥, respectively. I have.

As described above, the outer peripheral portions of the outer peripheral bonding electrodes 4B, 4B,.
When two thermoelectric element materials having the same characteristics (in this case, P type) and having the same shape are arranged, it is possible to obtain a Peltier module in which both sides are equal in strength and quality is more stable. It becomes possible. Also, the P-type thermoelectric element material is
Since the strength is generally higher than that of the N-type, two rod-shaped thermoelectric element materials having the same characteristics arranged on the outer peripheral side of the outer peripheral bonding electrodes 4B, 4B, and ‥ have a P-type characteristic. There is an advantage that a Peltier module having better durability can be obtained.

Next, after fixing the rod-shaped P-type and N-type thermoelectric elements 7 and 8 bonded to the lower bonding electrode 4 on the lower substrate 1 with wax, a cutting having a plurality of cutting blades shown in FIG. A predetermined position of each thermoelectric element material 7, 8 is cut by the member 9, the wax is washed and removed, and the thermoelectric elements (P-type thermoelectric element 2 or N-type thermoelectric element 3) are individually separated as shown in FIG. To the lower bonding electrode 4 to obtain the lower substrate 1. Next, an upper bonding electrode 4 'formed on an upper substrate 1' (not shown) made of a ceramic such as alumina prepared in advance.
The thermoelectric elements 2 and 3 on the lower substrate 1 are joined to each other using, for example, a solder paste or the like to produce a Peltier module according to the second embodiment shown in FIG.

As described above, in the embodiment relating to this manufacturing method, the rod-shaped P-type thermoelectric element material 7 and N
Two rod-shaped thermoelectric element materials having the same characteristics are used as the thermoelectric element materials which use the mold type thermoelectric element material 7 as a raw material and which are joined over the outer peripheral side of the outer peripheral junction electrode 4B on the lower substrate 1. Therefore, the Peltier module of the second embodiment shown in FIG. 2 can be manufactured very easily.

The outer peripheral bonding electrodes 4B, 4B, which form the outer peripheral part on one long side, which is a pair of opposite sides of the array pattern (rectangular shape) formed by the lower bonding electrode 4.
When two P-shaped thermoelectric element members 7 each having a rectangular cross section and the same height are arranged so as to extend over the outer peripheral sides of B and ‥, as shown in FIG. P to be placed on
The width of the thermoelectric element material 7 can be made larger than the width of the rod-shaped thermoelectric element material having the same characteristic provided on the bonding electrode 4 where only one rod-shaped thermoelectric element material having the same characteristic is bonded. . As shown in FIG. 6, the bonding electrode 4 in which the number of rod-shaped thermoelectric element materials having the same characteristics to be bonded is only one as shown in FIG.
Bonding electrode 4 inside outer circumferential bonding electrodes 4B, 4B, ‥
It is. As described above, the width of the P-type thermoelectric element material 7 arranged on the outermost peripheral side is changed to the rod-shaped thermoelectric element material having the same characteristic provided on the bonding electrode 4 where only one rod-shaped thermoelectric element material having the same characteristic is joined. If the width is larger than the width of the thermoelectric element material, at the corners and the outer periphery of the array pattern where the thermal stress is concentrated, the bonding area between the bonding electrode and the thermoelectric element and the total cross-sectional area of the thermoelectric element (cross-sectional area in the direction parallel to the substrate surface) Since a Peltier module having a larger size can be manufactured, a crack or the like is less likely to occur in the joint portion and the thermoelectric element, and a Peltier module with high reliability and improved durability can be manufactured.

