SI1716730T1 - Postopek za delno odstranjevanje prevodnega sloja - Google Patents

Postopek za delno odstranjevanje prevodnega sloja

Info

Publication number
SI1716730T1
SI1716730T1 SI200531024T SI200531024T SI1716730T1 SI 1716730 T1 SI1716730 T1 SI 1716730T1 SI 200531024 T SI200531024 T SI 200531024T SI 200531024 T SI200531024 T SI 200531024T SI 1716730 T1 SI1716730 T1 SI 1716730T1
Authority
SI
Slovenia
Prior art keywords
conductive layer
substrate
laser beam
removal
partial removal
Prior art date
Application number
SI200531024T
Other languages
English (en)
Inventor
Bostjan Podobnik
Drago Kovacic
Miran Poplasen
Original Assignee
Lpkf Laser & Elektronika D.O.O.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lpkf Laser & Elektronika D.O.O. filed Critical Lpkf Laser & Elektronika D.O.O.
Publication of SI1716730T1 publication Critical patent/SI1716730T1/sl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
SI200531024T 2004-02-09 2005-01-07 Postopek za delno odstranjevanje prevodnega sloja SI1716730T1 (sl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102004006414A DE102004006414B4 (de) 2004-02-09 2004-02-09 Verfahren zum partiellen Lösen einer leitfähigen Schicht
EP05700523A EP1716730B1 (de) 2004-02-09 2005-01-07 Verfahren zum partiellen lösen einer leitfähigen schicht
PCT/DE2005/000010 WO2005076678A1 (de) 2004-02-09 2005-01-07 Verfahren zum partiellen lösen einer leitfähigen schicht

Publications (1)

Publication Number Publication Date
SI1716730T1 true SI1716730T1 (sl) 2010-07-30

Family

ID=34801834

Family Applications (1)

Application Number Title Priority Date Filing Date
SI200531024T SI1716730T1 (sl) 2004-02-09 2005-01-07 Postopek za delno odstranjevanje prevodnega sloja

Country Status (6)

Country Link
EP (1) EP1716730B1 (sl)
AT (1) ATE461606T1 (sl)
DE (2) DE102004006414B4 (sl)
ES (1) ES2342720T3 (sl)
SI (1) SI1716730T1 (sl)
WO (1) WO2005076678A1 (sl)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010019407B4 (de) 2010-05-04 2013-06-27 Lpkf Laser & Electronics Ag Verfahren zum Einbringen elektrischer Isolierungen in Leiterplatten
DE102010019406B4 (de) * 2010-05-04 2012-06-21 Lpkf Laser & Electronics Ag Verfahren zum partiellen Lösen einer definierten Fläche einer leitfähigen Schicht
DE102011005678B4 (de) 2011-03-17 2018-06-07 Bayerische Motoren Werke Aktiengesellschaft Vorrichtung und Verfahren zum Aufspalten eines Endlos-Faserrovings
CN103769749B (zh) * 2013-12-30 2016-10-19 德中（天津）技术发展有限公司 一种在覆金属箔绝缘基板上制作导电图案的方法
CN113747673A (zh) * 2021-08-30 2021-12-03 德中（天津）技术发展股份有限公司 一种用激光分别加工电镀孔、线路掩膜和导电图案的制电路板方法
CN113766767A (zh) * 2021-08-30 2021-12-07 德中（天津）技术发展股份有限公司 一种用激光加工电镀孔及抗蚀图案的制电路板方法
CN113709986A (zh) * 2021-08-30 2021-11-26 德中（天津）技术发展股份有限公司 只电镀孔后激光制抗镀图案和导电图案的制电路板方法
CN113692131A (zh) * 2021-08-30 2021-11-23 德中（天津）技术发展股份有限公司 一种用激光加工电镀孔抗镀及导电图案的制电路板方法
CN113709983B (zh) * 2021-08-30 2024-03-22 德中（天津）技术发展股份有限公司 一种用激光加工电镀孔、焊盘抗镀及导电图案的制电路板方法
CN113727540A (zh) * 2021-08-30 2021-11-30 德中（天津）技术发展股份有限公司 选择性电镀孔、焊盘，激光制导电图案的制造电路板方法
CN113727538A (zh) * 2021-08-30 2021-11-30 德中（天津）技术发展股份有限公司 一种只电镀加厚并可焊性处理孔后激光制导电图案的制造电路板方法
CN113709984A (zh) * 2021-08-30 2021-11-26 德中（天津）技术发展股份有限公司 一种用激光加工电镀孔、焊盘抗镀及抗蚀图案的制电路板方法
CN113727541A (zh) * 2021-08-30 2021-11-30 德中（天津）技术发展股份有限公司 一种选择性电镀孔，激光制导电图案的电路板生产方法
CN113709982A (zh) * 2021-08-30 2021-11-26 德中（天津）技术发展股份有限公司 一种用激光加工电镀孔掩膜和导电图案的制电路板方法
DE102021210324A1 (de) 2021-09-17 2023-03-23 Robert Bosch Gesellschaft mit beschränkter Haftung Schweißverfahren und Schweißvorrichtung zum Laserschweißen einer flexiblen Folie an ein Substrat

