JP4280064B2 - Method for manufacturing thermoelectric conversion module - Google Patents

Method for manufacturing thermoelectric conversion module Download PDF

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JP4280064B2
JP4280064B2 JP2002380091A JP2002380091A JP4280064B2 JP 4280064 B2 JP4280064 B2 JP 4280064B2 JP 2002380091 A JP2002380091 A JP 2002380091A JP 2002380091 A JP2002380091 A JP 2002380091A JP 4280064 B2 JP4280064 B2 JP 4280064B2
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thermoelectric conversion
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substrate
solder
fixing step
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JP2004214306A (en
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康弘 鈴木
潤 贄川
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岡野電線株式会社
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Description

【０００１】
【発明の属する技術分野】
本発明は、例えば光通信用部品、理化学機器、携帯用クーラ、半導体プロセス中でのプロセス温度管理等に用いられて冷却や加熱を行う熱電変換モジュールや、ゼーベック効果を利用して発電を行う熱電変換モジュールの製造方法に関するものである。
【０００２】
【背景技術】
ペルチェモジュール等の熱電変換モジュールが、光通信分野等の様々な分野に用いられている。熱電変換モジュールは、例えば図３（ａ）に示すように、互いに間隔を介して上下に配置された第１の基板６と第２の基板７の間に、複数の熱電変換素子５（５ａ，５ｂ）を立設配置して形成されている。
【０００３】
基板６，７は、電気絶縁性を有する電気絶縁性基板であり、例えばアルミナ（Ａｌ２Ｏ３）等のセラミックにより形成されている。基板６，７には、それぞれ、その片面側（対向面側）に複数の導通用の電極２が互いに間隔を介して配列形成されている。第１の基板６と第２の基板７は、電極２の位置を互いにずらした状態で電極形成面１６，１７を対向させて配置されており、前記熱電変換素子５が対応する電極２を介して直列に接続されている。なお、電極２上には図示されていない半田が形成されて該半田を介して熱電変換素子５が電極２上に固定されている。
【０００４】
熱電変換素子５（５ａ，５ｂ）は、ペルチェ素子として一般的に知られており、Ｐ型半導体により形成されたＰ型の熱電変換素子５ａと、Ｎ型半導体により形成されたＮ型の熱電変換素子５ｂとを有する。Ｐ型の熱電変換素子５ａとＮ型の熱電変換素子５ｂは交互に配置され、電極２を介して直列に接続されてＰＮ素子対が形成されている。
【０００５】
Ｐ型の熱電変換素子５ａとＮ型の熱電変換素子５ｂは、それぞれ、例えばビスマス・テルル等の金属間化合物にアンチモン、セレン等の元素を添加することにより形成されている。従来の一般的なペルチェモジュールにおいて、１つの熱電変換素子５（５ａ，５ｂ）は直径０．６〜３ｍｍ程度、長さ０．５〜３ｍｍ程度の円柱形状または同程度の大きさの角柱形状に形成されている。また、前記基板６，７は、例えば厚さ３ｍｍ程度に形成され、例えば一辺の長さが１０ｍｍ程度の四辺形状に形成されている。
【０００６】
熱電変換モジュールを製造するときは、例えば図３（ｂ）に示すように、基板６，７の片面側にそれぞれ電極２を形成し、この電極２の表面側に半田（図示せず）を形成し、第２の基板７上に形成された電極２上に前記半田を介してＰ型の熱電変換素子５ａとＮ型の熱電変換素子５ｂを交互に配置する。そして、これらのＰ型の熱電変換素子５ａとＮ型の熱電変換素子５ｂ上に第１の基板６を設け、この状態で行われる加熱により半田を融解させて、Ｐ型の熱電変換素子５ａとＮ型の熱電変換素子５ｂを、半田を介して対応する電極２上に固定する。
【０００７】
熱電変換モジュールの製造方法は、上記以外にも様々な方法が提案されている（例えば、特許文献１参照。）。
【０００８】
熱電変換モジュールは、リード線２８から電極２に電流を流すと、Ｐ型の熱電変換素子５ａとＮ型の熱電変換素子５ｂに電流が流れて、熱電変換素子５（５ａ，５ｂ）と電極２との接合部（界面）で冷却・加熱効果が生じる。つまり、前記接合部を流れる電流の方向によって熱電変換素子５（５ａ，５ｂ）の一方の端部が発熱せしめられると共に他方の端部が冷却せしめられるいわゆるペルチェ効果が生じる。
【０００９】
このペルチェ効果によって熱電変換素子５（５ａ，５ｂ）の一方の端部、例えば上端部が発熱せしめられると、この熱が第１の基板６を介して、基板６の上側に設けられた部材に伝えられ、この部材の加熱が行われる。また、その逆に、ペルチェ効果によって熱電変換素子５（５ａ，５ｂ）の例えば上端部が冷却せしめられると、第１の基板６を介し、基板６の上側に設けられた部材の冷却（吸熱）が行われる。
【００１０】
【特許文献１】
特開平８−２２２７７０号公報
【００１１】
【発明が解決しようとする課題】
しかしながら、近年、例えば基板６，７の大きさが２〜３ｍｍ四方の熱電変換モジュール等、小型の熱電変換モジュールが形成されるようになり、この小型の熱電変換モジュールに適用される熱電変換素子５の大きさも小さくなっているため、図３（ｂ）に示したように、Ｐ型の熱電変換素子５ａとＮ型の熱電変換素子５ｂを交互に配置して熱電変換モジュールを形成する作業は非常に大変であった。そのため、小型の熱電変換モジュールを歩留まりよく製造することが難しかった。
【００１２】
本発明は、上記課題を解決するために成されたものであり、その目的は、小型の熱電変換モジュールであっても、容易に歩留まりよく製造することができる熱電変換モジュールの製造方法を提供することにある。