When a Peltier module is manufactured, as shown in FIG. 7, an outer peripheral portion on one long side, which is a pair of opposing sides of an array pattern (rectangular shape) formed by the lower bonding electrode 4. Outer peripheral junction electrode 4 forming
B, 4B, the total dimensions of the widths of two rod-shaped thermoelectric element materials having the same characteristics (in this case, P type) having the same height (in this case, P type) and having the same height (in this case, P), which are arranged so as to straddle the outer peripheral side Alternatively, the width of the rod-shaped thermoelectric element material having the same characteristics provided on the bonding electrode 4 in which only one rod-shaped thermoelectric element material having the same characteristics is joined may be set. As shown in FIG. 7, the bonding electrode 4 having only one rod-shaped thermoelectric element material having the same characteristics to be bonded is, as shown in FIG. 7, the outer peripheral bonding electrodes 4B, 4B,.
Is the bonding electrode 4 inside. In this way, P
Regarding the element cross-sectional area of −N pairs, an outer peripheral portion manufactured by joining a plurality of rod-shaped thermoelectric element materials to a joining electrode and a center produced by joining one rod-shaped thermoelectric element material to a joining electrode. Since it can be made the same for the Peltier module, there is an advantage that a highly reliable Peltier module with improved durability can be manufactured without lowering the heat absorption amount at the outer peripheral portion.

[0042]

The Peltier module according to the first aspect of the present invention is provided with a configuration in which a plurality of thermoelectric elements having the same characteristics are joined to the corner junction electrodes which form the corners of the array pattern and face each other. Therefore, according to the first aspect of the invention, at the corners of the array pattern where the thermal stress is concentrated,
Since the load can be shared by the plurality of thermoelectric elements, and the bonding area between the bonding electrode and the thermoelectric element can be increased, the thermal stress on the joint and the thermoelectric element can be reduced, and defects such as cracks can be reduced. In addition, even if one thermoelectric element among a plurality of thermoelectric elements having the same characteristic that is joined to the opposing corner junction electrode is broken, the other thermoelectric elements can conduct electricity, thereby preventing breakage due to disconnection. it can. Therefore, according to the first aspect of the present invention, a Peltier module with high reliability and improved durability can be configured.

In the Peltier module according to the second aspect of the present invention, since the arrangement pattern formed by the bonding electrodes is substantially rectangular, the Peltier module can be easily manufactured in addition to the effect of the first aspect. It works.

In the Peltier module according to the third aspect of the present invention, a plurality of thermoelectric elements having the same characteristics are joined to the long side outer peripheral joining electrodes in addition to the corner joining electrodes. Therefore, according to the third aspect of the present invention, the load can be shared by the plurality of thermoelectric elements at the corners and the outer periphery on the long side of the array pattern where the thermal stress is concentrated, and the bonding between the bonding electrode and the thermoelectric element can be performed. Since the area can be increased, thermal stress on the joint and the thermoelectric element can be reduced, and defects such as cracks can be reduced. Further, even if one thermoelectric element among a plurality of thermoelectric elements having the same characteristics and joined to the opposed corner junction electrode and the opposed long side outer peripheral junction electrode is damaged, another thermoelectric element is damaged. Since conduction can be achieved by the element, breakage due to disconnection can be prevented. Therefore, according to the third aspect of the invention, it is possible to configure a Peltier module with high reliability and improved durability.

In the Peltier module according to the fourth aspect of the present invention, in addition to the corner junction electrode, a P-type thermoelectric element and an N-type thermoelectric element are connected in series via a junction electrode. A configuration is provided in which a plurality of thermoelectric elements having the same characteristics are bonded to the opposing bonding electrode at a position to be a folded portion. Therefore, according to the fourth aspect of the present invention, the load can be shared by the plurality of thermoelectric elements at the corners of the array pattern where the thermal stress is concentrated and the folded portions of the circuit pattern, and the bonding between the bonding electrode and the thermoelectric element can be performed. Since the area can be increased, thermal stress on the joint and the thermoelectric element can be reduced, and defects such as cracks can be reduced. Further, even if one of the thermoelectric elements having the same characteristics and being joined to the opposing corner bonding electrode and the opposing bonding electrode at the position to be the folded portion is broken. Since conduction can be achieved by other thermoelectric elements, breakage due to disconnection can be prevented. Therefore, according to the invention of claim 4, a Peltier module with high reliability and improved durability can be configured.

In the method of manufacturing a Peltier module according to the fifth aspect of the present invention, when manufacturing the Peltier module according to the second or third aspect, bonding is performed by straddling the outer peripheral side of the outer peripheral bonding electrode on the substrate. Since a plurality of rod-shaped thermoelectric elements having the same characteristics are used as the rod-shaped thermoelectric elements, the Peltier module according to claim 2 or 3 can be manufactured very easily. .

