SG82001A1 - Method of making an electronic component using reworkable underfill encapsulants - Google Patents
Method of making an electronic component using reworkable underfill encapsulantsInfo
- Publication number
- SG82001A1 SG82001A1 SG9902958A SG1999002958A SG82001A1 SG 82001 A1 SG82001 A1 SG 82001A1 SG 9902958 A SG9902958 A SG 9902958A SG 1999002958 A SG1999002958 A SG 1999002958A SG 82001 A1 SG82001 A1 SG 82001A1
- Authority
- SG
- Singapore
- Prior art keywords
- electronic component
- making
- mono
- functional
- compounds
- Prior art date
Links
- 239000008393 encapsulating agent Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 abstract 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 abstract 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 abstract 1
- 239000002318 adhesion promoter Substances 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 238000011065 in-situ storage Methods 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/067—Polyurethanes; Polyureas
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/068—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Polymerisation Methods In General (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10918998A | 1998-07-02 | 1998-07-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG82001A1 true SG82001A1 (en) | 2001-07-24 |
Family
ID=22326283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG9902958A SG82001A1 (en) | 1998-07-02 | 1999-06-18 | Method of making an electronic component using reworkable underfill encapsulants |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0969058A3 (zh) |
JP (1) | JP2000036505A (zh) |
KR (1) | KR20000011414A (zh) |
CN (1) | CN1254182A (zh) |
SG (1) | SG82001A1 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6260264B1 (en) | 1997-12-08 | 2001-07-17 | 3M Innovative Properties Company | Methods for making z-axis electrical connections |
CN1270375C (zh) * | 2000-10-17 | 2006-08-16 | 3M创新有限公司 | 集成电路芯片与电路基片的连接方法及其应用 |
US6818680B2 (en) | 2002-09-23 | 2004-11-16 | Corning Incorporated | Curable adhesive compositions |
US9201299B2 (en) | 2007-10-01 | 2015-12-01 | San-Ei Kagaku Co., Ltd. | Inorganic filler and organic filler-containing curable resin composition, resist film coated printed wiring board, and method for producing the same |
JP5464314B2 (ja) * | 2007-10-01 | 2014-04-09 | 山栄化学株式会社 | 無機フィラー及び有機フィラー含有硬化性樹脂組成物、並びにレジスト膜被覆プリント配線板及びその製造方法 |
TWI370525B (en) | 2008-04-25 | 2012-08-11 | Ind Tech Res Inst | Encapsulant composition and method for fabricating encapsulant material |
GB2466251B (en) * | 2008-12-16 | 2011-03-09 | Ind Tech Res Inst | Encapsulant compositions and method for fabricating encapsulant materials |
KR101355511B1 (ko) * | 2011-12-19 | 2014-01-28 | 한국타이어 주식회사 | 고무혼합 제어방법 |
CN112004889B (zh) * | 2018-04-26 | 2022-12-09 | 三菱瓦斯化学株式会社 | 树脂组合物、层叠体、带树脂组合物层的半导体晶圆、带树脂组合物层的半导体搭载用基板和半导体装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5070154A (en) * | 1989-09-11 | 1991-12-03 | Shin-Etsu Chemical Co., Ltd. | Composition of maleimide and aromatic-double bond epoxy resin |
EP0484157A2 (en) * | 1990-10-31 | 1992-05-06 | Kabushiki Kaisha Toshiba | Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition |
EP0507603A1 (en) * | 1991-04-04 | 1992-10-07 | Shin-Etsu Chemical Co., Ltd. | Thermosetting resin compositions and their manufacture |
EP0559338A1 (en) * | 1992-02-13 | 1993-09-08 | Shin-Etsu Chemical Co., Ltd. | Thermosetting resin compositions |
US5290882A (en) * | 1991-08-13 | 1994-03-01 | Shin-Etsu Chemical Co., Ltd. | Thermosetting resin compositions |
US5310830A (en) * | 1990-06-28 | 1994-05-10 | Konishi Co., Ltd. | Epoxy resin, maleimide and OH- and epoxy-containing compound |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2469421A1 (fr) * | 1979-11-09 | 1981-05-22 | Rhone Poulenc Ind | Procede d'encapsulation de composants electroniques a l'aide d'une matiere moulable a base d'un prepolymere thermodurcissable |
EP0208634B1 (fr) * | 1985-07-01 | 1989-09-06 | Rhone-Poulenc Chimie | Nouveaux maléimides et nouvelles compositions thermodurcissables les contenant |