【００１３】
【課題を解決するための手段】
上記目的を達成するために、本発明は次のような構成をもって課題を解決するための手段としている。すなわち、第１の発明は、Ｐ型の熱電変換素子形成用板部材とＮ型の熱電変換素子形成用板部材を交互に両面接着熱収縮シートを介して複数重ね合わせ固定して第１の積層体を形成し、該第１の積層体を熱電変換素子形成用板部材の板面と略直交する方向に切断することによりＰ型とＮ型の熱電変換素子形成用部材が前記両面接着熱収縮シートを介して交互に縞状に配設固定されたＰＮ交互配置板材を複数形成し、一方のＰＮ交互配置板材のＰ型と積層方向に隣り合う他方のＰＮ交互配置板材のＮ型が互い違いに配置されるように複数のＰＮ交互配置板材の上下の重ね位置をずらして両面接着熱収縮シートを介して複数重ね合わせ固定して第２の積層体を形成し、該第２の積層体を前記縞と略直交する方向に切断することによりＰ型とＮ型の熱電変換素子が前記両面接着熱収縮シートを介して互い違いに千鳥格子縞状に配設固定されたＰＮ格子縞状配置板材を形成し、該ＰＮ格子縞状配置板材の表面と裏面のＰ型熱電変換素子とＮ型熱電変換素子との境界領域にマスキングして該マスキング領域を除く領域に金属膜を形成することにより、複数のＰ型とＮ型の熱電変換素子のそれぞれの表面と裏面に同時に又は片面ずつ一括して金属膜を形成した後、該金属膜上に半田を形成する工程と、この半田形成工程の後に行われて、前記ＰＮ格子縞状配置板材の表面を該表面に形成されている半田の加熱溶融によって、予め用意した第１の基板の電極形成面に固定してＰ型とＮ型の熱電変換素子を一括して第１の基板上の対応する電極に半田固定する第１の基板半田固定工程と、ＰＮ格子縞状配置板材の裏面を該裏面に形成されている半田の加熱溶融によって、前記第１の基板と上下に間隔を介して配置される第２の基板の電極形成面に固定してＰ型とＮ型の熱電変換素子を一括して第２の基板上の対応する電極に半田固定する第２の基板半田固定工程と、前記半田の加熱溶融時に熱収縮することにより前記熱電変換素子から剥がれた状態でＰ型とＮ型の熱電変換素子の境界領域に設けられている両面接着熱収縮シートを除去するシート除去工程とを有する構成をもって課題を解決する手段としている。
【００１４】
また、第２の発明は、上記第１の発明の構成に加え、前記第１の基板半田固定工程と第２の基板半田固定工程は、そのいずれか一方の工程を先に行うという如く、時間をずらして行い、第１の基板半田固定工程と第２の基板半田固定工程のいずれか一方の工程の後にシート除去工程を行い、然る後に前記第１の基板半田固定工程と第２の基板半田固定工程の他方を行う構成をもって課題を解決する手段としている。
【００１５】
さらに、第３の発明は、上記第１の発明の構成に加え、前記第１の基板半田固定工程と第２の基板半田固定工程を同時に行い、然る後にシート除去工程を行う構成をもって課題を解決する手段としている。
【００１７】
【発明の実施の形態】
以下、本発明の実施の形態を、図面を参照して説明する。なお、本実施形態例の説明において、従来例と同一名称部分には同一符号を付し、その重複説明は省略又は簡略化する。
【００１８】
図１には、本発明に係る熱電変換モジュールの製造方法の第１実施形態例が模式的に示されている。本実施形態例では、まず、図１（ａ）に示すように、熱電変換素子形成用板部材である板状のＰ型とＮ型の熱電変換素子形成用部材１（１ａ，１ｂ）をそれぞれ用意する。そして、Ｐ型の熱電変換素子形成用板部材１（１ａ）とＮ型の熱電変換素子形成用板部材１（１ｂ）を交互に両面接着熱収縮シート３を介して複数重ね合わせ固定し、図１（ｂ）に示す第１の積層体１１を形成する。なお、Ｐ型およびＮ型の熱電変換素子形成用部材１（１ａ，１ｂ）は、周知の如く、例えばインゴットをスライス加工して板状に形成される。
【００１９】
次に、図１（ｂ）に示すように、第１の積層体１１を熱電変換素子形成用部材１ａ，１ｂの板面と略直交する方向に、例えば切断線２０に沿って切断する。この切断により、図１（ｃ）に示すように、Ｐ型の熱電変換素子形成用部材１ａとＮ型の熱電変換素子形成用部材１ｂが前記両面接着熱収縮シート３を介して交互に縞状に配設固定されたＰＮ交互配置板材１３を複数形成する。なお、図１（ｃ）には、ＰＮ交互配置板材１３を２枚のみ示している。
【００２０】
次に、図１（ｄ）に示すように、一方のＰＮ交互配置板材１３のＰ型と積層方向に隣り合う他方のＰＮ交互配置板材１３のＮ型が互い違いに配置されるように、複数のＰＮ交互配置板材１３の上下の重ね位置をずらして両面接着熱収縮シート３を介して複数重ね合わせ固定して、図１（ｅ）に示すような第２の積層体１２を形成する。
【００２１】
そして、この第２の積層体１２を、例えば切断線２０に沿って、前記縞（Ｐ型の熱電変換素子形成用部材１ａとＮ型の熱電変換素子形成用部材１ｂの配列縞）と略直交する方向に切断することにより、図１（ｆ）に示すように、Ｐ型とＮ型の熱電変換素子５（５ａ，５ｂ）が前記両面接着熱収縮シート３を介して互い違いに千鳥格子縞状に配設固定されたＰＮ格子縞状配置板材１４を形成する。なお、図１は模式図であり、図１（ｅ）〜図１（ｋ）において、必ずしも熱電変換素子５（５ａ，５ｂ）の数や配置形態は一致していない。
【００２２】
次に、図１（ｇ）に示すように、ＰＮ格子縞状配置板材１４の表面と裏面のＰ型熱電変換素子５（５ａ）とＮ型熱電変換素子５（５ｂ）との境界領域にマスキングして（マスク８を形成して）、該マスキング領域を除く領域に金属膜９を形成することにより、複数のＰ型とＮ型の熱電変換素子５（５ａ，５ｂ）のそれぞれの表面と裏面に、同時に又は片面ずつ一括して金属膜９を形成する。なお、図１（ｇ）は、ＰＮ格子縞状配置板材１４の端部を一部除いて形成している。
【００２３】
次に、図１（ｈ）に示すように、上記金属膜９上に半田（ここでは半田バンプ）１０を例えば印刷により形成する。半田バンプは、ＰＮ格子縞状配置板材１４の表裏両面に形成され、Ｐ型とＮ型の熱電変換素子５（５ａ，５ｂ）のそれぞれの表面と裏面に、例えば１つずつ形成される。
【００２４】
この半田形成工程の後、図１（ｉ）に示すように、予め用意した第１の基板６と、該第１の基板６と上下に間隔を介して配置される第２の基板７によりＰＮ格子縞状配置板材１４を上下両側から挟み、図１（ｊ）に示すように、例えばセラミックヒーター２１等の加熱手段を用いて第１と第２の基板６，７を加熱し、この基板６，７に、ＰＮ格子縞状配置板材１４の表裏両面に形成されている半田１０を介してＰＮ格子縞状配置板材１４を固定する。