In the method for manufacturing a Peltier module according to the sixth aspect of the present invention, since all the rod-shaped thermoelectric element materials having the same characteristics to be used have the same cross-sectional shape, there is no need to prepare a thermoelectric element material having a new shape. In addition, the Peltier module according to claim 2 or 3 can be manufactured.

In the method of manufacturing a Peltier module according to the present invention, the outermost side of a plurality of rod-shaped thermoelectric element materials having the same characteristics to be joined so as to extend over the outer peripheral side of the outer peripheral junction electrode. Since the width is set to be larger than the width of the rod-shaped thermoelectric element material of the same characteristic provided on the joining electrode in which only one rod-shaped thermoelectric element material of the same characteristic to be bonded is arranged, thermal stress is concentrated. At the corners and outer periphery of the pattern,
It is possible to manufacture a Peltier module in which the junction area between the junction electrode and the thermoelectric element or the total cross-sectional area of the thermoelectric element is increased, and therefore, cracks and the like are less likely to occur in the junction and the thermoelectric element, and the reliability is high. Thus, a Peltier module with improved durability can be manufactured.

In the method of manufacturing a Peltier module according to the present invention, the total width of a plurality of rod-shaped thermoelectric element materials having the same characteristics to be joined across the outer peripheral side of the outer peripheral bonding electrode is determined. Since the width of the rod-shaped thermoelectric element material having the same characteristic is the same as the width of the rod-shaped thermoelectric element material having the same characteristic disposed on only one bonding electrode, the element cross-sectional area of the PN pair is: Since the outer peripheral portion manufactured by joining a plurality of rod-shaped thermoelectric element materials to the joining electrode and the central portion produced by joining one rod-shaped thermoelectric element material to the joining electrode can be made the same, It is possible to manufacture a highly reliable Peltier module with improved durability without causing a decrease in the amount of heat absorbed in the part.

In the method for manufacturing a Peltier module according to the ninth aspect of the present invention, the rod-shaped thermoelectric element material having the same characteristics is disposed on the outer peripheral side of both outer peripheral bonding electrodes on the pair of opposite sides of the array pattern. Both sides are equal in strength, and a Peltier module with more stable quality can be obtained.

In the method of manufacturing a Peltier module according to the tenth aspect of the present invention, all of the plurality of rod-shaped thermoelectric element materials having the same characteristics joined across the outer peripheral side of the outer peripheral junction electrode are P-type. . The P-type thermoelectric element material generally has higher strength than the N-type thermoelectric element material. Therefore, according to the method of manufacturing a Peltier module of the invention according to the tenth aspect, the Peltier module having better durability is provided. Modules can be obtained.

[Brief description of the drawings]

FIG. 1 is a plan view illustrating a Peltier module according to a first embodiment of the present invention, from which an upper substrate is omitted.

FIG. 2 is a plan view illustrating a Peltier module according to a second embodiment of the present invention, from which an upper substrate is omitted.

FIG. 3 is a diagram for explaining the manufacturing method of the present invention, and is a plan view showing a lower substrate to which a lower bonding electrode is fixed.

FIG. 4 is a view for explaining the manufacturing method of the present invention, and is a plan view showing an arrangement state of rod-shaped thermoelectric element materials.

FIG. 5 is a view for explaining the manufacturing method of the present invention, and is a plan view showing a state where a predetermined position of the thermoelectric element material is cut by a cutting member.

FIG. 6 is a diagram for explaining the manufacturing method of the present invention, and is a plan view showing different arrangement states of rod-shaped thermoelectric element materials.

FIG. 7 is a view for explaining the manufacturing method of the present invention, and is a plan view showing a further different arrangement state of rod-shaped thermoelectric element materials.

