SU128271A1 - Copper-manganese self-fluxing solder - Google Patents

Copper-manganese self-fluxing solder

Info

Publication number
SU128271A1
SU128271A1 SU618501A SU618501A SU128271A1 SU 128271 A1 SU128271 A1 SU 128271A1 SU 618501 A SU618501 A SU 618501A SU 618501 A SU618501 A SU 618501A SU 128271 A1 SU128271 A1 SU 128271A1
Authority
SU
USSR - Soviet Union
Prior art keywords
copper
manganese
solder
self
fluxing
Prior art date
Application number
SU618501A
Other languages
Russian (ru)
Inventor
Н.Ф. Лашко
С.В. Лашко
В.В. Орлова
Original Assignee
Н.Ф. Лашко
С.В. Лашко
В.В. Орлова
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Н.Ф. Лашко, С.В. Лашко, В.В. Орлова filed Critical Н.Ф. Лашко
Priority to SU618501A priority Critical patent/SU128271A1/en
Application granted granted Critical
Publication of SU128271A1 publication Critical patent/SU128271A1/en

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Description

Известные медномарганцовистые самофлюсующиес  припои, состо щие из никел , марганца, железа, лити , меди служат главным образом дл  припайки лезвий из быстрорежущих сталей к державкам инструмента и не предназначены дл .пайки авиаконструкций из нержавеющих сталей, а особенно стареющего типа марок СН2, СНЗ.The known copper-manganese self-fluxing solders consisting of nickel, manganese, iron, lithium, copper serve mainly for soldering blades of high-speed steels to tool holders and are not intended for soldering of aircraft structures made of stainless steel, and especially of the old CH2, CH3 types.

Описываемым изобретением устран етс  этот недостаток при пайке ответственных авиаконструкций, например, сотовых наполнителей из нержавеющих сталей.The described invention eliminates this disadvantage when soldering responsible aircraft structures, for example, cellular fillers made of stainless steels.

Описываемый припой имеет следующий состав (в процентах): никель 4,0-4,8, марганец 20,0-24,0, железо до 1,0, литий 0,15-0,20 и медь остальное количество.The solder described has the following composition (in percent): nickel 4.0-4.8, manganese 20.0-24.0, iron up to 1.0, lithium 0.15-0.20 and copper the rest.

Припой  вл етс  самофлюсующимс  при температуре плавлени  970°- Припой не склонен к межкристаллитному проникновению и дает прочную пайку нержавеющих сталей в среде проточного аргона. Предел прочности при срезе па ных соединений из стали типа марок СН2 и СНЗ достигает 35-40 кг/мм. Припой пластичен и может изготавливатьс  в виде фольги, проволоки, прутков и т. п.The solder is self-fluxing at a melting point of 970 ° - Solder is not prone to intergranular penetration and gives solid soldering to stainless steels in a flow medium of argon. The ultimate strength when cutting joints made of steel of the type of brands CH2 and CH3 reaches 35-40 kg / mm. Solder is plastic and can be made in the form of foil, wire, rods, etc.

Предмет изобретени Subject invention

Медномарганцовистый самофлюсующийс  припой, состо щий из никел , марганца, железа, лити  и меди, отличающийс  тем, что, с целью пол учени  качественной пайки ответственных авиаконструкций, например , сотовых наполнителей, и устранени  межкристаллитного проникновени  в нержавеющую сталь, установлен следующий состав припо  в процентах: никель 4,0-4,8, марганец 20,0-24,0, железо до 1,0, литий 0,15-0,20 и медь остальное.Copper-manganese self-fluxing solder, consisting of nickel, manganese, iron, lithium and copper, characterized in that, in order to provide high-quality soldering of important aircraft structures, such as cellular fillers, and eliminate intergranular penetration into stainless steel, : Nickel 4.0-4.8, manganese 20.0-24.0, iron up to 1.0, lithium 0.15-0.20, and copper the rest.

SU618501A 1959-02-06 1959-02-06 Copper-manganese self-fluxing solder SU128271A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU618501A SU128271A1 (en) 1959-02-06 1959-02-06 Copper-manganese self-fluxing solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU618501A SU128271A1 (en) 1959-02-06 1959-02-06 Copper-manganese self-fluxing solder

Publications (1)

Publication Number Publication Date
SU128271A1 true SU128271A1 (en) 1959-11-30

Family

ID=48399491

Family Applications (1)

Application Number Title Priority Date Filing Date
SU618501A SU128271A1 (en) 1959-02-06 1959-02-06 Copper-manganese self-fluxing solder

Country Status (1)

Country Link
SU (1) SU128271A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3948432A (en) * 1972-11-03 1976-04-06 Olin Corporation Brazing preforms and method of brazing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3948432A (en) * 1972-11-03 1976-04-06 Olin Corporation Brazing preforms and method of brazing

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