SG87725A1 - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
SG87725A1
SG87725A1 SG9502396A SG1995002396A SG87725A1 SG 87725 A1 SG87725 A1 SG 87725A1 SG 9502396 A SG9502396 A SG 9502396A SG 1995002396 A SG1995002396 A SG 1995002396A SG 87725 A1 SG87725 A1 SG 87725A1
Authority
SG
Singapore
Prior art keywords
resin composition
epoxy resin
epoxy
composition
resin
Prior art date
Application number
SG9502396A
Other languages
English (en)
Inventor
Fujita Hiroshi
Mogi Naoki
Ueda Shigehisa
Aihara Takashi
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP25094992A external-priority patent/JP3235799B2/ja
Priority claimed from JP4250947A external-priority patent/JP2793449B2/ja
Priority claimed from JP25600692A external-priority patent/JP3093051B2/ja
Priority claimed from JP25600592A external-priority patent/JP3093050B2/ja
Priority claimed from JP5037929A external-priority patent/JPH06234906A/ja
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG87725A1 publication Critical patent/SG87725A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG9502396A 1992-09-21 1993-05-11 Epoxy resin composition SG87725A1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP25094992A JP3235799B2 (ja) 1992-09-21 1992-09-21 エポキシ樹脂組成物
JP4250947A JP2793449B2 (ja) 1992-09-21 1992-09-21 エポキシ樹脂組成物
JP25600692A JP3093051B2 (ja) 1992-09-25 1992-09-25 エポキシ樹脂組成物
JP25600592A JP3093050B2 (ja) 1992-09-25 1992-09-25 エポキシ樹脂組成物
JP33898492 1992-12-18
JP5037929A JPH06234906A (ja) 1992-12-18 1993-02-26 エポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
SG87725A1 true SG87725A1 (en) 2002-04-16

Family

ID=27549879

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9502396A SG87725A1 (en) 1992-09-21 1993-05-11 Epoxy resin composition

Country Status (5)

Country Link
US (1) US5578660A (de)
EP (1) EP0589143B1 (de)
DE (1) DE69307442T2 (de)
MY (1) MY109105A (de)
SG (1) SG87725A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU4356196A (en) * 1995-01-05 1996-07-24 Toray Industries, Inc. Epoxy resin compound
EP0742261B1 (de) * 1995-04-10 2000-08-02 Shin-Etsu Chemical Co., Ltd. Epoxyharzmassen zur Einkapselung von Halbleitern, deren Herstellung und Verwendung, sowie damit eingekapselte Halbleiterbauteile
JPH10195179A (ja) * 1997-01-08 1998-07-28 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
DE19741437A1 (de) * 1997-09-19 1999-04-01 Siemens Ag Elektronisches Bauteil mit verbesserter Gehäusepreßmasse
JP3349963B2 (ja) * 1998-10-21 2002-11-25 日本電気株式会社 難燃性エポキシ樹脂組成物及びそれを用いた半導体装置
JP2002212268A (ja) * 2001-01-19 2002-07-31 Japan Epoxy Resin Kk 半導体封止用エポキシ樹脂組成物
US7417111B2 (en) * 2004-03-31 2008-08-26 Intel Corporation Liquid crystalline epoxy resins

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2499370A (en) * 1947-03-07 1950-03-07 Petrolite Corp Process for breaking petroleum emulsions
US2828283A (en) * 1952-12-08 1958-03-25 Petrolite Corp Certain polyepoxide modified phenolaldehyde resins, their oxyalkylation derivatives,and method of making same
US2837493A (en) * 1954-04-17 1958-06-03 Albert Ag Chem Werke Epoxy resin compositions containing polyvalent metal phenolates or phenolate-aldehyde resins and the process of their production
JPS6099117A (ja) * 1983-11-02 1985-06-03 Sumitomo Bakelite Co Ltd 熱硬化性樹脂組成物
JPH03210322A (ja) * 1990-01-11 1991-09-13 Toshiba Chem Corp 封止用樹脂組成物および半導体装置
JPH0459862A (ja) * 1990-06-29 1992-02-26 Toray Ind Inc 半導体封止用エポキシ樹脂組成物
EP0524433A2 (de) * 1991-06-21 1993-01-27 Dai-Ichi Kogyo Seiyaku Co., Ltd. Polymere Hydroxynaphtalinverbindungen und Epoxydharzzusammensetzung
EP0536748A1 (de) * 1991-10-11 1993-04-14 Sumitomo Chemical Company, Limited Polyhydrisilves Phenol und damit hergestellter Epoxydharz

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4072656A (en) * 1976-05-24 1978-02-07 Ici Americas Inc. Glycidyl ethers derived from 3,3',5,5'-tetraalkyl-4,4'-dihydroxybiphenyl
JPS62167318A (ja) * 1986-01-20 1987-07-23 Teijin Ltd エポキシ樹脂の硬化方法
JPH06104712B2 (ja) * 1987-04-08 1994-12-21 東レ株式会社 半導体封止用樹脂組成物
US4868059A (en) * 1987-11-16 1989-09-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
JP2732122B2 (ja) * 1989-06-13 1998-03-25 油化シエルエポキシ株式会社 エポキシ樹脂及び封止用エポキシ樹脂組成物
JPH0314818A (ja) * 1989-06-13 1991-01-23 Yuka Shell Epoxy Kk 半導体封止用エポキシ樹脂組成物
KR950011902B1 (ko) * 1990-04-04 1995-10-12 도오레 가부시끼가이샤 반도체 장치 캡슐 봉입 에폭시 수지 조성물

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2499370A (en) * 1947-03-07 1950-03-07 Petrolite Corp Process for breaking petroleum emulsions
US2828283A (en) * 1952-12-08 1958-03-25 Petrolite Corp Certain polyepoxide modified phenolaldehyde resins, their oxyalkylation derivatives,and method of making same
US2837493A (en) * 1954-04-17 1958-06-03 Albert Ag Chem Werke Epoxy resin compositions containing polyvalent metal phenolates or phenolate-aldehyde resins and the process of their production
JPS6099117A (ja) * 1983-11-02 1985-06-03 Sumitomo Bakelite Co Ltd 熱硬化性樹脂組成物
JPH03210322A (ja) * 1990-01-11 1991-09-13 Toshiba Chem Corp 封止用樹脂組成物および半導体装置
JPH0459862A (ja) * 1990-06-29 1992-02-26 Toray Ind Inc 半導体封止用エポキシ樹脂組成物
EP0524433A2 (de) * 1991-06-21 1993-01-27 Dai-Ichi Kogyo Seiyaku Co., Ltd. Polymere Hydroxynaphtalinverbindungen und Epoxydharzzusammensetzung
EP0536748A1 (de) * 1991-10-11 1993-04-14 Sumitomo Chemical Company, Limited Polyhydrisilves Phenol und damit hergestellter Epoxydharz

Also Published As

Publication number Publication date
DE69307442D1 (de) 1997-02-27
DE69307442T2 (de) 1997-08-21
EP0589143B1 (de) 1997-01-15
US5578660A (en) 1996-11-26
MY109105A (en) 1996-12-31
EP0589143A3 (en) 1994-09-28
EP0589143A2 (de) 1994-03-30

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