【００２５】
つまり、ＰＮ格子縞状配置板材１４の表面を該表面に形成されている半田１０の加熱溶融によって第１の基板６の電極形成面１６に固定して、Ｐ型とＮ型の熱電変換素子５（５ａ，５ｂ）を一括して第１の基板６上の対応する電極２（図１には図示せず）に半田固定する第１の基板半田固定工程と、ＰＮ格子縞状配置板材１４の裏面を該裏面に形成されている半田１０の加熱溶融によって第２の基板７の電極形成面１７に固定して、Ｐ型とＮ型の熱電変換素子５（５ａ，５ｂ）を一括して第２の基板上の対応する電極に半田固定する第２の基板半田固定工程を同時に行う。
【００２６】
なお、これらの半田固定工程は、望ましくは水素還元性の雰囲気中にて半田１０を加熱溶融することが、酸化物の影響を排除し、半田接合を行えるので都合がよい。もちろん、フラックスを利用し、大気中でのホットプレート等を用いて加熱溶融する方式も可能である。
【００２７】
次に、前記半田１０の加熱溶融時に接着力を無くし、かつ、熱収縮することにより、前記熱電変換素子５（５ａ，５ｂ）から剥がれた状態でＰ型とＮ型の熱電変換素子５（５ａ，５ｂ）の境界領域に設けられている両面接着熱収縮シート３を、例えば吸引等により除去し、図１（ｈ）に示すような熱電変換モジュールを形成する。また、熱電変換モジュールには、図３に示したリード線２８を適宜の位置に設ける。
【００２８】
本実施形態例は以上のようにして熱電変換モジュールを製造するものであり、複数のＰ型の熱電変換素子５ａと複数のＮ型の熱電変換素子５ｂを互い違いに千鳥格子縞状に配設固定されたＰＮ格子縞状配置板材１４を容易に形成し、Ｐ型とＮ型の熱電変換素子５（５ａ，５ｂ）を対応する第１、第２の基板６，７上に一括して配列固定できる。
【００２９】
そして、本実施形態例では、Ｐ型とＮ型の熱電変換素子５（５ａ，５ｂ）の基板６，７への固定後に、Ｐ型とＮ型の熱電変換素子５（５ａ，５ｂ）の境界領域に設けられた両面接着熱収縮シート３を容易に除去できるので、歩留まりよく熱電変換モジュールを製造することができる。
【００３０】
次に、本発明に係る熱電変換モジュールの製造方法の第２実施形態例について説明する。第２実施形態例は上記第１実施形態例とほぼ同様の製造方法を適用しており、第２実施形態例が上記第１実施形態例と異なる特徴的なことは、半田形成工程後の工程を以下のようにしたことである。つまり、第２実施形態例では、第１の基板半田固定工程と第２の基板半田固定工程は、そのいずれか一方の工程を先に行うという如く、時間をずらして行い、第１の基板半田固定工程の後にシート除去工程を行い、然る後に第２の基板半田固定工程を行う。
【００３１】
図２には、第１の基板半田固定工程によって、ＰＮ格子縞状配置板材１４のＰ型とＮ型の熱電変換素子５（５ａ，５ｂ）をそれぞれ一括して基板６の電極形成面１６に固定した状態を示している。このように、第１の基板半田固定工程の後にシート除去工程を行う場合、ＰＮ格子縞状配置板材１４の裏面側が露出された状態で両面接着熱収縮シート３の除去を行う。
【００３２】
第２実施形態例も上記第１実施形態例と同様の効果を奏することができ、また、第２実施形態例は、上記のように、ＰＮ格子縞状配置板材１４の裏面側が露出された状態でシート除去を行うことができるので、例えばブラッシング等によってシート除去を行うことができ、シート除去作業をより一層容易に行うことができる。
【００３３】
なお、本発明は上記各実施形態例に限定されることはなく、様々な実施の態様を採り得る。例えば、上記第２実施形態例では、第１の基板半田固定工程を第２の基板半田固定工程よりも先に行って、第１の基板半田固定工程後にシート除去工程を行い、然る後に第２の基板半田固定工程を行ったが、その逆に、第２の基板半田固定工程を先に行い、その後にシート除去工程を行い、然る後に第１の基板半田固定工程を行ってもよい。
【００３６】
また、上記第１実施形態例では、図１（ｊ）に示したように、セラミックヒーター２１を用いて、第１、第２の基板６，７を加熱したが、第１の基板半田固定工程と第２の基板半田固定工程を同時に行う場合は、第１、第２の基板７の間にＰＮ格子縞状配置板材１４を挟んで仮組み固定し、その状態で、リフロー炉中を通してリフロー炉で半田１０を溶解させ、その後、凝固させてもよい。
【００３７】
さらに、ＰＮ格子縞状配置板材１４の表面と裏面のいずれか一方に半田１０を形成した後、この半田１０によって、ＰＮ格子縞状配置板材１４を第１と第２の基板６，７の一方に固定し、その後、ＰＮ格子縞状配置板材１４の表面と裏面の他方に半田１０を形成して、この半田１０によって、ＰＮ格子縞状配置板材１４を第１と第２の基板６，７の他方に固定してもよい。
【００３８】
さらに、上記説明は熱電変換モジュールとしてのペルチェモジュールの製造方法について例を挙げて説明したが、本発明の熱電変換モジュールの製造方法は、ゼーベック効果を利用して発電を行う熱電変換モジュールの製造方法にも適用できる。
【００３９】
【発明の効果】
本発明によれば、複数のＰ型の熱電変換素子と複数のＮ型の熱電変換素子を互い違いに千鳥格子縞状に配設固定されたＰＮ格子縞状配置板材を容易に形成し、Ｐ型とＮ型の熱電変換素子を対応する第１、第２の基板上に一括して配列固定でき、例えばＰ型とＮ型の熱電変換素子の境界領域に設けられた両面接着熱収縮シートを容易に除去して歩留まりよく熱電変換モジュールを製造することができる。
【００４０】
また、本発明において、第１の基板半田固定工程と第２の基板半田固定工程のいずれか一方の工程の後にシート除去工程を行い、然る後に前記第１の基板半田固定工程と第２の基板半田固定工程の他方を行う構成においては、シート除去工程をより一層容易に行うことができる。
【００４１】
さらに、本発明において、第１の基板半田固定工程と第２の基板半田固定工程を同時に行い、然る後にシート除去工程を行う構成によれば、Ｐ型とＮ型の熱電変換素子を対応する基板に半田固定する工程を一度に行うことができ、熱電変換モジュールの製造工程を簡略化できる。
【図面の簡単な説明】
【図１】本発明に係る熱電変換モジュールの製造方法の第１実施形態例を模式的に示す説明図である。
【図２】本発明に係る熱電変換モジュールの製造方法の第２実施形態例における第１基板半田固定工程後の状態を示す説明図である。
【図３】従来の熱電変換モジュールとその製造方法例を示す説明図である。
【符号の説明】
１，１ａ，１ｂ 熱電変換素子形成用部材
２ 電極
３ 両面接着熱収縮シート
