SG86457A1 - Fastening device for a purge ring - Google Patents

Fastening device for a purge ring

Info

Publication number
SG86457A1
SG86457A1 SG200100809A SG200100809A SG86457A1 SG 86457 A1 SG86457 A1 SG 86457A1 SG 200100809 A SG200100809 A SG 200100809A SG 200100809 A SG200100809 A SG 200100809A SG 86457 A1 SG86457 A1 SG 86457A1
Authority
SG
Singapore
Prior art keywords
fastening device
purge ring
purge
ring
fastening
Prior art date
Application number
SG200100809A
Other languages
English (en)
Inventor
Yudovsky Joseph
Umotoy Salvador
C Lei Lawrence
Rose Ronald
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG86457A1 publication Critical patent/SG86457A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Cleaning In General (AREA)
SG200100809A 2000-02-15 2001-02-15 Fastening device for a purge ring SG86457A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/504,288 US6223447B1 (en) 2000-02-15 2000-02-15 Fastening device for a purge ring

Publications (1)

Publication Number Publication Date
SG86457A1 true SG86457A1 (en) 2002-02-19

Family

ID=24005627

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200100809A SG86457A1 (en) 2000-02-15 2001-02-15 Fastening device for a purge ring

Country Status (6)

Country Link
US (1) US6223447B1 (de)
EP (1) EP1126047A1 (de)
JP (1) JP5048185B2 (de)
KR (1) KR20010082657A (de)
SG (1) SG86457A1 (de)
TW (1) TW480327B (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6521292B1 (en) 2000-08-04 2003-02-18 Applied Materials, Inc. Substrate support including purge ring having inner edge aligned to wafer edge
US20030121898A1 (en) * 2001-11-26 2003-07-03 Tom Kane Heated vacuum support apparatus
US6730175B2 (en) 2002-01-22 2004-05-04 Applied Materials, Inc. Ceramic substrate support
JP4590364B2 (ja) * 2005-03-16 2010-12-01 日本碍子株式会社 処理装置
JP4590363B2 (ja) * 2005-03-16 2010-12-01 日本碍子株式会社 ガス供給部材及びそれを用いた処理装置
JP4783213B2 (ja) * 2005-06-09 2011-09-28 日本碍子株式会社 静電チャック
JP2007046141A (ja) * 2005-08-12 2007-02-22 Ngk Insulators Ltd 加熱装置
JP2007051317A (ja) * 2005-08-16 2007-03-01 Ngk Insulators Ltd 加熱装置
US7826724B2 (en) * 2006-04-24 2010-11-02 Nordson Corporation Electronic substrate non-contact heating system and method
US8226769B2 (en) 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
JP5069452B2 (ja) * 2006-04-27 2012-11-07 アプライド マテリアルズ インコーポレイテッド 二重温度帯を有する静電チャックをもつ基板支持体
JP5109376B2 (ja) * 2007-01-22 2012-12-26 東京エレクトロン株式会社 加熱装置、加熱方法及び記憶媒体
JP5179482B2 (ja) * 2007-05-09 2013-04-10 株式会社アルバック パージガスアセンブリ
KR102124441B1 (ko) * 2009-12-31 2020-06-18 어플라이드 머티어리얼스, 인코포레이티드 웨이퍼 엣지 및 경사면 증착을 수정하기 위한 쉐도우 링
US9490150B2 (en) * 2012-07-03 2016-11-08 Applied Materials, Inc. Substrate support for substrate backside contamination control
US20160002778A1 (en) * 2014-07-03 2016-01-07 Applied Materials, Inc. Substrate support with more uniform edge purge
US9460915B2 (en) 2014-09-12 2016-10-04 Lam Research Corporation Systems and methods for reducing backside deposition and mitigating thickness changes at substrate edges
US9738975B2 (en) 2015-05-12 2017-08-22 Lam Research Corporation Substrate pedestal module including backside gas delivery tube and method of making
US10177024B2 (en) 2015-05-12 2019-01-08 Lam Research Corporation High temperature substrate pedestal module and components thereof
KR102584339B1 (ko) * 2016-10-12 2023-09-27 램 리써치 코포레이션 반도체 프로세싱용 웨이퍼 포지셔닝 페데스탈의 패드 상승 메커니즘
KR102447277B1 (ko) * 2017-11-17 2022-09-26 삼성전자주식회사 스핀 코터 및 이를 구비하는 기판처리 장치와 기판처리 시스템
US20190287835A1 (en) * 2018-02-01 2019-09-19 Yield Engineering Systems, Inc. Interchangeable Edge Rings For Stabilizing Wafer Placement And System Using Same
JP7239560B2 (ja) 2018-03-26 2023-03-14 日本碍子株式会社 静電チャックヒータ
WO2020159708A1 (en) * 2019-01-31 2020-08-06 Lam Research Corporation Showerhead with configurable gas outlets
WO2021221886A1 (en) * 2020-04-29 2021-11-04 Applied Materials, Inc. Heater cover plate for uniformity improvement
CN111477576A (zh) * 2020-06-02 2020-07-31 深圳市石金科技股份有限公司 一种改进型承载盘及承载装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0628644A2 (de) * 1993-05-27 1994-12-14 Applied Materials, Inc. Verbesserungen betreffend Substrathalter geeignet für den Gebrauch in Vorrichtungen für die chemische Abscheidung aus der Dampfphase
US5505779A (en) * 1992-06-24 1996-04-09 Anelva Corporation Integrated module multi-chamber CVD processing system and its method for processing substrates
WO1999067440A2 (en) * 1998-06-24 1999-12-29 Applied Materials, Inc. Substrate support member with a purge gas channel and pumping system

