JP2002111079A - Peltier module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a durable Peltier module where, even if a junction part between a P- or N-type thermoelectric element and a junction electrode or a P- or N-type thermoelectric element is repeatedly applied with a thermal stress, such failure as disconnection caused by cracking of the junction part or the P- or the N-type thermoelectric element is hard to occur. SOLUTION: An array pattern has an angular part at its periphery which comprises junction electrodes 4 and 4' provided to a pair of substrates 1. A periphery supporting member 5 of a material different from that of a P-type thermoelectric element 2 or an N-type thermoelectric element 3 is provided on the peripheral side of facing angular part junction electrodes 4A and 4'A to form the angular part. The periphery supporting member 5 is jointed to the facing angular-part junction electrodes 4A and 4'A.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a Peltier module having a P-type thermoelectric element, an N-type thermoelectric element and a bonding electrode between a pair of opposing substrates and used for a cooling device or the like.

[0002]

2. Description of the Related Art Conventionally, as a Peltier module used for a cooling device or the like, a Peltier module between a pair of substrates such as ceramics is used.
Type thermoelectric element and N-type thermoelectric element are arranged, and P-type and N-type
A Peltier module is known in which a P-type thermoelectric element and an N-type thermoelectric element are joined so that they are connected in series via a joining electrode, and a series conduction circuit is formed.

When power is supplied to the Peltier module, one substrate acts as a heat radiation side and the other substrate acts as a heat absorbing side. Therefore, both substrates undergo thermal expansion and thermal contraction. And since this thermal expansion and thermal contraction are repeated,
In a conventional Peltier module, thermal stress is repeatedly applied to a junction between a P-type or N-type thermoelectric element and a bonding electrode or a P-type or N-type thermoelectric element, and cracks are generated in the junction or the P-type or N-type thermoelectric element. In some cases, disconnection occurs and the life of the Peltier module is shortened.

[0004]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the conventional Peltier module, and an object thereof is to provide a P-type or N-type thermoelectric element and a junction electrode. Even if thermal stress is repeatedly applied to the joint or P-type or N-type thermoelectric element, the joint or P-type or N-type thermoelectric element hardly suffers from problems such as disconnection due to cracks, and the durability is improved. To provide a Peltier module that has

[0005]

According to a first aspect of the present invention, there is provided a Peltier module having a plurality of P-type and N-type thermoelectric elements arranged side by side between a pair of opposing substrates and facing each substrate. A Peltier module in which a P-type thermoelectric element and an N-type thermoelectric element are connected in series via a provided bonding electrode, and an array pattern formed by bonding electrodes provided on each of a pair of substrates has an outer periphery. An arrangement pattern having corners, and an outer periphery support member made of a material different from the P-type or N-type thermoelectric element is arranged on the outer periphery side of the corner junction electrode that forms the corners and faces each other. A Peltier module, wherein an outer peripheral supporting member is joined to the opposed corner joining electrodes.

In the Peltier module according to the first aspect of the present invention, a P-type or N-type thermoelectric element is formed on the outer peripheral side of the corner junction electrode which forms the corner of the array pattern formed by the junction electrode and faces the corner. An outer peripheral support member made of a different material is provided, and the outer peripheral support member is joined to the opposed corner joining electrodes. Therefore, according to the present invention, the strength can be increased at the corners of the array pattern where the thermal stress is concentrated, and therefore, at the corner bonding electrode position where problems such as disconnection are likely to occur due to the thermal stress repeatedly applied conventionally. Problems such as disconnection due to cracks are less likely to occur in the junction between the thermoelectric element and the junction electrode and in the P-type or N-type thermoelectric element, and a Peltier module with improved durability can be obtained.

According to a second aspect of the present invention, there is provided the Peltier module according to the first aspect, wherein the arrangement pattern has a substantially square shape. Compared to the shape of
There is an advantage that a Peltier module can be easily manufactured.

According to a third aspect of the present invention, there is provided a Peltier module, wherein the outer peripheral portion of the array pattern is formed.
The thermoelectric element and the N-type thermoelectric element are in a position to be a folded part of a planar circuit pattern in which the thermoelectric element and the N-type thermoelectric element are connected in series via a bonding electrode, An outer peripheral support member made of a material different from the P-type or N-type thermoelectric element is provided, and the outer peripheral support member is joined to the opposed outer peripheral joint electrode. It is a Peltier module as described.