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3214315A (en) * 1962-03-28 1965-10-26 Burton Solomon Method for forming stamped electrical circuits
JP3153682B2 (ja) * 1993-08-26 2001-04-09 松下電工株式会社 回路板の製造方法
JP3159841B2 (ja) * 1993-08-26 2001-04-23 ポリプラスチックス株式会社 レーザーによる回路形成方法及び導電回路形成部品
TW284907B (en) * 1995-06-07 1996-09-01 Cauldron Lp Removal of material by polarized irradiation and back side application for radiation
US6203952B1 (en) * 1999-01-14 2001-03-20 3M Innovative Properties Company Imaged article on polymeric substrate
JP4928687B2 (ja) * 2001-08-02 2012-05-09 独立行政法人科学技術振興機構 超短パルスレーザーを用いた表面剥離洗浄方法とその装置
TW558743B (en) * 2001-08-22 2003-10-21 Semiconductor Energy Lab Peeling method and method of manufacturing semiconductor device

Also Published As

Publication number Publication date
ES2342720T3 (es) 2010-07-13
DE102004006414B4 (de) 2008-08-21
EP1716730A1 (de) 2006-11-02
DE502005009227D1 (de) 2010-04-29
DE102004006414A1 (de) 2005-08-25
ATE461606T1 (de) 2010-04-15
WO2005076678A1 (de) 2005-08-18
EP1716730B1 (de) 2010-03-17

Similar Documents

Publication Publication Date Title
SI1716730T1 (sl) Postopek za delno odstranjevanje prevodnega sloja
TW200639969A (en) Treatmeny of a removed layer of Si1-yGey
WO2005086226A8 (fr) Traitement thermique d’amelioration de la qualite d’une couche mince prelevee
TW200709278A (en) Method and apparatus to control semiconductor film deposition characteristics
WO2003092041A3 (en) Method for fabricating a soi substrate a high resistivity support substrate
WO2004032247A3 (de) Strahlungsemittierendes halbleiterbauelement und verfahren zur herstellung
ATE518242T1 (de) Methode zur trennung von substraten
BRPI0414904A (pt) método melhorado para tratamento de microdesbaste de circuito de cobre e de metal misto
EP1735837A4 (en) METHOD FOR SEPARATING MATERIAL LAYERS
WO2009112894A8 (en) Substrate having a charged zone in an insulating buried layer
TW200943476A (en) Manufacturing method of SOI substrate
TW200729289A (en) Non-plasma method of removing photoresist from a substrate
DE60336410D1 (de) Verfahren zur herstellung von abtrennbaren substraten
TWI350721B (en) Substrate for forming printed circuit, printed circuit board and method of forming metallic thin layer thereon
ATE371225T1 (de) Sicherheitselement zur rf-identifikation
MX2009012854A (es) Metodo para producir miembros de transferencia, transmisibles por onda electrica.
TW200729499A (en) Method of forming a semiconductor device
TW200616212A (en) Method for manufacturing thin film integrated circuit
EP1800330A4 (en) SYSTEM AND METHOD FOR LASER PROCESSING OF A SEMICONDUCTOR SUBSTRATE
GB0500273D0 (en) Surface treating method for substrate
TW200715438A (en) Manufacturing Method for an integrated semiconductor structure and corresponding integrated semiconductor structure
TW200623983A (en) Method for cutting printed circuit board
TW200731306A (en) Method of manufacturing thin film capacitor and printed circuit board having thin film capacitor embedded therein
ES2294343T3 (es) Montaje de circuito multicapa y procedimiento de preparacion.
ATE503854T1 (de) Verfahren zur herstellung eines schichtsystems umfassend einen metallischen träger und eine anodenfunktionsshicht