SU1295192A1 - Gravity heat pipe - Google Patents

Abstract

The invention relates to heat engineering and can be used when cooling power semiconductor devices (PP). The invention allows to increase operational reliability. The distribution of heat in PP 7 causes the heat carrier (T) to boil in zone 2 of evaporation. This process is accompanied by the chaotic movement of elements 4. At the same time, the heat-accumulating substance 5 in the latter accumulates heat. The vapor T rises to the condensation zone 3, where it condenses, giving away the latent heat of vaporization through the wall of this zone to the medium washing the zone outside, and the stack to the evaporation zone 2. When a pulsed load on the PP 7, for example, thyristors, during the pulse period, a heat burst is absorbed by elements 4, and between pulses, PP is heated through the liquid by T elements 4. During operation, the pipes move chaotically under the action of liquid and vapor streams. silt

Description

one

The invention relates to heat engineering, and specifically to heat transfer devices, and can be used in cooling power semiconductor devices.

The purpose of the invention is to increase operational reliability,

The drawing schematically shows a gravitational heat pipe, a longitudinal section.

The proposed pipe contains a hermetic body 1, partially filled with a heat-transfer fluid, with zones 2 and 3 of evaporation and condensation, respectively. In the evaporation zone 2, a sealed capsule is placed in the heat transfer fluid. The capsule consists of identical spherical elements 4 (with a shell, for example, copper) filled with heat-accumulating substance 5 (for example, paraffin). Condensation zone 3 is provided with ribs 6, and zone 2 is evaporated / t in contact with cooled semiconductor devices - 7. The average density of elements 4 (including the shell and heat storage substance 5) is 1.0-1.2 of the density of the liquid heat carrier in the working temperature and pressure ranges. The total volume of the element 4 is 0.35-0.45 of their total volume with the heat transfer fluid.

The gravitational heat pipe works as follows

Heat release in semiconductor devices 7 leads to the boiling of the heat-transfer fluid in the composition A. Lobanov Editor Mo Blanar Editor Tehred M. Khodanich

Corr Podpi

607/45 Circulation 612

VNIIPI USSR State Committee

for inventions and discoveries 113035, Moscow, Zh-35, Raushsk nab., 4/5

Production and printing company, Uzhgorod, st. Project, 4

five

0

five

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not 2 evaporations, accompanied by the chaotic movement of the elements 4 and the accumulation of heat by the heat accumulating substance 5. Heat carrier vapors rise upwards to the condensation zone 3, where they condense, giving away the latent heat of vaporization through the wall of this zone to the medium washing the condensation zone outside, and flow under the force of gravity back to the evaporation zone 2. When a pulse load on semiconductor devices 7, for example, thyristors, during the pulse period, a heat spike is absorbed by elements 4, and in the period between pulses, semiconductor devices are heated by elements 4 through a heat-transfer fluid.

In the course of operation of the pipe, the elements 4 randomly move under the action of flows of liquid and vaporous heat transfer medium.

Claims (1)

Invention Formula A gravitational heat pipe, a housing partially filled with a heat-transfer fluid with evaporation and condensation zones and an airtight capsule placed inside the housing, filled with a heat-accumulating substance, are distinguished35 40 This means that, in order to increase operational reliability, the capsule consists of separate identical elements placed in the evaporation zone with the possibility of autonomous free movement under the action of heat carrier fluxes. Proofreader V. Booth ha Subscription