５，５ａ，５ｂ 熱電変換素子
６ 第１の基板
７ 第２の基板
９ 金属膜
１１ 第１の積層体
１２ 第２の積層体
１３ ＰＮ交互配置板材
１４ ＰＮ格子縞状配置板材[0001]
BACKGROUND OF THE INVENTION
The present invention includes, for example, optical communication parts, physics and chemistry equipment, portable coolers, thermoelectric conversion modules that are used for process temperature management in semiconductor processes and the like, and thermoelectric modules that generate electricity using the Seebeck effect. The present invention relates to a method for manufacturing a conversion module.
[0002]
[Background]
Thermoelectric conversion modules such as Peltier modules are used in various fields such as the optical communication field. For example, as shown in FIG. 3A, the thermoelectric conversion module includes a plurality of thermoelectric conversion elements 5 (5a, 5a, 5b) between a first substrate 6 and a second substrate 7 that are arranged vertically with a space therebetween. 5b) is arranged upright.
[0003]
The substrates 6 and 7 are electrically insulating substrates having electrical insulating properties, and are made of ceramic such as alumina (Al 2 O 3 ), for example. On the substrates 6 and 7, a plurality of conductive electrodes 2 are arranged on one side (opposite side) of the substrates 6 and 7 so as to be spaced from each other. The first substrate 6 and the second substrate 7 are arranged with the electrode formation surfaces 16 and 17 facing each other with the position of the electrode 2 being shifted from each other, and the thermoelectric conversion element 5 passes through the corresponding electrode 2. Connected in series. A solder (not shown) is formed on the electrode 2, and the thermoelectric conversion element 5 is fixed on the electrode 2 through the solder.
[0004]
The thermoelectric conversion element 5 (5a, 5b) is generally known as a Peltier element, and a P-type thermoelectric conversion element 5a formed of a P-type semiconductor and an N-type thermoelectric conversion formed of an N-type semiconductor. And an element 5b. P-type thermoelectric conversion elements 5a and N-type thermoelectric conversion elements 5b are alternately arranged and connected in series via the electrode 2 to form a PN element pair.
[0005]
The P-type thermoelectric conversion element 5a and the N-type thermoelectric conversion element 5b are each formed by adding an element such as antimony or selenium to an intermetallic compound such as bismuth or tellurium. In a conventional general Peltier module, one thermoelectric conversion element 5 (5a, 5b) has a cylindrical shape with a diameter of about 0.6 to 3 mm and a length of about 0.5 to 3 mm, or a prismatic shape with the same size. Is formed. The substrates 6 and 7 are formed to have a thickness of about 3 mm, for example, and are formed in a quadrilateral shape having a side length of about 10 mm, for example.