In the Peltier module according to the third aspect of the present invention, in addition to the outer peripheral side of the corner junction electrode, the outer periphery of the opposing outer peripheral junction electrode is located at a position to be a folded portion of a planar circuit pattern. On the side, an outer peripheral support member made of a material different from the P-type or N-type thermoelectric element is provided, and this outer peripheral support member is joined to the opposed outer peripheral junction electrode. Therefore, according to the present invention, since the strength can be increased at the corners of the array pattern where the thermal stress is concentrated and the outer peripheral portion at the position where the flat circuit pattern is turned back, disconnection is caused by the thermal stress repeatedly applied conventionally. Peltier module with improved durability, in which failures such as breaks due to cracks are less likely to occur at the junction between the thermoelectric element and the bonding electrode and at the P-type or N-type thermoelectric element at positions where such defects easily occur. Can be obtained.

A peltier module according to a fourth aspect of the present invention is the peltier module according to any one of the first to third aspects, wherein the outer peripheral support member is formed of metal. According to the present invention, the Young's modulus and the coefficient of linear expansion of the outer peripheral support member can be made substantially equal to those of the P-type and N-type thermoelectric elements. It is possible to make it more difficult for problems such as disconnection due to cracks to occur in P-type or N-type thermoelectric elements.

A peltier module according to a fifth aspect of the present invention is the peltier module according to any one of the first to third aspects, wherein the outer peripheral support member is formed of ceramic. According to the present invention, since the outer peripheral support member is made of ceramic, it is possible to use a low heat conductive member, so that the temperature difference generated between the heat radiation side and the heat absorbing side of the Peltier module is less thermally short-circuited by the outer peripheral support member. A Peltier module with improved durability can be obtained without deteriorating performance.

According to a sixth aspect of the present invention, in the Peltier module according to any one of the first to fifth aspects, the outer peripheral support member has substantially the same shape as the P-type or N-type thermoelectric element. It is a Peltier module as described. In the present invention, since the shape of the outer peripheral support member is substantially the same as the P-type or N-type thermoelectric element, when assembling the Peltier module,
There is an advantage that it can be mounted in the same manner as a thermoelectric element and does not increase the difficulty in mounting.

According to a seventh aspect of the present invention, in the Peltier module, the horizontal cross-sectional area of the outer peripheral supporting member is smaller than any of the P-type and N-type thermoelectric elements. A Peltier module according to any one of claims 1 to 5. In the present invention, since the horizontal cross-sectional area of the outer peripheral supporting member is smaller than the horizontal cross-sectional area of any of the P-type and N-type thermoelectric elements, the temperature difference generated between the heat radiation side and the heat absorption side of the Peltier module is reduced. It is possible to obtain a Peltier module with improved durability without a degree of thermal short-circuiting at the support member, and therefore without deteriorating the performance. Here, the horizontal direction indicates a direction parallel to the substrate surface on which the bonding electrode is provided.

According to an eighth aspect of the present invention, in the Peltier module, the thickness of the electrode at the position where the outer peripheral support member is joined is formed larger than the thickness of the electrode at the position where the P-type thermoelectric element or the N-type thermoelectric element is joined. The Peltier module according to any one of claims 1 to 7, further comprising a corner junction electrode or a peripheral junction electrode. In the present invention, since the thickness of the electrode at the position where the outer peripheral support member is joined is formed larger than the thickness of the electrode at the position where the P-type thermoelectric element or the N-type thermoelectric element is joined, the joining electrode for joining the outer peripheral support member is formed. Since the strength on the outer peripheral side can be increased, it is possible to obtain a Peltier module with further improved durability.

In a peltier module according to a ninth aspect of the present invention, the thickness of the electrode at the position where the outer peripheral supporting member is joined is formed larger than the thickness of the electrode at the position where the P-type thermoelectric element or the N-type thermoelectric element is joined. 9. The Peltier module according to claim 8, wherein the outer peripheral support member joined to the corner junction electrode or the outer periphery junction electrode is formed of an adhesive. According to the present invention, since the outer peripheral supporting member is formed of the adhesive, it is possible to make the outer peripheral supporting member have a low thermal conductivity. Therefore, a temperature difference generated between the heat radiation side and the heat absorbing side of the Peltier module is reduced by the outer peripheral supporting member. It is possible to obtain a Peltier module having an improved durability without the degree of short-circuiting and therefore without deteriorating the performance.

