SG90132A1 - Compositions for the stripping of photoresists in the fabrication of integrated circuits - Google Patents

Compositions for the stripping of photoresists in the fabrication of integrated circuits

Info

Publication number
SG90132A1
SG90132A1 SG200002277A SG200002277A SG90132A1 SG 90132 A1 SG90132 A1 SG 90132A1 SG 200002277 A SG200002277 A SG 200002277A SG 200002277 A SG200002277 A SG 200002277A SG 90132 A1 SG90132 A1 SG 90132A1
Authority
SG
Singapore
Prior art keywords
photoresists
stripping
fabrication
compositions
integrated circuits
Prior art date
Application number
SG200002277A
Other languages
English (en)
Inventor
Lallier Jean-Pierre
Original Assignee
Atochem Elf Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atochem Elf Sa filed Critical Atochem Elf Sa
Publication of SG90132A1 publication Critical patent/SG90132A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Detergent Compositions (AREA)
SG200002277A 1999-04-26 2000-04-25 Compositions for the stripping of photoresists in the fabrication of integrated circuits SG90132A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9905237A FR2792737B1 (fr) 1999-04-26 1999-04-26 Compositions pour le decapage de photoresists dans la fabrication de circuits integres

Publications (1)

Publication Number Publication Date
SG90132A1 true SG90132A1 (en) 2002-07-23

Family

ID=9544843

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200002277A SG90132A1 (en) 1999-04-26 2000-04-25 Compositions for the stripping of photoresists in the fabrication of integrated circuits

Country Status (14)

Country Link
US (1) US6291410B1 (de)
EP (1) EP1048986B1 (de)
JP (1) JP2000347423A (de)
KR (1) KR20000077072A (de)
CN (1) CN1130454C (de)
AT (1) ATE230126T1 (de)
CA (1) CA2306673A1 (de)
DE (1) DE60001008T2 (de)
FR (1) FR2792737B1 (de)
IL (1) IL135565A0 (de)
MY (1) MY135996A (de)
PL (1) PL339886A1 (de)
SG (1) SG90132A1 (de)
TW (1) TW576952B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6276548B1 (en) * 2000-10-05 2001-08-21 David Mitchell Collapsible basket
FR2815359B1 (fr) * 2000-10-17 2003-05-16 Atofina Nettoyage apres gravure d'un dielectrique associe au cuivre
JP4532039B2 (ja) * 2001-09-28 2010-08-25 シャープ株式会社 レジスト剥離方法及び薄膜回路素子の形成方法
JP3833650B2 (ja) * 2003-12-04 2006-10-18 関東化学株式会社 低分子型有機ｅｌ素子製造の真空蒸着工程において使用するマスクの洗浄液組成物および洗浄方法
JP6126551B2 (ja) * 2013-05-20 2017-05-10 富士フイルム株式会社 パターン剥離方法、電子デバイスの製造方法
WO2021035673A1 (en) * 2019-08-30 2021-03-04 Dow Global Technologies Llc Photoresist stripping composition
CN114879457A (zh) * 2022-05-26 2022-08-09 诺而曼环保科技（江苏）有限公司 一种用于去除半导体生产用光刻胶的清洗剂及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5407788A (en) * 1993-06-24 1995-04-18 At&T Corp. Photoresist stripping method
US5417877A (en) * 1991-01-25 1995-05-23 Ashland Inc. Organic stripping composition
US5496491A (en) * 1991-01-25 1996-03-05 Ashland Oil Company Organic stripping composition
US5709756A (en) * 1996-11-05 1998-01-20 Ashland Inc. Basic stripping and cleaning composition

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5556482A (en) * 1991-01-25 1996-09-17 Ashland, Inc. Method of stripping photoresist with composition containing inhibitor
EP0578507B1 (de) * 1992-07-09 2005-09-28 Ekc Technology, Inc. Reinigungsmittelzusammensetzung, das einem Redox Aminverbindung enthält
US5308745A (en) * 1992-11-06 1994-05-03 J. T. Baker Inc. Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins
AU3131395A (en) * 1994-09-23 1996-04-09 Church & Dwight Company, Inc. Aqueous metal cleaner
FR2764278B1 (fr) 1997-06-09 1999-07-30 Maurice Granger Appareil distributeur de materiaux d'essuyage pouvant etre distribues sous forme non pliee

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5417877A (en) * 1991-01-25 1995-05-23 Ashland Inc. Organic stripping composition
US5496491A (en) * 1991-01-25 1996-03-05 Ashland Oil Company Organic stripping composition
US5407788A (en) * 1993-06-24 1995-04-18 At&T Corp. Photoresist stripping method
US5709756A (en) * 1996-11-05 1998-01-20 Ashland Inc. Basic stripping and cleaning composition

Also Published As

Publication number Publication date
EP1048986B1 (de) 2002-12-18
TW576952B (en) 2004-02-21
DE60001008D1 (de) 2003-01-30
MY135996A (en) 2008-07-31
JP2000347423A (ja) 2000-12-15
PL339886A1 (en) 2000-11-06
CA2306673A1 (fr) 2000-10-26
ATE230126T1 (de) 2003-01-15
DE60001008T2 (de) 2003-07-24
CN1280172A (zh) 2001-01-17
CN1130454C (zh) 2003-12-10
FR2792737B1 (fr) 2001-05-18
IL135565A0 (en) 2001-05-20
EP1048986A1 (de) 2000-11-02
US6291410B1 (en) 2001-09-18
KR20000077072A (ko) 2000-12-26
FR2792737A1 (fr) 2000-10-27

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