[0006]
When producing the thermoelectric conversion module, for example, as shown in FIG. 3 (b), respectively to form the electrode 2 on one side of the substrate 6, forming a solder (not shown) on the surface side of the electrode 2 Then, P-type thermoelectric conversion elements 5a and N-type thermoelectric conversion elements 5b are alternately arranged on the electrodes 2 formed on the second substrate 7 via the solder. Then, the first substrate 6 is provided on the P-type thermoelectric conversion element 5a and the N-type thermoelectric conversion element 5b, and the solder is melted by heating performed in this state, so that the P-type thermoelectric conversion element 5a and The N-type thermoelectric conversion element 5b is fixed on the corresponding electrode 2 via solder.
[0007]
Various methods other than the above have been proposed as a method for manufacturing a thermoelectric conversion module (see, for example, Patent Document 1).
[0008]
In the thermoelectric conversion module, when a current flows from the lead wire 28 to the electrode 2, a current flows through the P-type thermoelectric conversion element 5 a and the N-type thermoelectric conversion element 5 b, and the thermoelectric conversion elements 5 (5 a, 5 b) and the electrode 2. Cooling / heating effect occurs at the joint (interface). That is, a so-called Peltier effect is generated in which one end portion of the thermoelectric conversion element 5 (5a, 5b) is heated while the other end portion is cooled depending on the direction of the current flowing through the junction.
[0009]
When one end, for example, the upper end of the thermoelectric conversion element 5 (5a, 5b) is caused to generate heat by the Peltier effect, this heat is applied to the member provided on the upper side of the substrate 6 via the first substrate 6. It is transmitted and heating of this member is performed. On the contrary, when the upper end portion of the thermoelectric conversion element 5 (5a, 5b) is cooled by the Peltier effect, the member provided on the upper side of the substrate 6 is cooled (heat absorption) via the first substrate 6. Is done.
[0010]
[Patent Document 1]
JP-A-8-222770
[Problems to be solved by the invention]
However, in recent years, for example, small thermoelectric conversion modules such as thermoelectric conversion modules whose substrates 6 and 7 have a size of 2 to 3 mm square have been formed, and the thermoelectric conversion element 5 applied to this small thermoelectric conversion module. As shown in FIG. 3B, it is very difficult to form a thermoelectric conversion module by alternately arranging P-type thermoelectric conversion elements 5a and N-type thermoelectric conversion elements 5b, as shown in FIG. It was hard. Therefore, it has been difficult to manufacture a small thermoelectric conversion module with a high yield.
[0012]
The present invention has been made to solve the above problems, and an object of the present invention is to provide a method of manufacturing a thermoelectric conversion module that can be easily manufactured with high yield even if it is a small thermoelectric conversion module. There is.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, the present invention has the following configuration as means for solving the problems. That is, in the first invention, a plurality of P-type thermoelectric conversion element forming plate members and N-type thermoelectric conversion element forming plate members are alternately stacked and fixed via a double-sided adhesive heat-shrink sheet. The P-type and N-type thermoelectric conversion element forming members are bonded and thermally contracted by cutting the first laminate in a direction substantially perpendicular to the plate surface of the thermoelectric conversion element forming plate member. A plurality of PN alternately arranged plate members arranged alternately and fixed in a striped manner via sheets are formed, and the P type of one PN alternately arranged plate material and the N type of the other PN alternately arranged plate material adjacent to each other in the stacking direction are staggered. The upper and lower overlapping positions of the plurality of PN alternately arranged plate materials are shifted so as to be arranged, and a plurality of overlapping and fixing is performed via the double-sided adhesive heat-shrinkable sheet to form a second laminate, and the second laminate is P-type and N-type by cutting in a direction substantially perpendicular to the stripe Forming PN checkered arrangement plate materials in which electric conversion elements are alternately arranged and fixed in a staggered pattern via the double-sided adhesive heat-shrink sheet, and P-type thermoelectric conversion elements on the front and back surfaces of the PN checkered arrangement plate material, By masking the boundary region with the N-type thermoelectric conversion element and forming a metal film in a region excluding the masking region, the surface and the back surface of each of the plurality of P-type and N-type thermoelectric conversion elements can be formed simultaneously or on one side. After forming the metal film in a lump, a step of forming solder on the metal film, and after the solder formation step, the surface of the PN grid stripe arrangement plate material is formed on the surface. First substrate solder for fixing P-type and N-type thermoelectric conversion elements collectively to corresponding electrodes on the first substrate by fixing to the electrode formation surface of the first substrate prepared in advance by heating and melting. Fixing process and PN grid pattern The rear surface of the placement plate is fixed to the electrode formation surface of the second substrate that is disposed above and below the first substrate by heating and melting the solder formed on the rear surface. In a state where the thermoelectric conversion elements are peeled off from the thermoelectric conversion elements by heat shrinking when the solder is heated and melted, and a second board solder fixing process of soldering the thermoelectric conversion elements collectively to corresponding electrodes on the second substrate. A structure having a sheet removing step for removing the double-sided adhesive heat-shrinkable sheet provided in the boundary region between the P-type and N-type thermoelectric conversion elements is used as a means for solving the problem.
[0014]
Further, in the second invention, in addition to the configuration of the first invention, the first substrate solder fixing step and the second substrate solder fixing step are performed in such a manner that either one of the steps is performed first. And the sheet removing step is performed after one of the first substrate solder fixing step and the second substrate solder fixing step, and then the first substrate solder fixing step and the second substrate are performed. A configuration for performing the other side of the solder fixing step is a means for solving the problem.
[0015]
Further, the third invention has a problem in that in addition to the configuration of the first invention, the first substrate solder fixing step and the second substrate solder fixing step are simultaneously performed, and thereafter the sheet removing step is performed. As a means to solve.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the description of the present embodiment, the same reference numerals are assigned to the same names as those in the conventional example, and the duplicate description is omitted or simplified.