According to a tenth aspect of the present invention, in the Peltier module, the thickness of the electrode at the position where the outer peripheral supporting member is joined is P
The outer peripheral support member joined to the corner junction electrode or the outer periphery junction electrode formed thicker than the thickness of the electrode at the position where the type thermoelectric element or the N-type thermoelectric element is joined is formed of solder. A Peltier module according to claim 8. According to the present invention, when the P-type thermoelectric element and the N-type thermoelectric element and the bonding electrodes provided on the upper and lower substrates are soldered, there is an advantage that the outer peripheral support member and the bonding electrode can be simultaneously bonded.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION

[0018]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a Peltier module according to an embodiment of the present invention.

FIG. 1 is a plan view of an embodiment (first embodiment) of the Peltier module of the present invention, in which an upper substrate 1 'is omitted. In the first embodiment,
As shown in FIG. 1, a P-type thermoelectric element 2 and an N-type thermoelectric element are disposed between upper and lower substrates 1 and 1 ′ made of a pair of ceramics such as alumina or the like (the upper substrate 1 ′ is not shown in FIG. 1). A plurality of elements 3 are arranged in parallel. Bonding electrodes 4 and 4 'are provided on each of the substrates 1 and 1' so as to face each other.
The lower bonding electrode 4 provided on the lower substrate 1 is shown by a solid frame, and the upper bonding electrode 4 'provided on the lower surface of the upper substrate 1' (not shown in FIG. 1) is shown by a broken frame. ing. As shown in FIG. 1, the lower bonding electrode 4 provided on the lower substrate 1
The P-type thermoelectric element 2 is located at a position where the
Or, the N-type thermoelectric element 3 is joined and the lower joining electrode 4
Alternatively, the P-type thermoelectric element 2 and the N-type thermoelectric element 3 are connected in series via the upper bonding electrode 4 '. FIG.
, Reference numeral 6 denotes a lead wire.

Each of the arrangement patterns formed by the lower bonding electrode 4 and the upper bonding electrode 4 'has a rectangular shape in the first embodiment, as shown in FIG. P-type thermoelectric element 2 and N-type thermoelectric element 3
Are connected in series via the lower bonding electrode 4 or the upper bonding electrode 4 ′. Then, on the outer peripheral side of the corner bonding electrodes 4A, 4'A which form the corners of the array pattern formed by the lower bonding electrode 4 and the array pattern formed by the upper bonding electrode 4 'and face each other. , P-type or N-type thermoelectric element, and an outer peripheral support member 5 made of a material different from that of the P-type or N-type thermoelectric element.
A, 4'A. In FIG. 1, the P-type thermoelectric element 2 is P, the N-type thermoelectric element 3 is N,
Is denoted by the symbol Z.

In the arrangement pattern formed by the lower bonding electrode 4 and the upper bonding electrode 4 'shown in FIG.
The positions of the folded portions of the planar circuit pattern in which the P-type thermoelectric element 2 and the N-type thermoelectric element 3 are connected in series via the bonding electrode are all outer peripheral portions of the array pattern.
Then, as shown in FIG. 1, the P-type or N-type thermoelectric element is also provided on the outer peripheral side of the opposed outer peripheral junction electrodes 4B and 4'B at the position to be the folded portion of the planar circuit pattern. An outer peripheral supporting member 5 made of a material different from that of the above is provided and joined to these outer peripheral joining electrodes 4B and 4'B. Note that the corner bonding electrodes 4A, 4'A and the outer circumferential bonding electrodes 4B, 4 '
A junction electrode that is also B is present in the embodiment of FIG.

The outer periphery supporting member 5 is made of a material different from that of the P-type or N-type thermoelectric element, and may be any metal that can support the outer periphery of the substantially square array pattern formed by the bonding electrodes. A peripheral support member 5 formed of a ceramic or the like can be used. Then, the outer peripheral supporting member 5 and the bonding electrode 4,
The method of joining with the outer peripheral support member 5 may be appropriately determined according to the material of the outer peripheral support member 5 and the like, and can be performed using, for example, an adhesive or a solder paste.