EP0390565A3 (en) * | 1989-03-31 | 1992-02-26 | Mitsui Petrochemical Industries, Ltd. | Imide prepolymers, cured products, method for making the same, laminate preparation, and encapsulating compositions |
JPH0855940A (ja) * | 1994-08-12 | 1996-02-27 | Sumitomo Chem Co Ltd | 熱硬化性樹脂組成物 |
-
1999
- 1999-06-18 SG SG9902958A patent/SG82001A1/en unknown
- 1999-06-30 CN CN99111271A patent/CN1254182A/zh active Pending
- 1999-07-01 EP EP99112719A patent/EP0969058A3/en not_active Withdrawn
- 1999-07-01 KR KR1019990026329A patent/KR20000011414A/ko not_active Application Discontinuation
- 1999-07-02 JP JP11189331A patent/JP2000036505A/ja active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5070154A (en) * | 1989-09-11 | 1991-12-03 | Shin-Etsu Chemical Co., Ltd. | Composition of maleimide and aromatic-double bond epoxy resin |
US5310830A (en) * | 1990-06-28 | 1994-05-10 | Konishi Co., Ltd. | Epoxy resin, maleimide and OH- and epoxy-containing compound |
EP0484157A2 (en) * | 1990-10-31 | 1992-05-06 | Kabushiki Kaisha Toshiba | Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition |
EP0507603A1 (en) * | 1991-04-04 | 1992-10-07 | Shin-Etsu Chemical Co., Ltd. | Thermosetting resin compositions and their manufacture |
US5290882A (en) * | 1991-08-13 | 1994-03-01 | Shin-Etsu Chemical Co., Ltd. | Thermosetting resin compositions |
EP0559338A1 (en) * | 1992-02-13 | 1993-09-08 | Shin-Etsu Chemical Co., Ltd. | Thermosetting resin compositions |
Also Published As
Publication number | Publication date |
---|---|
KR20000011414A (ko) | 2000-02-25 |
JP2000036505A (ja) | 2000-02-02 |
CN1254182A (zh) | 2000-05-24 |
EP0969058A2 (en) | 2000-01-05 |
EP0969058A3 (en) | 2000-02-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY127943A (en) | Method of making encapsulated electronic component with reworkable package encapsulants | |
EP0969060A3 (en) | Underfill encapsulant compositions for use in electronic devices | |
EP0969063A3 (en) | Package encapsulant compositions for use in electronic devices | |
SG73662A1 (en) | Die attach adhesives for use in microelectronic devices | |
EP1229095A4 (en) | ADHESIVE AGENT, CONNECTION TECHNIQUE FOR WIRE TERMINALS AND WIRE STRUCTURE | |
TW200615355A (en) | Adhesive composition and circuit connecting material and circuit component connecting structure and semiconductor apparatus | |
MY118367A (en) | Thermally reworkable binders for flip-chip devices | |
SG82001A1 (en) | Method of making an electronic component using reworkable underfill encapsulants | |
AU3666899A (en) | Method of bonding a window to a substrate using a silane functional adhesive composition | |
ZA934290B (en) | Stabilizing compositions and methods for stabilizing subterranean formations | |
EP0980081A3 (de) | Hochgefülltes Kunststoffteil | |
AU2003202139A1 (en) | Encapsulating epoxy resin composition, and electronic parts device using the same | |
MY135107A (en) | Semiconductor device and process for fabrication | |
MY146873A (en) | Semiconductor device and method of manufacturing therof. | |
SG105450A1 (en) | Allylated amide compounds and die attach adhesives prepared therefrom | |
AU5407199A (en) | Method for sealing porous building materials and building components | |
EP1106654A3 (en) | Silicone rubber composition keypads | |
HK1046012A1 (zh) | 用於半導體封鑄的樹脂組合物、由所述材料獲得的半導體設備以及製造所述半導體設備的方法 | |
HK1027118A1 (en) | Powdery modified fillers containing rubber powder,method for the production and use thereof. | |
HK1064690A1 (en) | Polyorganosiloxane composition | |
WO1997029144A1 (fr) | Resine epoxy, composition de resine epoxy et produits obtenus par durcissement | |
AU7549698A (en) | Phenolic resin, resin composition, molding material for encapsulation, and electronic component device | |
EP1215718A3 (en) | Novel high temperature underfilling material with low exotherm during use | |
EP1057850A3 (en) | LCP bonding method | |
EP0683190A3 (en) | Improved epoxy novolak resin and resin composition for encapsulation of electronic components. |