[0018]
FIG. 1 schematically shows a first embodiment of a method for manufacturing a thermoelectric conversion module according to the present invention. In this embodiment, first, as shown in FIG. 1A, plate-like P-type and N-type thermoelectric conversion element forming members 1 (1a, 1b), which are thermoelectric conversion element forming plate members, are respectively provided. prepare. Then, a plurality of P-type thermoelectric conversion element-forming plate members 1 (1a) and N-type thermoelectric conversion element-forming plate members 1 (1b) are alternately stacked and fixed via double-sided adhesive heat-shrinkable sheets 3, The 1st laminated body 11 shown to 1 (b) is formed. Note that the P-type and N-type thermoelectric conversion element forming members 1 (1a, 1b) are formed in a plate shape by, for example, slicing an ingot.
[0019]
Next, as shown in FIG. 1B, the first laminate 11 is cut in a direction substantially orthogonal to the plate surfaces of the thermoelectric conversion element forming members 1a and 1b, for example, along a cutting line 20. By this cutting, as shown in FIG. 1 (c), the P-type thermoelectric conversion element forming member 1 a and the N-type thermoelectric conversion element forming member 1 b are alternately striped through the double-sided adhesive heat-shrinkable sheet 3. A plurality of PN alternately arranged plate members 13 arranged and fixed to each other are formed. In FIG. 1C, only two PN alternately arranged plate members 13 are shown.
[0020]
Next, as shown in FIG. 1 (d), a plurality of P-types of one PN alternately arranged plate member 13 and N-types of the other PN alternately arranged plate member 13 adjacent in the stacking direction are alternately arranged. A plurality of second stacked bodies 12 as shown in FIG. 1 (e) are formed by shifting the upper and lower overlapping positions of the PN alternately arranged plate materials 13 and overlapping and fixing them via the double-sided adhesive heat-shrinkable sheet 3.
[0021]
And this 2nd laminated body 12 is substantially orthogonal to the said stripe | stripes (array stripe of the P-type thermoelectric conversion element formation member 1a and the N-type thermoelectric conversion element formation member 1b) along the cutting line 20, for example. By cutting in such a direction, the P-type and N-type thermoelectric conversion elements 5 (5a, 5b) are staggered in a staggered pattern via the double-sided adhesive heat-shrinkable sheet 3, as shown in FIG. A PN grid-like arrangement plate material 14 which is arranged and fixed is formed. FIG. 1 is a schematic diagram, and the number and arrangement of the thermoelectric conversion elements 5 (5a, 5b) do not necessarily match in FIGS. 1 (e) to 1 (k).
[0022]
Next, as shown in FIG. 1 (g), masking is performed on the boundary region between the P-type thermoelectric conversion element 5 (5 a) and the N-type thermoelectric conversion element 5 (5 b) on the front surface and the back surface of the PN grid stripe arrangement plate material 14. (By forming a mask 8), a metal film 9 is formed in a region excluding the masking region, thereby forming a plurality of P-type and N-type thermoelectric conversion elements 5 (5a, 5b) on the front and back surfaces. The metal film 9 is formed simultaneously or simultaneously on one side. Note that FIG. 1G is formed by removing a part of the end portion of the PN grid stripe arrangement plate material 14.
[0023]
Next, as shown in FIG. 1H, solder (here, solder bumps) 10 is formed on the metal film 9 by, for example, printing. The solder bumps are formed on both the front and back surfaces of the PN grid stripe arrangement plate material 14, and are formed, for example, one on each of the front and back surfaces of the P-type and N-type thermoelectric conversion elements 5 (5a, 5b).
[0024]
After this solder formation step, as shown in FIG. 1 (i), a first substrate 6 prepared in advance and a second substrate 7 disposed above and below the first substrate 6 with a space therebetween are used for PN. As shown in FIG. 1 (j), the first and second substrates 6 and 7 are heated by using a heating means such as a ceramic heater 21 as shown in FIG. 7, the PN checkered arrangement plate 14 is fixed via the solder 10 formed on both front and back surfaces of the PN checkered arrangement plate 14.
[0025]
That is, the surface of the PN grid-arranged plate member 14 is fixed to the electrode forming surface 16 of the first substrate 6 by heating and melting the solder 10 formed on the surface, and the P-type and N-type thermoelectric conversion elements 5 ( 5a, 5b) are collectively soldered to the corresponding electrodes 2 (not shown in FIG. 1) on the first substrate 6, and the back surface of the PN grid stripe arrangement plate material 14 is attached. The solder 10 formed on the back surface is fixed to the electrode forming surface 17 of the second substrate 7 by heating and melting, and the P-type and N-type thermoelectric conversion elements 5 (5a, 5b) are integrated into the second. A second substrate solder fixing process is performed simultaneously for solder fixing to corresponding electrodes on the substrate.
[0026]
In these solder fixing steps, it is preferable to heat and melt the solder 10 in a hydrogen reducing atmosphere because the influence of the oxide can be eliminated and solder bonding can be performed. Of course, it is possible to use a method of heating and melting using a hot plate or the like in the air using a flux.
[0027]
Next, the adhesive force is lost when the solder 10 is heated and melted, and the solder 10 is thermally contracted, so that the P-type and N-type thermoelectric conversion elements 5 (5a) are peeled off from the thermoelectric conversion elements 5 (5a, 5b). , 5b), the double-sided adhesive heat-shrinkable sheet 3 provided in the boundary region is removed by, for example, suction to form a thermoelectric conversion module as shown in FIG. Further, the thermoelectric conversion module is provided with the lead wires 28 shown in FIG. 3 at appropriate positions.