[Explanation of symbols]

 1, 1 'substrate 2 P-type thermoelectric element 3 N-type thermoelectric element 4, 4' bonding electrode 4A, 4'A corner bonding electrode 4B, 4'B outer peripheral bonding electrode 6 lead wire 7 P-type thermoelectric element material 8N Type thermoelectric element material 9 Cutting member

Claims (10)

[Claims] A plurality of P-type and N-type thermoelectric elements are juxtaposed between a pair of opposing substrates, and a P-type thermoelectric element and an N-type thermoelectric element are interposed via a bonding electrode provided to face each substrate. A Peltier module in which thermoelectric elements are connected in series, wherein an array pattern formed by bonding electrodes provided on each of a pair of substrates is an array pattern having a corner on an outer periphery, and a corner of the array pattern. A Peltier module comprising a plurality of thermoelectric elements having the same characteristics joined to opposing corner junction electrodes. 2. The Peltier module according to claim 1, wherein the arrangement pattern is substantially rectangular. 3. The arrangement pattern is substantially rectangular,
The thermoelectric element having the same characteristics is joined to a long-side outer peripheral junction electrode which forms the long-peripheral outer peripheral portion of the array pattern and faces each other. 2. The Peltier module according to 2. 4. A position where a P-type thermoelectric element and an N-type thermoelectric element are connected to each other in series via a bonding electrode and which is a folded portion of a planar circuit pattern, The Peltier module according to any one of claims 1 to 3, wherein a plurality of thermoelectric elements having the same characteristics are joined. 5. A rod-shaped thermoelectric element having a substantially square cross section,
Joining across multiple joining electrodes on one substrate,
Thereafter, a rod-shaped thermoelectric element material is cut into individually separated thermoelectric elements, and then a bonding electrode on the other substrate is joined to the individually separated thermoelectric elements to produce a Peltier module. In manufacturing the Peltier module according to claim 2 or 3, an outer peripheral side of an outer peripheral bonding electrode forming one outer peripheral part of a pair of opposite sides of an array pattern formed by the bonding electrode of one substrate. A plurality of rod-shaped thermoelectric element materials having the same characteristics are used as the rod-shaped thermoelectric element materials to be joined over the Peltier module. 6. The method for manufacturing a Peltier module according to claim 5, wherein all of the rod-shaped thermoelectric element materials having the same characteristics to be used have the same cross-sectional shape. 7. A bar-shaped thermoelectric element material having a substantially square cross section is used, all of which have the same height, and form an outer peripheral portion on one side of a pair of opposite sides of an array pattern formed by bonding electrodes of one substrate. Of the plurality of rod-shaped thermoelectric element materials having the same characteristic, which are joined over the outer peripheral side of the outer peripheral junction electrode which has the same characteristic, the width of the rod-shaped thermoelectric element material having the same characteristic to be joined is 6. The method for manufacturing a Peltier module according to claim 5, wherein the width is larger than the width of the rod-shaped thermoelectric element material having the same characteristics provided on only one bonding electrode. 8. A rod-shaped thermoelectric element material having a substantially rectangular cross section is used, all of which have the same height, and form an outer peripheral portion on one side of a pair of opposite sides of an array pattern formed by bonding electrodes of one substrate. The total dimension of the width of a plurality of rod-shaped thermoelectric element materials having the same characteristics to be joined and astride the outer peripheral side of the outer peripheral bonding electrode is only one rod-shaped thermoelectric element material having the same characteristics to be joined. 6. The width of a rod-shaped thermoelectric element material having the same characteristics, which is disposed on the bonding electrode having the following characteristics:
A method for manufacturing the Peltier module described in the above. 9. A plurality of rod-shaped thermoelectric elements having the same characteristics joined over an outer peripheral side of an outer peripheral bonding electrode on one side of a pair of opposite sides of an array pattern formed by bonding electrodes on one substrate. Material, and a plurality of rod-shaped thermoelectric element materials having the same characteristics, which are joined across the outer peripheral side of the outer peripheral bonding electrode on the other side of the pair of sides, are both thermoelectric element materials having the same characteristics. The method for manufacturing a Peltier module according to any one of claims 5 to 8. 10. A method for manufacturing a Peltier module according to claim 9, wherein a plurality of rod-shaped thermoelectric element materials having the same characteristics joined over the outer peripheral side of the outer peripheral junction electrode are all P-type. A method for manufacturing a Peltier module, comprising: