JPS53110942A - Low melting point autogeneous hard solder material - Google Patents

Low melting point autogeneous hard solder material

Info

Publication number
JPS53110942A
JPS53110942A JP2600577A JP2600577A JPS53110942A JP S53110942 A JPS53110942 A JP S53110942A JP 2600577 A JP2600577 A JP 2600577A JP 2600577 A JP2600577 A JP 2600577A JP S53110942 A JPS53110942 A JP S53110942A
Authority
JP
Japan
Prior art keywords
melting point
low melting
solder material
autogeneous
hard solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2600577A
Other languages
Japanese (ja)
Other versions
JPS5847948B2 (en
Inventor
Takashi Fukumaki
Tomiro Yasuda
Mamoru Sawahata
Seiji Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2600577A priority Critical patent/JPS5847948B2/en
Publication of JPS53110942A publication Critical patent/JPS53110942A/en
Publication of JPS5847948B2 publication Critical patent/JPS5847948B2/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)

Abstract

PURPOSE:The titled solder material, which has a low melting point suitable for the step soldering, and also has an excellent wetting property, obtained by additionally including a suitable quantity of gold in a Cu-P-Ag ternary alloy, etc.
JP2600577A 1977-03-11 1977-03-11 Low melting point self-fusing brazing filler metal Expired JPS5847948B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2600577A JPS5847948B2 (en) 1977-03-11 1977-03-11 Low melting point self-fusing brazing filler metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2600577A JPS5847948B2 (en) 1977-03-11 1977-03-11 Low melting point self-fusing brazing filler metal

Publications (2)

Publication Number Publication Date
JPS53110942A true JPS53110942A (en) 1978-09-28
JPS5847948B2 JPS5847948B2 (en) 1983-10-25

Family

ID=12181570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2600577A Expired JPS5847948B2 (en) 1977-03-11 1977-03-11 Low melting point self-fusing brazing filler metal

Country Status (1)

Country Link
JP (1) JPS5847948B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0240770A (en) * 1988-07-30 1990-02-09 Omron Tateisi Electron Co Automatic charge paying machine

Also Published As

Publication number Publication date
JPS5847948B2 (en) 1983-10-25

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