[0028]
In this embodiment, a thermoelectric conversion module is manufactured as described above, and a plurality of P-type thermoelectric conversion elements 5a and a plurality of N-type thermoelectric conversion elements 5b are alternately arranged and fixed in a staggered pattern. In addition, the PN latticed arrangement plate material 14 can be easily formed, and the P-type and N-type thermoelectric conversion elements 5 (5a, 5b) can be collectively arranged and fixed on the corresponding first and second substrates 6 and 7.
[0029]
In this embodiment, after the P-type and N-type thermoelectric conversion elements 5 (5a, 5b) are fixed to the substrates 6 and 7, the boundary between the P-type and N-type thermoelectric conversion elements 5 (5a, 5b). Since the double-sided adhesive heat-shrinkable sheet 3 provided in the region can be easily removed, a thermoelectric conversion module can be manufactured with a high yield.
[0030]
Next, a second embodiment of the method for manufacturing a thermoelectric conversion module according to the present invention will be described. The second embodiment applies a manufacturing method substantially similar to that of the first embodiment, and the second embodiment is different from the first embodiment in that the process after the solder formation process Is as follows. In other words, in the second embodiment, the first substrate solder fixing step and the second substrate solder fixing step are performed at different times such that one of the steps is performed first, and the first substrate solder fixing step is performed. A sheet removing process is performed after the fixing process, and then a second substrate solder fixing process is performed.
[0031]
In FIG. 2, the P-type and N-type thermoelectric conversion elements 5 (5 a, 5 b) of the PN grid stripe arrangement plate material 14 are collectively fixed to the electrode forming surface 16 of the substrate 6 by the first substrate solder fixing step. Shows the state. Thus, when performing a sheet | seat removal process after a 1st board | substrate solder fixing process, the double-sided adhesive heat-shrink sheet 3 is removed in the state in which the back surface side of the PN grid stripe arrangement | positioning board | plate material 14 was exposed.
[0032]
The second embodiment can also achieve the same effects as the first embodiment, and in the second embodiment, as described above, the back side of the PN checkered arrangement plate material 14 is exposed. Since the sheet can be removed, the sheet can be removed by, for example, brushing, and the sheet removing operation can be performed more easily.
[0033]
The present invention is not limited to the above-described embodiments, and can take various forms. For example, in the second embodiment, the first substrate solder fixing step is performed before the second substrate solder fixing step, the sheet removing step is performed after the first substrate solder fixing step, and then the first substrate solder fixing step is performed. Although the second substrate solder fixing step is performed, the second substrate solder fixing step may be performed first, followed by the sheet removing step, and then the first substrate solder fixing step. .
[0036]
In the first embodiment, the first and second substrates 6 and 7 are heated using the ceramic heater 21 as shown in FIG. 1 (j). And the second substrate solder fixing step, the PN lattice stripe arrangement plate material 14 is sandwiched and fixed between the first and second substrates 7, and in that state, the reflow oven is passed through the reflow oven. The solder 10 may be dissolved and then solidified.
[0037]
Furthermore, after forming the solder 10 on either the front surface or the back surface of the PN checkered arrangement plate material 14, the solder 10 fixes the PN checkered arrangement plate material 14 to one of the first and second substrates 6 and 7. Thereafter, the solder 10 is formed on the other of the front and back surfaces of the PN checkered arrangement plate material 14, and the solder 10 fixes the PN checkered arrangement plate material 14 to the other of the first and second substrates 6 and 7. May be.
[0038]
Furthermore, although the above description has been described with reference to an example of a method for manufacturing a Peltier module as a thermoelectric conversion module, the method for manufacturing a thermoelectric conversion module of the present invention is a method for manufacturing a thermoelectric conversion module that generates power using the Seebeck effect. It can also be applied to.
[0039]
【The invention's effect】
According to the present invention, the P-type and N-type thermoelectric conversion elements and the plurality of N-type thermoelectric conversion elements are alternately formed in a staggered pattern and fixed in a staggered pattern, and the P-type and N-type plates are easily formed. Type thermoelectric conversion elements can be arranged and fixed collectively on the corresponding first and second substrates, for example, the double-sided adhesive heat-shrink sheet provided in the boundary region between P-type and N-type thermoelectric conversion elements can be easily removed Thus, the thermoelectric conversion module can be manufactured with a high yield.
[0040]
In the present invention, the sheet removing step is performed after one of the first substrate solder fixing step and the second substrate solder fixing step, and then the first substrate solder fixing step and the second substrate solder fixing step. In the configuration in which the other of the board solder fixing process is performed, the sheet removing process can be performed more easily.
[0041]
Furthermore, in the present invention, according to the configuration in which the first substrate solder fixing step and the second substrate solder fixing step are performed simultaneously, and then the sheet removing step is performed, the P-type and N-type thermoelectric conversion elements are supported. The process of solder fixing to the substrate can be performed at a time, and the manufacturing process of the thermoelectric conversion module can be simplified.
[Brief description of the drawings]
FIG. 1 is an explanatory view schematically showing a first embodiment of a method for manufacturing a thermoelectric conversion module according to the present invention.
FIG. 2 is an explanatory view showing a state after a first substrate solder fixing step in a second embodiment of the method for manufacturing a thermoelectric conversion module according to the present invention.
FIG. 3 is an explanatory view showing a conventional thermoelectric conversion module and an example of a manufacturing method thereof.
