SG84538A1 - Wiring board for bump bonding, semiconductor device assembled from the wiring board and manufacturing method of wiring board for bump bonding - Google Patents

Wiring board for bump bonding, semiconductor device assembled from the wiring board and manufacturing method of wiring board for bump bonding

Info

Publication number
SG84538A1
SG84538A1 SG9903595A SG1999003595A SG84538A1 SG 84538 A1 SG84538 A1 SG 84538A1 SG 9903595 A SG9903595 A SG 9903595A SG 1999003595 A SG1999003595 A SG 1999003595A SG 84538 A1 SG84538 A1 SG 84538A1
Authority
SG
Singapore
Prior art keywords
wiring board
bump bonding
manufacturing
semiconductor device
device assembled
Prior art date
Application number
SG9903595A
Inventor
Kanda Eizaburo
Shimoji Takumi
Original Assignee
Sumitomo Metal Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co filed Critical Sumitomo Metal Mining Co
Publication of SG84538A1 publication Critical patent/SG84538A1/en

Links

SG9903595A 1998-07-03 1999-07-02 Wiring board for bump bonding, semiconductor device assembled from the wiring board and manufacturing method of wiring board for bump bonding SG84538A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18850298 1998-07-03

Publications (1)

Publication Number Publication Date
SG84538A1 true SG84538A1 (en) 2001-11-20

Family

ID=16224858

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9903595A SG84538A1 (en) 1998-07-03 1999-07-02 Wiring board for bump bonding, semiconductor device assembled from the wiring board and manufacturing method of wiring board for bump bonding

Country Status (2)

Country Link
KR (1) KR100335875B1 (en)
SG (1) SG84538A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100526845B1 (en) * 2000-12-26 2005-11-08 앰코 테크놀로지 코리아 주식회사 Circuit board and its manufacturing method
KR102531702B1 (en) * 2021-09-01 2023-05-12 해성디에스 주식회사 Method of manufacturing printed circuit board

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02265294A (en) * 1989-04-05 1990-10-30 Ibiden Co Ltd Formation of bump on printed wiring board
GB2244176A (en) * 1990-05-18 1991-11-20 Hewlett Packard Co Method and apparatus for forming a conductive pattern on an integrated circuit
EP0457501A2 (en) * 1990-05-18 1991-11-21 International Business Machines Corporation Method of manufacturing a multilayer wiring board
EP0543364A2 (en) * 1991-11-21 1993-05-26 Nec Corporation Method for manufacturing polyimide multilayer wiring substrate
WO1996003020A1 (en) * 1994-07-19 1996-02-01 Olin Corporation Integrally bumped electronic package components

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02265294A (en) * 1989-04-05 1990-10-30 Ibiden Co Ltd Formation of bump on printed wiring board
GB2244176A (en) * 1990-05-18 1991-11-20 Hewlett Packard Co Method and apparatus for forming a conductive pattern on an integrated circuit
EP0457501A2 (en) * 1990-05-18 1991-11-21 International Business Machines Corporation Method of manufacturing a multilayer wiring board
EP0543364A2 (en) * 1991-11-21 1993-05-26 Nec Corporation Method for manufacturing polyimide multilayer wiring substrate
WO1996003020A1 (en) * 1994-07-19 1996-02-01 Olin Corporation Integrally bumped electronic package components

Also Published As

Publication number Publication date
KR100335875B1 (en) 2002-05-08
KR20000011430A (en) 2000-02-25

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