SI1610596T1 - Upravljanje s toploto pri sklopih plošč z vezjem - Google Patents
Upravljanje s toploto pri sklopih plošč z vezjemInfo
- Publication number
- SI1610596T1 SI1610596T1 SI200530046T SI200530046T SI1610596T1 SI 1610596 T1 SI1610596 T1 SI 1610596T1 SI 200530046 T SI200530046 T SI 200530046T SI 200530046 T SI200530046 T SI 200530046T SI 1610596 T1 SI1610596 T1 SI 1610596T1
- Authority
- SI
- Slovenia
- Prior art keywords
- heat management
- pcb
- circuit card
- card assemblies
- edges
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cookers (AREA)
- Steam Or Hot-Water Central Heating Systems (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Electric Clocks (AREA)
- Credit Cards Or The Like (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0413420.1A GB0413420D0 (en) | 2004-06-15 | 2004-06-15 | Heat management in printed wiring boards |
EP05253641A EP1610596B1 (en) | 2004-06-15 | 2005-06-13 | Heat management in circuit card assemblies |
Publications (1)
Publication Number | Publication Date |
---|---|
SI1610596T1 true SI1610596T1 (sl) | 2007-12-31 |
Family
ID=32749979
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SI200530046T SI1610596T1 (sl) | 2004-06-15 | 2005-06-13 | Upravljanje s toploto pri sklopih plošč z vezjem |
Country Status (10)
Country | Link |
---|---|
US (1) | US7660125B2 (sl) |
EP (1) | EP1610596B1 (sl) |
AT (1) | ATE364308T1 (sl) |
DE (1) | DE602005001297T2 (sl) |
DK (1) | DK1610596T3 (sl) |
ES (1) | ES2287875T3 (sl) |
GB (2) | GB0413420D0 (sl) |
PL (1) | PL1610596T3 (sl) |
PT (1) | PT1610596E (sl) |
SI (1) | SI1610596T1 (sl) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1495702A1 (fr) | 2003-07-10 | 2005-01-12 | Nestec S.A. | Dispositif pour l'extraction d'une capsule |
CL2008002963A1 (es) | 2007-10-04 | 2010-01-22 | Nestec Sa | Dispositivo calentador para una maquina para la preparacion de alimento liquido o bebida, que comprende una unidad termica con una masa metalica, a traves de la cual circula el liquido, y acumula calor y lo suministra al liquido, y tiene uno o mas componentes electricos asegurados en forma rigida a la unidad termica; y maquina. |
PL2205133T3 (pl) | 2007-10-04 | 2011-10-31 | Nestec Sa | Jednostka do zaparzania napojów |
CN102133047B (zh) | 2007-10-04 | 2014-04-30 | 雀巢产品技术援助有限公司 | 用于饮料制备设备的集成的加热器 |
CN103505057A (zh) | 2008-04-22 | 2014-01-15 | 雀巢产品技术援助有限公司 | 饮料制备机的模块化组件 |
RU2517804C2 (ru) | 2008-08-08 | 2014-05-27 | Нестек С.А. | Машина для приготовления напитков с ручкой для переноски, имеющая адаптируемый внешний вид и содержащая сменные боковые панели |
US7787249B2 (en) * | 2009-02-03 | 2010-08-31 | Honeywell International Inc. | Systems and methods for printed board assembly isolated heat exchange |
JP2012521231A (ja) | 2009-03-23 | 2012-09-13 | ネステク ソシエテ アノニム | 飲料調製装置におけるポンプ取付け |
DE102011088256A1 (de) * | 2011-12-12 | 2013-06-13 | Zf Friedrichshafen Ag | Multilayer-Leiterplatte sowie Anordnung mit einer solchen |
WO2019089076A1 (en) * | 2017-11-06 | 2019-05-09 | Core Innovation, Llc | Structures and methods of manufacture of serpentine stator coils |
US10827629B2 (en) * | 2018-01-19 | 2020-11-03 | Ge Aviation Systems Llc | Control boxes and system-on-module circuit boards for unmanned vehicles |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8304890D0 (en) * | 1983-02-22 | 1983-03-23 | Smiths Industries Plc | Chip-carrier substrates |
IT1201315B (it) * | 1985-06-17 | 1989-01-27 | M A S Ind Spa | Metodo per assicurare il raffreddamento di componenti elettronici fissati su di un multistrato per circuiti stampati e multistrato realizzato secondo detto metodo |
US4853828A (en) * | 1985-08-22 | 1989-08-01 | Dart Controls, Inc. | Solid state device package mounting apparatus |
US5172301A (en) * | 1991-10-08 | 1992-12-15 | Lsi Logic Corporation | Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same |
US5617294A (en) * | 1995-09-29 | 1997-04-01 | Intel Corporation | Apparatus for removing heat from an integrated circuit package that is attached to a printed circuit board |
US5825625A (en) * | 1996-05-20 | 1998-10-20 | Hewlett-Packard Company | Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink |
US5986887A (en) * | 1998-10-28 | 1999-11-16 | Unisys Corporation | Stacked circuit board assembly adapted for heat dissipation |
US6510053B1 (en) * | 2000-09-15 | 2003-01-21 | Lucent Technologies Inc. | Circuit board cooling system |
EP1276357A3 (de) * | 2001-07-13 | 2004-08-25 | Behr-Hella Thermocontrol GmbH | Leiterplatte für elektrische Schaltungen |
-
2004
- 2004-06-15 GB GBGB0413420.1A patent/GB0413420D0/en not_active Ceased
-
2005
- 2005-06-10 GB GB0511880A patent/GB2415297A/en not_active Withdrawn
- 2005-06-10 US US11/150,720 patent/US7660125B2/en not_active Expired - Fee Related
- 2005-06-13 AT AT05253641T patent/ATE364308T1/de active
- 2005-06-13 PT PT05253641T patent/PT1610596E/pt unknown
- 2005-06-13 SI SI200530046T patent/SI1610596T1/sl unknown
- 2005-06-13 PL PL05253641T patent/PL1610596T3/pl unknown
- 2005-06-13 DE DE602005001297T patent/DE602005001297T2/de active Active
- 2005-06-13 DK DK05253641T patent/DK1610596T3/da active
- 2005-06-13 EP EP05253641A patent/EP1610596B1/en not_active Not-in-force
- 2005-06-13 ES ES05253641T patent/ES2287875T3/es active Active
Also Published As
Publication number | Publication date |
---|---|
US20050281007A1 (en) | 2005-12-22 |
DE602005001297T2 (de) | 2007-12-20 |
DK1610596T3 (da) | 2007-10-08 |
GB2415297A (en) | 2005-12-21 |
PT1610596E (pt) | 2007-07-30 |
EP1610596A1 (en) | 2005-12-28 |
DE602005001297D1 (de) | 2007-07-19 |
ATE364308T1 (de) | 2007-06-15 |
GB0413420D0 (en) | 2004-07-21 |
EP1610596B1 (en) | 2007-06-06 |
US7660125B2 (en) | 2010-02-09 |
ES2287875T3 (es) | 2007-12-16 |
PL1610596T3 (pl) | 2007-09-28 |
GB0511880D0 (en) | 2005-07-20 |
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