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5238499A (en) 1990-07-16 1993-08-24 Novellus Systems, Inc. Gas-based substrate protection during processing
US5855687A (en) * 1990-12-05 1999-01-05 Applied Materials, Inc. Substrate support shield in wafer processing reactors
US5695568A (en) 1993-04-05 1997-12-09 Applied Materials, Inc. Chemical vapor deposition chamber
EP0668607A1 (de) * 1994-02-22 1995-08-23 Applied Materials, Inc. Erosionsbeständiger elektrostatischer Substratbehälter
US5888304A (en) 1996-04-02 1999-03-30 Applied Materials, Inc. Heater with shadow ring and purge above wafer surface
US5556476A (en) 1994-02-23 1996-09-17 Applied Materials, Inc. Controlling edge deposition on semiconductor substrates
US5766365A (en) 1994-02-23 1998-06-16 Applied Materials, Inc. Removable ring for controlling edge deposition in substrate processing apparatus
US5423558A (en) * 1994-03-24 1995-06-13 Ipec/Westech Systems, Inc. Semiconductor wafer carrier and method
JP3553204B2 (ja) * 1995-04-28 2004-08-11 アネルバ株式会社 Ｃｖｄ装置
US5994678A (en) * 1997-02-12 1999-11-30 Applied Materials, Inc. Apparatus for ceramic pedestal and metal shaft assembly
JPH10303286A (ja) * 1997-02-25 1998-11-13 Applied Materials Inc 静電チャック及び半導体製造装置
US5985033A (en) 1997-07-11 1999-11-16 Applied Materials, Inc. Apparatus and method for delivering a gas
US6179924B1 (en) * 1998-04-28 2001-01-30 Applied Materials, Inc. Heater for use in substrate processing apparatus to deposit tungsten

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5505779A (en) * 1992-06-24 1996-04-09 Anelva Corporation Integrated module multi-chamber CVD processing system and its method for processing substrates
EP0628644A2 (de) * 1993-05-27 1994-12-14 Applied Materials, Inc. Verbesserungen betreffend Substrathalter geeignet für den Gebrauch in Vorrichtungen für die chemische Abscheidung aus der Dampfphase
WO1999067440A2 (en) * 1998-06-24 1999-12-29 Applied Materials, Inc. Substrate support member with a purge gas channel and pumping system

Also Published As

Publication number Publication date
KR20010082657A (ko) 2001-08-30
EP1126047A1 (de) 2001-08-22
TW480327B (en) 2002-03-21
JP2001351967A (ja) 2001-12-21
JP5048185B2 (ja) 2012-10-17
US6223447B1 (en) 2001-05-01

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