SG91325A1 - Non-contact type ic card and process for manufacturing same - Google Patents

Non-contact type ic card and process for manufacturing same

Info

Publication number
SG91325A1
SG91325A1 SG200100059A SG200100059A SG91325A1 SG 91325 A1 SG91325 A1 SG 91325A1 SG 200100059 A SG200100059 A SG 200100059A SG 200100059 A SG200100059 A SG 200100059A SG 91325 A1 SG91325 A1 SG 91325A1
Authority
SG
Singapore
Prior art keywords
card
contact type
manufacturing same
manufacturing
same
Prior art date
Application number
SG200100059A
Other languages
English (en)
Inventor
Akagawa Masatoshi
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of SG91325A1 publication Critical patent/SG91325A1/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
SG200100059A 2000-01-05 2001-01-04 Non-contact type ic card and process for manufacturing same SG91325A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000000436A JP2001188891A (ja) 2000-01-05 2000-01-05 非接触型ｉｃカード

Publications (1)

Publication Number Publication Date
SG91325A1 true SG91325A1 (en) 2002-09-17

Family

ID=18529787

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200100059A SG91325A1 (en) 2000-01-05 2001-01-04 Non-contact type ic card and process for manufacturing same

Country Status (4)

Country Link
US (2) US6469371B2 (de)
EP (1) EP1115086A3 (de)
JP (1) JP2001188891A (de)
SG (1) SG91325A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001188891A (ja) * 2000-01-05 2001-07-10 Shinko Electric Ind Co Ltd 非接触型ｉｃカード
EP1265466A3 (de) * 2001-06-05 2004-07-21 Dai Nippon Printing Co., Ltd. Verfahren zur Herstellung einer Leiterplatte mit passiven Elementen und Leiterplatte mit passiven Elementen
CA2462252C (en) * 2001-10-01 2011-11-29 Nagraid S.A. Electronic circuit comprising conductive bridges and method for making such bridges
US6774470B2 (en) * 2001-12-28 2004-08-10 Dai Nippon Printing Co., Ltd. Non-contact data carrier and method of fabricating the same
US7652359B2 (en) * 2002-12-27 2010-01-26 Semiconductor Energy Laboratory Co., Ltd. Article having display device
US7397672B2 (en) * 2003-08-05 2008-07-08 Lintec Corporation Flip chip mounting substrate
US7566001B2 (en) * 2003-08-29 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. IC card
JP4479209B2 (ja) * 2003-10-10 2010-06-09 パナソニック株式会社 電子回路装置およびその製造方法並びに電子回路装置の製造装置
ITMO20040146A1 (it) * 2004-06-11 2004-09-11 Windinglab S R L Dispositivo di identificazione a radio-frequenza
JP4580944B2 (ja) * 2007-01-29 2010-11-17 大日本印刷株式会社 非接触データキャリアとその製造方法
JP4963981B2 (ja) * 2007-02-19 2012-06-27 住友電気工業株式会社 フレキシブルプリント配線板
DE102007063282A1 (de) * 2007-12-27 2009-07-02 Robert Bosch Gmbh Verfahren zur Herstellung eines elektrischen Leiters durch Auftragen zumindest einer Paste, insbesondere Dickschichtpaste
US8023269B2 (en) * 2008-08-15 2011-09-20 Siemens Energy, Inc. Wireless telemetry electronic circuit board for high temperature environments
DE102011082945A1 (de) * 2011-09-19 2013-03-21 Osram Ag Elektronische leiterplatte und verfahren zur herstellung einer leiterplatte
KR101901697B1 (ko) * 2016-03-21 2018-11-07 삼성전기 주식회사 코일 장치의 제작 방법 및 코일 장치
CN112735769B (zh) * 2020-12-23 2022-07-15 上海安费诺永亿通讯电子有限公司 一种铝fpc型线圈结构及其制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0737935A2 (de) * 1995-04-13 1996-10-16 Sony Chemicals Corporation Kontaktlose Chipkarte und Herstellungsverfahren
EP0780004A1 (de) * 1994-09-05 1997-06-25 Siemens Aktiengesellschaft Schaltungsanordnung mit einem chipkartenmodul und einer damit verbundenen spule

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE47505T1 (de) * 1984-07-31 1989-11-15 Siemens Ag Monolithisch integrierte halbleiterschaltung.
US5250600A (en) * 1992-05-28 1993-10-05 Johnson Matthey Inc. Low temperature flexible die attach adhesive and articles using same
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
AT1470U1 (de) * 1995-08-01 1997-05-26 Austria Card Laminierte karte und verfahren zu ihrer herstellung
IT240061Y1 (it) * 1996-03-01 2001-03-26 Cruciani Andrea Adattatore
US5795852A (en) 1996-04-24 1998-08-18 Lever Brothers Company, Division Of Conopco, Inc. Bar composition comprising nonionic polymeric surfacing as mildness enhancement agents
DE69617753T2 (de) * 1996-07-18 2002-08-08 Nagraid Sa Verfahren zur herstellung von gedruckten schaltungen sowie nach diesem verfahren hergestellte gedruckte schaltung
US5693956A (en) * 1996-07-29 1997-12-02 Motorola Inverted oleds on hard plastic substrate
DE19639033C1 (de) * 1996-09-23 1997-08-07 Siemens Ag Analysierschutz für einen Halbleiterchip
US6259158B1 (en) * 1996-12-26 2001-07-10 Hitachi, Ltd. Semiconductor device utilizing an external electrode with a small pitch connected to a substrate
US5909050A (en) * 1997-09-15 1999-06-01 Microchip Technology Incorporated Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor
ATE307363T1 (de) * 1998-02-13 2005-11-15 Shinko Electric Ind Co Ic-karte und ihre struktur
US6255725B1 (en) * 1998-05-28 2001-07-03 Shinko Electric Industries Co., Ltd. IC card and plane coil for IC card
FR2780551B1 (fr) * 1998-06-29 2001-09-07 Inside Technologies Micromodule electronique integre et procede de fabrication d'un tel micromodule
JP2001188891A (ja) * 2000-01-05 2001-07-10 Shinko Electric Ind Co Ltd 非接触型ｉｃカード

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0780004A1 (de) * 1994-09-05 1997-06-25 Siemens Aktiengesellschaft Schaltungsanordnung mit einem chipkartenmodul und einer damit verbundenen spule
EP0737935A2 (de) * 1995-04-13 1996-10-16 Sony Chemicals Corporation Kontaktlose Chipkarte und Herstellungsverfahren

Also Published As

Publication number Publication date
EP1115086A3 (de) 2002-02-13
EP1115086A2 (de) 2001-07-11
JP2001188891A (ja) 2001-07-10
US20010006118A1 (en) 2001-07-05
US6469371B2 (en) 2002-10-22
US6717249B2 (en) 2004-04-06
US20020190365A1 (en) 2002-12-19

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