As described above, in this embodiment, in addition to the outer peripheral sides of the corner junction electrodes 4A and 4'A, the opposing outer peripheral portions are located at positions where the planar circuit patterns are to be turned back. An outer peripheral support member 5 made of a material different from the P-type or N-type thermoelectric element is also provided on the outer peripheral side of the bonding electrodes 4B and 4'B, and the outer peripheral support member 5 is attached to the facing corner bonding electrode. 4A,
4′A and outer peripheral bonding electrodes 4B, 4′B.
Therefore, according to this embodiment, since the strength can be increased at the corners of the array pattern where the thermal stress is concentrated and the outer peripheral portion at the position where the flat circuit pattern is turned back, the conventional thermal stress caused by repeatedly applied thermal stress Peltier with improved durability, with less trouble such as breakage due to cracks at the junction between the thermoelectric element and the bonding electrode and the P-type or N-type thermoelectric element at locations where problems such as disconnection were likely to occur Modules can be obtained.

Further, if the material of the outer peripheral support member 5 in the first embodiment is a metal, it is possible to select a metal whose Young's modulus and linear expansion coefficient of the outer peripheral support member are substantially equal to those of the P-type or N-type thermoelectric element. Therefore, it is possible to make it more difficult for defects such as disconnection due to cracks to occur in the junction between the thermoelectric element and the joint electrode and the P-type or N-type thermoelectric element in the portion where the outer peripheral support member is provided. Become. As a preferable metal to be selected, a copper material or a copper material subjected to annealing can be exemplified.

If the material of the outer peripheral supporting member 5 in the first embodiment is ceramic, the outer peripheral supporting member can be made of low thermal conductivity by selecting the type of ceramic, so that the heat radiation side of the Peltier module and the heat absorbing side can be used. The degree of thermal short-circuit at the outer peripheral support member due to the temperature difference between the side and the outer peripheral member is reduced, so that it is possible to obtain a Peltier module with improved durability without lowering the performance. Examples of preferable ceramics to be selected include alumina and aluminum nitride.

In the first embodiment, the P-type thermoelectric element and the N-type thermoelectric element have substantially the same shape, and the shape of the outer peripheral support member 5 is also substantially the same as these shapes. Therefore,
At the time of assembling the Peltier module, it can be mounted with the same handling as the thermoelectric element, and the difficulty in mounting does not increase.

The shape of the outer peripheral support member 5 used in the present invention does not necessarily have to be substantially the same as the P-type or N-type thermoelectric element as described above. An H-shape or an I-shape can also be adopted. It is also possible to make the horizontal cross-sectional area of the outer peripheral supporting member 5 smaller than any of the horizontal cross-sectional areas of the P-type and N-type thermoelectric elements. The degree of thermal short-circuit in the outer peripheral support member 5 due to the temperature difference between
Therefore, a Peltier module with improved durability can be obtained without lowering the performance, which is preferable.

Next, a different embodiment (second embodiment) will be described with reference to FIG. FIG. 2 is a side view of a main part (a corner of the Peltier module) of the Peltier module according to the second embodiment. In the second embodiment, the thickness of the bonding electrodes 4 and 4 'at the position where the outer peripheral support member 5 is bonded is formed to be larger than the electrode thickness at the position where the P-type thermoelectric element 2 or the N-type thermoelectric element 3 is bonded. I have. The outer peripheral supporting member 5 shown in FIG. 2 is formed by solder. With such a configuration, the Peltier module of this embodiment has the bonding electrode 4 at the position where the outer peripheral support member 5 is bonded,
Since the strength on the outer peripheral side of 4 'can be increased, it is possible to obtain a Peltier module with further improved durability. Further, since the outer peripheral support member 5 is made of solder, when the P-type thermoelectric element 2 and the N-type thermoelectric element 3 and the bonding electrodes 4 and 4 'provided on the upper and lower substrates 1, 1' are soldered, the outer peripheral support member 5 is simultaneously supported. There is an advantage that the member 5 can be joined to the joining electrodes 4, 4 '. In FIG. 2, the P-type thermoelectric element 2
The bonding between the N-type thermoelectric element 3 and the bonding electrodes provided on the upper and lower substrates 1 and 1 ′ is performed by soldering, although the solder layer is omitted in the figure.

