SG91372A1 - Conductive, multilayer-structured resin particles and anisotropic conductive adhesives using the same - Google Patents

Conductive, multilayer-structured resin particles and anisotropic conductive adhesives using the same

Info

Publication number
SG91372A1
SG91372A1 SG200104075A SG200104075A SG91372A1 SG 91372 A1 SG91372 A1 SG 91372A1 SG 200104075 A SG200104075 A SG 200104075A SG 200104075 A SG200104075 A SG 200104075A SG 91372 A1 SG91372 A1 SG 91372A1
Authority
SG
Singapore
Prior art keywords
conductive
multilayer
same
resin particles
structured resin
Prior art date
Application number
SG200104075A
Inventor
Sasaki Ichiro
Fujii Tatsuo
Tachibana Shinji
Original Assignee
Mitsui Takeda Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Takeda Chemicals Inc filed Critical Mitsui Takeda Chemicals Inc
Publication of SG91372A1 publication Critical patent/SG91372A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/14—Glass
    • C09J2400/143—Glass in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
SG200104075A 2000-07-13 2001-07-09 Conductive, multilayer-structured resin particles and anisotropic conductive adhesives using the same SG91372A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000213358A JP2002033022A (en) 2000-07-13 2000-07-13 Conductive multilayer structure resin particle and anisotropic conductive adhesive using it

Publications (1)

Publication Number Publication Date
SG91372A1 true SG91372A1 (en) 2002-09-17

Family

ID=18709124

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200104075A SG91372A1 (en) 2000-07-13 2001-07-09 Conductive, multilayer-structured resin particles and anisotropic conductive adhesives using the same

Country Status (5)

Country Link
JP (1) JP2002033022A (en)
KR (1) KR20020008010A (en)
CN (1) CN1340573A (en)
SG (1) SG91372A1 (en)
TW (1) TW525193B (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004055058A1 (en) * 2002-12-17 2004-07-01 Sony Chemicals Corp. Process for producing resin particle and process for producing anisotropically conductive adhesive
JP2007012378A (en) * 2005-06-29 2007-01-18 Fujikura Kasei Co Ltd Conductive particulate
CN100441613C (en) * 2005-08-19 2008-12-10 湖北省化学研究院 Preparation of polymer composite conductive microsphere for aeolotropic conductive adhensive membrane
KR100722493B1 (en) * 2005-09-02 2007-05-28 제일모직주식회사 Insulated Conductive Particles and an Anisotropic Conductive Adhesive Film Using the Same
JP4918908B2 (en) * 2007-10-29 2012-04-18 住友電気工業株式会社 Anisotropic conductive film
JP5572913B2 (en) * 2008-01-17 2014-08-20 戸田工業株式会社 Conductive particle powder
JP5535507B2 (en) * 2009-03-30 2014-07-02 国立大学法人京都大学 Conductive particles and manufacturing method thereof
WO2011007646A1 (en) * 2009-07-17 2011-01-20 株式会社村田製作所 Structure for bonding metal plate and piezoelectric body and bonding method
JP5534891B2 (en) * 2010-03-26 2014-07-02 積水化学工業株式会社 Conductive particle, method for producing conductive particle, anisotropic conductive material, and connection structure
KR20130114170A (en) * 2010-11-02 2013-10-16 히타치가세이가부시끼가이샤 Electrically conductive particles and process for production thereof
CN102136313B (en) * 2010-12-06 2013-07-24 苏州纳微生物科技有限公司 Compound microsphere, anisotropic conductive material, anisotropic conductive film and conductive structure
CN102136314B (en) * 2010-12-06 2012-05-23 苏州纳微生物科技有限公司 Preparation method of composite microspheres, anisotropy conducting material and anisotropy conducting film
CN102560448B (en) * 2010-12-21 2014-01-08 苏州纳微生物科技有限公司 Preparation method of composite microsphere containing dendritic structure polymer, anisotropic conductive material and anisotropic conductive film
CN102167838B (en) * 2010-12-21 2012-11-28 苏州纳微生物科技有限公司 Polymer composite microsphere containing dendritic structure, anisotropic conducting material and anisotropic conducting film
JP6014438B2 (en) * 2012-09-21 2016-10-25 株式会社日本触媒 Conductive fine particles and anisotropic conductive material using the same
JP6798771B2 (en) * 2014-07-10 2020-12-09 積水化学工業株式会社 Method for manufacturing conductive particles, method for manufacturing conductive material, and method for manufacturing connecting structure
JP6739988B2 (en) * 2015-04-30 2020-08-12 積水化学工業株式会社 Base particle, method for producing base particle, conductive particle, conductive material, and connection structure
CN105070351A (en) * 2015-06-30 2015-11-18 苏州纳微科技有限公司 Flexible conductive microballoon and applications thereof
KR102417115B1 (en) 2015-12-04 2022-07-06 삼성디스플레이 주식회사 Flexible display apparatus
CN105623550A (en) * 2016-02-29 2016-06-01 苏州安洁科技股份有限公司 Printing-grade conductive adhesive
JP6586036B2 (en) * 2016-03-15 2019-10-02 東芝メモリ株式会社 Manufacturing method of semiconductor device
JP6551794B2 (en) * 2016-05-30 2019-07-31 パナソニックＩｐマネジメント株式会社 Conductive particle, connecting material for circuit member, connecting structure, and connecting method
JP6397552B2 (en) * 2017-09-29 2018-09-26 株式会社日本触媒 Conductive fine particles and anisotropic conductive material using the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05135618A (en) * 1991-09-18 1993-06-01 Sekisui Chem Co Ltd Electroconductive resin particle
JPH08193186A (en) * 1995-01-13 1996-07-30 Sony Chem Corp Conductive particle for anisotropically conductive adhesive and anisotropically conductive adhesive containing same
JPH11209714A (en) * 1998-01-22 1999-08-03 Shin Etsu Polymer Co Ltd Anisotropically electroconductive adhesive

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05135618A (en) * 1991-09-18 1993-06-01 Sekisui Chem Co Ltd Electroconductive resin particle
JPH08193186A (en) * 1995-01-13 1996-07-30 Sony Chem Corp Conductive particle for anisotropically conductive adhesive and anisotropically conductive adhesive containing same
JPH11209714A (en) * 1998-01-22 1999-08-03 Shin Etsu Polymer Co Ltd Anisotropically electroconductive adhesive

Also Published As

Publication number Publication date
TW525193B (en) 2003-03-21
JP2002033022A (en) 2002-01-31
KR20020008010A (en) 2002-01-29
CN1340573A (en) 2002-03-20

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