[Explanation of symbols]
1, 1a, 1b Thermoelectric conversion element forming member 2 Electrode 3 Double-sided adhesive heat-shrinkable sheets 5, 5a, 5b Thermoelectric conversion element 6 First substrate 7 Second substrate 9 Metal film 11 First laminate 12 Second Laminate 13 PN alternately arranged plate 14 PN lattice stripe arranged plate

Claims (3)

Ｐ型の熱電変換素子形成用板部材とＮ型の熱電変換素子形成用板部材を交互に両面接着熱収縮シートを介して複数重ね合わせ固定して第１の積層体を形成し、該第１の積層体を熱電変換素子形成用板部材の板面と略直交する方向に切断することによりＰ型とＮ型の熱電変換素子形成用部材が前記両面接着熱収縮シートを介して交互に縞状に配設固定されたＰＮ交互配置板材を複数形成し、一方のＰＮ交互配置板材のＰ型と積層方向に隣り合う他方のＰＮ交互配置板材のＮ型が互い違いに配置されるように複数のＰＮ交互配置板材の上下の重ね位置をずらして両面接着熱収縮シートを介して複数重ね合わせ固定して第２の積層体を形成し、該第２の積層体を前記縞と略直交する方向に切断することによりＰ型とＮ型の熱電変換素子が前記両面接着熱収縮シートを介して互い違いに千鳥格子縞状に配設固定されたＰＮ格子縞状配置板材を形成し、該ＰＮ格子縞状配置板材の表面と裏面のＰ型熱電変換素子とＮ型熱電変換素子との境界領域にマスキングして該マスキング領域を除く領域に金属膜を形成することにより、複数のＰ型とＮ型の熱電変換素子のそれぞれの表面と裏面に同時に又は片面ずつ一括して金属膜を形成した後、該金属膜上に半田を形成する工程と、この半田形成工程の後に行われて、前記ＰＮ格子縞状配置板材の表面を該表面に形成されている半田の加熱溶融によって、予め用意した第１の基板の電極形成面に固定してＰ型とＮ型の熱電変換素子を一括して第１の基板上の対応する電極に半田固定する第１の基板半田固定工程と、ＰＮ格子縞状配置板材の裏面を該裏面に形成されている半田の加熱溶融によって、前記第１の基板と上下に間隔を介して配置される第２の基板の電極形成面に固定してＰ型とＮ型の熱電変換素子を一括して第２の基板上の対応する電極に半田固定する第２の基板半田固定工程と、前記半田の加熱溶融時に熱収縮することにより前記熱電変換素子から剥がれた状態でＰ型とＮ型の熱電変換素子の境界領域に設けられている両面接着熱収縮シートを除去するシート除去工程とを有することを特徴とする熱電変換モジュールの製造方法。  A plurality of P-type thermoelectric conversion element forming plate members and N-type thermoelectric conversion element forming plate members are alternately stacked and fixed via a double-sided adhesive heat-shrinkable sheet to form a first laminate. Is cut in a direction substantially perpendicular to the plate surface of the thermoelectric conversion element forming plate member, whereby the P-type and N-type thermoelectric conversion element forming members are alternately striped through the double-sided adhesive heat-shrinkable sheet. A plurality of PN interleaved plate members arranged and fixed to each other are formed, and a plurality of PN interleaved plate materials are arranged alternately with a P type of one PN interleaved plate material and an N type of the other PN interleaved plate material adjacent in the stacking direction. The upper and lower overlapping positions of the alternately arranged plate materials are shifted and a plurality of overlapping and fixing are performed via a double-sided adhesive heat-shrink sheet to form a second laminated body, and the second laminated body is cut in a direction substantially perpendicular to the stripes P-type and N-type thermoelectric conversion elements Forming PN checkered arrangement plate materials alternately arranged in a zigzag checkered pattern via heat-shrink sheets, and forming P-type and N-type thermoelectric conversion elements on the front and back surfaces of the PN checkered arrangement plate material By forming the metal film in the boundary area and forming the metal film in the area excluding the masking area, the metal film is formed on the front and back surfaces of the plurality of P-type and N-type thermoelectric conversion elements simultaneously or one side at a time. After that, a step of forming solder on the metal film, and a surface of the PN grid stripe arrangement plate material prepared in advance by heating and melting the solder formed on the surface are performed after the solder formation step. A first substrate solder fixing step of fixing the P-type and N-type thermoelectric conversion elements to the corresponding electrodes on the first substrate by fixing them to the electrode forming surface of the first substrate; The back side of the plate The P-type and N-type thermoelectric conversion elements are collectively bonded to the electrode formation surface of the second substrate disposed above and below the first substrate by heating and melting the formed solder. A second substrate solder fixing step in which solder is fixed to a corresponding electrode on the second substrate; and P-type and N-type thermoelectric conversion in a state where the thermoelectric conversion element is removed by thermal contraction when the solder is heated and melted. A method of manufacturing a thermoelectric conversion module, comprising: a sheet removing step of removing a double-sided adhesive heat-shrinkable sheet provided in a boundary region of an element. 第１の基板半田固定工程と第２の基板半田固定工程は、そのいずれか一方の工程を先に行うという如く、時間をずらして行い、第１の基板半田固定工程と第２の基板半田固定工程のいずれか一方の工程の後にシート除去工程を行い、然る後に前記第１の基板半田固定工程と第２の基板半田固定工程の他方を行うことを特徴とする請求項１記載の熱電変換モジュールの製造方法。  The first substrate solder fixing step and the second substrate solder fixing step are performed at different times such that either one of the steps is performed first, and the first substrate solder fixing step and the second substrate solder fixing step are performed. 2. The thermoelectric conversion according to claim 1, wherein a sheet removing step is performed after any one of the steps, and then the other of the first substrate solder fixing step and the second substrate solder fixing step is performed. Module manufacturing method. 第１の基板半田固定工程と第２の基板半田固定工程を同時に行い、然る後にシート除去工程を行うことを特徴とする請求項１記載の熱電変換モジュールの製造方法。  2. The method of manufacturing a thermoelectric conversion module according to claim 1, wherein the first substrate solder fixing step and the second substrate solder fixing step are simultaneously performed, and thereafter the sheet removing step is performed.
JP2002380091A 2002-12-27 2002-12-27 Method for manufacturing thermoelectric conversion module Expired - Fee Related JP4280064B2 (en)

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