SG83188A1 - Laser processing apparatus and method - Google Patents

Laser processing apparatus and method

Info

Publication number
SG83188A1
SG83188A1 SG200000614A SG200000614A SG83188A1 SG 83188 A1 SG83188 A1 SG 83188A1 SG 200000614 A SG200000614 A SG 200000614A SG 200000614 A SG200000614 A SG 200000614A SG 83188 A1 SG83188 A1 SG 83188A1
Authority
SG
Singapore
Prior art keywords
processing apparatus
laser processing
laser
processing
Prior art date
Application number
SG200000614A
Other languages
English (en)
Inventor
Muneyuki Ken
Kasai Kenji
Nakai Izuru
Yuki Haruhiko
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of SG83188A1 publication Critical patent/SG83188A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0892—Controlling the laser beam travel length
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
SG200000614A 1999-02-09 2000-02-04 Laser processing apparatus and method SG83188A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03087799A JP3642969B2 (ja) 1999-02-09 1999-02-09 レーザー加工装置および方法

Publications (1)

Publication Number Publication Date
SG83188A1 true SG83188A1 (en) 2001-09-18

Family

ID=12315978

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200000614A SG83188A1 (en) 1999-02-09 2000-02-04 Laser processing apparatus and method

Country Status (6)

Country Link
US (1) US6403920B1 (fr)
EP (1) EP1031396B1 (fr)
JP (1) JP3642969B2 (fr)
CN (1) CN1162245C (fr)
SG (1) SG83188A1 (fr)
TW (1) TW445189B (fr)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4770057B2 (ja) 2001-05-14 2011-09-07 三菱電機株式会社 レーザ加工機及びレーザ加工方法
US6755107B2 (en) * 2001-05-18 2004-06-29 One World Technologies Lmt. Miter saw having a light beam alignment system
JP4031239B2 (ja) * 2001-12-19 2008-01-09 日立ビアメカニクス株式会社 加工装置
US6977775B2 (en) 2002-05-17 2005-12-20 Sharp Kabushiki Kaisha Method and apparatus for crystallizing semiconductor with laser beams
JP4668508B2 (ja) * 2002-05-17 2011-04-13 シャープ株式会社 半導体結晶化方法
US20030233921A1 (en) 2002-06-19 2003-12-25 Garcia Jaime E. Cutter with optical alignment system
US6947454B2 (en) * 2003-06-30 2005-09-20 Electro Scientific Industries, Inc. Laser pulse picking employing controlled AOM loading
US20060114948A1 (en) * 2004-11-29 2006-06-01 Lo Ho W Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams
GB2439962B (en) * 2006-06-14 2008-09-24 Exitech Ltd Process and apparatus for laser scribing
DE102006036544A1 (de) * 2006-08-04 2008-02-07 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Optoelektronisches Modul
CN101489712B (zh) * 2006-12-22 2012-06-20 松下电器产业株式会社 激光加工装置及使用该激光加工装置的激光加工方法
CN100463759C (zh) * 2007-07-10 2009-02-25 中国科学院上海光学精密机械研究所 模块化的激光直刻装置
JP4911050B2 (ja) * 2008-01-25 2012-04-04 パルステック工業株式会社 レーザ加工装置及びレーザ加工方法
DE102008014263A1 (de) * 2008-03-13 2009-09-24 Schott Solar Gmbh Verfahren und Vorrichtung zur Bildung der Trennlinien eines fotovoltaischen Moduls mit serienverschalteten Zellen
JP5371534B2 (ja) * 2009-04-24 2013-12-18 株式会社日立ハイテクノロジーズ レーザ加工方法、レーザ加工装置及びソーラパネル製造方法
JP2011067865A (ja) * 2009-08-27 2011-04-07 Hitachi High-Technologies Corp レーザ加工方法及びレーザ加工装置並びにソーラパネル製造方法
CN102350592A (zh) * 2010-03-30 2012-02-15 应用材料公司 具有可变束斑尺寸的激光处理系统
DE102010062071A1 (de) * 2010-11-26 2012-05-31 Rofin-Baasel Lasertech Gmbh & Co. Kg Vorrichtung zum Einbringen von voneinander in einer Längsrichtung beabstandeten Vertiefungen oder Öffnungen in eine in diese Längsrichtung bewegte Materialbahn
JP6030299B2 (ja) * 2011-12-20 2016-11-24 株式会社ディスコ レーザー加工装置
CN103862170B (zh) * 2012-12-12 2016-05-04 武汉楚天工业激光设备有限公司 一种解决叶轮焊接长光程问题的激光导光系统
EP2778784B8 (fr) * 2013-03-11 2022-02-23 Esko-Graphics Imaging GmbH Appareil et procédé de gravure directe multi-faisceaux de plaques et manchons d'impression en élastomère
CN105397312B (zh) * 2014-09-11 2017-06-27 大族激光科技产业集团股份有限公司 一种光纤激光高效加工头
CN104439716A (zh) * 2014-11-17 2015-03-25 深圳锜宏伟科技有限公司 激光加工系统及激光加工方法
JP6869623B2 (ja) * 2017-10-26 2021-05-12 住友重機械工業株式会社 レーザ加工装置
CN110153551A (zh) * 2018-02-14 2019-08-23 镭射沃激光科技(深圳)有限公司 激光加工装置及利用此的激光加工方法
TWI843784B (zh) * 2019-01-31 2024-06-01 美商伊雷克托科學工業股份有限公司 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0476965A2 (fr) * 1990-09-18 1992-03-25 Praxair S.T. Technology, Inc. Appareil produisant un rayon laser de longueur constante
EP0857536A1 (fr) * 1997-02-05 1998-08-12 Honda Giken Kogyo Kabushiki Kaisha Dispositif de soudage au rayon laser
EP0884128A1 (fr) * 1996-11-20 1998-12-16 Ibiden Co., Ltd. Appareil d'usinage laser, et procede et dispositif de fabrication d'une carte imprimee multicouche

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6240986A (ja) * 1985-08-20 1987-02-21 Fuji Electric Corp Res & Dev Ltd レ−ザ−加工方法
US5478983A (en) * 1992-10-22 1995-12-26 Rancourt; Yvon Process and apparatus for welding or heat treating by laser
TW382704B (en) * 1997-10-14 2000-02-21 Ind Tech Res Inst Method for focusing and tracking of CD optical head and device therefor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0476965A2 (fr) * 1990-09-18 1992-03-25 Praxair S.T. Technology, Inc. Appareil produisant un rayon laser de longueur constante
EP0884128A1 (fr) * 1996-11-20 1998-12-16 Ibiden Co., Ltd. Appareil d'usinage laser, et procede et dispositif de fabrication d'une carte imprimee multicouche
EP0857536A1 (fr) * 1997-02-05 1998-08-12 Honda Giken Kogyo Kabushiki Kaisha Dispositif de soudage au rayon laser

Also Published As

Publication number Publication date
US6403920B1 (en) 2002-06-11
TW445189B (en) 2001-07-11
JP2000233291A (ja) 2000-08-29
EP1031396A1 (fr) 2000-08-30
CN1262977A (zh) 2000-08-16
EP1031396B1 (fr) 2004-04-21
JP3642969B2 (ja) 2005-04-27
CN1162245C (zh) 2004-08-18

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