SU1295193A1 - Heat pipe - Google Patents

Abstract

 The invention relates to heat engineering and can be used when cooling power semiconductor devices (PP). The invention allows to increase the operational reliability. When detecting heat in PP 9, the heat carrier in the eon 2 of evaporation boils. The vapor condenses in the condensation zone 3, and the heat transfer fluid returns to zone 2 under the action of capillary or gravitational forces. During the overload period of PP 9, part of the heat released by it absorbs capsule 4, and during the fall of the current load, this heat is transferred from capsule 4 by thermal conductivity through protrusions 6 to eon 3 of condensation. The inner ribs 8 contribute to increasing the temperature stability of the pipe under varying thermal loads. 1 з.п, ф-л, 2 Ш1. (L tc from 01 00 Rig.1

Description

The invention relates to heat engineering, namely to heat transfer devices, and can be used when cooling power semiconductor devices.

The purpose of the invention is to increase the operational reliability and temperature stability at variable heat loads,

FIG. 1 schematically shows a heat pipe, a longitudinal section; in fig. 2 - condensation zone of a pipe with a wick, cross section.

The heat pipe contains a housing 1 partially filled with coolant, with evaporation and condensation zones 2 and 3, respectively, and placed inside the housing 1 in the condensation zone 3, an airtight capsule 4 filled with heat storage substance 5 and provided with protrusions on the outer surface. 1. When the wick 7 is in the pipe, the protrusions 6 pass through it. Capsule 4 is made of a material with high thermal conductivity, such as copper, and filled with paraffin. On the inner surface of the capsule is also provided with ribs 8. In contact with the evaporation zone 2, a cooled device 9 is installed.

Heat pipe works as follows.

When heat is released in the device, the coolant in the evaporation zone 2 boils (or evaporates without boiling),

the steam condenses in the condensation zone 3 and the heat transfer fluid returns to the evaporation zone 2 under the action of capillary or gravitational forces. During the overload period of the semiconductor device 9, part of the heat generated by it is absorbed by the capsule 4, and during the fall of the current load this heat is transferred from

Capsules 4 thermal conductivity. Through the protrusions 6 zone 3 condensation. Internal fins 8 contribute to increasing the temperature stability of the pipe during variable heat loads.

Claims (2)

1. A heat pipe containing a body partially filled with coolant with evaporation and condensation zones and an airtight capsule placed inside the body, filled with a heat-accumulating substance, which, in order to increase operational reliability, the capsule is placed in the condensation zone and provided on the outside the surface of the protrusions in contact with the pipe body, while the wall of the capsule is made of a material with high thermal conductivity. 2. A pipe according to claim 1, characterized in that, in order to increase the temperature stability of the pipe under variable thermal loads, the capsule on the inner surface has fins. Editor M. Blanan Compiled by A. Lobanov Tehred M. Khodanych Order 607/45 Circulation 612 Subscription VNSHPI USSR State Committee for inventions and discoveries 113035, Moscow,) K-35, Raushsk nab. 4/5 Psi water-printing enterprise, Uzhgorod, st. Project, 4 FIG. 2 Proofreader M. Sharoshi