PL1610596T3 - Zarządzanie ciepłem w zespołach płytek montażowych - Google Patents
Zarządzanie ciepłem w zespołach płytek montażowychInfo
- Publication number
- PL1610596T3 PL1610596T3 PL05253641T PL05253641T PL1610596T3 PL 1610596 T3 PL1610596 T3 PL 1610596T3 PL 05253641 T PL05253641 T PL 05253641T PL 05253641 T PL05253641 T PL 05253641T PL 1610596 T3 PL1610596 T3 PL 1610596T3
- Authority
- PL
- Poland
- Prior art keywords
- heat management
- pcb
- circuit card
- card assemblies
- edges
- Prior art date
Links
- 230000000712 assembly Effects 0.000 title 1
- 238000000429 assembly Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cookers (AREA)
- Structure Of Printed Boards (AREA)
- Steam Or Hot-Water Central Heating Systems (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Credit Cards Or The Like (AREA)
- Electric Clocks (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0413420.1A GB0413420D0 (en) | 2004-06-15 | 2004-06-15 | Heat management in printed wiring boards |
EP05253641A EP1610596B1 (en) | 2004-06-15 | 2005-06-13 | Heat management in circuit card assemblies |
Publications (1)
Publication Number | Publication Date |
---|---|
PL1610596T3 true PL1610596T3 (pl) | 2007-09-28 |
Family
ID=32749979
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL05253641T PL1610596T3 (pl) | 2004-06-15 | 2005-06-13 | Zarządzanie ciepłem w zespołach płytek montażowych |
Country Status (10)
Country | Link |
---|---|
US (1) | US7660125B2 (pl) |
EP (1) | EP1610596B1 (pl) |
AT (1) | ATE364308T1 (pl) |
DE (1) | DE602005001297T2 (pl) |
DK (1) | DK1610596T3 (pl) |
ES (1) | ES2287875T3 (pl) |
GB (2) | GB0413420D0 (pl) |
PL (1) | PL1610596T3 (pl) |
PT (1) | PT1610596E (pl) |
SI (1) | SI1610596T1 (pl) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1495702A1 (fr) | 2003-07-10 | 2005-01-12 | Nestec S.A. | Dispositif pour l'extraction d'une capsule |
WO2009043630A2 (en) | 2007-10-04 | 2009-04-09 | Nestec S.A. | Beverage brewing unit |
CL2008002963A1 (es) | 2007-10-04 | 2010-01-22 | Nestec Sa | Dispositivo calentador para una maquina para la preparacion de alimento liquido o bebida, que comprende una unidad termica con una masa metalica, a traves de la cual circula el liquido, y acumula calor y lo suministra al liquido, y tiene uno o mas componentes electricos asegurados en forma rigida a la unidad termica; y maquina. |
EP2209407B1 (en) | 2007-10-04 | 2017-01-25 | Nestec S.A. | Integrated heater for a beverage preparation device |
RU2497429C2 (ru) | 2008-04-22 | 2013-11-10 | Нестек С.А. | Устройство для приготовления напитков модульной конструкции |
JP5608647B2 (ja) | 2008-08-08 | 2014-10-15 | ネステク ソシエテ アノニム | 持ち運びハンドルおよび設定変更可能な外観ならびに副次的機能を伴う飲料装置 |
US7787249B2 (en) * | 2009-02-03 | 2010-08-31 | Honeywell International Inc. | Systems and methods for printed board assembly isolated heat exchange |
RU2534915C2 (ru) | 2009-03-23 | 2014-12-10 | Нестек С.А. | Крепление насоса в аппарате для приготовления напитка |
DE102011088256A1 (de) * | 2011-12-12 | 2013-06-13 | Zf Friedrichshafen Ag | Multilayer-Leiterplatte sowie Anordnung mit einer solchen |
US20210203213A1 (en) * | 2017-11-06 | 2021-07-01 | Core Innovation, Llc | Structures and methods of manufacture of serpentine stator coils |
US10827629B2 (en) * | 2018-01-19 | 2020-11-03 | Ge Aviation Systems Llc | Control boxes and system-on-module circuit boards for unmanned vehicles |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8304890D0 (en) * | 1983-02-22 | 1983-03-23 | Smiths Industries Plc | Chip-carrier substrates |
IT1201315B (it) * | 1985-06-17 | 1989-01-27 | M A S Ind Spa | Metodo per assicurare il raffreddamento di componenti elettronici fissati su di un multistrato per circuiti stampati e multistrato realizzato secondo detto metodo |
US4853828A (en) * | 1985-08-22 | 1989-08-01 | Dart Controls, Inc. | Solid state device package mounting apparatus |
US5172301A (en) * | 1991-10-08 | 1992-12-15 | Lsi Logic Corporation | Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same |
US5617294A (en) * | 1995-09-29 | 1997-04-01 | Intel Corporation | Apparatus for removing heat from an integrated circuit package that is attached to a printed circuit board |
US5825625A (en) * | 1996-05-20 | 1998-10-20 | Hewlett-Packard Company | Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink |
US5986887A (en) * | 1998-10-28 | 1999-11-16 | Unisys Corporation | Stacked circuit board assembly adapted for heat dissipation |
US6510053B1 (en) * | 2000-09-15 | 2003-01-21 | Lucent Technologies Inc. | Circuit board cooling system |
EP1276357A3 (de) * | 2001-07-13 | 2004-08-25 | Behr-Hella Thermocontrol GmbH | Leiterplatte für elektrische Schaltungen |
-
2004
- 2004-06-15 GB GBGB0413420.1A patent/GB0413420D0/en not_active Ceased
-
2005
- 2005-06-10 US US11/150,720 patent/US7660125B2/en not_active Expired - Fee Related
- 2005-06-10 GB GB0511880A patent/GB2415297A/en not_active Withdrawn
- 2005-06-13 AT AT05253641T patent/ATE364308T1/de active
- 2005-06-13 DK DK05253641T patent/DK1610596T3/da active
- 2005-06-13 PL PL05253641T patent/PL1610596T3/pl unknown
- 2005-06-13 PT PT05253641T patent/PT1610596E/pt unknown
- 2005-06-13 EP EP05253641A patent/EP1610596B1/en not_active Not-in-force
- 2005-06-13 SI SI200530046T patent/SI1610596T1/sl unknown
- 2005-06-13 DE DE602005001297T patent/DE602005001297T2/de active Active
- 2005-06-13 ES ES05253641T patent/ES2287875T3/es active Active
Also Published As
Publication number | Publication date |
---|---|
SI1610596T1 (sl) | 2007-12-31 |
US20050281007A1 (en) | 2005-12-22 |
PT1610596E (pt) | 2007-07-30 |
EP1610596A1 (en) | 2005-12-28 |
ATE364308T1 (de) | 2007-06-15 |
US7660125B2 (en) | 2010-02-09 |
DK1610596T3 (da) | 2007-10-08 |
ES2287875T3 (es) | 2007-12-16 |
GB0511880D0 (en) | 2005-07-20 |
GB0413420D0 (en) | 2004-07-21 |
EP1610596B1 (en) | 2007-06-06 |
GB2415297A (en) | 2005-12-21 |
DE602005001297T2 (de) | 2007-12-20 |
DE602005001297D1 (de) | 2007-07-19 |
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