Further, the outer peripheral support member 5 shown in FIG. 2 can be formed by an adhesive. In such a case, the outer peripheral supporting member 5 can be made of a material having low thermal conductivity, so that the temperature difference generated between the heat radiation side and the heat absorbing side of the Peltier module can be thermally short-circuited by the outer peripheral supporting member. Thus, it is possible to obtain a Peltier module having improved durability without reducing the performance.

[0030]

In the Peltier module according to the first aspect of the present invention, a P-type or N-type thermoelectric element is formed on the outer peripheral side of the corner junction electrode which forms the corner of the array pattern formed by the junction electrode and faces the corner. An outer peripheral support member made of a material different from the element is provided, and the outer peripheral support member is joined to the opposed corner joining electrodes. Therefore, according to the invention of claim 1,
Since the strength can be increased at the corners of the array pattern where the thermal stress is concentrated, the junction between the thermoelectric element and the junction electrode at the corner junction electrode where the failure such as disconnection was likely to occur due to the repeated thermal stress conventionally In the case of P-type or N-type thermoelectric elements, problems such as disconnection due to cracks are less likely to occur, and a Peltier module with improved durability can be obtained.

The Peltier module of the invention according to claim 2 has an effect that the Peltier module can be easily manufactured in addition to the effect of the invention of claim 1, since the arrangement pattern is substantially rectangular.

In the Peltier module according to the third aspect of the present invention, in addition to the outer peripheral side of the corner junction electrode, the outer peripheral side of the opposing outer peripheral junction electrode is located at a position where the planar circuit pattern is turned back. Also, an outer peripheral support member made of a material different from the P-type or N-type thermoelectric element is provided, and this outer peripheral support member is joined to the opposed outer peripheral portion joining electrode. Therefore, according to the third aspect of the present invention, since the strength can be increased at the corners of the array pattern where the thermal stress is concentrated and the outer peripheral portion at the position where the flat circuit pattern is turned back, the conventional method is repeatedly applied. Breakage and other problems due to cracks are less likely to occur in the junction between the thermoelectric element and the bonding electrode and in P-type or N-type thermoelectric elements at locations where problems such as disconnection were likely to occur due to the applied thermal stress, and durability was improved. It is possible to obtain the Peltier module that is running.

In the Peltier module according to the fourth aspect of the present invention, since the outer peripheral support member is made of metal, the outer peripheral support member can have a Young's modulus and a linear expansion coefficient substantially equal to those of the P-type and N-type thermoelectric elements. Since it becomes possible, it is possible to make it more difficult for problems such as disconnection due to cracks to occur at the junction between the thermoelectric element and the joint electrode and the P-type or N-type thermoelectric element at the portion where the outer peripheral support member is disposed. Becomes

In the peltier module according to the fifth aspect of the present invention, since the outer peripheral support member is formed of ceramic,
Since the outer peripheral supporting member can be made of a low heat conductive member, the degree of thermal short-circuit by the outer peripheral supporting member of the temperature difference generated between the heat radiation side and the heat absorbing side of the Peltier module is reduced. Therefore, in the Peltier module according to the fifth aspect of the present invention, it is possible to obtain a Peltier module having improved durability without lowering the performance.

In the Peltier module according to the sixth aspect of the present invention, the outer peripheral support member has substantially the same shape as the P-type or N-type thermoelectric element.
It can be mounted in the same way as a thermoelectric element, and does not increase the difficulty in mounting.

In the peltier module according to the seventh aspect of the present invention, the horizontal cross-sectional area of the outer peripheral support member is smaller than that of any of the P-type and N-type thermoelectric elements. The degree to which the temperature difference between the heat absorbing side and the heat absorbing side is thermally short-circuited by the outer peripheral supporting member is reduced. Therefore, with the Peltier module according to the seventh aspect of the invention, it is possible to obtain a Peltier module with improved durability without lowering the performance.

In the Peltier module according to the present invention, the thickness of the electrode at the position where the outer peripheral support member is joined is formed larger than the thickness of the electrode at the position where the P-type thermoelectric element or the N-type thermoelectric element is joined. Therefore, the strength on the outer peripheral side of the joining electrode for joining the outer peripheral supporting member can be increased, so that a Peltier module with further improved durability can be obtained.

According to the ninth aspect of the present invention, since the outer peripheral supporting member is formed of an adhesive, the outer peripheral supporting member can be made of low heat conductivity. And the degree of thermal short-circuiting of the temperature difference caused by the outer peripheral support member is reduced. Therefore, according to the ninth aspect of the present invention, in addition to the effect of the eighth aspect of the present invention, a Peltier module having improved durability can be obtained without deteriorating the performance.

According to the tenth aspect, according to the eighth aspect,
In addition to the effects of the invention described above, when the P-type thermoelectric element and the N-type thermoelectric element are soldered to the bonding electrodes provided on the upper and lower substrates, the same effect can be obtained that the bonding can be performed simultaneously with the bonding electrodes of the outer peripheral support member.

[Brief description of the drawings]

FIG. 1 is a plan view omitting an upper substrate for describing an embodiment of the present invention.

FIG. 2 is a side view of a main part for describing a different embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 1 lower substrate 1 'upper substrate 2 P-type thermoelectric element 3 N-type thermoelectric element 4, 4' bonding electrode 4A, 4'A corner bonding electrode 4B, 4'B outer peripheral bonding electrode 5 outer peripheral supporting member 6 lead wire

Claims (10)

[Claims] A plurality of P-type and N-type thermoelectric elements are juxtaposed between a pair of opposing substrates, and a P-type thermoelectric element and an N-type thermoelectric element are interposed via a bonding electrode provided to face each substrate. In a Peltier module in which thermoelectric elements are connected in series, an arrangement pattern formed by bonding electrodes provided on each of a pair of substrates is an arrangement pattern having a corner on an outer periphery, and forming the corner. An outer peripheral support member made of a material different from the P-type or N-type thermoelectric element is disposed on the outer peripheral side of the opposed corner junction electrode, and the outer peripheral support member is attached to the opposed corner joint electrode. Peltier module characterized by being joined. 2. The Peltier module according to claim 1, wherein the arrangement pattern is substantially rectangular. 3. A folded portion of a planar circuit pattern which forms an outer peripheral portion of the array pattern and connects a P-type thermoelectric element and an N-type thermoelectric element in series via a bonding electrode. In the position, an outer peripheral support member made of a material different from the P-type or N-type thermoelectric element is also arranged on the outer peripheral side of the opposing outer peripheral junction electrode, and this outer peripheral support member 3. The Peltier module according to claim 2, wherein the Peltier module is joined to the outer peripheral joining electrode. 4. The Peltier module according to claim 1, wherein said outer peripheral support member is formed of metal. 5. The Peltier module according to claim 1, wherein said outer peripheral support member is formed of ceramic. 6. The Peltier module according to claim 1, wherein the shape of the outer peripheral support member is substantially the same as that of a P-type or N-type thermoelectric element. 7. The method according to claim 1, wherein a horizontal cross-sectional area of the outer peripheral support member is smaller than any of the P-type and N-type thermoelectric elements. Peltier module according to Crab. 8. A corner junction electrode or an outer peripheral portion where the thickness of the electrode at the position where the outer peripheral support member is joined is formed larger than the thickness of the electrode at the position where the P type thermoelectric element or the N type thermoelectric element is joined. The Peltier module according to any one of claims 1 to 7, further comprising a bonding electrode. 9. A corner junction electrode or an outer peripheral junction electrode in which the thickness of the electrode at the position where the outer peripheral support member is joined is formed larger than the thickness of the electrode at the position where the P type thermoelectric element or the N type thermoelectric element is joined. 9. The Peltier module according to claim 8, wherein the outer peripheral supporting member joined to the Peltier module is formed of an adhesive. 10. A corner junction electrode or an outer peripheral junction electrode in which the thickness of the electrode at the position where the outer peripheral support member is joined is formed larger than the thickness of the electrode at the position where the P type thermoelectric element or the N type thermoelectric element is joined. 9. The Peltier module according to claim 8, wherein the outer peripheral supporting member joined to the Peltier module is formed of solder.